A pressure reducing valve with high coaxiality of a valve needle for semiconductor manufacturing
Patent Information
- Application Number
- CN202522515583.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-11-27
AI Technical Summary
由于螺纹副之间的间隙,导致阀针与膜片压块之间的同轴度有偏差
本实用新型通过在膜片压块的螺纹孔顶部设置有限位垫,通过阀针的细杆与限位垫过盈配合,以挤压限位垫使其发生变形,进而挤入螺纹孔的锥形结构内,保证了阀针与膜片压块的同轴度,同时增加了阀针的螺纹自锁能力,并延长了其使用寿命。
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Figure CN224871897U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor component manufacturing, and in particular to a pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing. Background Technology
[0002] A pressure reducing valve reduces pressure at the exhaust port by adjusting the opening between the valve core at the bottom of the valve needle and the sealing gasket. For example, when the inlet pressure is 10-20 MPa, the outlet pressure can be reduced to about 2 MPa.
[0003] A typical pressure reducing valve structure includes a valve body, valve needle, diaphragm assembly, and rear cover. The valve body has an inlet and an outlet, with a central cavity to house the pressure regulating mechanism. The rear cover is threaded to the valve body and secures the integrated assembly consisting of the upper diaphragm block, diaphragm, valve needle, lower diaphragm block, diaphragm block, and valve seat within the valve body. A through-hole is formed in the center of the diaphragm, and a clearance fit is used between the diaphragm and valve needle to achieve pressure sensing and displacement transmission. The diaphragm and diaphragm block are typically welded together to form a single assembly, while the valve needle is threaded to the diaphragm block.
[0004] However, because the valve needle has a needle-like structure that is wider at the bottom and narrower at the top, its lower sealing bevel needs to be pressed tightly against the valve seat for a seal. The upper part passes through the valve seat hole, the diaphragm lower pressure block, and the diaphragm central hole in sequence, and finally connects with the threaded hole on the diaphragm pressure block. Due to the gap between the threaded parts, there is a deviation in the coaxiality between the valve needle and the diaphragm pressure block. Summary of the Invention
[0005] To address the aforementioned problems, the purpose of this invention is to provide a pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing, which can effectively solve the problem of coaxiality deviation between the valve needle and the diaphragm pressure block.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing, the pressure reducing valve being divided into an upper part, a middle part, and a lower part; the lower part is the valve body, on which an air inlet and an air outlet are provided; the middle part includes a cavity formed by a rear cover and the upper part of the valve body, and a pressure regulating actuator disposed within the cavity; the upper part is a manual adjustment mechanism disposed within the rear cover; after the lower part of the rear cover is threadedly connected to the upper part of the valve body, the pressure regulating actuator formed by the diaphragm upper pressure block, the diaphragm, the valve needle, the diaphragm lower pressure block, the diaphragm pressure block, and the valve seat is fixed to the valve body; a hole is drilled in the middle of the diaphragm in the pressure regulating actuator and clearance fits with the valve needle, and the diaphragm is welded to the diaphragm pressure block; the top of the valve needle is threadedly connected to the threaded hole in the bottom of the diaphragm pressure block; a limit pad is provided in the top of the threaded hole of the diaphragm pressure block, the valve needle is interference-fitted with the limit pad, and the limit pad is pressed into the top of the threaded hole to make the valve needle and the diaphragm pressure block coaxial.
[0007] Furthermore, the limiting pad adopts a cylindrical structure and is made of PCTFE material.
[0008] Furthermore, the top of the limiting pad is provided with multiple square grooves spaced apart circumferentially, and expansion blades are formed between adjacent square grooves.
[0009] Furthermore, the top of the limiting pad is provided with multiple V-shaped grooves spaced apart circumferentially, and expansion blades are formed between adjacent V-shaped grooves.
[0010] Furthermore, the top of the limiting pad is provided with multiple arc-shaped V-grooves spaced apart along the circumference, and expansion blades are formed between adjacent arc-shaped V-grooves.
[0011] Furthermore, the valve needle adopts a needle-shaped structure that is larger at the bottom and smaller at the top; the top of the valve needle is a thin rod with a stepped surface at the end of the thin rod; the sealing slope at the bottom of the valve needle is pressed against the valve seat to achieve a seal.
[0012] Furthermore, the top of the threaded hole of the diaphragm pressure block is a conical structure, and the inner wall of the conical structure forms a guide surface; the limiting pad is set inside the conical structure, the stepped surface of the valve needle abuts against the bottom of the limiting pad, and the thin rod end of the valve needle is interference-fitted with the limiting pad, pressing the limiting pad into the conical structure along the guide surface.
[0013] Furthermore, the pressure regulating actuator consists of a valve seat, a lower diaphragm pressure block, a diaphragm, and a diaphragm pressure block arranged sequentially from bottom to top within the valve body; the diaphragm pressure block is located in the middle of the diaphragm, and an upper diaphragm pressure block is arranged circumferentially around the diaphragm pressure block to press against the diaphragm circumferentially.
[0014] Furthermore, the upper part of the valve needle passes through the hole in the valve seat, the diaphragm pressure block, and the hole in the diaphragm in sequence, and is threadedly connected to the diaphragm pressure block through the threaded hole in the diaphragm pressure block using a clearance fit.
[0015] Furthermore, the manual adjustment mechanism includes a buffer pad, a spring seat, a handle lock nut, a handle, a set screw, an upper pressure plate, a spring pad block, an exhaust ring, a pressure plate, and a spring; The top of the rear cover is provided with a pressure cap, and an exhaust ring is provided on the outside of the pressure cap at this end. The top of the pressure cap is provided with an upper pressure cap, and the bottom of the handle is located on the outside of the upper pressure cap and the top of the pressure cap. A set screw is provided inside the handle, and the upper part of the set screw is fixed inside the handle by a handle lock nut. The lower part of the set screw passes through the upper pressure cap and presses against a spring pad, which is located inside the upper pressure cap. One end of the spring is fixed on the spring pad, and the other end is embedded in the spring seat. The spring seat is located on the outside of the diaphragm pressure block, and a buffer pad is provided between the bottom of the spring seat and the upper pressure block of the diaphragm.
[0016] This utility model has the following advantages due to the adoption of the above technical solution: This invention provides a limiting pad at the top of the threaded hole of the diaphragm pressure block. The valve needle's thin rod is pressurized with the limiting pad to deform it and then squeeze into the conical structure of the threaded hole. This ensures the coaxiality of the valve needle and the diaphragm pressure block, increases the self-locking capability of the valve needle's thread, and extends its service life. Attached Figure Description
[0017] Figure 1 This is a cross-sectional view of a pressure reducing valve structure with high valve needle coaxiality for semiconductor manufacturing, as described in this utility model embodiment. Figure 2 yes Figure 1 Enlarged view of the limiting pad with square groove, valve needle, and diaphragm pressure block; Figure 3 yes Figure 2 A diagram showing the dynamic changes of the limiting pad with the square groove when it deforms; Figure 4 It corresponds Figure 2 A three-dimensional schematic diagram of a limiting pad with a square groove in the middle; Figure 5 It corresponds Figure 3 A three-dimensional schematic diagram of the dynamic changes of the limiting pad with square grooves when it deforms; Figure 6 yes Figure 1 Enlarged view of the limiting pad with V-groove, valve needle, and diaphragm pressure block; Figure 7 yes Figure 6 A diagram showing the dynamic changes of the V-groove-featured locating pad as it deforms. Figure 8 It corresponds Figure 6 A three-dimensional schematic diagram of a limiting pad with a V-shaped groove; Figure 9 It corresponds Figure 7 A three-dimensional schematic diagram of the dynamic changes of the limiting pad with V-groove when it deforms; Figure 10 yes Figure 1 Enlarged view of the limiting pad with arc-shaped V-groove, valve needle, and diaphragm pressure block; Figure 11 yes Figure 10 A diagram showing the dynamic changes of the limiting pad with the arc-shaped V-groove as it deforms; Figure 12 It corresponds Figure 10 A three-dimensional schematic diagram of a limiting pad with an arc-shaped V-groove. Figure 13 It corresponds Figure 11 A three-dimensional schematic diagram of the dynamic changes of the limiting pad with the arc-shaped V-groove when it deforms; Explanation of reference numerals in the attached figures: 1-Valve body; 2-Valve needle; 3-Valve seat; 4-Diaphragm lower pressure block; 5-Diaphragm upper pressure block; 6-Diaphragm; 7-Diaphragm pressure block; 71-Threaded hole; 8-Buffer pad; 9-Spring seat; 10-Rear cover; 11-Spring; 12-Pressure cover; 13-Exhaust ring; 14-Spring pad; 15-Upper pressure cover; 16-Setting screw; 17-Handle; 18-Handle lock nut; 19-Air inlet; 20-Air outlet; 21-Limiting pad; 22-Guide surface; 23-Square groove; 24-Expansion vane; 25-V-groove; 26-Arc-shaped V-groove. Detailed Implementation
[0018] For pressure reducing valves used in semiconductor manufacturing, due to the valve's structure, the valve needle 2 and diaphragm block 7 cannot be integrally molded; they can only be connected by threads. This results in low coaxiality between the threaded parts and the valve needle 2 and diaphragm block 7. Therefore, this invention provides a pressure reducing valve for semiconductor manufacturing with high valve needle coaxiality to effectively improve the coaxiality between the valve needle and diaphragm block.
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model are within the protection scope of this utility model.
[0020] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof; the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Example 1
[0021] The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing provided in this embodiment is such as... Figure 1 As shown, the pressure reducing valve is divided into upper, middle, and lower parts; the lower part is the valve body 1, which has an air inlet 19 and an air outlet 20; the middle part includes a cavity formed by the rear cover 10 and the upper part of the valve body 1, and a pressure regulating actuator disposed within the cavity; the upper part is a manual adjustment mechanism disposed within the rear cover 10. Wherein: After the lower part of the rear cover 10 is threadedly connected to the upper part of the valve body 1, the pressure regulating actuator formed by the diaphragm upper pressure block 5, diaphragm 6, valve needle 2, diaphragm lower pressure block 4, diaphragm pressure block 7, and valve seat 3 is fixed to the valve body 1. Specifically, the diaphragm 6 in the pressure regulating actuator has a hole drilled in its center and is clearance-fitted to the valve needle 2; the diaphragm 6 is welded to the diaphragm pressure block 7; and the top of the valve needle 2 is threadedly connected to the threaded hole 71 in the bottom of the diaphragm pressure block 7.
[0022] In this embodiment, the valve body 1 is provided with a valve seat 3, a diaphragm lower pressure block 4, a diaphragm 6 and a diaphragm pressure block 7 arranged sequentially from bottom to top; the diaphragm pressure block 7 is located in the middle of the diaphragm 6, and an upper pressure block 5 is arranged around the diaphragm pressure block 7 to press against the diaphragm 6.
[0023] In this embodiment, the manual adjustment mechanism includes a buffer pad 8, a spring seat 9, a handle lock nut 18, a handle 17, a set screw 16, an upper pressure cover 15, a spring pad 14, an exhaust ring 13, a pressure cover 12, and a spring 11. A pressure cover 12 is provided on the top of the rear cover 10, and an exhaust ring 13 is provided on the outside of the pressure cover 12 at this end. An upper pressure cover 15 is provided on the top of the pressure cover 12. The bottom of the handle 17 is located outside the top of the upper pressure cover 15 and the pressure cover 12. A set screw 16 is located inside the handle 17, and the upper part of the set screw 16 is fixed inside the handle 17 by the handle lock nut 18; the lower part of the set screw 16 passes through the upper pressure cover 15 and presses against the spring pad 14, which is located inside the upper pressure cover 15. One end of the spring 11 is fixed to the spring pad 14, and the other end is embedded in the spring seat 9; the spring seat 9 is located outside the diaphragm pressure block 7, and a buffer pad 8 is provided between the bottom of the spring seat 9 and the diaphragm upper pressure block 5.
[0024] In this embodiment, the valve needle 2 adopts a needle-like structure that is larger at the bottom and smaller at the top. The top of the valve needle 2 is a thin rod with a stepped end. The sealing bevel at the bottom of the valve needle 2 presses against the valve seat 3 to achieve a seal. Because the upper part of the valve needle 2 in the pressure reducing valve used in semiconductor manufacturing passes sequentially through the holes in the valve seat 3, the diaphragm pressure block 4, and the diaphragm 6, and uses a clearance fit, it is threadedly connected to the diaphragm pressure block 7 through the threaded hole 71 within the diaphragm pressure block 7. Therefore, a structure in which the valve needle 2 and the diaphragm pressure block 7 are integrally formed cannot be used.
[0025] In this embodiment, the top of the threaded hole 71 of the diaphragm pressure block 7 is a conical structure, and the inner sidewall of the conical structure forms a guide surface 22. A limiting pad 21 is provided inside the conical structure, and the stepped surface of the valve needle 2 abuts against the bottom of the limiting pad 21. The limiting pad 21 is pressed into the conical structure along the guide surface 22 by the interference fit between the thin rod end of the valve needle 2 and the limiting pad 21, thereby improving the coaxiality of the valve needle 2 and the diaphragm pressure block 7 and making the connection between the two more secure, so as to reduce the likelihood of threaded connection failure.
[0026] In the above embodiment, the limiting pad 21 adopts a cylindrical structure, that is, a through hole is provided in the middle of the limiting pad 21; the top of the cylindrical structure is a frustum, which partially contacts the guide surface 22 of the conical structure, so that the limiting pad 21 can enter the conical structure under the compression of the valve needle 2. The limiting pad 21 is made of PCTFE material.
[0027] During use, with the valve needle 2 in the threaded state, it compresses and deforms the limiting pad 21, converging it into the tapered structure at the top of the threaded hole 71 of the diaphragm pressure block 7. This ensures the coaxiality of the valve needle 2, avoiding the misalignment problem caused by the gap between the threaded pairs. This ensures that the pressure reducing valve has minimal error after multiple uses, i.e., a stable cv value. Furthermore, because the deformed limiting pad 21 is elastic, it increases the thread self-locking capability of the threaded valve needle 2, thereby increasing its service life. Example 2
[0028] The pressure reducing valve with high valve needle coaxiality provided in this embodiment has a structure and principle that are basically the same as the pressure reducing valve in Embodiment 1. The difference is that, for example... Figure 2 , Figure 4 As shown, in this embodiment, the top of the limiting pad 21 is provided with a plurality of square grooves 23 spaced apart along the circumference, and an expansion leaf 24 is formed between adjacent square grooves 23.
[0029] When using, such as Figure 3 , Figure 5 As shown, the stepped surface of the valve needle 2 abuts against the bottom of the limiting pad 21. When the valve needle 2 is in the threaded tightened state, it squeezes and deforms the limiting pad 21. The expansion blade 24 causes the top of the limiting pad 21 to deform regularly under the compression state, which further ensures the coaxiality of the valve needle 2 and the diaphragm block 7. Example 3
[0030] The pressure reducing valve with high valve needle coaxiality provided in this embodiment has a structure and principle that are basically the same as the pressure reducing valve in Embodiment 2. The difference is that, for example... Figure 6 , Figure 8 As shown, in this embodiment, the top of the limiting pad 21 is provided with a plurality of V-shaped grooves 25 spaced apart along the circumference, and an expansion leaf 24 is formed between adjacent V-shaped grooves 25.
[0031] When using, such as Figure 7 , Figure 9 As shown, the stepped surface of the valve needle 2 abuts against the bottom of the limiting pad 21. When the valve needle 2 is in the screw-tightened state, it compresses and deforms the limiting pad 21, causing the expansion blade 24 to promote regular deformation of the top of the limiting pad 21 from its root (i.e., the root of the V-groove 25), further ensuring the coaxiality of the valve needle 2 and the diaphragm block 7. Furthermore, the gaps in the limiting pad 21 are consistent after deformation, effectively improving coaxiality. Example 4
[0032] The pressure reducing valve with high valve needle coaxiality provided in this embodiment has a structure and principle that are basically the same as the pressure reducing valve in Embodiment 3. The difference is that, for example... Figure 10 , Figure 12 As shown, in this embodiment, the top of the limiting pad 21 is provided with a plurality of arc-shaped V-grooves 26 spaced apart along the circumference, and an expansion leaf 24 is formed between adjacent arc-shaped V-grooves 26.
[0033] When using, such as Figure 11 , Figure 13 As shown, the stepped surface of the valve needle 2 abuts against the bottom of the limiting pad 21. When the valve needle 2 is in the screw-tight state, the arc-shaped V-groove 26 forms a spiral-like extrusion plane under the extrusion of the screw rotation, which further promotes the regular deformation of the top of the limiting pad 21, thereby increasing the coaxiality of the valve needle 2 and the diaphragm pressure block 7.
[0034] In summary, this utility model, by setting a limiting pad 21 to cooperate with the valve needle 2, can deform regularly under the compression of the valve needle 2, which not only ensures coaxiality but also effectively extends the service life of the valve needle 2. Moreover, during use, the limiting pad 21 can be unscrewed along with the valve needle 2 for cleaning or replacement and reassembly, ensuring that the limiting pad 21 can provide a stable radial force and effectively ensure coaxiality.
[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing, characterized in that, The pressure reducing valve is divided into an upper part, a middle part and a lower part; the lower part is the valve body (1), which is provided with an air inlet (19) and an air outlet (20); the middle part includes the cavity formed by the rear cover (10) and the upper part of the valve body (1) and the pressure regulating actuator provided in the cavity; the upper part is a manual adjustment mechanism provided in the rear cover (10); After the lower part of the back cover (10) is threadedly connected to the upper part of the valve body (1), the pressure regulating actuator formed by the diaphragm upper pressure block (5), diaphragm (6), valve needle (2), diaphragm lower pressure block (4), diaphragm pressure block (7) and valve seat (3) is fixed to the valve body (1); the diaphragm (6) in the pressure regulating actuator is drilled in the middle and is clearance-fitted with the valve needle (2), and the diaphragm (6) is welded to the diaphragm pressure block (7); the top of the valve needle (2) is threadedly connected to the threaded hole (71) in the bottom of the diaphragm pressure block (7); A limiting pad (21) is provided inside the top of the threaded hole (71) of the diaphragm pressure block (7). The valve needle (2) is press-fitted with the limiting pad (21) to press the limiting pad (21) into the top of the threaded hole (71) so that the valve needle (2) and the diaphragm pressure block (7) are coaxial.
2. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The limiting pad (21) has a cylindrical structure and is made of PCTFE material.
3. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The top of the limiting pad (21) is provided with multiple square grooves (23) spaced apart in the circumferential direction, and expansion blades (24) are formed between adjacent square grooves (23).
4. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The top of the limiting pad (21) is provided with multiple V-shaped grooves (25) spaced apart in the circumferential direction, and expansion blades (24) are formed between adjacent V-shaped grooves (25).
5. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The top of the limiting pad (21) is provided with multiple arc-shaped V-grooves (26) spaced apart along the circumference, and expansion blades (24) are formed between adjacent arc-shaped V-grooves (26).
6. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The valve needle (2) adopts a needle-shaped structure with a larger bottom and a smaller top; the top of the valve needle (2) is a thin rod, and a stepped surface is provided at the end of the thin rod; the sealing slope at the bottom of the valve needle (2) is pressed against the valve seat (3) to achieve a seal.
7. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 6, characterized in that, The top of the threaded hole (71) of the diaphragm pressure block (7) is a conical structure, and the inner sidewall of the conical structure forms a guide surface (22); the limiting pad (21) is set inside the conical structure, the stepped surface of the valve needle (2) abuts against the bottom of the limiting pad (21), and the thin rod end of the valve needle (2) is press-fitted with the limiting pad (21) to press the limiting pad (21) into the conical structure along the guide surface (22).
8. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The pressure regulating actuator is as follows: the valve body (1) is provided with valve seat (3), diaphragm lower pressure block (4), diaphragm (6) and diaphragm pressure block (7) in sequence from bottom to top; the diaphragm pressure block (7) is located in the middle of the diaphragm (6), and the diaphragm upper pressure block (5) is located in the circumference of the diaphragm pressure block (7) to press on the circumference of the diaphragm (6).
9. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 8, characterized in that, After the upper part of the valve needle (2) passes through the hole of the valve seat (3), the diaphragm pressure block (4) and the hole of the diaphragm (6) in sequence, it is connected to the diaphragm pressure block (7) by a clearance fit through the threaded hole (71) in the diaphragm pressure block (7).
10. The pressure reducing valve with high valve needle coaxiality for semiconductor manufacturing as described in claim 1, characterized in that, The manual adjustment mechanism includes a buffer pad (8), a spring seat (9), a handle lock nut (18), a handle (17), a set screw (16), an upper pressure cover (15), a spring pad (14), an exhaust ring (13), a pressure cover (12), and a spring (11). The top of the back cover (10) is provided with a pressure cap (12), and an exhaust ring (13) is provided on the outside of the pressure cap (12) at this end. The top of the pressure cap (12) is provided with an upper pressure cap (15). The bottom of the handle (17) is provided on the outside of the top of the upper pressure cap (15) and the pressure cap (12). A set screw (16) is provided inside the handle (17). The upper part of the set screw (16) is fixed inside the handle (17) by the handle lock nut (18). The lower part of the set screw (16) passes through the upper pressure cap (15) and presses against the spring pad (14). The spring pad (14) is provided inside the upper pressure cap (15). One end of the spring (11) is fixed on the spring pad (14), and the other end is embedded in the spring seat (9). The spring seat (9) is provided on the outside of the diaphragm pressure block (7), and a buffer pad (8) is provided between the bottom of the spring seat (9) and the diaphragm upper pressure block (5).