Semiconductor crystal demolding apparatus

Abstract

The application provides a semiconductor crystal demolding device, which comprises a sealed container, a support and a temperature adjusting coil. The sealed container comprises a container body and a sealing cover, the sealing cover seals an opening of the container body to form a sealed cavity, and the sealed container is provided with a solution inlet for introducing a demolding solution. The support can be loaded into or taken out of the container body through the opening of the container body, and the support is used for placing a semiconductor crystal to be demolded. The temperature adjusting coil is arranged in the sealed container, and the temperature adjusting coil is connected with a temperature adjusting medium source outside the sealed container to adjust the temperature of the demolding solution by the temperature adjusting medium. The two ends of the temperature adjusting coil are respectively connected with a temperature adjusting inlet and a temperature adjusting outlet on the sealed container. The semiconductor crystal demolding device can improve the demolding efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor demolding technology, and in particular to a semiconductor crystal demolding device. Background Technology

[0002] In single-crystal furnaces grown using the vertical gradient solidification method, a layer of boron oxide exists between the crystal and the crucible. Boron oxide is an inorganic substance that crystallizes at high temperatures within the furnace, adhering to the outer surface of the crystal and the inner wall of the crucible. To demold the crystal from the crucible, the boron oxide crystals need to be treated. Since boron oxide crystals are soluble in methanol, the crystal and crucible are immersed in heated methanol to dissolve the boron oxide crystals.

[0003] Heating the methanol solution accelerates methanol volatilization, with most of the methanol being discharged through the exhaust pipe. Excessive methanol consumption leads to increased material costs. Because the crucible and crystal are tightly bonded, the methanol solution needs to be completely fused with boron oxide, resulting in prolonged soaking time and increased time costs. Furthermore, the methanol furnace has poor sealing; a small portion of the volatilized methanol can mix with air to form an explosive mixture, posing a certain degree of danger. Utility Model Content

[0004] This application provides a semiconductor crystal demolding device to at least solve some of the above-mentioned technical problems existing in the prior art.

[0005] This application provides a semiconductor crystal demolding device, including:

[0006] A sealed container includes a container body and a sealing cap, the sealing cap closing the opening of the container body to form a sealed cavity, and the sealed container having a solution inlet for introducing a release solution;

[0007] The support can be inserted into or removed from the container body through the opening of the container body, and the support is used to place the semiconductor crystal to be demolded;

[0008] A temperature-regulating coil is disposed inside the sealed container. The temperature-regulating coil is connected to a temperature-regulating medium source outside the sealed container to adjust the temperature of the release solution through the temperature-regulating medium. The two ends of the temperature-regulating coil are respectively connected to the temperature-regulating inlet and temperature-regulating outlet on the sealed container.

[0009] In an optional embodiment, the temperature-regulating coil includes:

[0010] The first coil is located at the bottom of the sealed cavity;

[0011] The second coil is located at the top of the sealed cavity;

[0012] The second coil is connected in series, in parallel, or independently to the temperature-regulating medium source as well as the first coil.

[0013] In an optional embodiment, the two ends of the first coil are respectively connected to the first temperature-regulating inlet and the first temperature-regulating outlet on the sealed container, and the two ends of the second coil are respectively connected to the second temperature-regulating inlet and the second temperature-regulating outlet on the sealed container.

[0014] In an optional embodiment, the bracket is equipped with rollers, and the sealed container is provided with a track that cooperates with the rollers.

[0015] In an optional embodiment, the container body includes:

[0016] A cylindrical body with openings at both ends, one end of which is connected to the sealing cap;

[0017] An end cap is provided, which is connected to the other end of the cylinder by a flange seal to close the opening at the other end of the cylinder.

[0018] In an optional embodiment, the cylinder is a round cylinder, and the cylinder is placed horizontally.

[0019] In an optional embodiment, the semiconductor crystal demolding device further includes:

[0020] A temperature sensor is installed on the sealed container to detect the temperature of the release solution inside the sealed container.

[0021] In an optional embodiment, the semiconductor crystal demolding device further includes:

[0022] A pressure sensor is installed on the sealed container to detect the pressure inside the sealed container.

[0023] In an optional embodiment, the top of the container is provided with an exhaust port, which is connected to a waste discharge valve.

[0024] In an optional embodiment, the temperature-regulating medium source includes a heating medium source and a cooling medium source. The heating medium source is used to provide a heating medium to heat the release solution, and the cooling medium source is used to provide a cooling medium to cool the release solution. The temperature-regulating coil is connected to the heating medium source and the cooling medium source respectively via a tee.

[0025] In the semiconductor crystal demolding device of this application, the semiconductor crystal to be demolded is placed in a sealed container, and a temperature-regulating coil is installed inside the sealed container. A temperature-regulating medium is supplied to the temperature-regulating coil through an external temperature-regulating medium source to adjust the temperature of the demolding solution. Utilizing the temperature-regulating medium to heat or cool the demolding solution through heat exchange results in stable temperature changes that are easy to control, ensuring demolding efficiency and effectiveness. The sealed container provides excellent sealing, significantly reducing demolding solution consumption and increasing the pressure of the demolding solution within the cavity, thereby increasing the activity of the demolding solution and accelerating the reaction rate. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This invention provides a schematic diagram of the structure of a semiconductor crystal demolding device according to an embodiment of this application.

[0028] Figure 2 This diagram shows the internal structure of a semiconductor crystal demolding device according to an embodiment of this application.

[0029] Figure 3 This is a schematic cross-sectional view of a semiconductor crystal demolding device according to an embodiment of this application.

[0030] The reference numerals in the attached drawings are explained as follows: 1-Sealed container, 11-Container body, 111-Cylinder body, 112-End cap, 12-Sealing cap, 13-Exhaust port, 14-Automatic exhaust valve, 15-Drain port, 2-Support, 21-Roller, 22-Crystal holder, 3-Temperature regulating coil, 31-First coil, 32-Second coil, 4-Solution inlet, 5-Railway, 6-Temperature sensor, 7-Pressure sensor, 8-Base, 9-Semiconductor crystal. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0032] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that comprises a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] See Figure 1 This application provides a semiconductor crystal 9 demolding device, including a sealed container 1, a support 2, and a temperature-regulating coil 3. The sealed container 1 forms a sealed cavity and has a solution inlet 4 for introducing a demolding solution. The sealed container 1 can reduce the consumption of the demolding solution and increase the pressure of the demolding solution in the cavity, thereby increasing the activity of the demolding solution and accelerating the reaction rate. The demolding solution can be, for example, a methanol solution.

[0035] The sealed container 1 may include a container body 11 and a sealing cap 12. The container body 11 has an opening through which the semiconductor crystal 9 is placed into the sealed container 1, or through which the demolded semiconductor crystal 9 is removed from the sealed container 1. The sealing cap 12 closes the opening of the container body 11 to form a sealed cavity. During demolding, the sealing cap 12 closes the opening of the container body 11 to form a sealed cavity, which can reduce the evaporation of the demolding solution and increase the pressure, thereby accelerating the reaction rate.

[0036] The support 2 can be inserted into or removed from the container 11 through the opening. The support 2 is used to hold the semiconductor crystal 9 to be demolded. Removing the support 2 from the container 11 facilitates placing the semiconductor crystal 9 onto the support 2. After placing the semiconductor crystal 9 onto the support 2, insert it into the container 11, close the sealing cap 12, and allow the demolding solution to be introduced into the sealed container 1 for dissolution and demolding.

[0037] A temperature-regulating coil 3 is located inside the sealed container 1. The temperature-regulating coil 3 is connected to a temperature-regulating medium source outside the sealed container 1 to adjust the temperature of the release solution. The sealed container 1 has a temperature-regulating inlet and a temperature-regulating outlet, and both ends of the temperature-regulating coil 3 are connected to the temperature-regulating inlet and outlet of the sealed container 1, respectively. The temperature-regulating medium is introduced into the temperature-regulating coil 3 through the temperature-regulating inlet, exchanging heat with the release solution to heat or cool it. This heat exchange method allows for precise control of the release solution temperature, ensuring effective and efficient release.

[0038] In the semiconductor crystal 9 demolding device of this application, the semiconductor crystal 9 to be demolded is placed in a sealed container 1, and a temperature-regulating coil 3 is installed inside the sealed container 1. A temperature-regulating medium is supplied to the temperature-regulating coil 3 through an external temperature-regulating medium source to adjust the temperature of the demolding solution. By using the temperature-regulating medium to heat or cool the demolding solution through heat exchange, the temperature change is stable and easy to control, ensuring demolding efficiency and effectiveness. The sealed container 1 has good sealing properties, significantly reducing the consumption of the demolding solution, and can increase the pressure of the demolding solution within the cavity, increasing the activity of the demolding solution and accelerating the reaction rate.

[0039] In some embodiments, the temperature-regulating coil 3 can be one or more sets. Multiple sets of temperature-regulating coils 3 can be arranged in different positions within the sealed container 1 to facilitate uniform heating or cooling of the release solution.

[0040] In an exemplary embodiment, the temperature-regulating coil 3 includes a first coil 31 and a second coil 32, with the first coil 31 located at the bottom of the sealed cavity and the second coil 32 located at the top of the sealed cavity. During heating, the first coil 31 and the second coil 32 can heat the release solution from the bottom and top, respectively. During cooling, the first coil 31 and the second coil 32 can cool the release solution from the bottom and top, respectively.

[0041] The second coil 32 and the first coil 31 can be connected in series. The second coil 32 and the first coil 31 can also be connected in parallel. Alternatively, the second coil 32 and the first coil 31 can be independently connected to a temperature-regulating medium source. The flow rate, temperature, etc. of the temperature-regulating medium in the second coil 32 and the first coil 31 can be independently adjusted and controlled.

[0042] The second coil 32 and the first coil 31 can be connected to the same temperature-regulating medium source in parallel or in series.

[0043] The second coil 32 and the first coil 31 can also be connected to different temperature-regulating medium sources. For example, the first coil 31 can be connected to the first temperature-regulating medium source, and the second coil 32 can be connected to the second temperature-regulating medium source.

[0044] In some embodiments, the two ends of the first coil 31 are respectively connected to the first temperature regulating inlet and the first temperature regulating outlet on the sealed container 1, and the two ends of the second coil 32 are respectively connected to the second temperature regulating inlet and the second temperature regulating outlet on the sealed container 1.

[0045] In some embodiments, the temperature-regulating medium source includes a heating medium source and a cooling medium source. The heating medium source provides a heating medium to heat the release solution to a specific temperature. The cooling medium source provides a cooling medium to cool the release solution.

[0046] In some embodiments, the temperature regulating coil 3 may include multiple groups, and the multiple groups of temperature regulating coil 3 may be divided into heating coils and cooling coils. The heating coils are connected to the heating medium source, and the cooling coils are connected to the cooling medium source.

[0047] In some embodiments, the temperature-regulating coil 3 is connected to both the heating medium source and the cooling medium source via a tee. When the temperature-regulating coil 3 is connected to the heating medium source, it is used to heat the release solution. When the temperature-regulating coil 3 is connected to the cooling medium source, it is used to cool the release solution.

[0048] The temperature-regulating medium can be water or other fluids. For example, hot water can be used as the heating medium, and cold water can be used as the cooling medium.

[0049] In some embodiments, a roller 21 is mounted on the support 2, and a track 5 that mates with the roller 21 is provided inside the sealed container 1. The interaction between the roller 21 and the track 5 facilitates the insertion and removal of the support 2, and makes it easier to remove and place the semiconductor crystal 9 for demolding.

[0050] In some embodiments, the support 2 may include a crystal holder 22, each crystal holder 22 fixing a semiconductor crystal 9 to be demolded. The crystal holder 22 may include a base and end supports. The base may have a concave arc-shaped support surface for supporting the bottom of the semiconductor crystal 9 to be demolded. The end supports are used to support the ends of the semiconductor crystal 9 to be demolded and to limit the semiconductor crystal 9 to be demolded at least unidirectionally in the axial direction. In an exemplary embodiment, the end support may include a variable diameter portion adapted to the end of the semiconductor crystal 9 to be demolded. The variable diameter portion can limit the semiconductor crystal 9 to be demolded.

[0051] In some embodiments, the container body 11 includes a cylindrical body 111 and an end cap 112. The cylindrical body 111 has openings at both ends, and a sealing cap 12 is connected to one end of the cylindrical body 111. The end cap 112 is sealed to the other end of the cylindrical body 111 via a flange to close the other end opening of the cylindrical body 111. Of course, the end cap 112 and the cylindrical body 111 can also be welded together.

[0052] In some embodiments, the cylinder 111 is a cylindrical shape. The cylinder 111 is placed horizontally.

[0053] The semiconductor crystal 9 demolding device of this application embodiment may include a base 8. A sealed container 1 is placed on the base 8.

[0054] In some embodiments, the semiconductor crystal 9 demolding device of this application further includes a temperature sensor 6, which is disposed on the sealed container 1 and used to detect the temperature of the demolding solution inside the sealed container 1. The temperature sensor 6 can be, for example, a bimetallic thermometer. The temperature sensor 6 can be installed at the end cap 112 and connected to the sealed container 1 to directly measure the temperature of the demolding solution.

[0055] In some embodiments, the semiconductor crystal 9 demolding device of this application further includes a pressure sensor 7, which is disposed on the sealed container 1 and is used to detect the pressure inside the sealed container 1.

[0056] In some embodiments, the top of the container body 11 is provided with an exhaust port 13, which is connected to a waste discharge valve.

[0057] The semiconductor crystal 9 demolding device of this application can use a pneumatic diaphragm pump to inject and pressurize the demolding solution. The solution inlet can be located at the lower part of the end cap 112. After closing the sealing cap 12, the pneumatic diaphragm pump is started to inject the demolding solution and pressurize.

[0058] An automatic vent valve 14 is installed on the top of the sealed container 1, and the pressure sensor 7 can be a diaphragm pressure gauge. When the release solution is added but the container is not full, the vent valve automatically releases air; once the release solution fills the sealed container 1, the vent valve automatically closes. The operator can adjust the diaphragm pump switch in real time according to the pressure gauge reading to maintain the pressure inside the sealed container 1 at the set value.

[0059] The bottom of the sealed container 1 is reserved with a drain port 15 and a pressure relief valve is installed to facilitate pressure relief and discharge of the demolding solution. The pressure relief valve is a stainless steel airtight valve to ensure the airtightness of the equipment.

[0060] Operators can adjust the methanol temperature in real time by operating the three-way valve based on temperature feedback.

[0061] The sealed container 1 can be made of stainless steel.

[0062] The foregoing description is merely an exemplary embodiment of this disclosure and should not be construed as limiting the scope of this disclosure. Any equivalent changes and modifications made in accordance with the teachings of this disclosure shall still fall within the scope of this disclosure. Other embodiments of this disclosure will be readily apparent to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not described herein. The specification and embodiments are to be considered exemplary only, and the scope and spirit of this disclosure are defined by the claims.

Claims

1. A semiconductor crystal release device, characterized in that, include: A sealed container includes a container body and a sealing cap, the sealing cap closing the opening of the container body to form a sealed cavity, and the sealed container having a solution inlet for introducing a release solution; The support can be inserted into or removed from the container body through the opening of the container body, and the support is used to place the semiconductor crystal to be demolded; A temperature-regulating coil is disposed inside the sealed container. The temperature-regulating coil is connected to a temperature-regulating medium source outside the sealed container to adjust the temperature of the release solution through the temperature-regulating medium. The two ends of the temperature-regulating coil are respectively connected to the temperature-regulating inlet and temperature-regulating outlet on the sealed container.

2. The semiconductor crystal demolding device according to claim 1, characterized in that, The temperature-regulating coil includes: The first coil is located at the bottom of the sealed cavity; The second coil is located at the top of the sealed cavity; The second coil is connected in series, in parallel, or independently to the temperature-regulating medium source as well as the first coil.

3. The semiconductor crystal demolding device according to claim 2, characterized in that, The two ends of the first coil are respectively connected to the first temperature regulating inlet and the first temperature regulating outlet on the sealed container, and the two ends of the second coil are respectively connected to the second temperature regulating inlet and the second temperature regulating outlet on the sealed container.

4. The semiconductor crystal demolding device according to claim 1, characterized in that, The bracket is equipped with rollers, and the sealed container is provided with a track that cooperates with the rollers.

5. The semiconductor crystal demolding device according to claim 1, characterized in that, The container body includes: A cylindrical body with openings at both ends, one end of which is connected to the sealing cap; An end cap is provided, which is connected to the other end of the cylinder by a flange seal to close the opening at the other end of the cylinder.

6. The semiconductor crystal demolding device according to claim 5, characterized in that, The cylinder is a round cylinder, and the cylinder is placed horizontally.

7. The semiconductor crystal demolding device according to claim 1, characterized in that, Also includes: A temperature sensor is installed on the sealed container to detect the temperature of the release solution inside the sealed container.

8. The semiconductor crystal demolding device according to claim 1, characterized in that, Also includes: A pressure sensor is installed on the sealed container to detect the pressure inside the sealed container.

9. The semiconductor crystal demolding device according to claim 1, characterized in that, The top of the container is provided with an exhaust port, which is connected to a waste discharge valve.

10. The semiconductor crystal demolding device according to claim 9, characterized in that, The temperature-regulating medium source includes a heating medium source and a cooling medium source. The heating medium source is used to provide a heating medium to heat the release solution, and the cooling medium source is used to provide a cooling medium to cool the release solution. The temperature-regulating coil is connected to the heating medium source and the cooling medium source respectively through a tee.

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