A blank and a smearing auxiliary tool for manufacturing a wafer electroplated conductive sealing ring

CN224870205UActive Publication Date: 2026-10-20MINGCHENG POLYMER TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202522285851.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-29
Publication Date
2026-10-20
Estimated Expiration
2035-10-29

AI Technical Summary

Technical Problem

[0003]但是由于这4片相互独立的铁片之间没有可靠的固定设计,当它们在模具中和橡胶圈共同进行硫化作业时,橡胶流动时会发生挤压变形,从而导致铁片位置发生位移,后果是铁片之间间隙不均匀甚至存在接触,又或者4个铁片不在同一平面上,导致最终产品不平整

Benefits of technology

[0013]其中,所述数个筋体沿所述挡体的内圈呈周向均匀分布。使整个挡体结构更加稳固,不易变形,延长了工装的使用寿命。

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Abstract

The utility model provides a kind of blank for making wafer electroplating conductive sealing ring and smearing auxiliary tool, blank includes annular fixed matrix;Annular conductive matrix, the diameter of conductive matrix is less than the diameter of fixed matrix;Several contacts, by the outside of conductive matrix and outward even radiation extension formation, and have reserved hole on contact;Several connecting ribs, annular array distribution between fixed matrix and conductive matrix, and the both ends of connecting rib are connected on fixed matrix, contact respectively;Fixed matrix, conductive matrix, contact and connecting rib are integrally formed into shape.This application designs the blank of integrally formed into shape from originally multiple independent iron sheet, can utilize the fixed structure on mould to fix the fixed matrix on blank, can effectively prevent displacement and deformation in the vulcanization process with rubber ring, and smearing auxiliary tool is used to assist blank and rubber ring vulcanization operation before adhesive smearing preparation work.
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Description

Technical Field

[0001] This utility model relates to the technical field of components in wafer electroplating processes. Specifically, it demonstrates a blank and coating auxiliary tooling for manufacturing conductive sealing rings for wafer electroplating. Background Technology

[0002] like Figure 1 As shown, this is an existing conductive sealing ring used in wafer electroplating processes, which is mainly composed of four independent iron sheets 100 and rubber rings 200.

[0003] However, since there is no reliable fixing design between these four independent iron pieces, when they are vulcanized together with the rubber ring in the mold, the rubber will be squeezed and deformed when it flows, which will cause the iron pieces to shift. As a result, the gaps between the iron pieces are uneven or even in contact, or the four iron pieces are not on the same plane, resulting in an uneven final product.

[0004] In addition, a hot vulcanizing adhesive needs to be applied to the iron sheet and rubber ring before vulcanization. However, due to the product size design, the area where the adhesive needs to be applied between the iron sheet and the rubber ring is very narrow. Without the aid of tools and relying solely on the intuition of technicians, it is difficult to ensure that the width and uniformity of the adhesive application are consistent. Utility Model Content

[0005] To address the above-mentioned technical problems, this utility model provides a blank and coating auxiliary tooling for manufacturing wafer electroplating conductive sealing rings, which has a simple structure and reasonable design.

[0006] The technical solution is as follows: A blank for fabricating a conductive sealing ring for wafer electroplating, comprising: Annular fixed substrate; A ring-shaped conductive substrate, the diameter of which is smaller than the diameter of the fixed substrate; Several contacts are formed by uniformly radiating outward from the outer side of the conductive substrate, and the contacts have pre-reserved holes; Several connecting ribs are arranged in a ring array between the fixed substrate and the conductive substrate, and the two ends of the connecting ribs are respectively connected to the fixed substrate and the contact. The fixed base, conductive base, contact and connecting rib are integrally formed.

[0007] In addition, the above embodiments of this utility model may also have the following additional technical features: According to one embodiment of this utility model, the fixing substrate and the conductive substrate are concentric, and the bottom end face of the fixing substrate and the bottom end face of the conductive substrate are coplanar. This allows the blank to be placed stably in the mold cavity, ensuring that pressure is applied evenly to the entire blank during vulcanization.

[0008] According to one embodiment of this utility model, four of the connecting ribs are positioned as a support, the size of which is larger than the size of the connecting ribs. The support is designed to subsequently contact the corresponding fixing structure within the mold, thus providing a stabilizing effect.

[0009] According to one embodiment of this utility model, the width of the connecting rib is smaller than the width of the contact, and the connecting rib is elongated. It can be easily and quickly removed after vulcanization using simple tools.

[0010] On the other hand, this utility model also proposes a coating auxiliary tooling, applied to the blank as described above, characterized in that it includes: An external positioning ring is used to abut against and contact the top surface of the fixed base. The base has a raised positioning shaft at its center; An annular stop is used to abut against the top surface of the conductive substrate. Several ribs are provided inside the stop, and the other ends of the ribs are connected to a bushing. The bushing is located at the center of the stop and can be fitted onto the positioning shaft.

[0011] This solved the problems of uneven glue application by technicians, unclear boundaries, and easy contamination of other areas.

[0012] The inner ring of the outer positioning ring extends inward to form several pressing bodies. These bodies firmly press the blank onto the base, preventing displacement of the conductive substrate of the blank during the adhesive application process due to operational force, thus avoiding disruption to the operation.

[0013] The ribs are evenly distributed circumferentially along the inner ring of the stop. This makes the entire stop structure more stable, less prone to deformation, and extends the service life of the tooling.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This application designs multiple independent iron sheets into a single molded blank. The fixing structure on the mold can be used to fix the fixing base on the blank, which can effectively prevent displacement and deformation during the vulcanization process of the rubber ring. Moreover, the design of the connecting ribs, fixing base and conductive base can assist in the positioning of the blank, fully offset the force of the rubber flow on the blank during vulcanization, and ensure uniform distribution and flat surface. In addition, another coating auxiliary tool designed in this application is designed for the blank. Its function is to cover the areas on the blank that do not need to be coated with adhesive, so that the operator can apply adhesive to other areas. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of an existing conductive sealing ring used in wafer electroplating processes; Figure 2 This is a simplified diagram of a blank for manufacturing a wafer electroplated conductive sealing ring, according to Embodiment 1 of this utility model. Figure 3 This is a schematic diagram of the coating auxiliary tooling in Embodiment 2 of this utility model; The relevant markings in the attached diagram are: 1-fixed base, 2-conductive base, 3-contact, 4-reserved hole, 5-connecting rib, 6-support, 7-external positioning ring, 8-base, 9-positioning shaft, 10-stop, 11-rib, 12-sleeve, 13-pressure body. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Example 1 See Figure 2 As shown, this embodiment provides a blank for fabricating a wafer electroplated conductive sealing ring, the main components of which include a fixing base 1, a conductive base 2, and connecting ribs 5.

[0018] Both the fixed base 1 and the conductive base 2 are designed in a ring shape. The diameter of the conductive base 2 is smaller than that of the fixed base 1. That is to say, the conductive base 2 is designed inside the fixed base 1. The conductive base 2 and the fixed base 1 share the same center and are fixedly connected by several connecting ribs 5.

[0019] A plurality of contacts 3 are formed by uniformly radiating outward from the outer side of the conductive substrate 2. The contacts 3 are flat and a pre-reserved hole 4 is provided in the front part of the contacts 3, which serves as the part for subsequent contact with the wafer. A plurality of connecting ribs 5 are distributed in a ring array between the fixed substrate 1 and the conductive substrate 2, and the two ends of the connecting ribs 5 are respectively connected to the fixed substrate 1 and the contacts 3.

[0020] It is worth noting that the fixing base 1, the conductive base 2, the contact 3 and the connecting rib 5 are all integrally molded and made of the same material, such as metal sheet.

[0021] The design of the fixing substrate, conductive substrate, and connecting ribs in this solution assists in the positioning of the blank, effectively counteracting the force exerted on the blank by the flow of rubber during vulcanization, ensuring uniform distribution and a smooth surface. Furthermore, the connecting ribs between the fixing substrate and the conductive substrate can be removed after product vulcanization, without affecting the functionality of the blank.

[0022] In addition to ensuring that the fixed substrate 1 and the conductive substrate 2 are concentric, the bottom surface of the fixed substrate 1 and the bottom surface of the conductive substrate 2 can also be coplanar. This coplanar design allows the blank to be placed stably in the mold cavity, ensuring that pressure is applied evenly to the entire blank during vulcanization. This avoids defects such as blank deformation or incomplete rubber filling caused by uneven stress. Furthermore, the concentric and coplanar structure makes blank manufacturing simpler and more symmetrical, reducing manufacturing difficulty and cost.

[0023] Among them, four of the connecting ribs 5 will be set as a support body 6. The size of the support body 6 is larger than the size of the connecting ribs 5. The support body will be designed to contact the corresponding fixed structure in the mold later to play a stabilizing role.

[0024] It should be noted that the width of the connecting rib 5 is much smaller than the width of the contact 3. The connecting rib 5 is a long and thin strip. The long and thin connecting rib has weak mechanical strength. After vulcanization, it can be easily and quickly cut off with simple tools such as scissors or special die, and the cut is clean and will not damage the product body. More specifically, the long and thin design can guide the break point during cutting, making the separation process more controllable and avoiding unnecessary stress or deformation to the contact or product body.

[0025] Example 2 Referring to the figure, for the blank in Example 1, this example designs a special coating auxiliary tool. Since the blank and the rubber ring need to be coated with adhesive before vulcanization, without the aid of tools, it is difficult for technicians to ensure the consistency and uniformity of the coating.

[0026] The coating auxiliary tooling in the scheme mainly includes an external positioning ring 7, a base 8, and a stop 10. The external positioning ring 7 is generally designed inside the mold cavity and is mainly used to contact the top surface of the fixed base 1 of the blank. That is to say, the size of the external positioning ring 7 is basically the same as the size of the fixed base 1.

[0027] The base 8 can be designed in the shape of a disc, and a positioning shaft 9 that protrudes upward is set at the center of the top surface of the base 8. The base 8 is used to provide a horizontal bearing surface.

[0028] The baffle 10 and the outer positioning ring 7 are both ring-shaped. The baffle 10 is used to contact the top surface of the conductive substrate 2. Similarly, the size of the baffle 10 is basically the same as that of the conductive substrate 2, but the width of the baffle 10 is smaller than that of the conductive substrate 2. The baffle 10 is used to shield and protect a part of the conductive substrate. The inner part of the unshielded area needs to be coated with adhesive.

[0029] Four ribs 11 are arranged in an array inside the stop 10. These four ribs 11 are distributed in a rotationally symmetrical manner. The other ends of the four ribs 11 are connected to a bushing 12. The bushing 12 is located at the center of the stop 10 and can also be fitted onto the positioning shaft 9. The bushing 12 and the positioning shaft 9 are in a clearance fit relationship. The designed ribs can make the entire stop structure more stable, less prone to deformation, and extend the service life of the tooling.

[0030] Through the cooperation of the positioning shaft and bushing, and with the assistance of the external positioning ring, the stop can fit against the conductive substrate of the workpiece and shield the middle part of the top surface of the conductive substrate, thus providing a shielding and protection function. It also guides the technicians in applying the adhesive, making the application width controllable and the boundaries clear, thereby improving the uniformity of the application. This fixture can achieve rapid and high-precision centering and positioning with the workpiece without the need for repeated adjustments by the operator.

[0031] Among them, the inner ring of the outer positioning ring 7 extends inward to form four pressure bodies 13. The position and number of pressure bodies 13 correspond to the position and number of support bodies 6. The pressure bodies 13 can apply downward pressure to the support bodies 6 to firmly fix the blank on the base and prevent the conductive base of the blank from shifting or deforming.

[0032] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A blank for fabricating conductive sealing rings for wafer electroplating, characterized in that, include: Annular fixed substrate (1); A ring-shaped conductive substrate (2) has a diameter smaller than that of the fixed substrate (1). Several contacts (3) are formed by uniformly radiating outward from the outer side of the conductive substrate (2), and the contacts (3) have reserved holes (4). Several connecting ribs (5) are arranged in a ring array between the fixed base (1) and the conductive base (2), and the two ends of the connecting ribs (5) are respectively connected to the fixed base (1) and the contact (3); The fixed base (1), conductive base (2), contact (3) and connecting rib (5) are integrally formed.

2. A blank for fabricating a conductive sealing ring for wafer electroplating according to claim 1, characterized in that, The fixed substrate (1) and the conductive substrate (2) share the same center, and the bottom surface of the fixed substrate (1) is coplanar with the bottom surface of the conductive substrate (2).

3. A blank for fabricating a conductive sealing ring for wafer electroplating according to claim 1, characterized in that, Four of the connecting ribs (5) are positioned as a support (6), the size of which is larger than that of the connecting ribs (5).

4. A blank for fabricating a conductive sealing ring for wafer electroplating according to claim 1, characterized in that, The width of the connecting rib (5) is smaller than the width of the contact (3), and the connecting rib (5) is a long and thin strip.

5. A coating auxiliary tooling, applied to a blank as described in any one of claims 1 to 4, characterized in that, include: An external positioning ring (7) is used to abut against the top surface of the fixed base (1); The base (8) has a raised positioning shaft (9) at its center. An annular stop (10) is used to contact the top surface of the conductive substrate (2). Several ribs (11) are provided inside the stop (10). The other ends of the several ribs (11) are connected to a bushing (12). The bushing (12) is located at the center of the stop (10) and can be fitted onto the positioning shaft (9).

6. The coating auxiliary tooling according to claim 5, characterized in that, The inner ring of the outer positioning ring (7) extends inward to form several pressure bodies (13).

7. The coating auxiliary tooling according to claim 5, characterized in that, The plurality of ribs (11) are evenly distributed circumferentially along the inner circle of the stop (10).