An indoor unit and an air conditioner

Abstract

The application provides an indoor unit and an air conditioner, which comprise an indoor air duct assembly, an indoor heat exchanger, an electric control module and a heat dissipation air duct piece. The indoor air duct assembly is formed with an indoor air duct. The indoor heat exchanger has a windward surface and a leeward surface. The electric control module is arranged on one side of the indoor air duct assembly along a first direction. The heat dissipation air duct piece is formed with a heat dissipation air duct. One end of the heat dissipation air duct is communicated with an indoor environment, and the other end is communicated with the windward surface. At least part of the electric control module is arranged in the heat dissipation air duct. The indoor unit of the application is less affected by the outdoor environment and temperature change. The heat generated by the electric control module can be received by the windward surface of the indoor heat exchanger through the heat dissipation air duct, so that effective heat dissipation is realized. An additional heat dissipation fan is not needed, and the phenomenon that the electric control module is short-circuited due to the condensate water generated by the fluorine cooling mode can be reduced. The heat of the electric control module will not enter the indoor air duct. The stability and balance of the air temperature in the indoor air duct are high, and the probability of condensation is low.

Description

Technical Field

[0001] This application relates to the field of air conditioning technology, and in particular to an indoor unit and an air conditioner. Background Technology

[0002] In related technologies, the electronic control module is located in the outdoor unit. On the one hand, the outdoor operating conditions are complex, with temperatures ranging from -40℃ to 52℃. The electronic control module is greatly affected by temperature and is prone to shutdown protection when the temperature is too low or too high. At the same time, it is also susceptible to outdoor rain, snow, dust and other factors. On the other hand, the electronic control module generates heat during operation. Although a heat sink is installed inside the electronic control module, the heat dissipation effect of the heat sink is poor. Utility Model Content

[0003] In view of this, the embodiments of this application aim to provide an indoor unit and an air conditioner that improves the operational reliability and heat dissipation effect of the electronic control module.

[0004] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows: This application provides an indoor unit, including: An indoor air duct assembly, forming an indoor air duct, the indoor air duct being used to introduce heat exchange airflow into the room; An indoor heat exchanger is installed in the indoor air duct, and the indoor heat exchanger has a windward side and a leeward side. An electronic control module is disposed on one side of the indoor air duct assembly along the first direction; A heat dissipation duct component is formed, one end of which is connected to the indoor environment and the other end is connected to the windward surface. At least part of the electronic control module is disposed in the heat dissipation duct, wherein the first direction is perpendicular to the height direction of the indoor unit.

[0005] In some implementations, the indoor unit includes a seal disposed at the connection between the heat dissipation duct and the indoor heat exchanger.

[0006] In some implementations, the electronic control module includes a circuit board assembly and a heat sink, with the heat dissipation duct spaced apart from the circuit board assembly, and at least a portion of the heat sink located within the heat dissipation duct.

[0007] In some embodiments, the heat dissipation duct component is disposed on the outside of the radiator along the first direction and away from the indoor air duct assembly, and the heat dissipation duct component is provided with an air inlet that connects the heat dissipation duct and the indoor environment.

[0008] In some implementations, the air inlet is opened along the second direction, and the radiator includes a plurality of heat dissipation fins, which are spaced apart along the height direction, wherein the first direction, the second direction, and the height direction are perpendicular to each other.

[0009] In some implementations, the heat dissipation duct component is an integral structure; and / or, The heat dissipation duct component includes a housing and a cover plate. The housing is open on one side along the second direction to form an opening. The cover plate is connected to the housing along the second direction and closes part of the opening. The other part of the opening forms the air inlet. The first direction, the second direction, and the height direction are perpendicular to each other.

[0010] In some embodiments, the heat dissipation duct component includes a housing and a spacer disposed within the housing. The spacer defines the heat dissipation duct within the housing and divides the space within the housing into a first duct section and a second duct section that are interconnected. The first duct section and the second duct section are located on opposite sides of the spacer along a first direction. The heat sink is located within the first duct section, and the second duct section is located downstream of the first duct section along the airflow direction.

[0011] In some implementations, the radiator is located on the side where the first air duct section and the second air duct section connect.

[0012] In some implementations, the space within the housing further includes a third air duct section, which connects the second air duct section and the windward surface, with the second air duct section being angled relative to the first air duct section.

[0013] In some implementations, the first and second air duct segments extend along a second direction, and the third air duct segment extends from its connection with the second air duct segment in a first direction to communicate with the windward surface, wherein the first direction, the second direction, and the height direction are mutually perpendicular.

[0014] In some implementations, the junction of the second and third air duct sections extends at an angle toward the indoor heat exchanger.

[0015] In some embodiments, the housing is open on one side along a second direction to form an opening, and the spacer divides the opening into a first opening and a second opening. The first opening defines an air inlet for the heat dissipation duct, which includes a cover that abuts against the housing along the second direction and seals the second opening.

[0016] In some implementations, the circuit board assembly includes a main control board, the main control board includes a board and electronic devices disposed on one side of the board facing the indoor air duct assembly along a first direction, the heat sink is integrated on the board, and the electronic devices and the heat sink are arranged along a second direction, wherein the first direction, the second direction and the height direction are mutually perpendicular.

[0017] This application provides an air conditioner, including: Outdoor unit, including outdoor heat exchanger; Chassis, outer shell, and partitions; The indoor unit described in any embodiment of this application, wherein the outdoor heat exchanger is in heat exchange communication with the indoor heat exchanger; the outer shell is disposed above the chassis, the outdoor unit and the indoor unit are disposed within the space defined by the chassis and the outer shell, and the partition separates the indoor unit and the outdoor unit.

[0018] The indoor unit provided in this application embodiment has an electronic control module housed within it, reducing the impact of outdoor environmental and temperature changes and ensuring high operational safety. A heat dissipation duct connects the electronic control module and the airflow side of the indoor heat exchanger. Heat generated by the electronic control module can be received by the indoor heat exchanger through the heat dissipation duct, effectively cooling the electronic control module. The structure is simple, eliminating the need for an additional cooling fan. It also reduces the risk of condensation and short circuits in the electronic control module caused by refrigerant cooling, resulting in high heat dissipation reliability and safety. Furthermore, heat from the electronic control module does not enter the indoor air duct, ensuring high stability and uniformity of airflow temperature within the duct and reducing the likelihood of condensation. Attached Figure Description

[0019] Figure 1 This is a partial structural schematic diagram of an air conditioner according to an embodiment of this application; Figure 2 for Figure 1 An exploded view of the structure shown. Figure 3 This is a schematic diagram of another part of the structure of an air conditioner according to an embodiment of this application; Figure 4 for Figure 3 The diagram shows a cross-sectional view of the structure along the AA direction, where the dashed arrows indicate the airflow direction at the heat dissipation duct. Figure 5 This is a schematic diagram illustrating the interaction between a heat dissipation duct component and an electronic control module according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures 100-Air conditioner; 10-Indoor unit; 10a-Indoor air duct; 11-Electrical control module; 110-Electrical control box; 111-Main control board; 1111-Board; 1112-Electronic components; 112-Radiator; 1121-Heat dissipation fins; 113-Mounting plate; 12-Indoor heat exchanger; 12a-Windward side; 12b-Leaning side; 13-Heat dissipation air duct component; 13a-Air inlet, first opening; 13b-First air duct section; 13c-Second air duct section; 13d-Third air duct section; 13e-Second opening; 131-Housing; 132-Spacer; 133-Cover plate; 14-Indoor air duct assembly; 15-Sealing component; 20-Outdoor unit; 21-Outdoor heat exchanger; 30-Chassis; 40-Outer shell; 50-Baffle. Detailed Implementation

[0021] In the description of the embodiments of this application, it should be noted that the terms "height direction", "up", "down", "top", "bottom", "left", "right", "front", "back", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0022] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "support" should be interpreted broadly. For example, they can refer to fixed supports, detachable supports, or integral supports; they can refer to mechanical supports or electrical supports; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] This application provides an indoor unit 10. Please refer to... Figures 1 to 5 The indoor unit 10 includes an indoor air duct assembly 14, an indoor heat exchanger 12, an electronic control module 11, and a heat dissipation air duct component 13.

[0024] It is understandable that the indoor unit 10 can be a separate air conditioning indoor unit or integrated into a single air conditioning unit; there are no restrictions on this.

[0025] This application provides an air conditioner 100, including an outdoor unit 20 and an indoor unit 10 in any embodiment of this application. The outdoor unit 20 includes an outdoor heat exchanger 21, which is in heat exchange communication with the indoor heat exchanger 12.

[0026] It is understood that the type of air conditioner 100 in this application is not limited. For example, it can be a window air conditioner. The window air conditioner is an integrated air conditioner, that is, the outdoor unit 20 and the indoor unit 10 are integrated into one box, so that the structure is compact and the space occupied is reduced.

[0027] For example, a mounting opening is formed in the wall, a window can be disposed in the mounting opening, and the air conditioner 100 can be installed in the mounting opening. The two sides of the window are the indoor side and the outdoor side, respectively. The indoor unit 10 is located on the indoor side of the window, and the outdoor unit 20 is located on the outdoor side of the window. Of course, the air conditioner 100 can also be installed in other locations that are substantially similar to the window. For example, the air conditioner 100 can be installed on the wall through a housing 40. The housing 40 may include an indoor housing and an outdoor housing. The outdoor housing is disposed outside the outdoor unit 20 and is mounted to the wall, while the indoor housing is disposed outside the indoor unit 10 and exposed to the indoor environment.

[0028] For example, the air conditioner 100 can be a PTAC (Packaged Terminal Air Conditioner) window unit, that is, the air conditioner 100 has a fresh air function while cooling and heating, thus improving air quality.

[0029] In some embodiments, the air conditioner 100 includes a chassis 30, a housing 40, and a partition 50. The housing 40 covers the chassis 30, and the outdoor unit 20 and the indoor unit 10 are disposed within the space defined by the chassis 30 and the housing 40. The partition 50 separates the indoor unit 10 and the outdoor unit 20.

[0030] The chassis 30 is positioned at the bottom of the outdoor unit 20 and the indoor unit 10 to support them. The outer casing 40 covers the chassis 30. Thus, the outdoor unit 20 and the indoor unit 10 are located within the space defined by the chassis 30 and the outer casing 40, providing protection for them and ensuring the overall structural stability of the air conditioner 100, facilitating its installation. The partition 50 separates the indoor unit 10 and the outdoor unit 20; that is, the indoor unit 10 is located on the side of the partition 50 facing inwards, and the outdoor unit 20 is located on the side of the partition 50 facing outwards.

[0031] Understandably, without a partition, the cold air drawn in by the indoor fan may leak directly from the casing to the outdoor side, or the hot air drawn in by the outdoor fan may directly enter the indoor side, causing a decrease in the cooling and heating efficiency of the air conditioner and affecting its performance.

[0032] Therefore, the partition 50 is used to isolate indoor air from outdoor air. The partition 50 physically blocks the direct connection between the indoor air duct 10a and the outdoor air duct, ensuring that indoor air can only be drawn in by the indoor fan, exchanged heat through the indoor heat exchanger 12, and then blown back indoors; outdoor air can only be drawn in by the outdoor fan, exchanged heat through the outdoor heat exchanger 21, and then discharged outdoors. This allows the air conditioner 100 to efficiently complete the heat exchange process of indoor heat absorption and outdoor heat release (cooling) or outdoor heat absorption and indoor heat release (heating). Of course, the partition 50 also provides structural support and dust and water protection, reducing the likelihood of rainwater and dust directly entering the indoor side.

[0033] The partition 50 can be made of sheet metal, which is lightweight and easy to mass-produce, thus ensuring the structural strength of the partition 50.

[0034] The indoor heat exchanger 12 and the outdoor heat exchanger 21 are used as evaporators or condensers. The working principle of the air conditioner 100 is briefly described below.

[0035] In cooling mode, the outdoor heat exchanger 21 acts as a condenser, and the indoor heat exchanger 12 acts as an evaporator. The compressor draws in low-temperature, low-pressure gaseous refrigerant and compresses it into high-temperature, high-pressure gaseous refrigerant. The high-temperature, high-pressure gaseous refrigerant enters the outdoor heat exchanger 21, and the outdoor fan draws in outdoor air. The high-temperature, high-pressure refrigerant exchanges heat with the outdoor air, lowering its temperature and causing it to condense from a gaseous state into a liquid state. At the same time, it releases a large amount of heat to the outdoor air. The high-temperature liquid refrigerant passes through a throttling device and becomes low-temperature, low-pressure liquid refrigerant, which then enters the indoor heat exchanger 12. The indoor fan draws in indoor air, and the low-temperature, low-pressure liquid refrigerant exchanges heat with the indoor air, absorbing heat from the indoor air and evaporating from a liquid state into a gaseous state. Simultaneously, it lowers the indoor air temperature, and the cooled air is blown back into the room, achieving cooling.

[0036] In heating mode, the outdoor heat exchanger 21 is used as an evaporator, and the indoor heat exchanger 12 is used as a condenser. The compressor compresses the low-temperature, low-pressure gaseous refrigerant into a high-temperature, high-pressure gas. The high-temperature, high-pressure gas first enters the room and exchanges heat with the indoor heat exchanger 12. The indoor fan blows through the indoor heat exchanger 12, and the refrigerant releases heat to the indoor air and condenses into a liquid, thus raising the temperature of the indoor air. The high-temperature liquid refrigerant passes through a throttling device and becomes a low-temperature liquid. The low-temperature liquid refrigerant enters the outdoor heat exchanger 21, where it absorbs heat from the outdoor air and evaporates into a gas. In this way, heating is achieved.

[0037] The indoor air duct assembly 14 forms an indoor air duct 10a, which is used to introduce heat exchange airflow into the room; the indoor heat exchanger 12 is disposed in the indoor air duct 10a, and the indoor heat exchanger 12 has a windward side 12a and a leeward side 12b.

[0038] The indoor air duct assembly 14 is the structure used to form the indoor air duct 10a. The indoor air duct assembly 14 can be a single component or multiple components assembled together, without any limitation.

[0039] The windward side 12a and the leeward side 12b are the opposite two sides of the indoor heat exchanger 12 along its thickness direction. The windward side 12a refers to the surface of the indoor heat exchanger 12 that is in contact with the airflow. After the airflow comes into contact with the windward side 12a of the indoor heat exchanger 12 and exchanges heat, it leaves the indoor heat exchanger 12b through the leeward side 12b and is blown out through the indoor air duct 10a. Thus, the indoor air duct 10a introduces the heat-exchanged airflow into the indoor environment to improve the indoor temperature.

[0040] For example, the windward side 12a and the leeward side 12b are the opposite side surfaces of the indoor heat exchanger 12 along the second direction.

[0041] The electronic control module 11 is a component responsible for the operation control, signal processing, power management and protection of the air conditioner 100.

[0042] The electronic control module 11 is disposed on one side of the indoor air duct assembly 14 along a first direction, wherein the first direction is perpendicular to the height direction of the indoor unit 10. For example, the first direction can be a left-right direction, and the second direction can be a front-back direction.

[0043] The electronic control module 11 and the indoor air duct assembly 14 are arranged along the first direction, making full use of the indoor space to arrange the electronic control module 11. On the one hand, the placement of the electronic control module 11 on the indoor side can effectively protect the electronic control module 11, reducing its impact from rain, snow, dust, etc. on the outdoor side. Furthermore, the indoor temperature is more stable and milder than the outdoor temperature, further reducing the impact of low or high outdoor temperatures on the electronic control module 11. This also facilitates maintenance and increases ease of maintenance. On the other hand, it allows for heat dissipation of the electronic control module 11 using negative pressure air intake. The electronic control module 11 is located on the side of the indoor heat exchanger 12 that is different from the heat exchange direction, achieving a compact layout without affecting the heat exchange operation of the indoor heat exchanger 12.

[0044] The heat dissipation duct component 13 connects the electronic control module 11 and the indoor heat exchanger 12. The heat dissipation duct component 13 forms a heat dissipation duct. One end of the heat dissipation duct is connected to the indoor environment, and the other end is connected to the windward surface 12a. At least a portion of the electronic control module 11 is disposed in the heat dissipation duct.

[0045] Specifically, one end of the heat dissipation duct component 13 is connected to the indoor environment, and the other end is connected to the indoor heat exchanger 12. Thus, when the indoor heat exchanger 12 is running, a negative pressure is formed at the indoor heat exchanger 12, and a negative pressure is also formed in the heat dissipation duct. Part of the indoor air blows directly towards the windward side 12a, and another part blows towards the windward side 12a through the heat dissipation duct. While passing through the heat dissipation duct, this part of the airflow carries away the heat generated by the electronic control module 11. Thus, after the hot air exchanges heat with the indoor heat exchanger 12, it enters the indoor air duct 10a from the leeward side 12b. The indoor air duct 10a then discharges the heat-exchanged airflow into the indoor environment, thereby achieving heat dissipation for the electronic control module 11.

[0046] In other words, in this application, the heat exchange of the indoor heat exchanger 12 is used to dissipate heat from the electronic control module 11. After the hot air exchanges heat with the indoor heat exchanger 12, it is blown out through the indoor air duct 10a. In this way, the airflow entering the indoor air duct 10a has all exchanged heat with the indoor heat exchanger 12. The airflow temperature in the indoor air duct 10a is uniform and stable, reducing the probability that hot air will directly enter the indoor air duct 10a without passing through the indoor heat exchanger 12 and come into contact with the heat exchanged airflow in the indoor air duct 10a, thus causing condensation. As a result, the hot air will not affect the temperature of the indoor heat exchanger 12, nor will it condense in the indoor air duct 10a, ensuring user comfort.

[0047] Taking the air conditioner 100 in cooling mode as an example, the indoor heat exchanger 12 is used as an evaporator. The surface temperature of the indoor heat exchanger 12 is low, and the heat from the electronic control module 11 can be quickly reduced when it is transferred to the windward side 12a through the heat dissipation duct. The indoor heat exchanger 12 condenses and dehumidifies the hot airflow. The airflow entering the indoor air duct 10a is all dry and cold airflow, and no condensation will occur. At the same time, the heat exchange efficiency of the indoor heat exchanger 12 is much greater than the heating power of the electronic control module 11. The indoor heat exchanger 12 can quickly and effectively cool down the electronic control module 11 in real time. It has high heat dissipation efficiency and does not require an additional cooling fan for the electronic control module 11, resulting in good noise reduction.

[0048] It should be noted that the heat dissipation duct component 13 is a specific, tangible structure. The heat dissipation duct component 13 connects the electronic control module 11 and the indoor heat exchanger 12, and can provide a relatively closed heat dissipation duct to introduce all or almost all of the heat generated by the electronic control module 11 into the indoor heat exchanger 12, thereby improving heat dissipation efficiency and reducing the impact of heat on other structures.

[0049] Meanwhile, in this embodiment, the electronic control module 11 is connected to the indoor environment through a heat dissipation duct, meaning that the electronic control module 11 is not directly connected to the indoor environment. The airflow from the indoor environment first enters the heat dissipation duct and is then guided by the heat dissipation duct to carry away the heat from the electronic control module 11. On the one hand, there is no need to set an air intake structure on the structure of the electronic control module 11, which makes it easier to increase the structural reliability of the electronic control module 11. On the other hand, the air intake of the heat dissipation duct can better guide the air volume to the heat concentration point of the electronic control module 11, which facilitates electrical isolation.

[0050] Understandably, in some related technologies, the electronic control module is located in the outdoor unit and is equipped with a cooling fan to dissipate heat. However, due to space limitations, the cooling fan is small, with low power and airflow, making it difficult to dissipate heat from the electronic control module quickly and efficiently. Furthermore, in summer, high outdoor temperatures make it difficult for outdoor air to effectively remove heat from the module. In other related technologies, the electronic control module is located in the outdoor unit, with its radiator and refrigerant piping tightly fitted for refrigerant cooling. However, this method can negatively impact cooling and heating efficiency. Additionally, the tight fit between the refrigerant piping and the radiator can cause condensation, leading to water damage to the circuit board components within the electronic control module and affecting the normal operation of the air conditioner.

[0051] The indoor unit 10 provided in this application embodiment has an electronic control module 11 disposed therein, reducing the impact of outdoor environment and temperature changes, resulting in high operational safety. The heat dissipation duct 13 connects the electronic control module 11 to the airflow side 12a of the indoor heat exchanger 12. The heat generated by the electronic control module 11 can be received by the indoor heat exchanger 12 through the heat dissipation duct, effectively cooling the electronic control module 11. This design is simple, requiring no additional cooling fan, and also reduces the possibility of condensation causing short circuits in the electronic control module 11 when using refrigerant cooling. This ensures high reliability and safety in heat dissipation. Furthermore, the heat from the electronic control module 11 will not enter the indoor air duct 10a, resulting in high stability and uniformity of the airflow temperature within the indoor air duct 10a, reducing the likelihood of condensation.

[0052] In some embodiments, please refer to Figure 4 The indoor unit 10 includes a seal 15, which is disposed at the connection between the heat dissipation duct 13 and the indoor heat exchanger 12.

[0053] The heat dissipation duct component 13 can be directly pressed onto the sealing component 15 to achieve a sealed fit with the indoor heat exchanger 12.

[0054] The material of the seal 15 is not limited. For example, the seal 15 can be silicone, rubber, sponge, felt, etc.

[0055] In this embodiment, a sealing element 15 is provided at the connection between the heat dissipation duct component 13 and the indoor heat exchanger 12. Through the deformation of the sealing element 15, the connection between the heat dissipation duct component 13 and the indoor heat exchanger 12 is less prone to leakage, thereby improving the sealing performance of the joint and reducing the probability of hot air leaking from the joint between the heat dissipation duct component 13 and the indoor heat exchanger 12, thus ensuring heat dissipation efficiency.

[0056] In some embodiments, please refer to Figure 5 The electronic control module 11 includes a circuit board assembly and a heat sink 112. The heat dissipation duct component 13 is spaced apart from the circuit board assembly, and at least a portion of the heat sink 112 is located within the heat dissipation duct.

[0057] The electronic control module 11 controls the air conditioner 100 through the circuit board assembly. The circuit board assembly generates heat during operation, and the heat is transferred to the radiator 112. At least part of the radiator 112 is located in the heat dissipation duct. In this way, the radiator 112 can transfer all the heat to the heat dissipation duct so as to guide it to the indoor heat exchanger 12.

[0058] In this embodiment, at least a portion of the heat sink 112 is located within the heat dissipation duct, which facilitates the efficient transfer of heat generated by the circuit board assembly to the indoor heat exchanger 12 via the heat dissipation duct, thereby achieving effective heat dissipation. At the same time, the heat dissipation duct component 13 is spaced apart from the circuit board assembly, which can also reduce interference with the circuit board assembly and enable the circuit board assembly to work normally.

[0059] In some embodiments, please refer to Figure 5 The heat dissipation duct component 13 is mounted on the outside of the radiator 112 along the first direction and away from the indoor air duct component 14. The heat dissipation duct component 13 is provided with an air inlet 13a, which connects the heat dissipation duct and the indoor environment. That is, the air inlet 13a is located upstream of the radiator 112 along the airflow direction, and the air inlet 13a guides the indoor air to the heat dissipation duct to contact the radiator 112.

[0060] For example, the indoor unit 10 includes an indoor fan, which is disposed in the indoor air duct 10a. When the indoor fan is working, it generates negative pressure in the indoor air duct 10a, driving the airflow of the indoor environment to flow toward the indoor heat exchanger 12. In this embodiment, the air inlet 13a is provided so that a part of the airflow enters the heat dissipation air duct through the air inlet 13a and then flows toward the windward surface 12a of the indoor heat exchanger 12, while the other part of the airflow flows directly toward the windward surface 12a of the indoor heat exchanger 12.

[0061] In this embodiment, the air inlet 13a connects the heat dissipation duct to the indoor environment. When the indoor fan generates negative pressure, some air in the indoor environment flows towards the windward side 12a of the indoor heat exchanger 12, and some flows through the heat dissipation duct towards the windward side 12a of the indoor heat exchanger 12, carrying away the heat from the electronic control module 11 to exchange heat with the indoor heat exchanger 12, thus achieving effective heat dissipation for the electronic control module 11. Simultaneously, the heat dissipation duct component 13 covers the radiator 112, and the air inlet 13a is located on the heat dissipation duct component 13, facilitating electrical isolation and protection, and reducing the probability of direct contact between cold air and the circuit board components of the electronic control module 11.

[0062] In some embodiments, please refer to Figure 3 The air inlet 13a is opened along the second direction, and the radiator 112 includes a plurality of heat dissipation fins 1121. The plurality of heat dissipation fins 1121 are arranged at intervals along the height direction, wherein the first direction, the second direction, and the height direction are perpendicular to each other.

[0063] In this embodiment, multiple heat dissipation fins 1121 are spaced apart along the height direction. The gap between any two adjacent heat dissipation fins 1121 can be set towards the air inlet 13a. In this way, after the airflow enters through the air inlet 13a, it can directly pass through the gap between the fins and carry away the heat, thereby effectively achieving heat dissipation while reducing airflow resistance.

[0064] For example, the air inlet 13a is located on the front side of the heat dissipation duct 13, which is the side facing the indoor side.

[0065] The molding method of the air inlet 13a is not limited.

[0066] In some embodiments, the heat dissipation duct 13 is an integral structure.

[0067] For example, the heat dissipation duct 13 is a one-piece injection molded structure.

[0068] In this embodiment, the heat dissipation duct component 13 is manufactured as a single piece, meaning that the heat dissipation duct component 13 has an air inlet 13a as soon as it is formed, without the need for additional docking structures. The structure of the heat dissipation duct component 13 is simple, easy to manufacture, and reduces assembly steps.

[0069] In other embodiments, the heat dissipation duct 13 includes a housing 131 and a cover plate 133. The housing 131 is open on one side along the second direction to form an opening. The cover plate 133 is mated with the housing 131 along the second direction and closes a portion of the opening. The other portion of the opening forms an air inlet 13a.

[0070] In this embodiment, the housing 131 and the cover plate 133 are separate structures.

[0071] The way the cover plate 133 and the housing 131 are connected in the second direction is not limited. It can be a detachable method such as snap-fit ​​or screw-fit, or a non-detachable method such as welding.

[0072] In this embodiment, the air inlet 13a is defined by the portion of the housing 131 not covered by the cover plate 133. The way the housing 131 and the cover plate 133 are matched allows for several advantages. First, during assembly, the housing 131 can be connected to the indoor heat exchanger 12 and the electrical control module 11. The opening of the housing 131 along the second direction allows for visual adjustment of the fit between the housing 131 and the indoor heat exchanger 12 and the electrical control module 11, improving assembly simplicity and alignment reliability. After the fit is complete, the housing 131 is then fitted with the cover plate 133. Second, the way the cover plate 133 is fitted with the housing 131 also allows for adjustment of the size of the air inlet 13a by setting the cover plate 133, so as to achieve effective heat dissipation without affecting the direct air intake and heat exchange of the indoor heat exchanger 12.

[0073] The specific structure of the heat dissipation air duct component 13 is not limited.

[0074] In some embodiments, please refer to Figure 2 and Figure 4 The heat dissipation duct component 13 includes a housing 131 and a spacer 132 disposed within the housing 131. The space within the housing 131 defines a heat dissipation duct. The spacer 132 divides the space within the housing 131 into a first duct section 13b and a second duct section 13c that are interconnected. The first duct section 13b and the second duct section 13c are located on opposite sides of the spacer 132 along a first direction. The radiator 112 is located within the first duct section 13b, and the second duct section 13c is located downstream of the first duct section 13b along the airflow direction.

[0075] It is understood that the housing 131 and the spacer 132 can be an integral structure or a separate structure. For example, the housing 131 and the spacer 132 are integrally formed.

[0076] The spacer 132 divides the heat dissipation air duct into a first air duct section 13b and a second air duct section 13c. The first air duct section 13b and the second air duct section 13c are located on opposite sides of the spacer 132 along the first direction. That is, the airflow direction is opposite in the first air duct section 13b and the second air duct section 13c. The airflow enters the first air duct section 13b through the air inlet 13a, takes away the heat of the radiator 112 and flows to the second air duct section 13c.

[0077] For example, in a plane orthographic projection perpendicular to the first direction, the first air duct segment 13b and the second air duct segment 13c at least partially overlap. The overall flow direction of the airflow in the first air duct segment 13b and the second air duct segment 13c is perpendicular to the first direction; for example, the airflow in the first air duct segment 13b and the second air duct segment 13c flows along the second direction.

[0078] In this embodiment, the arrangement of the first air duct section 13b and the second air duct section 13c extends the airflow path. This allows for full utilization of the residual cooling generated by the surface temperature of the indoor heat exchanger 12 within the heat dissipation duct. As the airflow carries away the heat generated by the radiator 112 through the first air duct section 13b and flows to the second air duct section 13c, it undergoes a certain degree of cooling. This results in a lower temperature when the hot air contacts the indoor heat exchanger 12, reducing the operating pressure on the indoor heat exchanger 12. Simultaneously, the airflow needs to be redirected as it carries away the heat generated by the radiator 112 through the first air duct section 13b and flows to the second air duct section 13c, which consumes airflow noise energy and reduces noise, thereby reducing the operating noise of the air conditioner 100. Furthermore, it also ensures that the airflow entering the heat dissipation duct component 13 flows along a predetermined path towards the windward side 12a, reducing the probability of heat overflowing through the air inlet 13a and increasing the reliability of heat dissipation.

[0079] In some embodiments, please refer to Figure 4 The radiator 112 is located on the side where the first air duct section 13b and the second air duct section 13c connect.

[0080] In other words, the radiator 112 is located on the side of the first air duct section 13b away from the air inlet 13a. Thus, when the indoor air enters the first air duct section 13b, it flows along the first air duct section 13b to the side that connects with the second air duct section 13b. While connecting with the second air duct section 13b, it carries away the heat from the radiator 112. In this way, the radiator 112 is a certain distance from the air inlet 13a, which can reduce the probability of heat overflowing from the air inlet 13a to the outside of the heat dissipation air duct component 13. This makes it easier for the indoor air to carry away the heat from the radiator 112 under the action of negative pressure. At the same time, it also makes it easier for the radiator 112 to flow smoothly from the first air duct section 13b to the second air duct section 13c through the connection between the first air duct section 13b and the second air duct section 13c, and thus flow towards the windward side 12b.

[0081] In some embodiments, please refer to Figure 2 and Figure 4 The space inside the housing 131 also includes a third air duct section 13d, which connects the second air duct section 13c and the windward surface 12a. The second air duct section 13c and the third air duct section 13d are set at an angle.

[0082] In other words, the airflow flows towards the windward side 12a through the first air duct section 13b, the second air duct section 13c, and the third air duct section 13d. The second air duct section 13c and the third air duct section 13d are set at an angle, meaning that the airflow direction is different in the second air duct section 13c and the third air duct section 13d. The airflow needs to change direction during its flow from the second air duct section 13c to the third air duct section 13d.

[0083] In this embodiment, the setting of the third air duct section 13d can smoothly guide the hot air at the second air duct section 13c to the indoor heat exchanger 12 for heat exchange. The second air duct section 13c and the third air duct section 13d are set at an angle, which can achieve thermal isolation to a certain extent. The third air duct section 13d is set close to the indoor heat exchanger 12, and its temperature is lower than that of the second air duct section 13c. This makes it easier for the hot air to be cooled by residual cold before flowing to the windward side 12a, reducing the thermal impact on the indoor heat exchanger 12. Of course, it can also reduce the convergence of hot air and achieve noise reduction.

[0084] In some embodiments, please refer to Figure 2 and Figure 4 The first air duct section 13b and the second air duct section 13c extend along the second direction, and the third air duct section 13d extends from the connection with the second air duct section 13c in the first direction to connect with the windward surface 12a.

[0085] In other words, the airflow flows in the second direction at the first air duct section 13b and the second air duct section 13c, and flows in the first direction at the third air duct section 13d. Finally, the airflow flows in the second direction toward the windward side 12a and exchanges heat with the indoor heat exchanger 12.

[0086] In this embodiment, the layout of the first air duct section 13b, the second air duct section 13c, and the third air duct section 13d can make full use of the limited space and guide the airflow from the radiator 112 to the windward surface 12a. This can reduce hot air recirculation and also use the extension of the airflow path to pre-cool the hot air, thereby increasing the reliability of heat dissipation.

[0087] In some embodiments, please refer to Figure 4 The connection between the second air duct section 13c and the third air duct section 13d extends at an angle toward the indoor heat exchanger 12.

[0088] In this embodiment, the connection between the second air duct section 13c and the third air duct section 13d is inclined, which can play a guiding role, reduce airflow resistance, facilitate the smooth flow of air from the second air duct section 13c to the third air duct section 13d, and increase the airflow efficiency.

[0089] In some embodiments, please refer to Figure 2The housing 131 is open on one side along the second direction to form an opening. The spacer 132 divides the opening into a first opening and a second opening 13e. The first opening defines the air inlet 13a of the heat dissipation duct 13. The heat dissipation duct 13 includes a cover plate 133, which is mated with the housing 131 along the second direction and seals the second opening 13e.

[0090] In other words, the cover plate 133, the spacer 132, and the housing 131 together define the second air duct section 13c and the third air duct section 13d. The cover plate 133 and the housing 131 are joined along the second direction, and one end of the cover plate 133 abuts against the housing 131 along the first direction, while the other end abuts against the spacer 132 to close the second opening 13e, thereby closing the third air duct section 13d. The cover plate 133 is spaced apart from the first opening, that is, the air inlet 13a is separated by the spacer 132 to facilitate the intake of air into the heat dissipation air duct component 13.

[0091] In this embodiment, a first opening and a second opening 13e are separated by a spacer 132. After assembly, the second opening 13e is closed by a cover to allow the airflow to be guided to the windward surface 12a in a sealed manner. The first opening defines the air inlet 13a, so that the airflow can enter only from the first opening, reducing eddy phenomena. At the same time, after the airflow enters from the air inlet 13a, it can flow directly along the first air duct section 13b, reducing wind resistance and ensuring high airflow smoothness.

[0092] In some embodiments, the circuit board assembly includes a main control board 111.

[0093] The main control board 111 is the brain and core control center of the air conditioner 100. The main control board 111 is responsible for receiving instructions, processing information, coordinating and controlling the operation of all components of the air conditioner 100 to realize functions such as cooling, heating, air supply, dehumidification, and automatic mode.

[0094] For example, the heat sink 112 is integrated with the main control board 111, that is, the heat sink 112 and the main control board 111 form a whole.

[0095] In this embodiment, the heat sink 112 and the main control board 111 are integrated into one unit. In this way, the heat generated by the main control board 111 can be transferred to the heat sink 112 more effectively, increasing the heat dissipation efficiency. At the same time, there is no need to install the heat sink 112 separately, reducing assembly steps, increasing installation efficiency, and making the layout reliability of the electronic control module 11 higher.

[0096] In some embodiments, please refer to Figure 5 The main control board 111 includes a board 1111 and an electronic device 1112 disposed on the side of the board 1111 facing the indoor air duct assembly 14 in a first direction. The heat sink 112 is integrated on the board 1111, and the electronic device 1112 and the heat sink 112 are arranged in a second direction.

[0097] Board 1111 is used to support and connect electronic device 1112. Board 1111 can be a flat plate made of one or more layers of insulating material, through chemical deposition, electroplating, or other methods to form conductive paths to connect electronic device 1112. Electronic device 1112 refers to a physical entity capable of performing basic functions such as electrical signal conversion, amplification, and switching. For example, electronic device 1112 can be a capacitor, resistor, diode, etc.

[0098] In this embodiment, the heat sink 112 is integrated on the board 1111 and arranged along the second direction with the electronic device 1112, which reduces the probability of interference between the heat sink 112 and the electronic device 1112. The heat sink 112 will not block the electronic device 1112, which makes it easy to maintain the heat sink 112 and the electronic device 1112 separately. Of course, it is also easy for the heat sink 112 to be connected to the heat dissipation duct component 13 without affecting the electronic device 1112.

[0099] In some embodiments, please refer to Figure 5 The electronic control module 11 includes an electronic control box 110, a main control board 111, and a heat sink 112 disposed in the electronic control box 110.

[0100] The electrical control box 110 provides installation space for the main control board 111 and the heat sink 112, thereby protecting the main control board 111 and the heat sink 112.

[0101] In some embodiments, please refer to Figure 2 and Figure 5 The electronic control module 11 includes a mounting plate 113, and the electronic control box 110 is connected to the mounting plate 113. The electronic control module 11 is rotatably connected to the outer casing 40 or partition 50 of the air conditioner 100 through the mounting plate 113. The rotation axis of the electronic control module 11 is parallel to the height direction.

[0102] In other words, the mounting plate 113 serves as a connection structure between the electronic control module 11 and the external structure, enabling the installation of the electronic control module 11 within the indoor unit 10.

[0103] In this embodiment, the electronic control module 11 can be rotatably connected to the partition 50 or the outer shell 40 via the mounting plate 113, so that the electronic control module 11 can be rotated relative to the partition 50 or the outer shell 40 as a whole to achieve installation on the indoor side. The rotation axis of the electronic control module 11 is parallel to the height direction. When disassembly is required, the entire electronic control module 11 can be lifted upwards to achieve disassembly for maintenance.

[0104] In the description of this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0105] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An indoor unit, characterized in that, include: An indoor air duct assembly, forming an indoor air duct, the indoor air duct being used to introduce heat exchange airflow into the room; An indoor heat exchanger is installed in the indoor air duct, and the indoor heat exchanger has a windward side and a leeward side. An electronic control module is disposed on one side of the indoor air duct assembly along the first direction; A heat dissipation duct component is formed, one end of which is connected to the indoor environment and the other end is connected to the windward surface. At least part of the electronic control module is disposed in the heat dissipation duct, wherein the first direction is perpendicular to the height direction of the indoor unit.

2. The indoor unit according to claim 1, characterized in that, The indoor unit includes a seal, which is disposed at the connection between the heat dissipation duct and the indoor heat exchanger.

3. The indoor unit according to claim 1, characterized in that, The electronic control module includes a circuit board assembly and a heat sink, with the heat dissipation duct component spaced apart from the circuit board assembly, and at least a portion of the heat sink located within the heat dissipation duct.

4. The indoor unit according to claim 3, characterized in that, The heat dissipation duct component is disposed on the outside of the radiator along the first direction and away from the indoor air duct assembly. The heat dissipation duct component is provided with an air inlet, which connects the heat dissipation duct and the indoor environment.

5. The indoor unit according to claim 4, characterized in that, The air inlet is opened along the second direction, and the radiator includes multiple heat dissipation fins. The multiple heat dissipation fins are spaced apart along the height direction, wherein the first direction, the second direction, and the height direction are perpendicular to each other.

6. The indoor unit according to claim 4, characterized in that, The heat dissipation duct component is an integral structure; and / or, The heat dissipation duct component includes a housing and a cover plate. The housing is open on one side along the second direction to form an opening. The cover plate is connected to the housing along the second direction and closes part of the opening. The other part of the opening forms the air inlet. The first direction, the second direction, and the height direction are perpendicular to each other.

7. The indoor unit according to claim 3, characterized in that, The heat dissipation duct component includes a housing and a spacer disposed within the housing. The space within the housing defines the heat dissipation duct. The spacer divides the space within the housing into a first duct section and a second duct section that are interconnected. The first duct section and the second duct section are located on opposite sides of the spacer along a first direction. The heat sink is located within the first duct section, and the second duct section is located downstream of the first duct section along the airflow direction.

8. The indoor unit according to claim 7, characterized in that, The radiator is located on the side where the first air duct section and the second air duct section connect.

9. The indoor unit according to claim 7, characterized in that, The space inside the housing also includes a third air duct section, which connects the second air duct section and the windward surface. The second air duct section and the third air duct section are set at an angle.

10. The indoor unit according to claim 9, characterized in that, The first air duct segment and the second air duct segment extend along the second direction, and the third air duct segment extends from the connection point with the second air duct segment in the first direction to communicate with the windward surface, wherein the first direction, the second direction, and the height direction are perpendicular to each other.

11. The indoor unit according to claim 9, characterized in that, The connection between the second air duct section and the third air duct section extends at an angle toward the indoor heat exchanger.

12. The indoor unit according to claim 7, characterized in that, The housing is open on one side along the second direction to form an opening, and the spacer divides the opening into a first opening and a second opening. The first opening defines the air inlet of the heat dissipation duct component, which includes a cover plate that abuts against the housing along the second direction and seals the second opening.

13. The indoor unit according to claim 3, characterized in that, The circuit board assembly includes a main control board, which includes a board and electronic components disposed on one side of the board facing the indoor air duct assembly along a first direction. The heat sink is integrated on the board, and the electronic components and the heat sink are arranged along a second direction, wherein the first direction, the second direction, and the height direction are mutually perpendicular.

14. An air conditioner, characterized in that, include: Outdoor unit, including outdoor heat exchanger; Chassis, outer shell, and partitions; And the indoor unit according to any one of claims 1-13, wherein the outdoor heat exchanger is in heat exchange communication with the indoor heat exchanger; the outer shell is disposed above the chassis, the outdoor unit and the indoor unit are disposed within the space defined by the chassis and the outer shell, and the partition separates the indoor unit and the outdoor unit.

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