Liner assembly and semiconductor process equipment

Abstract

The utility model relates to the technical field of semiconductor technology, more particularly to a kind of inner liner subassembly and semiconductor process equipment.The inner liner subassembly includes inner liner and gas supply plug, and the mounting hole that passes through inner liner is formed on inner liner, and gas supply plug is detachably installed in mounting hole, and gas supply plug has gas supply hole, and gas supply hole is communicated with the chamber of semiconductor process equipment, for gas is sent into chamber.The semiconductor process equipment includes gas supply subassembly and inner liner subassembly, and gas supply subassembly has gas supply channel, and gas supply channel is communicated in gas supply hole;When the aperture of different gas supply hole needs to be replaced during the use of the inner liner subassembly and semiconductor process equipment, then only gas supply plug needs to be replaced, without replacing inner liner, reduce cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor process technology, and more specifically, to an inner liner component and semiconductor process equipment. Background Technology

[0002] Physical vapor deposition (PVD) is a technique that uses physical methods under vacuum conditions to vaporize the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionize them into ions, and then deposits a thin film on the substrate surface through a low-pressure gas (or plasma) process.

[0003] During the deposition process, process gas needs to be introduced to interact with the target material. Different thin films require different process gases or process gases with different flow rates. In related technologies, process gas through holes are directly set in the liner. When the aperture of the process gas through holes needs to be adjusted for different thin film deposition processes, the liner needs to be replaced with one of the corresponding aperture diameter, resulting in high production costs.

[0004] Furthermore, the flow rate and concentration uniformity of process gases need to be controlled during the process to ensure film yield. For example, when preparing vanadium dioxide (VO2) films using physical vapor deposition (PVD), the flow rate ratio of argon (Ar) to oxygen (O2) needs to be controlled. If the flow rate ratio is not properly controlled, byproducts are easily generated during the process, affecting the film deposition quality. If oxygen is insufficient, the obtained film will contain low-valence oxides, such as vanadium monoxide (VO) and vanadium trioxide (V2O3), while if oxygen is excessive, the obtained film will contain high-valence oxides, such as vanadium pentoxide (V2O5). However, there is currently no effective solution in related technologies to effectively control the process gas flow rate ratio, which leads to the generation of byproducts during the process and affects product yield. Utility Model Content

[0005] The purpose of this invention is to provide an inner liner component and semiconductor process equipment to solve at least one of the technical problems mentioned in the background art.

[0006] This utility model provides a liner assembly for use in semiconductor process equipment. The liner assembly includes a liner and a gas supply plug. The liner has a mounting hole that penetrates the liner. The gas supply plug is detachably mounted in the mounting hole and has a gas supply hole that communicates with a chamber of the semiconductor process equipment for supplying gas into the chamber.

[0007] Optionally, the mounting holes are evenly distributed along the circumference of the liner.

[0008] Optionally, the air supply plug includes a flange and a column fixed coaxially, and the air supply hole is at least partially located on the column.

[0009] Optionally, the air supply port includes a vertical hole section and a horizontal hole section that are connected to each other. The vertical hole section is provided on the column and penetrates the side wall of the column, and the horizontal hole section penetrates the free end face of the column or the flange.

[0010] Optionally, the air inlet includes a vertical section and an inclined section that are connected to each other. The vertical section is an oblong hole provided on the column and penetrates the side wall of the column. The inclined section is inclined upward or downward relative to the horizontal direction. The inclined hole section is provided on the column and penetrates the free end face of the column, or the inclined hole section is provided on the flange and penetrates the flange.

[0011] Optionally, the air supply port includes a vertical section, a horizontal section, and an inclined section connected in sequence. The vertical section is located on the column and penetrates the side wall of the column. The horizontal section is located on the column. The inclined section is inclined upward or downward relative to the horizontal direction. The inclined section is located on the column and penetrates the free end face of the column. Alternatively, the inclined section is located on the flange and penetrates the flange.

[0012] Optionally, the sidewall of the liner has a connecting channel, the axis of which is angled to the axis of the mounting hole and communicates with the vertical hole section of the air supply hole.

[0013] Optionally, the axial direction of the connecting channel extends in the vertical direction.

[0014] Optionally, the inlet end of the air inlet penetrates the outer wall of the column, and the outlet end penetrates the flange. The flange is tightly abutted against the liner, and the free end face of the flange faces the chamber. Alternatively, the inlet end of the air supply hole penetrates through the outer wall of the column, the outlet end penetrates through the free end face of the column, the flange is tightly abutted against the liner, and the free end face of the flange faces away from the chamber.

[0015] Optionally, when the free end face of the flange faces the cavity, the inner wall surface of the liner has a countersunk hole, the flange tightly abuts against the countersunk hole, and the free end face of the flange is flush with the inner wall surface of the liner. When the free end face of the flange faces away from the cavity, the free end face of the column is flush with the inner wall surface of the liner.

[0016] Optionally, the outer end face of the column has a first annular groove with a first sealing ring, and the inner end face of the flange facing the column has a second annular groove with a second sealing ring. Both the first annular groove and the second annular groove are coaxially arranged with the column.

[0017] Optionally, the opening portions of both the first annular groove and the second annular groove are constricted structures.

[0018] Optionally, the flange has a positioning structure; or, the column has a positioning structure.

[0019] Optionally, the flange has a flat surface.

[0020] This utility model embodiment also provides a semiconductor process apparatus, including a gas supply component and the aforementioned inner liner component, wherein the gas supply component has a gas supply channel, and the gas supply channel is connected to the gas supply hole.

[0021] Optionally, the air supply assembly includes a first air supply channel and a second air supply channel that are independent of each other; the first air supply channel is connected to a first air inlet and a plurality of spaced-apart first air outlets, and the second air supply channel is connected to a second air inlet and a plurality of spaced-apart second air outlets. A plurality of first air outlets are connected to the air inlet of a portion of the air supply plug, and a plurality of second air outlets are connected to the air inlet of the remaining portion of the air supply plug.

[0022] Optionally, the first air inlet and the second air inlet are located on a first horizontal plane, and the first air outlet and the second air outlet are located on a second horizontal plane, wherein the first horizontal plane and the second horizontal plane are not coplanar.

[0023] Optionally, both the first air inlet and the second air inlet are disposed on the outer side wall of the air delivery component; the first air outlet and the second air outlet are alternately arranged on the air delivery component at circumferential intervals.

[0024] Optionally, in the first air supply channel, the air supply path length between each of the first air outlets and the first air inlet is the same; in the second air supply channel, the air supply path length between each of the second air outlets and the second air inlet is the same.

[0025] Optionally, the first air delivery channel has multiple layers spiraling radially from the outside to the inside, with each layer's channel segment being arc-shaped and the end of each outer layer channel segment located in the middle of the adjacent inner layer channel segment; the second air delivery channel has multiple layers spiraling radially from the outside to the inside, with each layer's channel segment being arc-shaped and the end of each outer layer channel segment located in the middle of the adjacent inner layer channel segment.

[0026] Optionally, the semiconductor process equipment further includes an upper housing, a lower housing, and a target material; The upper housing contains an upper electrode assembly located above the target material, and the inner liner is located below the target material; the gas delivery assembly is fixedly installed between the upper housing and the lower housing.

[0027] Optionally, the upper housing includes an upper adapter and a grounding shield located above the upper adapter; The lower housing includes a lower adapter and a grounding housing located below the lower adapter; The air supply assembly is fixedly installed between the upper adapter and the lower adapter, and the first air inlet and the second air inlet are connected to an air source.

[0028] The liner assembly and semiconductor process equipment provided in this embodiment of the invention have the following beneficial effects: During the process, the process gas is delivered into the interior of the liner through the gas delivery hole of the gas delivery plug to carry out the semiconductor process. Taking physical vapor deposition as an example, when it is necessary to change the diameter of different gas delivery holes, only the gas delivery plug needs to be replaced, and there is no need to replace the liner, which reduces costs. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0030] Figure 1 This is a cross-sectional schematic diagram of a semiconductor process equipment in an embodiment of the present invention; Figure 2a This is a partial cross-sectional schematic diagram of a semiconductor process equipment in an embodiment of the present utility model, mainly showing the structure and usage status of the gas supply component from a first-view perspective. Figure 2b This is a partial cross-sectional schematic diagram of a semiconductor process equipment in an embodiment of the present utility model, mainly showing the structure and usage state of the gas supply component from a second perspective. Figure 2c This is a partial cross-sectional schematic diagram of a semiconductor process equipment in an embodiment of the present utility model, mainly showing the structure and usage state of the gas supply component from a second perspective. Figure 2d This is a partial cross-sectional schematic diagram of another semiconductor process equipment in an embodiment of this utility model; Figure 3aThis is a three-dimensional structural diagram of the first type of air supply plug in an embodiment of the present utility model; Figure 3b for Figure 3a A cross-sectional schematic diagram of the first type of air delivery plug; Figure 3c This is a three-dimensional structural diagram of the second type of air supply plug in an embodiment of the present invention; Figure 3d for Figure 3c A cross-sectional schematic diagram of the second type of air delivery plug; Figure 3e This is a cross-sectional schematic diagram of the third type of air supply plug in this embodiment of the present invention; Figure 3f This is a three-dimensional structural diagram of the fourth type of air supply plug in this embodiment of the present invention; Figure 3g Figure 3f A cross-sectional schematic diagram of the fourth type of air delivery plug; Figure 3h This is a three-dimensional structural diagram of the fifth type of air supply plug in this embodiment of the present invention; Figure 3i for Figure 3h A cross-sectional schematic diagram of the fifth type of air delivery plug; Figure 3j This is a cross-sectional schematic diagram of the sixth type of air supply plug in this embodiment of the present invention.

[0031] Figure 4 This is a three-dimensional structural diagram of the air delivery component in an embodiment of the present invention; Figure 5a This is a first-view perspective three-dimensional structural diagram of the air supply seat in the air supply assembly in an embodiment of the present utility model; Figure 5b for Figure 5a A partial cross-sectional schematic diagram of the central air delivery seat; Figure 6a This is a second-view perspective three-dimensional structural diagram of the air supply seat in the air supply assembly in an embodiment of the present utility model; Figure 6b for Figure 5a A schematic diagram of one cross-section of the air supply seat; Figure 6c for Figure 5a Another cross-sectional view of the air supply seat; Figure 7a This is a three-dimensional structural diagram of the first cover plate from a first perspective in an embodiment of the present utility model; Figure 7b for Figure 6a A schematic diagram of one cross-section of the first cover plate; Figure 7c for Figure 6aAnother cross-sectional view of the first cover plate; Figure 7d This is a two-dimensional structural diagram of the first cover plate from a second perspective in an embodiment of the present invention; Explanation of reference numerals in the attached figures: 100 - Liner assembly; 110 - Liner; 111 - Mounting hole; 112 - Connection channel; 120 - Air supply plug; 121 - Air supply port; 122 - Flange; 123 - Column; 124 - First sealing structure; 125 - Second sealing structure; 126 - First annular groove; 127 - First sealing ring; 128 - Second annular groove; 129 - Second sealing ring; 200 - Air supply assembly; 210 - First air supply channel; 211 - First air inlet; 212 - First air outlet; 213 - First inlet port; 214 - First outer air passage; 215 - First middle air passage; 216 - First inner airway; 217 - First terminal outlet; 218 - First inlet port; 220 - Second air supply channel; 221 - Second air inlet; 222 - Second air outlet; 223 - Second inlet port; 224 - Second outer air passage; 225 - Second middle air passage; 226 - Second inner air passage; 227 - Second terminal outlet; 228 - Second air inlet; 229 - Third entry hole; 230 - First cover plate; 240 - Air supply seat; 250 - Second cover plate; 300 - Upper housing; 310 - Upper electrode assembly; 320 - Upper adapter; 330 - Grounding shield; 340 - Power supply; 350 - Magnetically controlled assembly; 351 - Magnetically controlled drive device; 360 - Inner insulating cover; 370 - Vacuum pump; 400 - Lower housing; 410 - Base; 420 - Shielding ring; 430 - Lower adapter; 440 - Grounding housing; 500-target material; 600-chamber; 700 - Gas source; 710 - Flow controller. Detailed Implementation

[0032] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0033] The present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings.

[0034] This utility model provides an inner liner assembly 100 and a semiconductor process apparatus. The semiconductor process apparatus includes the inner liner assembly 100, which includes an inner liner 110 and a gas supply plug 120 that penetrates the inner liner 110 and is detachably installed in the inner liner 110. The gas supply plug 120 has a gas supply hole 121 to supply process gas into the chamber of the semiconductor process apparatus. When it is necessary to change the diameter of different gas supply holes 121, only the gas supply plug 120 needs to be replaced, without replacing the inner liner 110, thus reducing costs. The inner liner assembly 100 and the semiconductor process apparatus provided by this utility model embodiment will be further described below with reference to the accompanying drawings.

[0035] This utility model embodiment provides an inner liner assembly 100, which is applied to semiconductor process equipment, such as... Figure 1-2d As shown, the liner assembly 100 includes a liner 110 and an air plug 120. The liner 110 has a mounting hole 111 through it. The air plug 120 is detachably mounted in the mounting hole 111. The air plug 120 has an air outlet 121 that communicates with a chamber of a semiconductor process equipment for delivering gas into the chamber.

[0036] During the process, the process gas is delivered into the chamber of the semiconductor process equipment through the gas delivery hole 121 of the gas delivery plug 120 to carry out the semiconductor process. Taking physical vapor deposition as an example, when it is necessary to change the aperture of different gas delivery holes 121, only the gas delivery plug 120 needs to be replaced, and there is no need to replace the inner liner 110, which reduces costs.

[0037] In this embodiment, the mounting holes 111 are evenly arranged along the circumference of the inner liner 110. Specifically, there are multiple mounting holes 111, and their distribution can take various forms, such as... Figure 1As shown, the mounting holes 111 are evenly arranged along the circumference of the lining 110; or, they are evenly arranged along the circumference of the lining 110 and spaced apart along the axial direction of the lining 110. That is, multiple sets of mounting holes 111 are arranged along the axial direction of the lining, and each set of mounting holes 111 has multiple holes and is evenly distributed along the circumference of the lining 110. In this case, the mounting holes 111 of adjacent sets can be arranged facing each other along the axial direction or staggered (layered), which is not limited here; correspondingly, there are multiple air plugs 120, which correspond to the mounting holes 111.

[0038] In this embodiment, as Figures 3a-3j As shown, the air supply plug 120 includes a flange 122 and a column 123 coaxially fixed, with the air supply port 121 at least partially located on the column 123. Specifically, as... Figures 1-2d As shown, the column 123 fits tightly into the mounting hole 111. (As indicated...) Figures 3a-3j As shown, the longitudinal cross-sectional shape of the air inlet 121 can be L-shaped.

[0039] The following examples further illustrate the structural features of the air supply plug 120.

[0040] In one example of the air plug 120, such as Figure 3b , Figure 3g As shown, the air inlet 121 includes a vertical section and a horizontal section that are connected to each other. The vertical section is located on the column 123 and penetrates the side wall of the column 123, while the horizontal section penetrates the free end face of the column 123 (e.g., ...). Figure 3b , Figure 3c ) or flange 122 (e.g. Figure 3g , Figure 3f ).

[0041] In another example of the air plug 120, such as Figure 3d , Figure 3e , Figure 3i , Figure 3j As shown, the air inlet 121 includes a vertical section and an inclined section that are connected to each other. The vertical section is an oblong hole located on the column 123 and penetrates the side wall of the column 123. The inclined section is inclined upward or downward relative to the horizontal direction. The inclined section is located on the column 123 and penetrates the free end face of the column 123 (e.g., ...). Figure 3d , Figure 3e ), or, the inclined hole section is provided on flange 122 and extends through flange 122 (e.g. Figure 3i , Figure 3j ).

[0042] In another example of the air supply plug 120, the air supply port 121 includes a vertical port section, a horizontal port section, and an inclined port section (not shown in the figure) connected in this manner. The vertical port section is located on the column and passes through the side wall of the column 123. The horizontal port section is located on the column 123. The inclined port section is inclined upward or downward relative to the horizontal direction. The inclined port section is located on the column 123 and passes through the free end face of the column 123, or the inclined port section is located on the flange 122 and passes through the flange 122.

[0043] As can be seen from the example of the air supply plug 120 above, the outlet end of the air supply hole 121 can be set as an inclined section, which can be inclined upwards (e.g., Figure 3d As shown), it can also be tilted downwards (as shown). Figure 3e (As shown). Thus, by selecting / replacing air plugs 120 with air outlets 121 having different extension directions / angles, the airflow direction delivered into the chamber 600 is adjusted, thereby adjusting the reasonable vertical distribution of the process gas within the chamber.

[0044] In this embodiment, as Figures 1-2d As shown, the sidewall of the liner 110 has a connecting channel 112, the axis of which is angled to the axis of the mounting hole 111, and connects to the vertical section of the air inlet 121. Specifically, as... Figures 1-2d As shown, the axial direction of the connecting channel 112 extends vertically. Specifically, the axial direction of the connecting channel 112 can be perpendicular to the axial direction of the mounting hole 111. One end of the connecting channel 112 is connected to the inlet end of the air supply hole 121, and the other end is connected to the corresponding air supply channel, such as the first air outlet 212 or the second air outlet 222. The first air inlet 211 and the second air inlet 221 are connected to an air source 700, such as a first process gas source and a second process gas source, so as to send the first process gas and the second process gas into the chamber 600 respectively.

[0045] In this embodiment, as Figures 3a-3e As shown, the inlet end of the air inlet 121 penetrates the outer wall of the column 123, and the outlet end penetrates the free end face of the column 123. The flange 122 is tightly abutted against the inner liner 110, and the free end face of the flange 122 faces away from the chamber; that is, the air inlet 121 is located inside the column and its outlet end penetrates the free end face of the column 123 (facing away from the end face of the flange). Its inlet end hole section is located on the outer wall of the column 123, that is, the inlet end hole section is a vertical hole section, and the inlet end hole section can be a cylindrical hole (e.g., Figures 3a-3b As shown), it can also be used for waist-shaped hole structures (such as...). Figures 3c-3e The length of the waist-shaped hole extends in the same direction as the axial direction of the column 123; the outlet end section of the air inlet 121 can be inclined upwards (e.g., Figure 3d As shown), it can also be tilted downwards (as shown). Figure 3eAs shown), the outlet end hole section is an inclined hole section; the free end face of the column 123 is flush with the inner wall surface of the liner 110; the flange 122 is provided with through holes, and multiple through holes can be provided and spaced apart, for example, four; the liner 110 has screw holes that match the through holes of the flange 122 (such as...). Figures 1-2c (as shown), to securely connect the two.

[0046] The structure of the air plug 120 and the air inlet 121 can also be configured in other ways, such as... Figures 3f-3j As shown, the inlet end of the air inlet 121 penetrates the outer wall of the column 123, and the outlet end penetrates the flange 122. The flange 122 is tightly abutted against the inner liner 110, and the free end face of the flange 122 faces the chamber; that is, the air inlet 121 is located inside the column 123 and its outlet end penetrates the outer end face of the flange 122 (away from the end face of the column 123). Its inlet end hole section is located on the outer wall of the column 123, that is, the inlet end hole section is a vertical hole section, and the inlet end hole section can be a cylindrical hole (e.g., Figure 3f-3g As shown), it can also be used for waist-shaped hole structures (such as...). Figures 3h-3j The outlet end section of the air inlet 121 can be tilted upwards (e.g., Figure 3i As shown), it can also be tilted downwards (as shown). Figure 3j As shown), the outlet end hole section is an inclined hole section; the inner wall surface of the liner 110 has a countersunk hole, and the flange 122 tightly abuts against this countersunk hole, with the free end face of the flange 122 flush with the inner wall surface of the liner 110. The outer end face (free end) of the column 123 has a threaded hole, and the liner 110 has a through hole that matches the threaded hole of the column 123 (e.g., Figure 2d (as shown), to securely connect the two.

[0047] like Figures 3f-3j As shown, the outer end face of the column 123 has a first annular groove 126, and the first annular groove 126 has a first sealing ring 127. The inner end face of the flange 122 facing the column 123 has a second annular groove 128, and the second annular groove 128 has a second sealing ring 129. Both the first annular groove 126 and the second annular groove 128 are coaxially arranged with the column 123. Specifically, in this embodiment, as... Figures 3f-3j As shown, the openings of the first annular groove 126 and the second annular groove 128 are both constricted to secure the sealing ring.

[0048] In this embodiment, flange 122 has a positioning structure, such as... Figures 3a-3e As shown, flange 122 has a flat surface that serves as a positioning structure; or, column 123 has a positioning structure (not shown in the figure). The positioning structure facilitates the quick determination of the installation position of the air inlet end of the air supply hole 121 of the air supply plug 120 during installation, so as to quickly and accurately connect it with the corresponding air supply channel of the connecting channel 620 / air supply assembly.

[0049] It should be noted that, under the same other process conditions, the aperture of the air supply hole 121 affects the airflow velocity through the air supply hole 121. Therefore, the air supply plug 120 can be configured with air supply holes 121 of various apertures. Different apertures of the air supply hole 121 result in different radial distances from which the process gas is injected into the chamber 600, thereby adjusting the distribution of the process gas within the chamber 600. In this embodiment, air supply plugs 120 with different structures and different air supply hole apertures can be used in combination to further adjust the vertical and radial gas distribution within the chamber 600, such as gas uniformity. Furthermore, since each air supply plug 120 is independent and not interconnected, each air supply plug 120 can be replaced to further adjust the gas uniformity within the chamber. When replacing the air supply plug 120, the inner liner 110 can be removed first, and then the fastening screws between the air supply plug 120 and the inner liner 110 can be removed to complete the disassembly and replacement.

[0050] This embodiment also provides a semiconductor process apparatus, such as... Figures 1-2d As shown, the semiconductor process equipment includes a gas supply assembly 200 and the aforementioned inner liner assembly 100. The gas supply assembly 200 has a gas supply channel that is connected to a gas supply port 121.

[0051] In this embodiment, as Figure 4 As shown, the air supply assembly 200 includes a first air supply channel 210 and a second air supply channel 220 that are independent of each other; the first air supply channel 210 is connected to a first air inlet 211 and a plurality of spaced-apart first air outlets 212, and the second air supply channel 220 is connected to a second air inlet 221 and a plurality of spaced-apart second air outlets 222; as Figures 1-2d As shown, multiple first air outlets 212 are connected to the air delivery holes 121 of a portion of the air delivery plug 120, and multiple second air outlets 222 are connected to the air delivery holes 121 of the remaining portion of the air delivery plug 120. Since the air delivery assembly 200 has multiple independent air delivery channels, namely a first air delivery channel 210 and a second air delivery channel 220, during the process, the first air delivery channel 210 and the second air delivery channel 220 can be independently controlled to achieve precise control of the process gas flow ratio, thereby reducing or even avoiding the generation of unnecessary or even harmful byproducts and improving product yield.

[0052] In this embodiment, as Figure 6a As shown, the first air inlet 211 and the second air inlet 221 are located on the first horizontal plane, as... Figure 7a As shown, the first air outlet 212 and the second air outlet 222 are located on the second horizontal plane, and the first horizontal plane and the second horizontal plane are not coplanar.

[0053] In this embodiment, as Figure 4As shown, the first air inlet 211 and the second air inlet 221 are both located on the outer side wall of the air delivery assembly 200. Specifically, they can be located on the same outer side wall for ease of operation. The first air outlet 212 and the second air outlet 222 are alternately arranged on the air delivery assembly 200 at circumferential intervals.

[0054] Specifically, the first air outlet 212 is located on the end face or inner wall of the gas supply assembly 200 and is evenly distributed along the circumference of the gas supply assembly 200, thereby supplying a uniform first process gas to the chamber 600; the second air outlet 222 is located on the end face or inner wall of the gas supply assembly 200 and is evenly distributed along the circumference of the gas supply assembly 200, thereby supplying a uniform second process gas to the chamber 600. The first air outlet 212 and the second air outlet 222 can be located on the end face of the gas supply assembly 200 and near the inner wall of the gas supply assembly 200, for example, both can be located on the upper end face and near the inner wall of the gas supply assembly 200.

[0055] In this embodiment of the utility model, such as Figure 4 As shown, the air delivery assembly 200 may include a first cover plate 230 and an air delivery seat 240. The air delivery seat 240 has a first end face and a first groove recessed in the first end face. The first cover plate 230 covers the first end face, and the first groove and the first cover plate 230 form a first air delivery channel 210.

[0056] Furthermore, such as Figure 4 As shown, the gas supply seat 240 also has a first air inlet 218 and a first inlet 213. The first air inlet 218 extends horizontally, and the first inlet 213 extends vertically. The first air inlet 211 is located on the outer wall of the gas supply seat 240. The first air inlet 211, the first air inlet 218, the first inlet 213, the first gas supply channel 210, and the first air outlet 212 are connected in sequence. The first air outlet 212 penetrates the outer end face of the first cover plate 230 (away from the end face of the gas supply seat 240). During the process, the process gas enters from the first air inlet 211 into the first air inlet 218, then enters the first inlet 213 and is sent upward to the first air outlet 212. Finally, the process gas is sent into the chamber through the first air outlet 212.

[0057] Furthermore, such as Figure 4 As shown, the air delivery assembly 200 also includes a second cover plate 250. The air delivery seat 240 has a second end face and a second groove recessed in the second end face. The second cover plate 250 covers the second end face. The second groove and the second cover plate 250 form a second air delivery channel 220. The second end face is disposed opposite to the first end face.

[0058] Furthermore, such as Figure 4As shown, the gas supply seat 240 also has a second air inlet 228, a second inlet 223, and a third inlet 229. The second air inlet 228 extends horizontally, while the second inlet 223 and the third inlet 229 are spaced apart and both extend vertically. The second air inlet 221 is located on the outer wall of the gas supply seat 240. The second air inlet 221, the second air inlet 228, the third inlet 223, the second gas supply channel 220, the third inlet 229, and the second air outlet 222 are sequentially connected. The second air outlet 222 penetrates the outer end face of the first cover plate 230. During the process, the process gas enters from the second air inlet 221 into the second air inlet 228, then enters the third inlet 223 and is fed downwards into the second gas supply channel 220, then enters the third inlet 229 and is fed upwards to the second air outlet 222. Finally, the process gas is delivered into the chamber through the second air outlet 222.

[0059] Specifically, such as Figure 4 As shown, the air supply assembly 200 includes a first cover plate 230, an air supply seat 240, and a second cover plate 250 that are sequentially stacked and sealed along its axial direction; as Figures 5a-5b The air supply seat 240 has a first groove recessed into the first end face, such as Figures 6a-6c As shown, the air supply seat 240 has a second groove recessed into the second end face, such as Figure 4 As shown, the first end face faces the first cover plate 230, the second end face faces the second cover plate 250, the first groove and the first cover plate 230 form a first air supply channel 210, and the second groove and the second cover plate 250 form a second air supply channel 220; as Figures 5a-6b As shown, the first air inlet 211 and the second air inlet 221 are both located on the outer side wall of the air supply seat 240.

[0060] It should be noted that, in this embodiment of the present invention, the gas supply component 200 can be configured with other structures besides the structure described above. For example, the gas supply component 200 includes multiple gas supply seats 240, and two adjacent gas supply seats 240 are sealed and separated by an intermediate cover plate. This intermediate cover plate is actually equivalent to the first cover plate 230 or the second cover plate 240. In this way, more than three gas supply channels can be used to supply gas into the chamber 600, and more different types of process gases can be supplied simultaneously. The specific implementation method is described in the structural features and relative positions of the gas supply seats 240, the first cover plate 230, and the second cover plate 250, and is not limited here.

[0061] Specifically, in this embodiment of the present invention, the first air outlet 212 penetrates the outer end face of the first cover plate 230 or penetrates the outer end face of the second cover plate 250 (opposite to the end face of the air supply seat 240); the second air outlet 222 penetrates the outer end face of the first cover plate 230 or extends through the outer end face of the second cover plate 250; specifically, as... Figures 7a-7dAs shown, taking the example where both the first air outlet 212 and the second air outlet 222 penetrate the outer end face of the first cover plate 230, the shape of the first groove structure and the shape of the second groove structure can be set to be the same. The number of the first air outlet 212 and the second air outlet 222 is the same, and they are alternately arranged. In this case, the setting position of the first groove and the relative position of the second groove are offset to avoid interference between the positions of the first air outlet 212 and the second air outlet 222. Figure 6c As shown, the final section of the second air supply channel 120 (the third inlet hole 229) extends through the thickness of the air supply seat 240 to connect to the second air outlet 222. It should be noted that the shapes of the first and second groove structures can be different; the number of first and second air outlets 212 and 222 can be the same or different, and this is not limited here. Furthermore, the first and second air outlets 212 and 222 can be respectively located on the first cover plate 230 or the second cover plate 240, and this is not limited here.

[0062] In this embodiment, as Figure 4 As shown, taking a single first air inlet 211 as an example, in the first air delivery channel 210, the air delivery path length between each first air outlet 212 and the first air inlet 211 is the same; taking a single second air inlet 221 as an example, in the second air delivery channel 220, the air delivery path length between each second air outlet 222 and the second air inlet 221 is the same. The channel shapes of the first air delivery channel 210 and the second air delivery channel 220 can be regular or irregular, and can be the same or different, as long as the air delivery paths between the first air inlet 211 and each first air outlet 212 are the same, and the air delivery paths between the second air inlet 221 and each second air outlet 222 are the same. This ensures that the process gas at each first air outlet 212 and each second air outlet 222 is consistent, which not only allows for precise control of the process gas flow ratio but also ensures gas uniformity in all areas within the chamber 600, improving product yield.

[0063] In this embodiment, as Figure 5a As shown, the first air supply channel 210 has multiple layers spiraling radially from the outside to the inside. The channel sections in each layer are arc-shaped, with the ends of the outermost channel sections located in the middle of the adjacent innermost channel sections; as shown... Figure 6a As shown, the second air supply channel 220 has multiple layers spiraling radially from the outside to the inside. The channel sections in each layer are all arc-shaped, and the ends of each outer channel section are located in the middle of the adjacent inner channel section.

[0064] Specifically, such as Figure 4 , Figure 5a As shown, the number of first air outlets 212 is x=2. nn is a natural number; along the direction of the airflow, the first air delivery channel 210 has multiple layers spiraling radially from the outside to the inside. The channel segments in each layer are arc-shaped, and the end of each outer channel segment is located in the middle of the adjacent inner channel segment. n is the number of spiral layers of the first air delivery channel 210. Taking n=3 as an example, the first air delivery channel 210 has 3 layers of arc-shaped channel segments spiraling radially from the outside to the inside: 1 outer channel segment (first outer air channel 214), 2 middle channel segments (first middle air channel 215), and 4 inner channel segments (first inner air channel 216). Among them, the first air channel is located in the middle of the outer channel segment. The inlet hole 213 has two ends (first end outlet 217) of the outer channel section at an angle of 180°, and the two ends (first end outlet 217) of the outer channel section are the inlet ends of the middle channel section. The inlet ends are located in the middle of the middle channel section, and the two ends of the middle channel section are at an angle of 90°. The two ends of the inner channel section are the inlet ends of the inner channel section. The inlet ends are located in the middle of the inner channel section, and the two ends of the inner channel section are at an angle of 45°. This forms eight first air outlets 212 that are evenly distributed circumferentially.

[0065] As described above, the first air outlet 212 is configured in such a way that the number of second air outlets 222 is y=2. m m is a natural number; such as Figure 6aAs shown, along the airflow direction, the second air delivery channel 220 has multiple layers spiraling radially from the outside to the inside. Each layer's channel segment is arc-shaped, with the end of each outer channel segment located in the middle of the adjacent inner channel segment. m represents the number of spiral layers in the second air delivery channel 220. Taking m=3 as an example, the second air delivery channel 220 has 3 layers of arc-shaped channel segments spiraling radially from the outside to the inside: 1 outer arc-shaped channel segment (second outer airway 224), 2 middle arc-shaped channel segments (second middle airway 225), and 4 inner arc-shaped channel segments (second inner airway 226). A second inlet hole 223 is located in the center of each outer channel segment. The two ends of the outer channel segment (second end outlet 227) are at an angle of 180° (i.e., a semicircle), and the two ends of the outer channel segment (second end outlet 227) are the inlet ends of the middle channel segment. The inlet ends are located in the middle of the middle channel segment, and the two ends of the middle channel segment are at an angle of 90° (i.e., 1 / 4 of a circle). The two ends of the inner channel segment are the inlet ends of the inner channel segment. The inlet ends are located in the middle of the inner channel segment, and the two ends of the inner channel segment are at an angle of 45° (i.e., 1 / 8 of a circle). This forms eight second air outlets 222 that are evenly distributed circumferentially. As can be seen from the above, both the first air supply channel 210 and the second air supply channel 220 are maze structures formed by multiple channel segments spiraling radially from the outside to the inside. The paths from the first air inlet 211 to each of the first air outlets 212 are consistent, with the same flow resistance, and the same air output of each first air outlet 212. Similarly, the paths from the second air inlet 221 to each of the second air outlets 222 are consistent, with the same flow resistance, and the same air output of each second air outlet 222.

[0066] In this embodiment, as Figures 1-2d As shown, the mating portion between the liner 110 and the air plug 120 is provided with a sealing structure, and the mating portion between the flange and the liner is provided with a sealing ring (second sealing structure 125) to prevent process gas in the chamber 600 from leaking out from the mating portion; as Figures 3f-3j As shown, grooves are provided at the free end of the column 123 and the inner end face of the flange 122 facing the column 123. These grooves are used to accommodate the sealing ring. It should be noted that the grooves for accommodating the sealing ring can be located in the liner 110 or on the inner end face (the end face facing the column) of the flange 122. A sealing structure (first sealing structure 124) is provided at the mating part between the air supply assembly 200 and the liner 600. Specifically, as shown... Figures 1-2dAs shown, the upper surface of the first cover plate 230 is provided with a groove, and a sealing ring is provided in the groove to prevent the process gas in the self-supplying gas channel from leaking out from the mating part between the first cover plate 230 and the inner liner 110. It should be noted that the groove for accommodating the sealing ring can also be provided in the inner liner 110. The arrangement of each sealing structure enables the process gas to flow out in a predetermined direction without leakage or cross-contamination with other gas channels, and can ensure precise control of the process gas flow ratio, thereby ensuring product yield.

[0067] In this embodiment, as Figure 1 As shown, the semiconductor process equipment also includes an upper housing 300, a lower housing 400, and a target 500. An upper electrode assembly 310 is disposed within the upper housing 300, located above the target 500, and an inner liner 110 is disposed below the target 500. A gas supply assembly 200 is fixedly installed between the upper housing 300 and the lower housing 400. A base 410 is disposed within the lower housing 400, and a shielding ring 420 is provided on the outer periphery of the base 410. The base 410, shielding ring 420, inner liner 110, and target 500 form a chamber 600. The gas supply assembly 200 is fixedly installed between the upper housing 300 and the lower housing 400, and is fitted onto the outer periphery of the inner liner 110. A first gas outlet 212 and a second gas outlet 222 are respectively connected to corresponding mounting holes 111.

[0068] In this embodiment, as Figure 1 As shown, the upper housing 300 includes an upper adapter 320 and a grounding shield 330 located above the upper adapter 320; the upper electrode assembly 310 is located inside the grounding shield 330 and the two are insulated from each other; the upper adapter 320 is a hollow columnar structure; the lower housing 400 includes a lower adapter 430 and a grounding housing 440 located below the lower adapter 430, and the base 410 is located inside the grounding housing 440; the lower adapter 430 is a hollow columnar structure; the air supply assembly 200 is fixedly installed between the upper adapter 320 and the lower adapter 430, and the first air inlet 211 and the second air inlet 221 are connected to an air source 700.

[0069] The gas source 700 can be the same type of gas source or different types of gas sources. For example, the process gas from the first gas source enters the first inlet 211, passes through the first gas delivery channel 210, and is evenly divided into 8 parts along the circumference of the chamber 600, flowing out from the first outlet 212 into the chamber 600. Similarly, the process gas from the second gas source enters the second inlet 221, passes through the second gas delivery channel 220, and is evenly divided into 8 parts along the circumference of the chamber 600, flowing out from the second outlet 222 into the chamber 600. The two process gases are evenly mixed in the chamber 600, thereby obtaining a uniformly mixed reaction gas. The first inlet 211 and the second inlet 221 are respectively connected to flow controllers 710 to precisely control the flow rate of the process gas in each gas delivery channel.

[0070] In this embodiment, as Figure 1 As shown, the semiconductor process equipment also includes a power supply 340, a magnetron assembly 350, a magnetron drive device 351, an inner insulating shield 360, and a vacuum pump 370. The power supply 340 provides the capability for sputtering the target 500. The magnetron assembly 350 rotates during operation to provide a magnetic field to the target 500, improving sputtering efficiency. The magnetron drive device 351 drives the magnetron assembly 350 to rotate. The inner insulating shield 360 is in direct contact with the target 500 and is a sealed environment. The inner insulating shield 360 has a coolant storage chamber (e.g., divided into a coolant storage chamber by a partition, not shown in the figure) to cool the target 500. The vacuum pump 370 is used to cool the corresponding chambers of the semiconductor process equipment. As shown in the figure, the lower chamber is evacuated to provide the required process environment; the liner 110 is used to shield the inner sidewall of the chamber to prevent contamination of the inner sidewall; the shielding ring 420 is used to shield the sputtered material from being ejected downwards onto the non-wafer surface to prevent contamination of the bottom surface (base) of the chamber; the liner 110, shielding ring 420, target 500 and wafer constitute the chamber 600 (i.e., sputtering reaction chamber); the sputtering products of the sputtering target 500 are constrained within the chamber 600 by the process gas fed into the process gas through the labyrinthine first gas supply channel 210 and the second gas supply channel 220, so that the sputtering reaction will not contaminate the lower vacuum chamber and other components within the chamber; the base 410 is connected to the lifting drive assembly that drives its lifting and the heating system that controls its temperature (not shown in the figure).

[0071] It should be noted that in this embodiment, the inner lining component 100 can reduce process costs, and the gas supply component 200 can provide a multi-layer gas uniformity system (such as two layers). The labyrinthine first gas supply channel 210 and second gas supply channel 220 can be set as an asymmetrical structure according to the environment of the chamber 600 and the operating conditions, so that the gas output of each first gas outlet 212 or second gas outlet 222 is different, which meets the needs of different process gas concentrations in different areas.

[0072] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0073] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "installation" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; and it can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A liner assembly, characterized in that, For use in semiconductor process equipment, the liner assembly includes a liner (110) and an air plug (120). The liner (110) has a mounting hole (111) through the liner (110), and the gas plug (120) is detachably mounted in the mounting hole (111). The gas plug (120) has a gas outlet (121) that communicates with the chamber of the semiconductor process equipment for delivering gas into the chamber.

2. The liner assembly according to claim 1, characterized in that, The mounting holes (111) are evenly arranged along the circumference of the liner (110).

3. The liner assembly according to claim 1, characterized in that, The air supply plug (120) includes a flange (122) and a column (123) fixed coaxially, and the air supply hole (121) is at least partially located on the column (123).

4. The liner assembly according to claim 3, characterized in that, The air inlet (121) includes a vertical section and a horizontal section that are connected. The vertical section is located on the column (123) and extends through the side wall of the column (123). The horizontal section extends through the free end face of the column (123) or the flange (122).

5. The liner assembly according to claim 3, characterized in that, The air inlet (121) includes a vertical hole section and an inclined hole section that are connected. The vertical hole section is an oblong hole provided on the column (123) and penetrates the side wall of the column (123). The inclined hole section is inclined upward or downward relative to the horizontal direction. The inclined hole section is provided on the column (123) and passes through the free end face of the column (123), or the inclined hole section is provided on the flange (122) and passes through the flange (122).

6. The liner assembly according to claim 3, characterized in that, The air inlet (121) includes a vertical section, a horizontal section and an inclined section connected thereto. The vertical section is located on the column and penetrates the side wall of the column (123). The horizontal section is located on the column (123). The inclined section is inclined upward or downward relative to the horizontal direction. The inclined section is located on the column (123) and penetrates the free end face of the column (123). Alternatively, the inclined section is located on the flange (122) and penetrates the flange (122).

7. The liner assembly according to any one of claims 4-6, characterized in that, The sidewall of the liner (110) has a connecting channel (112), the axial direction of the connecting channel (112) is set at an angle to the axial direction of the mounting hole (111), and is connected to the vertical hole section of the air supply hole (121).

8. The liner assembly according to claim 7, characterized in that, The axial direction of the connecting channel (112) extends vertically.

9. The liner assembly according to claim 7, characterized in that, The inlet end of the air inlet (121) penetrates the outer wall of the column (123), and the outlet end penetrates the flange (122). The flange (122) is tightly abutted against the liner (110), and the free end face of the flange (122) faces the chamber. Alternatively, the inlet end of the air inlet (121) penetrates the outer wall of the column (123), the outlet end penetrates the free end face of the column (123), the flange (122) is tightly abutted against the liner (110), and the free end face of the flange (122) faces away from the chamber.

10. The liner assembly according to claim 9, characterized in that, When the free end face of the flange (122) faces the cavity, the inner wall surface of the liner (110) has a countersunk hole, the flange (122) is tightly abutted against the countersunk hole, and the free end face of the flange (122) is flush with the inner wall surface of the liner (110). When the free end face of the flange (122) faces away from the chamber, the free end face of the column (123) is flush with the inner wall surface of the liner (110).

11. The liner assembly according to claim 7, characterized in that, The outer end face of the column (123) has a first annular groove (126), the first annular groove (126) has a first sealing ring (127), the inner end face of the flange (122) facing the column (123) has a second annular groove (128), the second annular groove (128) has a second sealing ring (129), and the first annular groove (126) and the second annular groove (128) are both coaxially arranged with the column (123).

12. The liner assembly according to claim 11, characterized in that, The openings of the first annular groove (126) and the second annular groove (128) are both constricted structures.

13. The liner assembly according to claim 7, characterized in that, The flange (122) has a positioning structure; or, the column (123) has a positioning structure.

14. The liner assembly according to claim 13, characterized in that, The flange (122) has a flat surface.

15. A semiconductor process apparatus, characterized in that, It includes an air supply assembly (200) and an inner liner assembly (100) according to any one of claims 1-14, wherein the air supply assembly (200) has an air supply channel communicating with the air supply hole (121).

16. The semiconductor process equipment according to claim 15, characterized in that, The air supply assembly (200) includes a first air supply channel (210) and a second air supply channel (220) that are independent of each other; the first air supply channel (210) is connected to a first air inlet (211) and a plurality of spaced first air outlets (212), and the second air supply channel (220) is connected to a second air inlet (221) and a plurality of spaced second air outlets (222). A plurality of first air outlets (212) are connected to the air outlet (121) of a portion of the air supply plug (120), and a plurality of second air outlets (222) are connected to the air outlet (121) of the remaining portion of the air supply plug (120).

17. The semiconductor process equipment according to claim 16, characterized in that, The first air inlet (211) and the second air inlet (221) are located on the first horizontal plane, and the first air outlet (212) and the second air outlet (222) are located on the second horizontal plane. The first horizontal plane and the second horizontal plane are not coplanar.

18. The semiconductor process equipment according to claim 16 or 17, characterized in that, The first air inlet (211) and the second air inlet (221) are both located on the outer side wall of the air delivery assembly (200); the first air outlet (212) and the second air outlet (222) are alternately arranged on the air delivery assembly (200) at circumferential intervals.

19. The semiconductor process equipment according to claim 18, characterized in that, In the first air supply channel (210), the air supply path length between each of the first air outlets (212) and the first air inlet (211) is the same; in the second air supply channel (220), the air supply path length between each of the second air outlets (222) and the second air inlet (221) is the same.

20. The semiconductor process equipment according to claim 19, characterized in that, The first air delivery channel (210) has multiple layers spiraling radially from the outside to the inside. The channel segments in each layer are all arc-shaped, and the end of each outer channel segment is located in the middle of the adjacent inner channel segment. The second air delivery channel (220) has multiple layers spiraling radially from the outside to the inside. The channel segments in each layer are all arc-shaped, and the end of each outer channel segment is located in the middle of the adjacent inner channel segment.

21. The semiconductor process equipment according to claim 20, characterized in that, The semiconductor process equipment also includes an upper housing (300), a lower housing (400), and a target material (500). The upper housing (300) is provided with an upper electrode assembly (310), which is located above the target material (500), and the inner liner (110) is located below the target material (500); the gas delivery assembly (200) is fixedly installed between the upper housing (300) and the lower housing (400).

22. The semiconductor process equipment according to claim 21, characterized in that, The upper housing (300) includes an upper adapter (320) and a grounding shield (330) located above the upper adapter (320). The lower housing (400) includes a lower adapter (430) and a grounding housing (440) located below the lower adapter (430). The air supply assembly (200) is fixedly installed between the upper adapter (320) and the lower adapter (430), and the first air inlet (211) and the second air inlet (221) are connected to an air source (700).

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