Compressor and new energy vehicle with same

Abstract

The utility model provides a compressor and new energy automobile with compressor, wherein, the compressor includes: a circuit board, the one side of circuit board is locally formed at least one heating area away from motor, at least one first gasket, the first side of each first gasket is at least with the heat area of circuit board pastes together, a vapo(u)r chamber, the first side of vapo(u)r chamber is pasted together with the second side of first gasket, a second gasket, the first side of second gasket is pasted together with the second side of vapo(u)r chamber, and the heat conductivity coefficient of vapo(u)r chamber is higher than first gasket and second gasket, a cover plate, pastes together the second side of second gasket, the utility model discloses compressor can solve the vibration inhibition and heat dissipation problem of circuit board, cover plate simultaneously, high -efficiently, reduces the noise of complete machine, and enhances the reliability.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment, specifically to compressors and new energy vehicles equipped with compressors. Background Technology

[0002] With the development of new energy vehicles and high-end air conditioning systems, the performance requirements for scroll compressors, as core components, are increasing, especially in terms of noise control and operational reliability. When an electric scroll compressor is operating, its internal circuit board (controller) not only generates a large amount of heat due to the operation of its power components, but is also subjected to vibration excitation from the motor and compressor section. This leads to two prominent problems: First, the vibration of the entire casing during operation is transmitted to the relatively thin cover plate, causing it to resonate and generate unpleasant electromagnetic and mechanical noise, affecting the overall NVH (noise, vibration, and harshness) performance of the compressor; second, if the heat generated by the circuit board cannot be dissipated in time, it can lead to excessively high component temperatures, decreased reliability, and even malfunctions.

[0003] Several attempts have been made in the prior art to address the aforementioned problems. For example, prior art document 1 (CN208763899U) discloses a scheme for setting a vibration damping pad between a circuit board and a cover plate. This vibration damping pad has a hollowed-out portion, designed to simultaneously achieve vibration damping and increase the heat dissipation area. However, this scheme has significant shortcomings: First, the presence of the hollowed-out portion inevitably reduces the effective contact area between the vibration damping pad and the circuit board, resulting in a significant reduction in its suppression effect on circuit board vibration, especially on local high-frequency vibration; second, its heat dissipation path depends on the thermal conductivity of the vibration damping pad material itself, and materials with both good damping and excellent thermal conductivity are often expensive, and their thermal conductivity is far lower than that of metals, making them inadequate for the heat dissipation requirements of high-power-density circuit boards.

[0004] Comparative document 2 (CN208734551 U) adopts a different approach, directly attaching a damping layer to the inner surface of the cover plate. This solution suppresses resonance by increasing the damping of the cover plate itself, which is effective in reducing radiated noise. However, this damping layer is not in direct contact with the circuit board, so it cannot effectively suppress the vibration of the circuit board itself, nor can it provide an effective heat dissipation path for the circuit board. The heat of the circuit board is still mainly dissipated through air convection and limited radiation, resulting in low heat dissipation efficiency.

[0005] In summary, existing technologies either prioritize vibration reduction at the expense of heat dissipation (e.g., poor contact due to perforation in Comparative Document 1) or focus on altering cover plate properties without addressing both circuit board vibration and heat dissipation (e.g., Comparative Document 2). Currently, there is a lack of an integrated solution that can simultaneously and efficiently address both circuit board vibration suppression and heat dissipation. Therefore, there is an urgent need in this field for an innovative structure that can achieve synergistic optimization of circuit board vibration and heat dissipation without significantly increasing cost and complexity.

[0006] In view of this, there is an urgent need in the field for an innovative structure that can achieve synergistic optimization of circuit board and cover plate vibration and heat dissipation problems without significantly increasing cost and complexity. Utility Model Content

[0007] In view of the problems in the prior art, the purpose of this utility model is to provide a compressor and a new energy vehicle with a compressor, which overcomes the difficulties of the prior art and can simultaneously and efficiently solve the vibration suppression and heat dissipation problems of the circuit board and cover plate, reduce the noise of the whole machine, and enhance reliability.

[0008] An embodiment of this utility model provides a compressor, comprising:

[0009] A circuit board, wherein at least one heating area is formed on the side of the circuit board away from the motor;

[0010] At least one first pad, and a first side of each first pad is in contact with at least one heat-generating area of ​​the circuit board;

[0011] A heat spreader plate, wherein a first side of the heat spreader plate is attached to a second side of the first gasket;

[0012] A second gasket, the first side of which is attached to the second side of the heat spreader, wherein the thermal conductivity of the heat spreader is higher than that of the first and second gaskets; and

[0013] A cover plate is fitted to the second side of the second gasket.

[0014] Preferably, it further includes:

[0015] case;

[0016] The motor section and the compressor section are disposed in the first mounting cavity within the housing; and

[0017] The second mounting cavity is defined by the housing and the cover plate. The circuit board is housed inside the second mounting cavity. The cover plate is screwed to the housing and presses the second gasket, the heat spreader, and the first gasket onto the circuit board, causing the first gasket and the second gasket to be deformed by compression.

[0018] Preferably, the shape and position of the first pad are respectively configured to cover at least the heat-generating area, the main vibration area, and the main vibration area of ​​the cover plate on the circuit board. The heat-generating area is defined at least based on the chip position and the power module position on the circuit board. The first pad in contact with the heat-generating area transfers heat to the heat spreader. The main vibration area is defined at least based on the position of the center projection of the cover plate onto the circuit board. The first pad in contact with the main vibration area provides shock-absorbing support for the main vibration area.

[0019] Preferably, the first side of the first gasket is provided with at least one of a slot, a half slot, an opening, or a countersunk hole to accommodate or avoid the protruding element on the circuit board. After being pressed and deformed, the first side of the first gasket forms surface contact with the top surface and side surface of the protruding element, respectively. The second side of the first gasket, the heat spreader, the second gasket, and the cover plate all form surface contact.

[0020] Preferably, at least one chip or power module of the circuit board is located at the center of the cover plate projected onto the circuit board, and the first pad in contact with the main vibration area provides shock-absorbing support for the main vibration area and transfers heat to the heat spreader.

[0021] Preferably, the projected area of ​​the heat spreader is greater than or equal to the projected area of ​​the first gasket, the projected area of ​​the second gasket is greater than or equal to the projected area of ​​the heat spreader, and the inner surface area of ​​the cover plate is greater than or equal to the projected area of ​​the second gasket.

[0022] Preferably, the distance between the inner surface of the cover plate and the circuit board is L, the thickness of the first gasket is in the range of 0.5L to 5L, the thickness of the heat spreader is less than L, and the thickness of the second gasket is less than L.

[0023] Preferably, the heat spreader is a vacuum heat spreader with a sealed cavity, and the sealed cavity is filled with a cooling medium or a heat exchange medium.

[0024] Preferably, the heat spreader is a copper plate or an aluminum plate, and the outer surface of the heat spreader is coated with an insulating coating. The first and second gaskets are made of thermally conductive silicone pads, thermally conductive silicone grease, thermally conductive phase change materials, or polymer elastomers filled with thermally conductive fillers.

[0025] An embodiment of this utility model also provides a new energy vehicle with a compressor, including the compressor described above.

[0026] The compressor of this invention, as well as new energy vehicles equipped with the compressor, can simultaneously and efficiently solve the problems of vibration suppression and heat dissipation of circuit boards and cover plates, reduce overall noise, and enhance reliability. Attached Figure Description

[0027] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0028] Figure 1 This is a schematic diagram of a compressor according to the present invention.

[0029] Figure 2 for Figure 1 Sectional view along the AA direction.

[0030] Figure 3 This is a cross-sectional view of a compressor cover assembly according to the present invention.

[0031] Figure 4 This is a perspective view of a compressor cover assembly according to the present invention.

[0032] Figure 5 This is a cross-sectional view of a cover plate assembly for another compressor according to the present invention.

[0033] Figure Labels

[0034] 1 Circuit board

[0035] 2 First gasket

[0036] 21-sided bonding type first gasket

[0037] 22 Buffer-type first pad

[0038] 23 Encapsulated first gasket

[0039] 3 heat spreaders

[0040] 4 Second gasket

[0041] 5. Cover plate

[0042] 10 Compressors

[0043] 11. Shell

[0044] 12. Electric Motor Department

[0045] 13 Compression Section

[0046] 14 First mounting cavity

[0047] 15 Second mounting cavity

[0048] 16 chips

[0049] 17 Power Module Detailed Implementation

[0050] The following specific examples illustrate the implementation methods of this application. Those skilled in the art can easily understand the other advantages and effects of this application from the content disclosed herein. This application can also be implemented or applied through other different specific embodiments, and various details in this application can be modified or changed according to different viewpoints and application systems without departing from the spirit of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0051] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily implement the application. This application may be embodied in many different forms and is not limited to the embodiments described herein.

[0052] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics represented in connection with that embodiment or example, which are included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate different embodiments or examples represented in this application, as well as features of different embodiments or examples.

[0053] Furthermore, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the representation of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0054] For the purpose of clearly describing this application, devices that are not relevant to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0055] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Furthermore, when it is said that a device "comprises" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather implies that other constituent elements may be included.

[0056] When we say that a device is "above" another device, this can mean that it is directly above the other device, or it can mean that other devices are present in between. Conversely, when we say that a device is "directly" "above" another device, there are no other devices present in between.

[0057] Although the terms first, second, etc., are used in some instances herein to refer to various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, first interface and second interface, etc., are used. Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0058] The technical terms used herein are for reference only to specific embodiments and are not intended to limit the scope of this application. The singular form used herein includes the plural form unless the statement explicitly indicates otherwise. The word "comprising" as used in the specification means to specify a particular characteristic, region, integer, step, operation, element, and / or component, and does not exclude the presence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.

[0059] Although not explicitly defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Terms defined in commonly used dictionaries shall be further interpreted as having a meaning consistent with the relevant technical literature and the content of this present application, and shall not be over-interpreted as having an ideal or overly formulaic meaning unless otherwise defined.

[0060] Figure 1 This is a schematic diagram of a compressor according to the present invention. Figure 2 for Figure 1 Sectional view along the AA direction. Figure 3 This is a cross-sectional view of a compressor cover assembly according to the present invention. Figure 4 This is a perspective view of a compressor cover assembly according to this utility model. Figures 1 to 4As shown, the compressor 10 of this invention includes: a circuit board 1, at least one first gasket 2, a heat spreader 3, a second gasket 4, and a cover plate 5. The circuit board 1 has at least one heating area partially formed on the side facing away from the motor. The first side of each first gasket 2 is in contact with at least one heating area of ​​the circuit board 1. The first side of the heat spreader 3 is in contact with the second side of the first gasket 2. The first side of the second gasket 4 is in contact with the second side of the heat spreader 3, and the heat spreader 3 has a higher thermal conductivity than the first gasket 2 and the second gasket 4. The cover plate 5 is in contact with the second side of the second gasket 4. This invention provides an integrated heat dissipation and vibration reduction structure for a scroll compressor. This structure can simultaneously and efficiently solve the vibration suppression and heat dissipation problems of the circuit board and the cover plate, resulting in a scroll compressor containing the above structure having lower operating noise and higher operational reliability.

[0061] In a preferred embodiment, it further includes:

[0062] Casing 11;

[0063] The motor section 12 and the compressor section 13 are disposed in the first mounting cavity 14 within the housing 11; and

[0064] The second mounting cavity 15 is defined by the housing 11 and the cover plate 5. The circuit board is housed inside the second mounting cavity 15. The cover plate 5 is screwed to the housing 11 and presses the second gasket 4, the heat spreader 3, and the first gasket 2 onto the circuit board 1 so that the first gasket 2 and the second gasket 4 are compressed and deformed, but this is not the limitation.

[0065] In a preferred embodiment, the shape and position of the first pad 2 are respectively configured to cover at least the heat-generating area, the main vibration area, and the main vibration area of ​​the cover plate on the circuit board. The heat-generating area is defined at least based on the chip position and the position of the power module on the circuit board 1. The first pad 2 in contact with the heat-generating area transfers heat to the heat spreader 3. The main vibration area is defined at least based on the position of the center projection of the cover plate 5 onto the circuit board. The first pad 2 in contact with the main vibration area provides shock-absorbing support for the main vibration area, but is not limited thereto.

[0066] In a preferred embodiment, the first side of the first pad 2 is provided with at least one of a slot, a half slot, an opening, or a countersunk hole to accommodate or avoid the protruding element on the circuit board 1. After being pressed and deformed, the first side of the first pad 2 forms surface contact with the top surface and side surface of the protruding element, respectively. The second side of the first pad 2, the heat spreader 3, the second pad 4, and the cover plate 5 all form surface contact, but are not limited thereto.

[0067] In a preferred embodiment, at least one chip or power module of the circuit board 1 is located at the center of the cover plate 5 projected onto the circuit board, and the first pad 2 in contact with the main vibration area provides damping support for the main vibration area and transfers heat to the heat spreader 3, but is not limited thereto.

[0068] In a preferred embodiment, the projected area of ​​the heat spreader 3 is greater than or equal to the projected area of ​​the first gasket 2, the projected area of ​​the second gasket 4 is greater than or equal to the projected area of ​​the heat spreader 3, and the inner surface area of ​​the cover plate 5 is greater than or equal to the projected area of ​​the second gasket 4, but is not limited thereto.

[0069] In a preferred embodiment, the distance between the inner surface of the cover plate 5 and the circuit board 1 is L, the thickness of the first gasket ranges from 0.5L to 5L, the thickness of the heat spreader is less than L, and the thickness of the second gasket is less than L, but not limited thereto.

[0070] In a preferred embodiment, the heat spreader 3 is a vacuum heat spreader with a sealed cavity, which is filled with a cooling medium or a heat exchange medium, but is not limited thereto.

[0071] In a preferred embodiment, the heat spreader 3 is a copper plate or an aluminum plate, and the outer surface of the heat spreader 3 is coated with an insulating coating. The first gasket 2 and the second gasket 4 are made of thermally conductive silicone pads, thermally conductive silicone grease, thermally conductive phase change materials, or polymer elastomers filled with thermally conductive fillers, but are not limited thereto.

[0072] The integrated heat dissipation and vibration damping structure of this utility model is disposed between the compressor's circuit board 1 and the cover plate 5. The core of this structure lies in its use of a "sandwich"-style multi-layered sandwich structure, specifically including:

[0073] First gasket 2: Its first side is in close contact with the circuit board 1. This gasket is made of a flexible material (such as a thermally conductive silicone pad) with good thermal conductivity and damping properties. It is in direct contact with the circuit board 1, and on the one hand, it uses its damping properties to absorb and attenuate the vibration energy of the circuit board 1, preventing vibration from being transmitted to the cover plate 5; on the other hand, it uses its thermal conductivity to efficiently conduct the heat generated by the core heat-generating components on the circuit board 1.

[0074] The heat spreader 3 has its first side tightly fitted to the second side of the first gasket 2. The heat spreader 3 is made of a metal material with high thermal conductivity (such as copper or aluminum), and its thermal conductivity is far superior to that of the first gasket 2. Its main function is to act as a heat "distributor," rapidly diffusing the heat concentrated in a small area from the first gasket 2 onto a two-dimensional plane, transforming a "point heat source" into a "surface heat source," thereby greatly increasing the effective heat dissipation area.

[0075] The second gasket 4 has its first side tightly fitted to the second side of the heat spreader 3, and its second side tightly fitted to the cover plate 5. The second gasket 4 is also made of a flexible material with both thermal conductivity and damping properties. It plays a dual role: first, it transfers the heat already diffused on the heat spreader 3 to the larger cover plate 5, using the cover plate 5 as the final heat sink; second, it fills the gap between the heat spreader 3 and the cover plate 5, suppressing fretting wear and noise that may occur between the heat spreader 3 and the cover plate 5 due to vibration.

[0076] The shape and arrangement of the first pad 2 are customizable. Its projected area is less than or equal to that of the circuit board 1, and it preferentially covers the core heat-generating points (such as IGBT modules, IPM modules, and driver ICs) and main oscillation points on the circuit board 1. To accommodate the layout of the circuit board 1, various slots and holes can be formed on the first pad 2 to avoid taller components.

[0077] The projected area of ​​the heat spreader 3 is greater than or equal to that of the first gasket 2 to ensure that it can receive all the heat transferred from the first gasket 2 and effectively diffuse it. The heat spreader 3 can be a solid metal plate or a vacuum heat spreader 3 with an internal capillary structure and working fluid, the latter having a higher equivalent thermal conductivity. The surface of the heat spreader 3 can be insulated to improve safety.

[0078] The projected area of ​​the second gasket 4 is greater than or equal to that of the heat spreader 3, and it can cover all or part of the inner surface of the cover plate 5 to ensure that the final heat transfer path is unobstructed.

[0079] This embodiment defines the thickness relationships of each layer. The distance between the inner surface of the cover plate 5 and the circuit board 1 is defined as the reference dimension L. The first gasket 2, serving as the primary buffer and initial heat-conducting layer, has the largest thickness, ranging from 0.5L to 5L. The heat spreader 3 and the second gasket 4, serving as functional extension layers, are thinner, ranging from 0.1L to 1L respectively. This thickness configuration maximizes functionality within a limited space.

[0080] Based on the same inventive concept, this utility model also provides a scroll compressor, which includes a housing, a motor section, a compression section, a circuit board 1, and a cover plate 5, characterized in that an integrated heat dissipation and vibration reduction structure of any of the above is provided between the circuit board 1 and the cover plate 5.

[0081] Compared with the prior art, the technical solution provided by this utility model has the following significant advantages:

[0082] Synergistic Solution to Vibration and Heat Dissipation Issues: This utility model creatively integrates vibration suppression and heat dissipation seamlessly through a unique configuration of "flexible thermal pad + rigid heat spreader 3 + flexible thermal pad". The first pad 2 directly suppresses the vibration of the circuit board 1 and conducts initial heat; the heat spreader 3 efficiently diffuses heat, avoiding localized overheating; the second pad 4 completes the final heat transfer and suppresses structural noise. The three work together to achieve a technical effect of "1+1+1>3", fundamentally solving the problem of "one aspect being addressed at the expense of another" in existing technologies.

[0083] Excellent vibration suppression effect: Compared with perforated damping pads, the first pad 2 of this invention can achieve a large-area, gapless, and tight fit with the circuit board 1, resulting in more comprehensive and effective vibration suppression, especially significantly improving the damping effect on high-frequency and local vibrations. The entire sandwich structure also increases the structural damping of the cover plate 5 system, further suppressing resonance.

[0084] Significantly improved heat dissipation performance: The key to this invention is the introduction of a highly thermally conductive heat spreader 3. It establishes a highly efficient heat conduction path from the circuit board 1 to the cover plate 5, with heat diffusion capabilities far exceeding those of simple thermal pads or perforated vibration damping pads. Experiments show that, under the same operating conditions, the core temperature of the circuit board 1 using this invention's structure can be reduced by more than 15°C compared to existing solutions, greatly improving the lifespan and reliability of components.

[0085] Compact structure and strong applicability: This structure can be directly embedded in the space between the existing circuit board 1 and the cover plate 5 without major modifications to the main compressor structure, resulting in low implementation costs and easy promotion. The thickness and shape of each layer are highly designable, flexibly adapting to the needs of different compressor models and different circuit board 1 layouts.

[0086] The specific embodiments of this utility model include:

[0087] See Figures 1 to 4This utility model provides a scroll compressor 10, including a housing 11, a motor section 12 and a compression section 13 (typically a scroll assembly) disposed within the housing 11. The housing 11 is jointly formed by the housing 11 and a cover plate 5. A first mounting cavity 14 is formed within the housing 11 to accommodate the motor section 12 and the compression section 13. A second mounting cavity 15 is jointly defined between the housing 11 and the cover plate 5 for accommodating a circuit board 1. The circuit board 1 is typically an electronic control board (controller) for driving and controlling the operation of the motor section 12. The core improvement of this utility model lies in the provision of an integrated heat dissipation and vibration damping structure between the circuit board 1 and the cover plate 5. This structure is composed of three layers of materials with different functions stacked or in close contact, which are, from the circuit board 1 side to the cover plate 5 side, sequentially: a first gasket 2, a heat dissipation plate 3, and a second gasket 4. The first gasket 2 in this utility model is made of a soft, elastic insulating material with a high thermal conductivity (e.g., 1-5 W / m·K), preferably a thermally conductive silicone pad. Its first side (lower surface) applies a certain pressure to the upper surface of the circuit board 1, especially to the core heat-generating components (such as chip 16, IGBT, diode, etc.) and vibration-sensitive areas, to achieve close physical contact. The thickness, shape, and hardness of the first gasket 2 can be designed as needed.

[0088] Figure 5 This is a cross-sectional view of another compressor cover assembly according to this utility model. (Reference) Figure 5 As shown, this illustrates the different functions of different types of first gaskets 2. Figure 5 In this design, a surface-mount type first gasket 21 is used to directly bond the chip 16, thereby achieving better heat transfer. To avoid high protruding components (such as power module 17) on the circuit board 1, corresponding slots, countersunk holes, or through holes can be machined on the first gasket 2. The main functions of the first gasket 2 are: (a) to absorb and dissipate vibration energy from the circuit board 1 using its elastic damping characteristics, blocking the transmission path of vibration to the cover plate 5; and (b) to initially conduct heat (H) locally concentrated on the circuit board 1 using its thermal conductivity. Figure 5In this embodiment, a slotted, wrap-around first pad 23 is used to wrap the power module 17. This allows it to fit both the back and sides of the power module 17. The wrap-around first pad 23 mentioned in this embodiment refers to a first pad 2 with precisely slotted grooves based on the spatial shape of the three-dimensional device it will contact (obtained through precise electrical spatial scanning). This allows the grooves of the first pad 23 to accurately fit each surface of the first pad 23, forming separate surface contacts (similar to a three-dimensional wrap, eliminating air insulation). This is particularly beneficial for anisotropic heat-generating devices, potentially achieving better heat transfer. Furthermore, a buffer-type first pad 22 (whose main function is cushioning and shock absorption) can be used to support the cover plate 5 at locations prone to vibration, thereby reducing noise. In a preferred structure, a high-heat-generating chip is positioned in the center of the circuit board 1. A first pad 2 can be used to directly support the chip in the center of the circuit board 1 and the center of the cover plate 5, thus providing both heat transfer and cushioning / shock absorption functions.

[0089] The vapor chamber 3, located above the first pad 2, is made of a metal material with excellent thermal conductivity, such as copper (thermal conductivity approximately 400 W / m·K) or aluminum alloy (thermal conductivity approximately 200 W / m·K). Its projected area should at least completely cover the first pad 2 below it. The core function of the vapor chamber 3 is the lateral diffusion of heat (H). It rapidly conducts and disperses the high heat flux density heat (H) from the first pad 2 in a "point-like" or "linear" manner within its own plane, making the entire upper surface of the vapor chamber 3 a relatively uniform "low-temperature heat source," thus creating favorable conditions for the next stage of heat dissipation. To ensure electrical safety, the outer surface of the vapor chamber 3 can be sprayed with an insulating varnish or covered with an insulating film. In this embodiment, the vapor chamber 3 is a vacuum vapor chamber. It is formed by welding and sealing two metal plates (upper plate and lower plate), with a small amount of cooling medium injected after vacuuming the interior, and a capillary structure sintered thereon. Its working principle is similar to that of a heat pipe, which transfers heat (H) through the phase change of the working fluid (evaporation-condensation). It has an extremely high equivalent thermal conductivity (up to several thousand W / m·K) and its heat dissipation effect far exceeds that of a solid metal plate.

[0090] The second gasket 4 is disposed between the heat spreader 3 and the cover plate 5. Its material can be the same as or similar to the first gasket 2, such as a flexible thermally conductive material like a thermally conductive silicone pad. The projected area of ​​the second gasket 4 should ideally cover the entire heat spreader 3, and may even extend to a greater area of ​​the cover plate 5. Its functions are: (a) to fill the assembly gap between the heat spreader 3 and the cover plate 5, ensuring that heat (H) can be efficiently conducted from the heat spreader 3 to the cover plate 5; (b) to utilize its flexibility to compensate for manufacturing and assembly tolerances, ensuring good contact between layers; and (c) to provide additional damping, suppressing any minor relative movement (micromotion) that may occur between the heat spreader 3 and the cover plate 5 due to vibration, preventing the generation of new noise.

[0091] To achieve optimal performance within a limited space, this invention optimizes the thickness of each layer. The initial distance between the inner surface of the cover plate 5 and the upper surface of the circuit board 1 is defined as the reference dimension L. In this embodiment, the thickness H1 of the first gasket 2 is 0.5L to 5L. A thicker gasket provides better cushioning and vibration isolation. The thickness H2 of the heat spreader 3 is 0.1L to 1L. It is made as thin as possible to save space while ensuring structural strength and thermal conductivity. The thickness H3 of the second gasket 4 is 0.1L to 1L. Sufficient thickness ensures contact and a certain amount of compression. During compressor assembly, the first gasket 2 and the second gasket 4 are moderately compressed, with the compression amount ranging from 10% to 30% of their initial thickness, thereby generating continuous contact pressure and ensuring good thermal contact and vibration restraint.

[0092] Continue to refer to Figure 5 The central suspended position of the cover plate 5 in this invention is most prone to vibration. The vibration path (dotted arrow) is effectively attenuated by the soft, cushioning first pad 22. In contrast, the hollow structure of the prior art document 1 results in discontinuous vibration transmission and a small area, while the prior art document 2 completely fails to suppress the vibration of the circuit board itself. The heat dissipation path of this invention (dashed arrow) is through the efficient channel of "circuit board 1 → surface-fitting first pad 21, wrapping first pad 23 → heat spreader 3 → second pad 4 → cover plate 5". The heat dissipation path of the prior art document 1 is blocked due to the hollow structure, and the prior art document 2 hardly establishes an effective heat conduction path. Through careful material selection and structural design, this invention provides a compact, efficient, and reliable integrated solution, significantly improving the performance of the scroll compressor in terms of noise control and thermal management.

[0093] This utility model also provides a new energy vehicle with a compressor, including the aforementioned compressor. The relevant technical features are as described above and will not be repeated here. Because this new energy vehicle uses the aforementioned compressor, it can also reduce overall vehicle noise and vibration, optimizing the passenger riding experience.

[0094] In summary, the purpose of this utility model is to provide a compressor and a new energy vehicle with a compressor, which can simultaneously and efficiently solve the problems of vibration suppression and heat dissipation of circuit boards and cover plates, reduce overall noise, and enhance reliability.

[0095] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A compressor, characterized in that, include: A circuit board (1), wherein at least one heating area is partially formed on the side of the circuit board (1) away from the motor; At least one first pad (2), and a first side of each first pad (2) is in contact with at least a heating area of ​​the circuit board (1); A heat spreader (3) is provided, wherein the first side of the heat spreader (3) is attached to the second side of the first gasket (2); A second gasket (4), the first side of which is attached to the second side of the heat spreader (3), wherein the thermal conductivity of the heat spreader (3) is higher than that of the first gasket (2) and the second gasket (4); and A cover plate (5) is attached to the second side of the second gasket (4).

2. The compressor as described in claim 1, characterized in that, Also includes: Shell (11); The motor section (12) and the compression section (13) are disposed in the first mounting cavity (14) inside the housing (11); as well as The second mounting cavity (15) is defined by the housing (11) and the cover plate (5). The circuit board is housed inside the second mounting cavity (15). The cover plate (5) is screwed to the housing (11) and presses the second gasket (4), the heat spreader (3), and the first gasket (2) onto the circuit board (1) so that the first gasket (2) and the second gasket (4) are deformed by compression.

3. The compressor as described in claim 2, characterized in that, The shape and position of the first pad (2) are respectively configured to cover at least the heat-generating area, the main vibration area and the main vibration area of ​​the cover plate on the circuit board. The heat-generating area is defined at least based on the chip position and the position of the power module on the circuit board (1). The first pad (2) in contact with the heat-generating area transfers heat to the heat spreader (3). The main vibration area is defined at least based on the position of the center projection of the cover plate (5) onto the circuit board. The first pad (2) in contact with the main vibration area provides shock-absorbing support for the main vibration area.

4. The compressor as described in claim 3, characterized in that, The first side of the first pad (2) is provided with at least one of a slot, a half slot, an opening or a countersunk hole to accommodate or avoid the protruding element on the circuit board (1). After being pressed and deformed, the first side of the first pad (2) forms surface contact with the top surface and side surface of the protruding element, respectively. The second side of the first pad (2), the heat spreader (3), the second pad (4) and the cover plate (5) all form surface contact.

5. The compressor as described in claim 3, characterized in that, At least one chip or power module of the circuit board (1) is located at the center of the cover plate (5) projected onto the circuit board. The first pad (2) in contact with the main vibration area provides shock absorption support for the main vibration area and transfers heat to the heat spreader (3).

6. The compressor as claimed in claim 1, characterized in that, The projected area of ​​the heat spreader (3) is greater than or equal to the projected area of ​​the first gasket (2), the projected area of ​​the second gasket (4) is greater than or equal to the projected area of ​​the heat spreader (3), and the inner surface area of ​​the cover plate (5) is greater than or equal to the projected area of ​​the second gasket (4).

7. The compressor as claimed in claim 1, characterized in that, The distance between the inner surface of the cover plate (5) and the circuit board (1) is L, the thickness of the first gasket is in the range of 0.5L to 5L, the thickness of the heat spreader is less than L, and the thickness of the second gasket is less than L.

8. The compressor as claimed in claim 1, characterized in that, The heat exchange plate (3) is a vacuum heat exchange plate with a sealed cavity, which is filled with a cooling medium or a heat exchange medium.

9. The compressor as claimed in claim 1, characterized in that, The heat spreader (3) is a copper plate or an aluminum plate. The outer surface of the heat spreader (3) is coated with an insulating coating. The first gasket (2) and the second gasket (4) are made of thermally conductive silicone pads, thermally conductive silicone grease, thermally conductive phase change materials, or polymer elastomers filled with thermally conductive fillers.

10. A new energy vehicle with a compressor, characterized in that, Includes the compressor as described in claim 1.

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