A horizontal electroplating system

Abstract

The utility model discloses a horizontal electroplating system relates to electroplating technical field, including electroplating cabinet and the electroplating area, overflow storage area, pipeline area and electric control area of the separate arrangement in electroplating cabinet, overflow storage area is located below the electroplating area, the electroplating area has a plurality of electroplating tank that arranges in order along the silicon wafer conveying direction, the conveying mechanism that is located electroplating tank outside is suitable for conveying silicon wafer, the water retaining component that is located electroplating tank's conveying mouth inside and the cathode conductive roller that is located electroplating tank outside both sides, and share a pair of cathode conductive roller between two adjacent electroplating tank, the electroplating tank is linked together with overflow storage area. The utility model discloses through the mode of adjacent electroplating tank sharing cathode conductive roller reduces the quantity of cathode conductive roller, can place more electroplating tank under the same electroplating cabinet size, and will water retaining component place in the electroplating tank inside, thereby increases the contact time of silicon wafer and electroplating solution, improves the space utilization of electroplating cabinet and electroplating efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to a horizontal electroplating system. Background Technology

[0002] Electroplating is a process that deposits metallic copper onto the surface of crystalline silicon solar cells at low temperatures to form the electrodes of crystalline silicon solar cells. Silicon wafer electroplating is mainly divided into two types: tank plating and chain plating. Tank plating (such as patent number CN219136985U) uses clamps to hold the silicon wafers and completes the plating process in a plating tank. Chain plating uses rollers to transport the silicon wafers from the outside into the plating tank. Because the silicon wafer processing requires multiple immersion and electroplating steps, each using different plating solutions, tank plating requires frequent lifting and lowering to transfer the silicon wafers to different plating tanks. Furthermore, the clamping of the silicon wafers is more difficult. Therefore, tank plating has a more complex structure and is not suitable for mass production of silicon wafers.

[0003] Existing horizontal electroplating equipment is largely still in the experimental stage, with complex structures that fail to consider both space utilization and electroplating efficiency. For example, existing electroplating equipment does not address the arrangement of multiple electroplating units. Furthermore, the horizontal electroplating equipment disclosed in patent CN210886263U has its water-blocking rollers positioned outside the tank. Since the distance between the cathode rollers on both sides of the tank is limited, excessive distance prevents the formation of an electroplating circuit. Therefore, placing the water-blocking rollers outside the tank reduces the internal space, decreasing the effective contact time between the silicon wafer and the electroplating solution, thus lowering electroplating efficiency. Moreover, the water-blocking rollers in this patent only block the electroplating solution in front of the cathode rollers; however, due to the gap between the water-blocking rollers and the electroplating tank, it cannot completely prevent the outflowing electroplating solution from splashing onto the cathode rollers. Therefore, the risk of the cathode being electroplated still exists, preventing the formation of a conductive circuit. Utility Model Content

[0004] To address the technical problems of existing horizontal electroplating equipment, such as complex structure and failure to simultaneously consider space utilization and electroplating efficiency, this utility model provides a horizontal electroplating system to solve the above problems.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a horizontal electroplating system, including an electroplating cabinet and an electroplating area, an overflow storage area, a pipeline area and an electrical control area arranged separately inside the electroplating cabinet. The overflow storage area is located below the electroplating area. The electroplating area has a plurality of electroplating tanks arranged sequentially along the silicon wafer conveying direction, a conveying mechanism located outside the electroplating tank suitable for conveying silicon wafers, a water-blocking component located inside the conveying port of the electroplating tank, and cathode conductive rollers located on both sides outside the electroplating tank. Adjacent electroplating tanks share a pair of cathode conductive rollers. The electroplating tank is connected to the overflow storage area.

[0006] In an optional embodiment of this utility model, the electroplating tank is provided with two anode plates, which are located above and below the silicon wafer, respectively.

[0007] In an optional embodiment of this utility model, the water-blocking components are symmetrically arranged on the upper and lower sides of the conveying port. The water-blocking components include a sealing plate and a transmission water-blocking roller. The sealing plate is fixed to the electroplating tank, and the transmission water-blocking roller is rotatably connected to the electroplating tank. The transmission water-blocking roller in the two symmetrically arranged water-blocking components is in contact with the silicon wafer, and the sealing plate abuts against the transmission water-blocking roller.

[0008] In an optional embodiment of this utility model, the sealing plate has an L-shaped structure. One end of the sealing plate is connected to the inner wall of the electroplating tank where the conveying port is located, and the other end of the sealing plate extends toward the direction of the transmission water-blocking roller to form an abutting part that abuts against the transmission water-blocking roller. Two of the abutting parts of the two symmetrically arranged water-blocking components are located close to the conveying port.

[0009] In an optional embodiment of this invention, a gap is left between the two abutting parts of the two symmetrically arranged water-blocking components to allow the silicon wafer to move.

[0010] In an optional embodiment of this utility model, circulating water pipes are provided above and below the silicon wafer in the electroplating tank.

[0011] In an optional embodiment of this utility model, the sealing plate has a V-shaped baffle that presses against the outer surface of the transmission water-blocking roller, and two of the two V-shaped baffles in the two symmetrically arranged water-blocking components are located on the upper and lower sides of the two transmission water-blocking rollers; a circulating water channel is formed on the sealing plate.

[0012] In an optional embodiment of this utility model, an air knife is also provided outside the electroplating tank to blow towards the conveying port, and the air knife is symmetrically arranged along the upper and lower sides of the conveying port.

[0013] In an optional embodiment of this utility model, a hanging ear is fixed to the outside of the electroplating tank, and the air knife is rotatably connected to the hanging ear, and the air knife and the hanging ear can be fixed relative to each other.

[0014] In an optional embodiment of this utility model, the anode plate is suspended in the electroplating tank by a hook, and the hook has a waist-shaped groove so that the anode plate can be adjusted up and down.

[0015] In an optional embodiment of this utility model, the top of the electroplating tank is further provided with an overflow frame, the overflow frame and the electroplating tank forming an overflow trough, the overflow frame having an overflow port communicating with the overflow storage area, and the height of the overflow port being greater than the height of the upper surface of the electroplating tank.

[0016] The beneficial effects of this utility model are:

[0017] (1) The horizontal electroplating system described in this utility model divides the electroplating cabinet into four areas, each of which does not interfere with each other and is clean and pollution-free. At the same time, by sharing the cathode conductive rollers between adjacent electroplating tanks, the number of cathode conductive rollers is reduced. More electroplating tanks can be placed in the same size electroplating cabinet. The water-blocking component is placed inside the electroplating tank, thereby increasing the contact time between the silicon wafer and the electroplating solution and improving the space utilization and electroplating efficiency of the electroplating cabinet.

[0018] (2) This utility model achieves double-sided synchronous electroplating by setting anode plates on both the upper and lower sides of the silicon wafer. It has a simple structure, is easy to operate, and effectively improves processing efficiency.

[0019] (3) The water-blocking component in this utility model consists of a sealing plate and a transmission water-blocking roller. The silicon wafer is conveyed through the transmission water-blocking roller, and the sealing plate is used to connect the transmission water-blocking roller and the electroplating tank to prevent the electroplating liquid from passing over the transmission water-blocking roller and reaching the conveying port through the gap between it and the electroplating tank, thereby improving the sealing effect and reducing the probability of equipment failure.

[0020] (4) The depth of the anode plate in the electroplating tank is adjustable, and the distance between the anode plate and the silicon wafer can be set according to the silicon wafer of different sizes.

[0021] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is a schematic diagram of the internal partitions of a specific embodiment of the horizontal electroplating system described in this utility model;

[0025] Figure 2 This is a schematic diagram of the interior of the electroplating zone of the horizontal electroplating system described in this utility model;

[0026] Figure 3 yes Figure 2 Enlarged view at point c;

[0027] Figure 4 This is a perspective view of a single electroplating unit in this utility model;

[0028] Figure 5 yes Figure 4 A schematic diagram of the internal structure of the electroplating unit in a specific implementation method shown.

[0029] Figure 6 yes Figure 5 Enlarged view of point a in the middle;

[0030] Figure 7 yes Figure 4 Side view;

[0031] Figure 8 yes Figure 4 A schematic diagram of the internal structure of the electroplating unit in a specific implementation method shown.

[0032] Figure 9 yes Figure 8 Enlarged view at point b;

[0033] Figure 10 yes Figure 5 A sectional view along line AA.

[0034] In the diagram, 1. Electroplating tank, 2. Cathode conductive roller, 3. Anode plate, 4. Water baffle assembly, 401. Sealing plate, 402. Transmission water baffle roller, 5. Conveying port, 6. Abutment part, 7. Circulating water pipe, 8. V-shaped baffle, 9. Circulating water channel, 10. Air knife, 11. Hanging ear, 12. Pin, 13. Hook, 14. Waist-shaped groove, 15. Overflow frame, 16. Overflow trough, 17. Overflow port, 18. Auxiliary roller, 19. Silicon wafer, 20. Electroplating cabinet, 21. Electroplating area, 22. Overflow storage area, 23. Piping area, 24. Electrical control area, 25. Conveying mechanism. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] Example 1

[0037] A horizontal electroplating system includes an electroplating cabinet 20 and electroplating zones 21, overflow storage zones 22, piping zones 23, and an electrical control zone 24, which are arranged separately within the electroplating cabinet 20. Electroplating zone 21 is for electroplating silicon wafers. Overflow storage zone 22 stores the electroplating solution overflowing from electroplating zone 21. Piping zone 23 is used to lay pipes and pumps, etc., to circulate the electroplating solution from overflow storage zone 22 back to electroplating zone 21. The electrical control zone 24 contains power supplies and control components to control the opening and closing of the cathode and anode in electroplating zone 21, as well as the opening and closing of other equipment and valves in the system. Figure 1As shown, the electroplating area 21 is located in front of the electroplating cabinet 20, the overflow storage area 22 is located directly below the electroplating area 21, the electrical control area 24 is located at the top rear side of the electroplating cabinet 20, and the other area is the pipeline area 23. The four areas are arranged independently and do not interfere with each other, which can ensure that each area is clean and tidy.

[0038] like Figure 2 and Figure 3 As shown, the electroplating area 21 has several electroplating tanks 1 arranged sequentially along the conveying direction of the silicon wafer 19, a conveying mechanism 25 located outside the electroplating tank 1 suitable for conveying the silicon wafer 19, a water-blocking component 4 located inside the conveying port 5 of the electroplating tank 1, and cathode conductive rollers 2 located on both sides outside the electroplating tank 1. A pair of cathode conductive rollers 2 are shared between two adjacent electroplating tanks 1, and the electroplating tank 1 is connected to the overflow storage area 22.

[0039] The electroplating tank 1 is used to hold the electroplating solution. The electroplating tank 1 has relatively arranged conveyor ports 5 for silicon wafers 19 to enter and exit. The conveyor ports 5 are small enough to allow the silicon wafers 19 to pass through. The electroplating tank 1 typically also contains an anode plate 3. A pair of cathode conductive rollers 2 are provided outside each conveyor port 5. The silicon wafer 19 is sandwiched between the two cathode conductive rollers 2 and conveyed forward, contacting the cathode conductive rollers 2. When the silicon wafer 19 enters the electroplating tank 1, it becomes electrically connected to the anode plate 3 through the electroplating solution. Simultaneously, cathode conductive rollers 2 are provided at the conveyor ports 5 on both sides of the electroplating tank 1, and the horizontal distance between the two pairs of cathode conductive rollers 2 needs to be less than the length of the silicon wafer 19. This ensures that the silicon wafer 19 remains in contact with the cathode conductive rollers 2 throughout the conveying process, preventing the electroplating process from stopping midway due to loss of conductivity.

[0040] The electroplating tank 1 and the cathode conductive rollers 2 on both sides form an electroplating unit. Traditional electroplating equipment arranges these units sequentially as a whole, without considering space utilization. This invention shares a pair of cathode conductive rollers 2 between adjacent electroplating tanks 1, thus reducing the number of cathode conductive rollers 2 between every two electroplating units. Therefore, within the same conveying length, more electroplating tanks 1 can be placed in the electroplating cabinet of this invention, increasing the effective contact time between the silicon wafer 19 and the electroplating solution, and improving the space utilization and electroplating efficiency of the electroplating cabinet 20. Furthermore, this invention places the water-blocking component 4 inside the electroplating tank 1, thereby reducing the horizontal distance between the cathode conductive rollers 2 and the electroplating tank 1, increasing the size of the electroplating tank 1 along the conveying direction of the silicon wafer 19, increasing the effective contact time between the silicon wafer 19 and the electroplating solution, and thus increasing the electroplating volume and improving the electroplating effect.

[0041] Example 2

[0042] Based on Example 1, such as Figure 5As shown, the electroplating tank 1 is equipped with two anode plates 3, which are located above and below the silicon wafer 19, respectively. The two anode plates 3 in the vertical direction cooperate with the corresponding cathode conductive rollers 2 to achieve simultaneous electroplating on the upper and lower surfaces of the silicon wafer 19.

[0043] Example 3

[0044] This embodiment addresses the problem mentioned in the background art that the gap between the water-blocking roller and the electroplating tank cannot completely prevent the outflowing electroplating liquid from splashing onto the cathode roller. In this embodiment, the water-blocking component 4 can suppress the movement of the electroplating liquid towards the conveying port 5, thereby completely blocking the cathode conductive roller 2 from the electroplating liquid and preventing the cathode conductive roller 2 from being unable to form a conductive circuit with the anode plate 3 after being electroplated.

[0045] Water-blocking components 4 are symmetrically arranged on the upper and lower sides of the conveying port 5. Specifically, each water-blocking component 4 includes a sealing plate 401 and a drive water-blocking roller 402. The sealing plate 401 is fixed to the electroplating tank 1, and the drive water-blocking roller 402 is rotatably connected to the electroplating tank 1. In the two symmetrically arranged water-blocking components 4, the drive water-blocking roller 402 contacts the silicon wafer 19, and the sealing plate 401 abuts against the drive water-blocking roller 402. Since the silicon wafer 19 is conveyed forward by the two drive water-blocking rollers 402, there is essentially no gap between the contact surfaces of the two drive water-blocking rollers 402 and the silicon wafer 19. The electroplating liquid will not flow from between the two drive water-blocking rollers 402 to the conveying port 5; it will only pass over the outside of the drive water-blocking rollers 402 (either above the drive water-blocking roller 402 above the silicon wafer 19 or below the drive water-blocking roller 402 below the silicon wafer 19). Figure 6 and Figure 9 Following the path indicated by the middle arrow, the electroplating solution passes through the gap between the transmission baffle roller 402 and the inner wall of the electroplating tank 1 to reach the conveying port 5. The function of the sealing plate 401 is to prevent the electroplating solution from flowing along the path. Figure 6 and Figure 9 The path shown reaches the delivery port 5, thereby completely sealing the electroplating solution inside the electroplating tank 1.

[0046] Both the cathode conductive roller 2 and the transmission water-blocking roller 402 are driven to rotate by the external conveying mechanism 25. The conveying mechanism 25 is the same as the existing chain electroplating mechanism, and this utility model has not improved it, so its specific structure will not be described in detail.

[0047] Given the sufficient space inside the electroplating tank 1 along the conveying direction of the silicon wafer 19, this embodiment selects a sealing plate 401 with the following structure: the sealing plate 401 has an L-shaped structure, one end of the sealing plate 401 is connected to the inner wall of the electroplating tank 1 where the conveying port 5 is located, and the other end of the sealing plate 401 extends towards the drive water-blocking roller 402 to form an abutting part 6 that abuts against the drive water-blocking roller 402. Two abutting parts 6 of the two symmetrically arranged water-blocking components 4 are positioned close to the conveying port 5. Figure 5 and Figure 6As shown, in this structure, the distance between the transmission baffle roller 402 and the inner wall of the electroplating tank 1 is relatively far, and the sealing plate 401 is completely located between the two. The sealing plate 401 does not occupy the space in the vertical direction of the transmission baffle roller 402. The circulating water pipes 7 are independently set in the vertical direction of the transmission baffle roller 402 for replenishing the electroplating solution into the electroplating tank 1.

[0048] like Figure 6 As shown, a gap is left between the two abutting parts 6 of the two symmetrically arranged water-blocking components 4 for the movement of the silicon wafer 19, that is, the distance between the two is approximately equal to the opening size of the conveying port 5.

[0049] In a preferred embodiment, an auxiliary roller 18 may also be provided at the middle position in the electroplating tank 1 to ensure stable transport of the silicon wafer 19.

[0050] Example 4

[0051] This embodiment differs in structure from the sealing plate 401 in Embodiment 3. This embodiment addresses the situation where the space inside the electroplating tank 1 along the conveying direction of the silicon wafer 19 is relatively small. Specifically, the sealing plate 401 has a V-shaped baffle 8 that presses against the outer surface of the drive water-blocking roller 402. Two of the two symmetrically arranged water-blocking components 4 have two V-shaped baffles 8 located on the upper and lower sides of the two drive water-blocking rollers 402. A circulating water channel 9 is formed on the sealing plate 401. For example... Figure 8 and Figure 9 As shown, the distance between the drive baffle roller 402 and the inner wall of the electroplating tank 1 is relatively small. The sealing plate 401 is mainly located above or below the drive baffle roller 402 and extends to the height of the anode plate 3, thus forming the circulating water channel 9 directly on the sealing plate 401 without the need for a separate circulating water pipe 7. The V-shaped baffle 8 on the sealing plate 401 can increase the contact area with the drive baffle roller 402, preventing the electroplating solution from passing over the drive baffle roller 402.

[0052] Example 5

[0053] Based on the above embodiments, an air knife 10 is also provided outside the electroplating tank 1 to blow towards the conveying port 5. The air knife 10 is symmetrically arranged on the upper and lower sides of the conveying port 5. Similar to the prior art, the air knife 10 is mainly used to output gas and blow dry the silicon wafer 19 at the conveying port 5 by blowing, so as to prevent the electroplating solution from being carried to the cathode conductive roller 2 by the silicon wafer 19.

[0054] The air knife 10 can be installed using the following structure: a hanging lug 11 is fixed to the outside of the electroplating tank 1, and the air knife 10 is rotatably connected to the hanging lug 11, with the air knife 10 and the hanging lug 11 being relatively fixed together. For example... Figure 4 and Figure 7As shown, the end of the lug 11 is curved in an arc shape. The air knife 10 has a pin 12 inserted into the end of the lug 11. The pin 12 and the lug 11 can be tightly fitted. Since the lug 11 is lightweight, the tight fit can prevent the lug 11 from shaking. Applying external force to rotate the air knife 10 can also slightly adjust the tilt angle of the air knife 10. The air knife 10 and the lug 11 can also be fixed by setting screws on the lug 11 to abut against the pin 12.

[0055] Example 6

[0056] Based on the above embodiments, in this embodiment, the vertical height of the anode plate 3 within the electroplating tank 1 is adjustable, thereby allowing adjustment of the distance between the anode plate 3 and the silicon wafer 19 according to the size of the silicon wafer 19. The specific structure is as follows: Figure 4 , Figure 7 and Figure 10 As shown, the anode plate 3 is suspended in the electroplating tank 1 by a hook 13. The hook 13 has a waist-shaped groove 14 so that the anode plate 3 can be adjusted up and down.

[0057] Example 7

[0058] Based on the above embodiments, such as Figure 4 and Figure 5 As shown, the top of the electroplating tank 1 is also provided with an overflow frame 15, which forms an overflow trough 16 with the electroplating tank 1. The overflow trough 16 prevents the electroplating solution from splashing outward from the top of the electroplating tank 1. In a further design, the overflow frame 15 has an overflow port 17 connected to the overflow storage area 22, and the height of the overflow port 17 is greater than the height of the upper surface of the electroplating tank 1. The overflow port 17 is designed to transport the overflowing liquid through a pipeline to the overflow storage area 22, thereby cleaning the overflow trough 16.

[0059] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0060] In the description of this utility model, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0061] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A horizontal electroplating system, characterized in that: The device includes an electroplating cabinet and electroplating areas, overflow storage areas, piping areas, and electrical control areas arranged separately within the electroplating cabinet. The overflow storage area is located below the electroplating areas. The electroplating areas have several electroplating tanks arranged sequentially along the silicon wafer conveying direction, a conveying mechanism located outside the electroplating tanks suitable for conveying silicon wafers, a water-blocking assembly located inside the conveying port of the electroplating tanks, and cathode conductive rollers located on both sides outside the electroplating tanks. Adjacent electroplating tanks share a pair of cathode conductive rollers. The electroplating tanks are connected to the overflow storage area.

2. The horizontal electroplating system according to claim 1, characterized in that: The electroplating tank is equipped with two anode plates, which are located above and below the silicon wafer, respectively.

3. The horizontal electroplating system according to claim 1, characterized in that: The water-blocking components are symmetrically arranged on the upper and lower sides of the conveying port. The water-blocking components include a sealing plate and a transmission water-blocking roller. The sealing plate is fixed to the electroplating tank, and the transmission water-blocking roller is rotatably connected to the electroplating tank. The transmission water-blocking roller in the two symmetrically arranged water-blocking components is in contact with the silicon wafer, and the sealing plate abuts against the transmission water-blocking roller.

4. The horizontal electroplating system according to claim 3, characterized in that: The sealing plate has an L-shaped structure. One end of the sealing plate is connected to the inner wall of the electroplating tank where the conveying port is located, and the other end of the sealing plate extends towards the direction of the transmission water-blocking roller to form an abutting part that abuts against the transmission water-blocking roller. Two of the abutting parts of the two symmetrically arranged water-blocking components are located close to the conveying port.

5. The horizontal electroplating system according to claim 4, characterized in that: The electroplating tank is equipped with circulating water pipes located both above and below the silicon wafer.

6. The horizontal electroplating system according to claim 3, characterized in that: The sealing plate has a V-shaped baffle that presses against the outer surface of the drive water-blocking roller. Two of the two water-blocking components arranged symmetrically are located on the upper and lower sides of the two drive water-blocking rollers. A circulating water channel is formed on the sealing plate.

7. The horizontal electroplating system according to claim 1, characterized in that: The electroplating tank is also equipped with air knives that blow towards the conveying port, and the air knives are symmetrically arranged on the upper and lower sides of the conveying port.

8. The horizontal electroplating system according to claim 7, characterized in that: The electroplating tank is fixed with a hanging lug, and the air knife is rotatably connected to the hanging lug, and the air knife and the hanging lug can be fixed relative to each other.

9. The horizontal electroplating system according to claim 2, characterized in that: The anode plate is suspended in the electroplating tank by hooks with waist-shaped grooves to allow the anode plate to be adjusted up and down.

10. The horizontal electroplating system according to claim 1, characterized in that: The top of the electroplating tank is also provided with an overflow frame, which forms an overflow trough with the electroplating tank. The overflow frame has an overflow port that communicates with the overflow storage area, and the height of the overflow port is greater than the height of the upper surface of the electroplating tank.

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