A mechanism for inhibiting wobble of a support pin

Abstract

The utility model provides a kind of mechanism for inhibiting support pin to sway, including pedestal, pedestal is used to carry substrate in CVD process.The pedestal is provided with mounting hole, bushing is assembled in mounting hole, the inner hole of bushing constitutes support hole, and support pin is slidably connected with support hole.The one end of mounting hole is adjustably provided with locating disc, and locating disc is provided with positioning hole, and support pin is arranged through positioning hole.Positioning hole is used to constrain the radial sway of support pin.Support pin in the utility model is doubly constrained by bushing and adjustable locating disc in the process of movement, can effectively inhibit the sway in the process of movement of support pin, improve the stability and reliability of substrate transmission, reduce particle pollution, and protect the high yield of CVD process.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor and display panel manufacturing equipment, and specifically relates to a mechanism for suppressing the wobbling of support pins. Background Technology

[0002] Chemical vapor deposition (CVD) is a key process for fabricating thin films for precision devices such as semiconductors and display panels. In this process, the substrate (such as glass or silicon wafer) is supported by a heated base within the equipment and needs to be heated to a high temperature to complete the thin film deposition in a reactive gas environment.

[0003] In automated equipment, substrate loading and unloading are achieved through a multi-point support pin system. During the transfer phase, the support pins rise to receive substrates delivered by the robotic arm, or lift them for the robotic arm to remove. The stability of the support pins' posture is crucial during this process. In existing technologies, dedicated mounting holes (commonly referred to in the industry as "roller bush holes") are typically machined on the base, and bushings are press-fitted into these holes. Through precise engagement with the support pins, radial wobble is limited, thereby ensuring the verticality and movement accuracy of the support pins and providing a fundamental guarantee for the smooth transfer of substrates.

[0004] However, the applicant discovered that the existing support structure still has significant defects. In the high-temperature environment of actual CVD process operation, the differences in the thermal expansion coefficients of components such as the base, bushing, and support pins will cause changes in the original precise fit, creating or increasing the fit clearance. This amplifies the radial wobble of the support pins during loading and unloading. The wobble of the support pins leads to sliding or friction between the substrate and the support pins, causing substrate scratches. In extreme cases, it can lead to the direct breakage of brittle substrates (such as silicon wafers or glass). Friction-generated particles fall into the chamber or onto the back of the substrate, causing film defects.

[0005] Therefore, the above problems urgently need to be solved. Utility Model Content

[0006] Purpose of the utility model: In order to overcome the above shortcomings, this utility model provides a mechanism for suppressing the wobbling of the support pin. By setting up double constraints to suppress the wobbling of the support pin, the stability and reliability of substrate transmission are improved, particle contamination is reduced, and the high yield of CVD process is guaranteed.

[0007] Technical Solution: To achieve the above objectives, this utility model provides a mechanism for suppressing the wobbling of a support pin, including a base for supporting a substrate during a CVD process. The base has a mounting hole, within which a bushing is fitted. The inner hole of the bushing forms a support hole, to which a support pin is slidably connected. An adjustable positioning plate is provided at one end of the mounting hole, and the positioning plate has a positioning hole through which the support pin passes. The positioning hole constrains the radial wobbling of the support pin.

[0008] In CVD processes, support pins on the substrate mounting base are pre-raised to facilitate substrate loading and unloading by robotic arms. The robotic arm feeds the substrate into the process chamber and places it on the top of the support pin. Then, the support pin descends, smoothly placing the substrate on the base for heating. Once deposition is complete, the support pin rises again, lifting the coated substrate from the base and separating it. The robotic arm then reaches in and removes the substrate from the support pin. The support pin design facilitates substrate loading and unloading by the robotic arm, preventing collisions. However, if the support pins vibrate, tilt, or move asynchronously during their ascent and descent, slippage or friction can occur between the substrate and the support pin, or between the substrate and the base, causing scratches on the substrate. In extreme cases, this can lead to the direct breakage of brittle substrates (such as silicon wafers or glass), resulting in significant losses. Unstable movement of the support pins can also cause friction between the support pins and the substrate or base hole walls, generating tiny particulate contaminants. These particles can fall onto the substrate or into the process chamber, forming defects after coating and severely affecting the electrical performance and reliability of the chip.

[0009] In this invention, the support pin is constrained by the bushing and the adjustable positioning plate during movement, forming a double constraint. This effectively suppresses the shaking of the support pin during movement, improves the stability and reliability of substrate transmission, reduces particle contamination, and ensures a high yield for the CVD process.

[0010] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, the positioning plate is provided with multiple oblong holes. The positioning plate is adjusted to the base through fasteners passing through the oblong holes. During assembly, fine adjustments to the positioning plate are allowed to ensure that the positioning holes on it are precisely aligned with the support holes provided on the bushing, preventing the support pin from getting stuck or moving improperly due to machining or assembly errors.

[0011] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, the long axis of the oblong hole extends towards the center of the positioning hole. This arrangement allows the positioning plate to perform radial fine-tuning to achieve concentricity correction. Simultaneously, when the positioning plate expands due to heat, it can generate slight radial slippage to release thermal stress.

[0012] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, the mounting hole is a multi-stage countersunk through hole, including a primary countersunk head and a secondary countersunk head. The bushing is connected inside the primary countersunk head, and the positioning plate is connected inside the secondary countersunk head. The bushing is installed in the primary countersunk head, and the positioning plate installed in the secondary countersunk head provides axial restraint for the bushing, preventing axial movement of the bushing during frequent sliding of the support pin and ensuring the positional stability of the support hole.

[0013] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, the positioning plate has a boss on the side near the bushing, and the outer diameter of the boss is smaller than the inner diameter of the first-stage countersunk head. When the positioning plate is installed on the second-stage countersunk head, the boss can extend into the first-stage countersunk head and form a fit with the end face of the bushing, which can pre-position the installation of the positioning plate and assist in the rapid alignment of the positioning hole and the support hole. At the same time, when the support pin is subjected to radial force, the boss can provide support for the bushing, reduce the offset of the support hole caused by the bushing under force, and enhance the suppression effect on the wobbling of the support pin.

[0014] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, both the bushing and the support pin are made of ceramic. Ceramic materials possess excellent high-temperature resistance and a low coefficient of friction, enabling them to adapt to the high-temperature environment of the CVD process. Their low coefficient of thermal expansion reduces changes in the fit clearance caused by material expansion differences at high temperatures. In addition, ceramic materials exhibit good wear resistance and chemical stability, reducing frictional wear between the support pin and the bushing, minimizing the generation of particulate contaminants, and preventing pollution of the process environment.

[0015] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, the positioning plate is made of heat-resistant aluminum alloy. While ensuring good mechanical strength, the heat-resistant aluminum alloy also possesses good high-temperature stability and thermal conductivity, preventing the positioning plate from affecting the accuracy of the positioning holes due to thermal deformation.

[0016] Furthermore, in the aforementioned mechanism for suppressing the wobbling of the support pin, a connector is attached to the end of the support pin furthest from the pin, and the connector is made of heat-resistant aluminum alloy. The support pin itself is made of ceramic, which is not impact-resistant and difficult to process. The connector absorbs and buffers the impact and vibration from the drive mechanism, protecting the support pin and ensuring its long-term stable operation. Moreover, the metal connector is easy to process into a structure compatible with the drive mechanism, reducing manufacturing difficulty and cost.

[0017] Furthermore, in the aforementioned mechanism for suppressing the swaying of the support pin, the bushing sidewall is provided with a through hole. When the support pin moves within the bushing, the through hole in the sidewall acts as a vent, preventing excessive resistance to the support pin's movement, maintaining a balance between the internal and external air pressures of the bushing, and ensuring smooth, stable, and rapid response of the support pin's lifting and lowering motion. Simultaneously, the through hole weakens the radial stiffness of the bushing, alleviating thermal stress between the base and the ceramic bushing, and preventing the bushing from cracking.

[0018] As can be seen from the above technical solution, this utility model has the following beneficial effects: The mechanism for suppressing the wobbling of the support pin in this utility model solves the problem of support pin wobbling caused by the difference in thermal expansion of materials under high temperature environments through the dual constraint structure design of the bushing and the adjustable positioning plate. The dual constraint structure improves the posture stability of the support pin during movement, reduces the risk of friction during substrate handover, and avoids production accidents such as substrate scratches or cracks. The adjustable design of the positioning plate and the multi-stage countersunk structure of the mounting holes ensure smooth and unimpeded movement of the support pin, and also provide reliable axial limiting for the bushing, preventing it from shifting during long-term use, thus enhancing the overall stability and service life of the mechanism. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the mechanism for suppressing the wobbling of the support pin according to this utility model; Figure 2 This is a partial cross-sectional view of the mounting hole location in the mechanism for suppressing the wobbling of the support pin in this utility model. Figure 3 This is an assembly diagram of the bushing, support pin, and positioning plate. Figure 4 This is a cross-sectional view of the mounting hole; Figure 5 A schematic diagram of the positioning disk. Figure 6 This is a schematic diagram of the structure of Embodiment 2 of this utility model.

[0020] In the diagram: 1. Base, 11. Mounting hole, 111. Primary countersunk head, 112. Secondary countersunk head, 2. Bushing, 21. Support hole, 3. Support pin, 4. Positioning plate, 41. Positioning hole, 42. Waist-shaped hole, 43. Boss, 5. Connector. Detailed Implementation

[0021] Example 1 like Figure 1-3 The illustrated mechanism for suppressing the wobbling of a support pin includes a base 1, which supports a substrate during a CVD process. The base 1 has a mounting hole 11, within which a bushing 2 is fitted. The inner hole of the bushing 2 forms a support hole 21, to which a support pin 3 is slidably connected. One end of the mounting hole 11 is adjustablely fitted with a positioning plate 4, which has a positioning hole 41 through which the support pin 3 passes. The positioning hole 41 constrains the radial wobbling of the support pin 3.

[0022] In this embodiment, the positioning disk 4 is provided with multiple oblong holes 42. The positioning disk 4 is adjustablely connected to the base 1 through fasteners passing through the oblong holes 42.

[0023] In this embodiment, the long axis of the waist-shaped hole 42 extends towards the center of the positioning hole 41. This arrangement allows the positioning disk 4 to be finely adjusted radially to achieve concentricity correction.

[0024] like Figure 4 The mechanism shown for suppressing the wobbling of the support pin has a multi-stage countersunk through hole 11, which includes a primary countersunk head 111 and a secondary countersunk head 112. The bushing 2 is connected to the primary countersunk head 111, and the positioning plate 4 is connected to the secondary countersunk head 112.

[0025] like Figure 5 The mechanism shown suppresses the wobbling of the support pin. The positioning plate 4 has a boss 43 on the side near the bushing 2. The outer diameter of the boss 43 is smaller than the inner diameter of the first-stage countersunk head 111.

[0026] In this embodiment, the bushing 2 and the support pin 3 are both made of ceramic.

[0027] In this embodiment, the positioning disk 4 is made of heat-resistant aluminum alloy.

[0028] In this embodiment, a connector 5 is connected to the end of the support pin 3 furthest away from the connector 5, which is made of heat-resistant aluminum alloy. The support pin 3 is made of ceramic, which is not impact-resistant and difficult to process. The connector 5 is provided to absorb and buffer the impact and vibration from the drive mechanism, thus protecting the support pin 3.

[0029] The working principle of this utility model includes: Before the CVD process begins, the support pin 3 is in its initial low position, and the substrate is fed into the process chamber by the robot arm. When the substrate needs to be loaded, the drive mechanism drives the support pin 3 to slide upward along the support hole 21 of the bushing 2 via the connector 5, rise through the positioning hole 41 of the positioning disk 4, and lift the substrate that has been fed in and suspended by the robot arm from below. Subsequently, the robot arm exits the chamber, and the support pin 3 slowly descends again, placing the substrate smoothly on the bearing surface of the base 1. After the process is completed, the support pin 3 rises again according to the above process, pushing the substrate away from the base 1 so that the robot arm can remove it.

[0030] Example 2 The difference between this embodiment and Embodiment 1 is that... Figure 6 The mechanism shown suppresses the swaying of the support pin. The bushing 2 has a through hole on its side wall, which is designed as a waist hole and is aligned with the axis of the bushing 2. When the support pin 3 moves within the bushing 2, it moves like a piston in a cylinder, experiencing high resistance. The through hole in the side wall acts as a vent, preventing excessive resistance and maintaining pressure balance between the inside and outside of the bushing. This ensures smooth, stable, and rapid lifting and lowering of the support pin. The through hole in the side wall of the bushing 2 structurally reduces its radial stiffness, providing a small deformation space to prevent stress concentration and breakage, thus extending its lifespan.

[0031] The above embodiments are exemplary and are intended to illustrate the technical concept and features of this utility model, so that those skilled in the art can understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A mechanism for suppressing the wobbling of a support pin, characterized in that: The device includes a base (1) for supporting a substrate in a CVD process; the base (1) has a mounting hole (11) and a bushing (2) is fitted inside the mounting hole (11). The inner hole of the bushing (2) forms a support hole (21), and a support pin (3) is slidably connected to the support hole (21); a positioning plate (4) is adjustable at one end of the mounting hole (11), and the positioning plate (4) has a positioning hole (41). The support pin (3) passes through the positioning hole (41); the positioning hole (41) is used to constrain the radial movement of the support pin (3).

2. The mechanism for suppressing the wobbling of the support pin according to claim 1, characterized in that: The positioning plate (4) is provided with multiple waist-shaped holes (42); the positioning plate (4) is adjustablely connected to the base (1) through the waist-shaped holes (42) and fasteners.

3. The mechanism for suppressing the wobbling of the support pin according to claim 2, characterized in that: The long axis of the waist-shaped hole (42) extends in the direction of the center of the positioning hole (41).

4. The mechanism for suppressing the wobbling of the support pin according to claim 2, characterized in that: The mounting hole (11) is a multi-stage countersunk through hole. The mounting hole (11) includes a first-stage countersunk head (111) and a second-stage countersunk head (112). The bushing (2) is connected inside the first-stage countersunk head (111), and the positioning plate (4) is connected inside the second-stage countersunk head (112).

5. The mechanism for suppressing the wobbling of the support pin according to claim 4, characterized in that: The positioning plate (4) has a boss (43) on the side near the bushing (2), and the outer diameter of the boss (43) is smaller than the inner diameter of the first-stage countersunk head (111).

6. The mechanism for suppressing the wobbling of the support pin according to claim 1, characterized in that: The bushing (2) and the support pin (3) are both made of ceramic.

7. The mechanism for suppressing the wobbling of the support pin according to claim 1, characterized in that: The positioning plate (4) is made of heat-resistant aluminum alloy.

8. The mechanism for suppressing the wobbling of the support pin according to claim 1, characterized in that: The support pin (3) is connected to a connector (5) at one end away from the support pin, and the connector (5) is made of heat-resistant aluminum alloy.

9. The mechanism for suppressing the wobbling of the support pin according to claim 1, characterized in that: The bushing (2) has through holes on its side wall.

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