A semiconductor wafer electroplating cell jet device

Abstract

The utility model discloses a semiconductor wafer electroplating tank jet flow device relates to electroplating tank jet flow technical field, the utility model discloses a support is provided with the jet flow subassembly on the top, the jet flow subassembly top is provided with the moving assembly, the moving assembly top is provided with the angle adjusting subassembly, the jet flow subassembly includes the fixed plate, the number of fixed plate is two, and the fixed plate bottom is fixedly connected with the support, and the fixed plate top is fixedly connected with the water pump. The utility model discloses through the second motor drive second swingle rotation, drives second sliding plate to go up and down, and then adjusts the angle of shunt plate through the connecting belt, and the angle and the distance of the nozzle and wafer are changed flexibly, and the adjustability of process parameter is improved, and the demand of different plating process is satisfied, and the filter screen in the processing box and the water outlet groove carry out the filtration to the recovered electrolyte, and intercept the impurity particle, avoid its re -entering circulation system and polluting wafer surface or blocking nozzle.

Description

Technical Field

[0001] This utility model belongs to the field of electroplating tank spraying technology, and in particular relates to a semiconductor wafer electroplating tank spraying device. Background Technology

[0002] As semiconductor devices develop towards higher precision and higher density, extremely high requirements are placed on the uniformity, surface quality, and process stability of wafer electroplating. Among these requirements, the jetting device, as a core component for controlling the flow state of the electrolyte, directly affects the transport efficiency of metal ions, the uniformity of current distribution on the wafer surface, and the final coating quality. Therefore, it has become an important research direction for optimizing the electroplating process.

[0003] Chinese patent application CN219951254U discloses a spray device for a semiconductor wafer electroplating tank, including nozzles and a spray plate. The spray plate has a main channel for water flow and branch channels connected to the main channel. The surface of the spray plate has several nozzle mounting holes connected to the branch channels. The back of the spray plate has a water supply port connected to the main channel. Each nozzle includes a nozzle seat and a nozzle head. The nozzle seat includes a threaded pipe and a connecting seat at the front end of the pipe. A cavity is provided inside the connecting seat. The pipe communicates with the cavity. The nozzle head is detachably installed inside the cavity. A spray hole is provided at the front end of the nozzle head. The nozzle head is screwed to the nozzle mounting hole. The nozzle of this invention is easy to clean.

[0004] The above device achieves convenient nozzle cleaning by setting a detachable nozzle structure, solving the problems of easy clogging and difficult maintenance of traditional nozzles. In the existing electroplating tank spray device, the nozzles are mostly fixed, and the coverage range cannot be flexibly adjusted according to the wafer size or electroplating process requirements. When processing wafers of different diameters, it is easy to have insufficient electrolyte rinsing in the edge area or excessive rinsing in the center area, resulting in uneven coating thickness. The distance between the spray plate and the wafer surface directly affects the impact intensity of the electrolyte. At the same time, the lack of a height adjustment mechanism makes it difficult to adjust the spray angle according to the process requirements of different metal coatings, which limits the process adaptability.

[0005] To address these issues, we provide a semiconductor wafer electroplating tank jetting device. Utility Model Content

[0006] The purpose of this invention is to provide a jetting device for a semiconductor wafer electroplating tank. By combining a moving component and an angle adjustment component, it solves the problems in the prior art where the fixed installation of the nozzle in the electroplating tank jetting device leads to an inflexible adjustment of the coverage area, resulting in insufficient or excessive rinsing, as well as the problem of lacking a height adjustment mechanism, making it difficult to adjust the jetting angle.

[0007] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution.

[0008] This utility model relates to a jetting device for a semiconductor wafer electroplating tank, comprising a support frame, a jetting assembly at the top of the support frame, a movable assembly at the top of the jetting assembly, and an angle adjustment assembly at the top of the movable assembly. The jetting assembly includes two fixed plates, the bottom of which are fixedly connected to the support frame. A water pump is fixedly connected to the top of the fixed plates. One side of the water pump is connected to a water tank via a water pipe. Two flow dividers are connected to the top of the water pump via water pipes. Spray nozzles are connected to the bottom of the flow dividers and are equidistantly spaced. The fixed plates are bolted to the top of the support frame. The system features a stable connection to provide overall support. The water pump is vertically fixed to the top of the fixed plate and is an IHF50-32-125 fluoroplastic centrifugal pump. The water inlet of the pump is connected to the water tank via a water pipe, and the water outlet is connected to two flow dividers via a water pipe. The top edge of the flow dividers is movably connected to the bottom of the first slide plate via a rotating shaft, which rotates around the shaft to change the spray direction. The bottom is connected to the nozzles via threads. During operation, the water pump presses the electrolyte in the water tank into the flow dividers through the pipeline, and then sprays it out in a columnar shape from each nozzle to form a uniform spray area. This ensures the stability of the spray process and the uniformity of the liquid source, adapts to the needs of wafers of different sizes, and improves the uniformity of electrolyte distribution and coating quality during electroplating.

[0009] The present invention is further configured such that the moving component includes a first sliding plate, the bottom of which is movably connected to a flow divider plate via a rotating shaft, a processing box is slidably connected to one side of the first sliding plate, a first motor is fixedly connected to one side of the processing box, a first pulley is fixedly connected to the output end of the first motor, a second pulley is connected to the first pulley via belt drive, a first rotating rod is fixedly connected to one side of the second pulley, the surface of the first rotating rod is threadedly connected to the first sliding plate, and the first motor drives the first rotating rod to rotate via the pulley drive, thereby moving the first sliding plate and the flow divider plate to achieve nozzle position adjustment. The first motor adopts a Dunkermotoren GR63x55 brushless DC motor, which realizes the adjustment of the relative position of the wafer and the nozzle according to the wafer size, improving the adaptability of the device to wafers of different specifications.

[0010] This invention is further configured such that the angle adjustment component includes a second motor, the bottom of which is fixedly connected to a first slide plate, a third pulley fixedly connected to the output end of the second motor, a fourth pulley connected to the third pulley via belt drive, a second rotating rod fixedly connected to the top of the fourth pulley, a second slide plate threadedly connected to the surface of the second rotating rod, a connecting mechanism movably connected to one side of the second slide plate via a rotating shaft, and two limiting plates fixedly connected to the top side of the first slide plate. The limiting plates are slidably connected to the second slide plate. The second motor drives the second rotating rod to rotate via belt drive, causing the threadedly connected second slide plate to rise and fall smoothly along the limiting plates. The second motor is a Dunkermotoren GR63x55 brushless DC motor. The limiting plates guide and limit the second slide plate, ensuring the stability of the lifting process. This structure drives the connecting mechanism to move by the lifting of the second slide plate, thereby controlling the tilt angle of the diverter plate and realizing flexible adjustment of the nozzle spray angle. This solves the problem of fixed spray angle in traditional devices, optimizes the electrolyte impact direction according to the electroplating process requirements, and improves the uniformity of the coating on the wafer surface.

[0011] The present invention is further configured such that the connecting mechanism includes a connecting belt, the top of which is movably connected to the second slide plate via a rotating shaft, the bottom of which is movably connected to the diverter plate via a rotating shaft, and a pulley is movably connected to one side of the inner cavity of the first slide plate via a rotating shaft. There are two pulleys, and the connecting belt is slidably connected to the pulleys. The connecting belt is movably connected to the second slide plate and the diverter plate via rotating shafts respectively, and the two pulleys achieve guided sliding to form a stable force transmission path. At the same time, the sliding connection of the pulleys reduces component wear and extends the service life of the device.

[0012] The present invention is further configured such that a water outlet groove is provided at the bottom of the inner cavity of the processing box, a filter screen is fixedly connected to the top of the water outlet groove, a first water outlet is provided on one side of the processing box, and a first pad is fixedly connected to the bottom of the processing box. The first pads are equidistant from each other. The water outlet groove in the inner cavity of the processing box cooperates with the top filter screen to filter the recovered electrolyte in real time, effectively intercepting impurity particles. The first water outlet on one side facilitates the export of the filtered electrolyte. The first pad enhances the stability of the overall structure, reduces the device offset caused by vibration during the spraying process, provides a stable support foundation, and avoids the impact of shaking on the nozzle spraying accuracy and wafer positioning accuracy.

[0013] The present invention is further configured such that a second pad is fixedly connected to the bottom of the bracket, and the second pads are equidistant from each other. The second pads provide a stable support foundation for the water pump, reducing the offset problem caused by vibration and indirectly ensuring the stability of electroplating quality.

[0014] The present invention is further configured such that a water inlet is provided on the top of the treatment tank and a second water outlet is provided on one side of the water tank. The water inlet on the top of the water tank facilitates the addition of electrolyte, while the second water outlet on one side of the water tank provides a passage for the electrolyte to flow out.

[0015] The present invention has the following beneficial effects.

[0016] 1. This utility model uses a first motor to drive a first rotating rod to rotate, so that the processing box slides smoothly along the first sliding plate. The nozzle position is adjusted according to the wafer size to ensure that the electrolyte evenly covers the wafer surface. This solves the problems of fixed spray range and poor coating uniformity in the existing electroplating tank spray device, and improves the adaptability of the device to wafers of different specifications.

[0017] 2. This utility model uses a second motor to drive a second rotating rod to rotate, which in turn drives the second sliding plate to rise and fall. The angle of the flow divider is adjusted by the connecting belt, which flexibly changes the angle and distance between the nozzle and the wafer, improving the adjustability of process parameters and meeting the needs of different coating processes. The filter screen and water tank in the processing box filter the recovered electrolyte, intercepting impurity particles and preventing them from re-entering the circulation system to contaminate the wafer surface or clog the nozzle. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0019] Figure 1 This is a perspective view of a jetting device for a semiconductor wafer electroplating tank.

[0020] Figure 2 This is a right-side perspective view of a jetting device for semiconductor wafer electroplating tanks.

[0021] Figure 3 This is a cross-sectional view of the processing box in a semiconductor wafer electroplating tank jetting device.

[0022] Figure 4 In a semiconductor wafer electroplating tank jetting device Figure 3 A magnified structural diagram of part A in the middle.

[0023] Figure 5 This is a perspective view of the processing box in a semiconductor wafer electroplating tank jetting device.

[0024] In the attached diagram: 1. Bracket; 2. Spray assembly; 21. Fixing plate; 22. Water pump; 23. Water tank; 24. Diverter plate; 25. Nozzle; 3. Moving assembly; 31. First sliding plate; 32. Processing tank; 33. First motor; 34. First pulley; 35. Second pulley; 36. First rotating rod; 4. Angle adjustment assembly; 41. Second motor; 42. Third pulley; 43. Fourth pulley; 44. Second rotating rod; 45. Second sliding plate; 46. Connecting mechanism; 461. Connecting belt; 462. Pulley; 47. Limiting plate; 5. Water outlet tank; 6. Filter screen; 7. First water outlet; 8. First pad; 9. Second pad; 10. Water inlet; 11. Second water outlet. Detailed Implementation

[0025] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0026] Please see Figure 1-5 This utility model is a jetting device for a semiconductor wafer electroplating tank, including a support 1, a jetting component 2 on the top of the support 1, a moving component 3 on the top of the jetting component 2, and an angle adjustment component 4 on the top of the moving component 3. The jetting component 2 includes two fixed plates 21. The bottom of the fixed plates 21 is fixedly connected to the support 1, and a water pump 22 is fixedly connected to the top of the fixed plates 21. A water tank 23 is connected to one side of the water pump 22 through a water pipe. A diverter plate 24 is connected to the top of the water pump 22 through a water pipe. There are two diverter plates 24. The bottom of the diverter plate 24 is connected to a nozzle 25, and the nozzles 25 are equidistant from each other.

[0027] Specifically: The fixed plate 21 is rigidly connected to the top of the bracket 1 by bolts, providing stable support for the whole. The water pump 22 is vertically fixed to the top of the fixed plate 21. The water pump 22 is an IHF50-32-125 fluoroplastic centrifugal pump. The water inlet of the water pump 22 is connected to the water tank 23 through a water pipe, and the water outlet is connected to two diverter plates 24 through a water pipe. The top edge of the diverter plate 24 is movably connected to the bottom of the first slide plate 31 by a rotating shaft. It rotates around the rotating shaft to change the spray direction. The bottom is connected to the nozzle 25 by a thread. When working, the water pump 22 presses the electrolyte in the water tank 23 into the diverter plate 24 through the pipeline, and then sprays it out in a columnar shape from each nozzle 25 to form a uniform spray area, which ensures the stability of the spray process and the uniformity of the liquid source, adapts to the needs of wafers of different sizes, and improves the uniformity of electrolyte distribution and coating quality during electroplating.

[0028] The moving component 3 includes a first slide plate 31, the bottom of which is movably connected to the diverter plate 24 via a pivot. A processing box 32 is slidably connected to one side of the first slide plate 31, and a first motor 33 is fixedly connected to one side of the processing box 32. A first pulley 34 is fixedly connected to the output end of the first motor 33. A second pulley 35 is connected to the first pulley 34 via a belt drive. A first rotating rod 36 is fixedly connected to one side of the second pulley 35, and its surface is threadedly connected to the first slide plate 31. The angle adjustment component 4 includes a second motor 41, the bottom of which is fixedly connected to the first slide plate 31. A third pulley 42 is fixedly connected to the output end of the second motor 41. A fourth pulley 43 is connected to the third pulley 42 via a belt drive. A second rotating rod 44 is fixedly connected to the top of the fourth pulley 43. A second slide plate 45 is threadedly connected to the surface of the second rotating rod 44, and a connecting mechanism 46 is movably connected to one side of the second slide plate 45 via a pivot. Two limiting plates 47 are fixedly connected to the top side of the first slide plate 31. The limiting plates 47 are slidably connected to the second slide plate 45. The connecting mechanism 46 includes a connecting belt 461. The top of the connecting belt 461 is movably connected to the second slide plate 45 through a pivot. The bottom of the connecting belt 461 is movably connected to the diverter plate 24 through a pivot. Two pulleys 462 are movably connected to one side of the inner cavity of the first slide plate 31 through a pivot. The connecting belt 461 is slidably connected to the pulleys 462. A water outlet 5 is opened at the bottom of the inner cavity of the treatment tank 32. A filter screen 6 is fixedly connected to the top of the water outlet 5. A first water outlet 7 is opened on one side of the treatment tank 32. A first pad 8 is fixedly connected to the bottom of the treatment tank 32. The first pads 8 are equidistant from each other. A second pad 9 is fixedly connected to the bottom of the bracket 1. The second pads 9 are equidistant from each other. A water inlet 10 is opened at the top of the treatment tank 32. A second water outlet 11 is opened on one side of the water tank 23.

[0029] Specifically: The first motor 33 drives the first rotating rod 36 to rotate via a belt pulley, thereby moving the first slide plate 31 and the flow divider plate 24 to adjust the position of the nozzle 25. The first motor 33 is a Dunkermotoren GR63x55 brushless DC motor, which adjusts the relative position of the wafer and the nozzle 25 according to the wafer size, improving the device's adaptability to wafers of different specifications. The second motor 41 drives the second rotating rod 44 to rotate via a belt pulley, causing the threaded second slide plate 45 to rise and fall smoothly along the limiting plate 47. The second motor 41 is also a Dunkermotoren GR63x55 brushless DC motor. The limiting plate 47 guides and limits the second slide plate 45, ensuring the stability of the lifting process. This structure uses the lifting of the second slide plate 45 to drive the connecting mechanism 46, thereby controlling the tilt angle of the flow divider plate 24 and achieving flexible adjustment of the nozzle 25's spray angle. This solves the problem of fixed spray angle in traditional devices and optimizes the electrolyte flushing according to the electroplating process requirements. The direction of the spraying improves the uniformity of the coating on the wafer surface. The connecting belt 461 is movably connected to the second slide plate 45 and the diverter plate 24 respectively through the rotating shaft, and is guided by two pulleys 462 to form a stable force transmission path. At the same time, the sliding connection of the pulleys 462 reduces component wear and extends the service life of the device. The water outlet 5 in the inner cavity of the processing tank 32 cooperates with the top filter screen 6 to filter the recovered electrolyte in real time, effectively intercepting impurity particles. The first water outlet 7 on one side facilitates the export of the filtered electrolyte. The first pad 8 enhances the stability of the overall structure, reduces the device offset caused by vibration during the spraying process, and provides a stable support foundation to avoid affecting the spraying accuracy of the nozzle 25 and the wafer positioning accuracy due to shaking. The second pad 9 provides a stable support foundation for the water pump 22, reduces the offset problem caused by vibration, and indirectly ensures the stability of the electroplating quality. The water inlet 10 at the top of the water tank 23 facilitates the addition of electrolyte, and the second water outlet 11 on one side of the water tank 23 provides a passage for the electrolyte to flow out.

[0030] The working principle of this utility model is as follows: the operator injects clean electrolyte into the water tank 23 through the water inlet 10 at the top of the water tank 23, and then starts the water pump 22. The water pump 22 draws electrolyte from the water tank 23 through the water pipe, and after being pressurized, the electrolyte is diverted and transported to the diversion plate 24 through the water pipe. After the electrolyte is evenly distributed inside the diversion plate 24, it is sprayed out from the nozzle 25 to form a uniform spray area covering the wafer surface, providing a stable electrolyte impact environment for wafer electroplating.

[0031] Then, the first motor 33 is started. Since the surface of the first rotating rod 36 is threadedly connected to the first sliding plate 31, the rotation of the first rotating rod 36 is converted into linear movement of the first sliding plate 31, which in turn drives the flow divider plate 24 and the bottom nozzle 25 to move synchronously, ensuring that the jet can completely cover the wafer surface. If necessary, the second motor 41 is started. The output end of the second motor 41 drives the third pulley 42 to rotate. The third pulley 42 drives the fourth pulley 43 to rotate through belt transmission. The second rotating rod 44 rotates accordingly. Since the surface of the second rotating rod 44 is threadedly connected to the second sliding plate 45, and the first rotating rod 46 is threadedly connected to the first sliding plate 45, and the second ... Under the guidance and limiting action of the limiting plate 47, the second slide plate 45 can only move in the vertical direction. The rotation of the second rotating rod 44 is converted into the smooth lifting and lowering of the second slide plate 45. When the second slide plate 45 is lifted and lowered, the connecting belt 461 is driven to move through the rotating shaft. Under the guidance of the two pulleys 462 in the inner cavity of the first slide plate 31, the connecting belt 461 changes the direction of force, thereby pulling the diverter plate 24 to rotate around the rotating shaft connected to the first slide plate 31 at its top, realizing the adjustment of the tilt angle of the diverter plate 24 and the nozzle 25, so that the electrolyte spraying direction can be adapted to the electroplating requirements of different areas of the wafer.

[0032] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific implementation methods described. The present specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present utility model, so that those skilled in the art can better understand and utilize the present utility model.

Claims

1. A semiconductor wafer electroplating tank jetting device, comprising a support (1), characterized in that: The bracket (1) is provided with a jet assembly (2) on top, the jet assembly (2) is provided with a moving assembly (3) on top, and the moving assembly (3) is provided with an angle adjustment assembly (4) on top. The jet assembly (2) includes a fixing plate (21), and there are two fixing plates (21). The bottom of the fixing plate (21) is fixedly connected to the bracket (1). A water pump (22) is fixedly connected to the top of the fixing plate (21). A water tank (23) is connected to one side of the water pump (22) through a water pipe. A diverter plate (24) is connected to the top of the water pump (22) through a water pipe. There are two diverter plates (24). A nozzle (25) is connected to the bottom of the diverter plate (24). The nozzles (25) are equidistant from each other.

2. The semiconductor wafer electroplating tank jetting device according to claim 1, characterized in that: The moving component (3) includes a first slide plate (31), the bottom of which is movably connected to a diverter plate (24) via a rotating shaft. A processing box (32) is slidably connected to one side of the first slide plate (31), and a first motor (33) is fixedly connected to one side of the processing box (32). A first pulley (34) is fixedly connected to the output end of the first motor (33), and a second pulley (35) is connected to the first pulley (34) via a belt drive. A first rotating rod (36) is fixedly connected to one side of the second pulley (35), and the surface of the first rotating rod (36) is threadedly connected to the first slide plate (31).

3. The semiconductor wafer electroplating tank jetting device according to claim 1, characterized in that: The angle adjustment component (4) includes a second motor (41), the bottom of which is fixedly connected to the first slide plate (31). The output end of the second motor (41) is fixedly connected to a third pulley (42). The third pulley (42) is connected to a fourth pulley (43) via belt drive. The top of the fourth pulley (43) is fixedly connected to a second rotating rod (44). The surface of the second rotating rod (44) is connected to a second slide plate (45) via a thread. One side of the second slide plate (45) is movably connected to a connecting mechanism (46) via a rotating shaft. A limiting plate (47) is fixedly connected to one side of the top of the first slide plate (31). There are two limiting plates (47), and the limiting plates (47) are slidably connected to the second slide plate (45).

4. The semiconductor wafer electroplating tank jetting device according to claim 3, characterized in that: The connecting mechanism (46) includes a connecting belt (461), the top of which is movably connected to the second slide plate (45) via a pivot, and the bottom of which is movably connected to the diverter plate (24) via a pivot. A pulley (462) is movably connected to one side of the inner cavity of the first slide plate (31) via a pivot. There are two pulleys (462), and the connecting belt (461) is slidably connected to the pulleys (462).

5. The semiconductor wafer electroplating tank jetting device according to claim 2, characterized in that: The bottom of the inner cavity of the treatment box (32) is provided with a water outlet trough (5), and a filter screen (6) is fixedly connected to the top of the water outlet trough (5). A first water outlet (7) is provided on one side of the treatment box (32), and a first pad (8) is fixedly connected to the bottom of the treatment box (32). The first pads (8) are equidistant from each other.

6. The semiconductor wafer electroplating tank jetting device according to claim 1, characterized in that: The bottom of the bracket (1) is fixedly connected to a second pad (9), and the second pads (9) are equidistant from each other.

7. The semiconductor wafer electroplating tank jetting device according to claim 5, characterized in that: The treatment tank (32) has a water inlet (10) on the top and a second water outlet (11) on one side of the water tank (23).

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