A horizontal electroplating device

Abstract

The utility model discloses a horizontal electroplating device relates to electroplating technical field, including electroplating tank, the cathode conductive roller of being located electroplating tank outside and the anode plate and water baffle subassembly of being located electroplating tank inside, the electroplating tank has opposite arrangement and supplies silicon piece and goes in and out conveying port, the anode plate is equipped with two and is located silicon piece's upper and lower respectively, the water baffle subassembly is suitable for inhibiting the flow of liquid medicine conveying port place. The horizontal electroplating device of the utility model sets up the water baffle subassembly in the electroplating tank, avoids the cathode conductive roller being electroplated through the mode of blocking liquid medicine, thereby reduces the equipment failure probability, can increase the size of electroplating tank simultaneously, increases the effective contact time of silicon piece and liquid medicine, improves the electroplating efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to a horizontal electroplating apparatus. Background Technology

[0002] Electroplating is a process that deposits metallic copper onto the surface of crystalline silicon solar cells at low temperatures to form the electrodes of crystalline silicon solar cells. Silicon wafer electroplating is mainly divided into two types: tank plating and chain plating. Tank plating (such as patent number CN219136985U) uses clamps to hold the silicon wafers and completes the plating process in a plating tank. Chain plating uses rollers to transport the silicon wafers from the outside into the plating tank. Because the silicon wafer processing requires multiple immersion and electroplating steps, each using different solutions, tank plating requires frequent lifting and lowering to transfer the silicon wafers to different plating tanks. Furthermore, the clamping of the silicon wafers is more difficult. Therefore, tank plating has a more complex structure and is not suitable for mass production of silicon wafers.

[0003] Existing horizontal electroplating equipment is largely still in the experimental stage, exhibiting certain practical shortcomings in actual use. For example, the horizontal electroplating equipment disclosed in patent number CN210886263U has a water-blocking roller positioned outside the tank, merely blocking the plating solution in front of the cathode roller. However, due to the gap between the water-blocking roller and the tank, it cannot completely prevent the outflowing plating solution from splashing onto the cathode roller, thus posing a risk of the cathode being electroplated and preventing the formation of a conductive circuit. Secondly, the distance between the cathode rollers on both sides of the tank is limited; if the distance is too large, an electroplating circuit cannot be formed. Therefore, placing the water-blocking roller outside the tank reduces the internal space, thereby decreasing the effective contact time between the silicon wafer and the plating solution and lowering the electroplating efficiency.

[0004] In conclusion, designing a horizontal electroplating system that can improve electroplating efficiency and reduce equipment failure rate is a technical problem that needs to be solved. Utility Model Content

[0005] In order to solve the technical problems of low electroplating efficiency and easy equipment failure in existing horizontal electroplating equipment, this utility model provides a horizontal electroplating device to solve the above problems.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a horizontal electroplating device, including an electroplating tank, a cathode conductive roller located outside the electroplating tank, and an anode plate and a water-blocking assembly located inside the electroplating tank. The electroplating tank has a relatively arranged inlet and outlet for silicon wafers. There are two anode plates, which are respectively located above and below the silicon wafers. The water-blocking assembly is adapted to suppress the flow of chemical solution to the inlet.

[0007] In an optional embodiment of this utility model, the water-blocking components are symmetrically arranged on the upper and lower sides of the conveying port. The water-blocking components include a sealing plate and a transmission water-blocking roller. The sealing plate is fixed to the electroplating tank, and the transmission water-blocking roller is rotatably connected to the electroplating tank. The transmission water-blocking roller in the two symmetrically arranged water-blocking components is in contact with the silicon wafer, and the sealing plate abuts against the transmission water-blocking roller.

[0008] In an optional embodiment of this utility model, the sealing plate has an L-shaped structure. One end of the sealing plate is connected to the inner wall of the electroplating tank where the conveying port is located, and the other end of the sealing plate extends toward the direction of the transmission water-blocking roller to form an abutting part that abuts against the transmission water-blocking roller. Two of the abutting parts of the two symmetrically arranged water-blocking components are located close to the conveying port.

[0009] In an optional embodiment of this invention, a gap is left between the two abutting parts of the two symmetrically arranged water-blocking components to allow the silicon wafer to move.

[0010] In an optional embodiment of this utility model, circulating water pipes are provided above and below the silicon wafer in the electroplating tank.

[0011] In an optional embodiment of this utility model, the sealing plate has a V-shaped baffle that presses against the outer surface of the transmission water-blocking roller, and two of the two V-shaped baffles in the two symmetrically arranged water-blocking components are located on the upper and lower sides of the two transmission water-blocking rollers; a circulating water channel is formed on the sealing plate.

[0012] In an optional embodiment of this utility model, an air knife is also provided outside the electroplating tank to blow towards the conveying port, and the air knife is symmetrically arranged along the upper and lower sides of the conveying port.

[0013] In an optional embodiment of this utility model, a hanging ear is fixed to the outside of the electroplating tank, and the air knife is rotatably connected to the hanging ear, and the air knife and the hanging ear can be fixed relative to each other.

[0014] In an optional embodiment of this utility model, the anode plate is suspended in the electroplating tank by a hook, and the hook has a waist-shaped groove so that the anode plate can be adjusted up and down.

[0015] In an optional embodiment of this utility model, the top of the electroplating tank is further provided with an overflow frame, the overflow frame and the electroplating tank forming an overflow trough, the overflow frame having an overflow port communicating with the outside, and the height of the overflow port being greater than the height of the upper surface of the electroplating tank.

[0016] The beneficial effects of this utility model are:

[0017] (1) The horizontal electroplating device of this utility model sets the water-blocking component inside the electroplating tank, which prevents the cathode conductive roller from being electroplated by blocking the chemical solution, thereby reducing the probability of equipment failure. At the same time, it can increase the size of the electroplating tank, increase the effective contact time between the silicon wafer and the chemical solution, and improve the electroplating efficiency.

[0018] (2) This utility model achieves double-sided synchronous electroplating by setting anode plates on both the upper and lower sides of the silicon wafer. It has a simple structure, is easy to operate, and effectively improves processing efficiency.

[0019] (3) The water-blocking component in this utility model consists of a sealing plate and a transmission water-blocking roller. The silicon wafer is conveyed through the transmission water-blocking roller, and the sealing plate is used to connect the transmission water-blocking roller and the electroplating tank to prevent the liquid from passing over the transmission water-blocking roller and reaching the conveying port through the gap between it and the electroplating tank, thereby improving the sealing effect.

[0020] (4) The depth of the anode plate in the electroplating tank is adjustable, and the distance between the anode plate and the silicon wafer can be set according to the silicon wafer of different sizes.

[0021] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is a perspective view of a specific embodiment of the horizontal electroplating device described in this utility model;

[0025] Figure 2 This is a schematic diagram of the internal structure of a specific embodiment of the horizontal electroplating device described in this utility model;

[0026] Figure 3 yes Figure 2 Enlarged view of point a in the middle;

[0027] Figure 4 This is a side view of a specific embodiment of the horizontal electroplating apparatus described in this utility model;

[0028] Figure 5 This is a schematic diagram of the internal structure of a specific embodiment of the horizontal electroplating device described in this utility model;

[0029] Figure 6 yes Figure 5 Enlarged view at point b in the middle;

[0030] Figure 7 yes Figure 2 A sectional view along line AA.

[0031] In the diagram, 1. Electroplating tank, 2. Cathode conductive roller, 3. Anode plate, 4. Water-blocking assembly, 401. Sealing plate, 402. Transmission water-blocking roller, 5. Conveying port, 6. Abutment part, 7. Circulating water pipe, 8. V-shaped baffle, 9. Circulating water channel, 10. Air knife, 11. Hanging ear, 12. Pin, 13. Hook, 14. Waist-shaped groove, 15. Overflow frame, 16. Overflow groove, 17. Overflow port, 18. Auxiliary roller, 19. Silicon wafer. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] Example 1

[0034] like Figures 1-3 As shown, a horizontal electroplating apparatus includes an electroplating tank 1, a cathode conductive roller 2 located outside the electroplating tank 1, and an anode plate 3 and a water-blocking assembly 4 located inside the electroplating tank 1. The electroplating tank 1 has a relatively arranged conveying port 5 for silicon wafers 19 to enter and exit. There are two anode plates 3, which are respectively located above and below the silicon wafers 19. The water-blocking assembly 4 is adapted to suppress the flow of chemical solution to the conveying port 5.

[0035] The electroplating tank 1 is used to hold the electroplating solution. The conveying port 5 is small in size, just large enough for the silicon wafer 19 to pass through. Each conveying port 5 is equipped with two cathode conductive rollers 2. The silicon wafer 19 is sandwiched between the two cathode conductive rollers 2 and conveyed forward. The silicon wafer 19 is in contact with the cathode conductive rollers 2. After the silicon wafer 19 enters the electroplating tank 1, it is electrically connected to the anode plate 3 through the solution. At the same time, cathode conductive rollers 2 are set at the conveying ports 5 on both sides of the electroplating tank 1. The horizontal distance between two adjacent sets of cathode conductive rollers 2 in the horizontal direction needs to be less than the length of the silicon wafer 19. This ensures that the silicon wafer 19 is always in contact with the cathode conductive rollers 2 during the conveying process, and prevents the electroplating from stopping midway due to loss of conductivity.

[0036] This invention places the water-blocking component 4 inside the electroplating tank 1, thereby reducing the horizontal distance between the cathode conductive roller 2 and the electroplating tank 1, increasing the size of the electroplating tank 1 along the silicon wafer 19 conveying direction, increasing the effective contact time between the silicon wafer 19 and the chemical solution, and thus increasing the electroplating amount and improving the electroplating effect. Furthermore, the water-blocking component 4 can inhibit the movement of the chemical solution towards the conveying port 5, thereby completely blocking the cathode conductive roller 2 from the chemical solution and preventing the cathode conductive roller 2 from failing to form a conductive circuit with the anode plate 3 after electroplating. In addition, this invention provides anode plates 3 in both the upper and lower directions of the silicon wafer 19 inside the electroplating tank 1, and achieves simultaneous electroplating of the upper and lower surfaces of the silicon wafer 19 through cooperation with the corresponding cathode conductive roller 2.

[0037] The water-blocking components 4 are symmetrically arranged on the upper and lower sides of the conveying port 5. The water-blocking components 4 in this invention include a sealing plate 401 and a transmission water-blocking roller 402. The sealing plate 401 is fixed to the electroplating tank 1, and the transmission water-blocking roller 402 is rotatably connected to the electroplating tank 1. The transmission water-blocking roller 402 in the two symmetrically arranged water-blocking components 4 contacts the silicon wafer 19, and the sealing plate 401 abuts against the transmission water-blocking roller 402. Since the silicon wafer 19 is conveyed forward by the two transmission water-blocking rollers 402, there is essentially no gap between the contact surfaces of the two transmission water-blocking rollers 402 and the silicon wafer 19. The liquid will not flow from between the two transmission water-blocking rollers 402 to the conveying port 5; it will only pass over the outside of the transmission water-blocking roller 402 (either over the transmission water-blocking roller 402 above the silicon wafer 19 or under the transmission water-blocking roller 402 below the silicon wafer 19, i.e.) Figure 3 and Figure 6 Following the path indicated by the middle arrow, the solution passes through the gap between the transmission baffle roller 402 and the inner wall of the electroplating tank 1 to reach the conveying port 5. The function of the sealing plate 401 is to prevent the solution from flowing along... Figure 3 and Figure 6 The path shown reaches the delivery port 5, thereby completely sealing the liquid medicine inside the electroplating tank 1.

[0038] Both the cathode conductive roller 2 and the transmission water-blocking roller 402 are driven to rotate by an external transmission structure. The transmission structure is the same as that of the existing chain electroplating, and this utility model has not improved it, so its specific structure will not be described in detail.

[0039] In this embodiment, considering the sufficient space inside the electroplating tank 1 along the conveying direction of the silicon wafer 19, a sealing plate 401 with the following structure is selected: The sealing plate 401 has an L-shaped structure. One end of the sealing plate 401 is connected to the inner wall of the electroplating tank 1 where the conveying port 5 is located. The other end of the sealing plate 401 extends towards the drive water-blocking roller 402 to form an abutting part 6 that abuts against the drive water-blocking roller 402. Two abutting parts 6 of the two symmetrically arranged water-blocking components 4 are positioned close to the conveying port 5. Figure 2 and Figure 3As shown, in this structure, the distance between the transmission baffle roller 402 and the inner wall of the electroplating tank 1 is relatively far, and the sealing plate 401 is completely located between the two. The sealing plate 401 does not occupy the space in the vertical direction of the transmission baffle roller 402. The circulating water pipes 7 are independently set in the vertical direction of the transmission baffle roller 402 for replenishing the chemical solution into the electroplating tank 1.

[0040] like Figure 3 As shown, a gap is left between the two abutting parts 6 of the two symmetrically arranged water-blocking components 4 for the movement of the silicon wafer 19, that is, the distance between the two is approximately equal to the opening size of the conveying port 5.

[0041] In a preferred embodiment, an auxiliary roller 18 may also be provided at the middle position in the electroplating tank 1 to ensure stable transport of the silicon wafer 19.

[0042] Example 2

[0043] This embodiment differs in structure from the sealing plate 401 in Embodiment 1. This embodiment addresses the situation where the space inside the electroplating tank 1 along the conveying direction of the silicon wafer 19 is relatively small. Specifically, the sealing plate 401 has a V-shaped baffle 8 that presses against the outer surface of the drive water-blocking roller 402. Two of the two symmetrically arranged water-blocking components 4 have two V-shaped baffles 8 located on the upper and lower sides of the two drive water-blocking rollers 402. A circulating water channel 9 is formed on the sealing plate 401. For example... Figure 5 and Figure 6 As shown, the distance between the drive baffle roller 402 and the inner wall of the electroplating tank 1 is relatively small. The sealing plate 401 is mainly located above or below the drive baffle roller 402 and extends to the height of the anode plate 3, thus forming the circulating water channel 9 directly on the sealing plate 401 without the need for additional circulating water pipe 7. The V-shaped baffle 8 on the sealing plate 401 can increase the contact area with the drive baffle roller 402, preventing the liquid from passing over the drive baffle roller 402.

[0044] Example 3

[0045] Based on the above embodiments, an air knife 10 is also provided outside the electroplating tank 1 to blow towards the conveying port 5. The air knife 10 is symmetrically arranged on the upper and lower sides of the conveying port 5. Similar to the prior art, the air knife 10 is mainly used to output gas and dry the silicon wafer 19 at the conveying port 5 by blowing, so as to prevent the liquid from being carried to the cathode conductive roller 2 by the silicon wafer 19.

[0046] The air knife 10 can be installed using the following structure: a hanging lug 11 is fixed to the outside of the electroplating tank 1, and the air knife 10 is rotatably connected to the hanging lug 11, with the air knife 10 and the hanging lug 11 being relatively fixed together. For example... Figure 1 and Figure 4As shown, the end of the lug 11 is curved in an arc shape. The air knife 10 has a pin 12 inserted into the end of the lug 11. The pin 12 and the lug 11 can be tightly fitted. Since the lug 11 is lightweight, the tight fit can prevent the lug 11 from shaking. Applying external force to rotate the air knife 10 can also slightly adjust the tilt angle of the air knife 10. The air knife 10 and the lug 11 can also be fixed by setting screws on the lug 11 to abut against the pin 12.

[0047] Example 4

[0048] Based on the above embodiments, in this embodiment, the vertical height of the anode plate 3 within the electroplating tank 1 is adjustable, thereby allowing adjustment of the distance between the anode plate 3 and the silicon wafer 19 according to the size of the silicon wafer 19. The specific structure is as follows: Figure 1 , Figure 4 and Figure 7 As shown, the anode plate 3 is suspended in the electroplating tank 1 by a hook 13. The hook 13 has a waist-shaped groove 14 so that the anode plate 3 can be adjusted up and down.

[0049] Example 5

[0050] Based on the above embodiments, such as Figure 1 and Figure 2 As shown, the top of the electroplating tank 1 is also provided with an overflow frame 15, which forms an overflow channel 16 with the electroplating tank 1. The overflow channel 16 can prevent the chemical solution from splashing outward from the top of the electroplating tank 1. In a further design, the overflow frame 15 has an overflow port 17 communicating with the outside, and the height of the overflow port 17 is greater than the height of the upper surface of the electroplating tank 1. The overflow port 17 is designed to transport the overflowing liquid outward through pipelines, thereby cleaning the overflow channel 16, and can also realize the recycling of the chemical solution through the arrangement of circulation pipelines.

[0051] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0052] In the description of this utility model, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0053] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A horizontal electroplating apparatus, characterized in that: The device includes an electroplating tank, a cathode conductive roller located outside the electroplating tank, and an anode plate and a water-blocking assembly located inside the electroplating tank. The electroplating tank has a relatively arranged inlet for silicon wafers to enter and exit. There are two anode plates, which are located above and below the silicon wafers respectively. The water-blocking assembly is adapted to suppress the flow of chemical solution to the inlet.

2. The horizontal electroplating apparatus according to claim 1, characterized in that: The water-blocking components are symmetrically arranged on the upper and lower sides of the conveying port. The water-blocking components include a sealing plate and a transmission water-blocking roller. The sealing plate is fixed to the electroplating tank, and the transmission water-blocking roller is rotatably connected to the electroplating tank. The transmission water-blocking roller in the two symmetrically arranged water-blocking components is in contact with the silicon wafer, and the sealing plate abuts against the transmission water-blocking roller.

3. The horizontal electroplating apparatus according to claim 2, characterized in that: The sealing plate has an L-shaped structure. One end of the sealing plate is connected to the inner wall of the electroplating tank where the conveying port is located, and the other end of the sealing plate extends towards the direction of the transmission water-blocking roller to form an abutting part that abuts against the transmission water-blocking roller. Two of the abutting parts of the two symmetrically arranged water-blocking components are located close to the conveying port.

4. The horizontal electroplating apparatus according to claim 3, characterized in that: A gap is left between the two abutting parts of the two symmetrically arranged water-blocking components to allow the silicon wafer to move.

5. The horizontal electroplating apparatus according to claim 3, characterized in that: The electroplating tank is equipped with circulating water pipes located both above and below the silicon wafer.

6. The horizontal electroplating apparatus according to claim 2, characterized in that: The sealing plate has a V-shaped baffle that presses against the outer surface of the drive water-blocking roller. Two of the two water-blocking components arranged symmetrically are located on the upper and lower sides of the two drive water-blocking rollers. A circulating water channel is formed on the sealing plate.

7. The horizontal electroplating apparatus according to claim 1, characterized in that: The electroplating tank is also equipped with air knives that blow towards the conveying port, and the air knives are symmetrically arranged on the upper and lower sides of the conveying port.

8. The horizontal electroplating apparatus according to claim 7, characterized in that: The electroplating tank is fixed with a hanging lug, and the air knife is rotatably connected to the hanging lug, and the air knife and the hanging lug can be fixed relative to each other.

9. The horizontal electroplating apparatus according to claim 1, characterized in that: The anode plate is suspended in the electroplating tank by hooks with waist-shaped grooves so that the anode plate can be adjusted up and down.

10. The horizontal electroplating apparatus according to claim 1, characterized in that: The top of the electroplating tank is also provided with an overflow frame, which forms an overflow trough with the electroplating tank. The overflow frame has an overflow port that communicates with the outside, and the height of the overflow port is greater than the height of the upper surface of the electroplating tank.

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