Wireless acoustic vibration angle temperature sensor

Abstract

The utility model belongs to industrial internet of things intelligent monitoring technical field, concretely relates to a wireless sound vibration angle temperature sensor, and this sensor includes casing, main PCB board, collection PCB board and microphone PCB board. Collection PCB board is horizontally established in casing bottom, is equipped with MEMS acceleration sensor, temperature sensor and magnetic field sensor, and is connected with main PCB board through connector. Microphone PCB board is vertically arranged, is connected with collection board through FPC line. Main PCB board is equipped with MCU, wireless transceiver chip and power management module. Power management module adopts hierarchical independent power supply design, is powered respectively for sensor through switch stabilizer and two way LDO, and adopts independent boost chip for MCU and wireless chip power supply, realizes digital analog power supply isolation, reduces the interference. The utility model highly integrates four kinds of sensing functions, is compact in structure, is low in power consumption, is strong in anti -interference ability, is applicable to wireless condition monitoring of industrial equipment.

Description

Technical Field

[0001] This utility model belongs to the field of intelligent monitoring technology of industrial Internet of Things, and specifically relates to a wireless acoustic vibration angle temperature sensor. Background Technology

[0002] In industrial settings, large mechanical equipment such as generators, steam turbines, and machine tools experience changes in operating noise and vibration frequencies due to wear and loosening of internal components. Temperature variations during operation also reflect load conditions and the presence of overheating. Angle parameters can be used to monitor the rotational position and tilt of mechanical parts, ensuring the equipment operates along a pre-defined trajectory. For example, in wind power generation, it's necessary to collect real-time data on the angle of wind turbine blades to adjust the windward side, while simultaneously monitoring vibration, noise, and the temperature of critical components like the gearbox to determine if the turbine is operating normally and prevent significant economic losses due to malfunctions.

[0003] Although there are sensor products on the market that can collect sound, vibration, angle and temperature separately, and they have been applied to some extent in their respective fields, there are still many problems with sensor technology that integrates the acquisition functions of these four parameters into one and meets the requirements of high precision, high stability and low power consumption in practical applications.

[0004] In existing technologies, multiple independent sensors are mostly used to collect sound, vibration, angle, and temperature parameters separately. For example, microphone sensors are used to collect sound, piezoelectric sensors to collect vibration, gyroscopes or tilt sensors to collect angle, and thermocouples or thermistors to collect temperature. This distributed acquisition method requires a separate power supply module, signal conditioning circuit, and data transmission interface to be designed for each sensor. This results in a complex and bulky hardware structure for the entire monitoring system, which not only increases the difficulty of installation and space occupation costs, but also makes the overall stability of the system susceptible to compatibility issues between modules. Utility Model Content

[0005] The purpose of this invention is to provide a wireless acoustic vibration angle temperature sensor to solve the above problems, so as to provide an integrated wireless sensor structure that can highly integrate four sensing functions of sound, vibration, angle and temperature, and has low power consumption, high stability and anti-interference capability.

[0006] This utility model achieves the above objectives through the following technical solutions: This utility model proposes a wireless acoustic vibration angle temperature sensor, comprising: case; Microphone module, used to collect sound signals; A triaxial MEMS accelerometer is used to collect vibration signals; Temperature sensor, used to collect temperature signals; A magnetic field sensor is used to collect magnetic field signals to obtain angle information; The main PCB board contains a microcontroller (MCU), a wireless transceiver chip, a power management module, and a storage unit. The acquisition PCB board is horizontally set at the bottom of the housing and is used to install the triaxial MEMS accelerometer, temperature sensor and magnetic field sensor, and is electrically connected to the main PCB board. The microphone module is mounted on a separate microphone board and is electrically connected to the acquisition PCB board via an FPC cable.

[0007] Furthermore, the housing includes a lower base plate and an upper box body. The lower base plate has mounting holes for connecting to the device under test, and the upper box body contains a battery.

[0008] Furthermore, the power management module includes a switching regulator, a first low-dropout linear regulator, and a second low-dropout linear regulator; The input terminal of the switching regulator is connected to the battery, and its output terminal is connected to the input terminals of the first low-dropout linear regulator and the second low-dropout linear regulator, respectively. The output of the first low-dropout linear regulator is electrically connected to the triaxial MEMS accelerometer, temperature sensor, and microphone module to provide a 3.3V voltage. The output terminal of the second low-dropout linear regulator is electrically connected to the magnetic field sensor to provide a 5.0V voltage.

[0009] Furthermore, the power management module also includes a boost regulator chip, whose output terminal is electrically connected to the power input terminal of the microcontroller MCU, the storage unit and the wireless transceiver chip, for providing a 3.3V operating voltage; The microcontroller (MCU) signal input terminal is electrically connected to the acquisition PCB board via a terminal connector to receive signals from the triaxial MEMS accelerometer, temperature sensor, and magnetic field sensor, and is electrically connected to the microphone module via an FPC cable.

[0010] Furthermore, the signal output terminal of the microcontroller (MCU) is connected to the signal of an external data acquisition device through the wireless transceiver chip.

[0011] Furthermore, the wireless transceiver chip is a Zigbee chip module.

[0012] Furthermore, the storage unit is a NOR flash memory chip.

[0013] The beneficial effects of this utility model are as follows: 1. This application integrates the microphone, MEMS accelerometer, magnetic field sensor and temperature sensor on separate daughterboards and acquisition boards, and adopts a three-layer PCB layout to achieve space optimization and signal isolation, effectively solving the problems of complex structure, large size and mutual signal interference in traditional multi-sensor systems.

[0014] 2. The power management module in this application adopts a hierarchical independent power supply design: one path provides a stable and low-noise analog power supply for various sensors through a switching regulator and a low-dropout linear regulator; the other path independently powers the microcontroller and wireless communication module through an ultra-low static current boost chip, realizing power isolation between digital and analog circuits, significantly reducing noise coupling, and improving the signal-to-noise ratio of signal acquisition and the overall stability of the system. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top view cross-sectional structural diagram of the present invention; Figure 3 This is a side view sectional structural schematic diagram of this utility model; Figure 4 This is a schematic diagram of the structure of the main PCB board in this utility model; Figure 5 This is a schematic diagram of one side structure of the PCB board in this utility model; Figure 6 This is a schematic diagram of the other side of the PCB board used in this utility model.

[0016] In the diagram: 1. Bottom plate; 2. Battery; 3. Battery cover; 4. Acquisition PCB board; 5. Main PCB board; 6. Microphone board; 7. Upper housing; 8. Screw; 9. Microphone module; 10. Microcontroller (MCU); 11. Wireless transceiver chip; 12. Storage unit; 13. First connection port; 14. First low-dropout linear regulator; 15. Boost regulator chip; 16. Switching regulator; 17. Triaxial MEMS accelerometer; 18. FPC flexible flat cable interface; 19. Second connection port; 20. Temperature sensor; 21. Magnetic field sensor; 22. Mounting hole; 23. Second low-dropout linear regulator. Detailed Implementation

[0017] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0018] Example 1 A preferred embodiment of this utility model proposes a wireless acoustic vibration angle temperature sensor, which integrates the functions of acquiring sound, vibration, angle and temperature. Through integrated hardware construction and optimized power management, it realizes wireless monitoring of the operating status of industrial equipment.

[0019] Please see Figures 1-6 The sensor mainly consists of a lower base plate 1, an upper housing 7, a battery 2, a main PCB board 5, a data acquisition PCB board 4, and a microphone board 6. The data acquisition PCB board 4 is equipped with a triaxial MEMS accelerometer 17, a temperature sensor 20, and a magnetic field sensor 21; the microphone board 6 is equipped with a microphone module 9.

[0020] Microphone module 9 is used to collect sound signals; triaxial MEMS accelerometer 17 is used to collect vibration signals; temperature sensor 20 is used to collect temperature signals; magnetic field sensor 21 is used to collect magnetic field signals to obtain angle information; the main PCB board 5 is equipped with microcontroller MCU 10, wireless transceiver chip 11, power management module and storage unit 12; the acquisition PCB board 4 is horizontally set at the bottom of the housing, used to install triaxial MEMS accelerometer 17, temperature sensor 20 and magnetic field sensor 21, and is electrically connected to the main PCB board 5; microphone module 9 is installed on a separate microphone board 6 and is electrically connected to acquisition PCB board 4 through FPC cable.

[0021] The sensor housing is composed of a lower base plate 1 and an upper housing 7, forming a sealed protective space with screws 8. The lower base plate 1 has multiple mounting holes 22, facilitating the secure mounting of the sensor to the surface of the device under test (such as a motor, fan, machine tool, etc.) using bolts or other fasteners. The upper housing 7 contains a battery compartment for accommodating the battery 2, including a battery cover 3. Preferably, the housing's exterior surface adopts an integrated streamlined design, with concealed mounting and disassembly structures only on the sides, resulting in a clean overall appearance while ensuring good sealing to adapt to complex industrial environments.

[0022] To optimize space utilization and signal isolation, a three-layer PCB layout is adopted internally. The acquisition PCB 4 is horizontally fixed at the bottom of the housing, close to the mounting surface, which helps to transmit vibration signals with high fidelity. The core sensing chips are integrated on it: a triaxial MEMS accelerometer 17 is used to acquire vibration acceleration signals of the device in the X, Y, and Z directions with high precision; a temperature sensor 20 (such as a digital temperature sensor chip) is attached to the surface of the acquisition PCB 4 or extends to the bottom plate 1 of the housing through thermally conductive material, for directly measuring the temperature of the device surface or the surrounding environment; a magnetic field sensor 21 (such as a Hall sensor or magnetoresistive sensor) is used to acquire magnetic field signals around the device, and the angular offset or rotation state of the motor shaft can be indirectly calculated by analyzing the changes in the magnetic field.

[0023] The microphone board 6, as an independent sub-board, is vertically mounted on one side of the housing. A microphone module 9 is mounted on it, with a pickup hole on the side wall of the housing facing the module, used to effectively collect sound signals generated during device operation. The microphone board 6 is connected to the acquisition PCB board 4 below via a flexible printed circuit board (FPC line) to achieve signal and power transmission. This separate design effectively reduces interference from motherboard vibration on the microphone signal.

[0024] The main PCB board 5 is vertically mounted on the other side of the housing, and integrates a microcontroller MCU10, a wireless transceiver chip 11, a storage unit 12, and a power management module.

[0025] The detailed structure and working mechanism of the power management module are as follows: The power management module is key to achieving low power consumption and high stability in this embodiment. It adopts a hierarchical independent power supply strategy, specifically including a switching regulator 16, a first low-dropout linear regulator 14, a second low-dropout linear regulator 23, and a boost regulator chip 15.

[0026] The input of the switching regulator 16 (such as a DC-DC buck-boost converter) is directly connected to the battery 2. It features a wide input voltage range and high conversion efficiency, stabilizing fluctuating battery voltage at a preset intermediate voltage value. This design adapts to changes in battery charge and provides a stable input source for subsequent regulators.

[0027] The input of the first low-dropout linear regulator 14 is connected to the output of the switching regulator 16. It converts the input intermediate voltage into a clean, low-noise 3.3V voltage. This 3.3V voltage is supplied to the triaxial MEMS accelerometer 17 and temperature sensor 20 on the acquisition PCB board 4 through circuit traces and connectors, and to the microphone module 9 on the microphone board 6 through an FPC line.

[0028] The second low-dropout linear regulator 23 also draws input from the switching regulator 16 and converts it to a 5.0V voltage. This 5.0V voltage is specifically designed to power the magnetic field sensor 21 on the acquisition PCB board 4 to meet its specific operating voltage requirements.

[0029] More importantly, the input of the boost regulator chip 15 is also connected to the battery 2. It is an ultra-low quiescent current boost regulator specifically designed to power the digital core circuitry. It directly boosts and regulates the battery voltage to 3.3V. This 3.3V voltage is independent of the aforementioned sensor power supply path and directly supplies the microcontroller MCU 10, the memory unit 12 (preferably a NOR flash memory chip), and the wireless transceiver chip 11 (preferably a Zigbee chip module) on the main PCB board 5. This independent hierarchical power supply design achieves power-level isolation between the sensor analog circuitry and the digital processing / communication circuitry, effectively preventing digital circuit switching noise from interfering with the analog sensing signal through power coupling.

[0030] See Figure 5 The FPC flexible flat cable interface 18 on the acquisition PCB 4 is used to connect the microphone board 6 and the acquisition PCB 4. The sound signal acquired by the microphone module 9 installed on the microphone board 6 is transmitted to this interface through a flexible circuit board (FPC cable).

[0031] See Figure 4 The first connection port 13 on the main PCB board 5 is used to connect the main PCB board 5 and the acquisition PCB board 4. Through this interface, sensor signals (vibration, temperature, magnetic field) on the PCB board 4 and microphone signals from the FPC interface are acquired and transmitted to the main PCB board 5.

[0032] See Figure 5 The second connection port 19 located on the acquisition PCB board 4 and the first connection port 13 located on the main PCB board 5 are paired by cable or direct plug-in to form an electrical connection path, which is used to output all sensor signals to the main PCB board 5 and receive the power supply voltage from the main PCB board 5.

[0033] In the signal transmission path, analog signals collected by the triaxial MEMS accelerometer 17, temperature sensor 20, and magnetic field sensor 21 on the acquisition PCB board 4 are pre-conditioned (such as filtered and amplified) on the board and then transmitted to the main PCB board 5 through the first terminal connector (CN1). At the same time, the sound signal collected by the microphone module 9 is also incorporated into the signal link of the acquisition PCB board 4 through the FPC line and uploaded together through CN1.

[0034] On the main PCB board 5, all sensing signals are sent to the multi-channel analog / digital input interface of the microcontroller MCU10 (preferably a low-power ARM Cortex-M series chip) for processing and then stored in the storage unit 12.

[0035] When data needs to be reported, the signal output terminal of the microcontroller MCU10 is electrically connected to the signal input terminal of the wireless transceiver chip 11 to output the processed data; the wireless transceiver chip 11 is electrically connected to the antenna module to wirelessly send data to an external data acquisition device to complete real-time monitoring and fault diagnosis of the device status.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wireless acoustic vibration angle temperature sensor, characterized in that, include: case; Microphone module (9) is used to collect sound signals; A triaxial MEMS accelerometer (17) is used to acquire vibration signals; Temperature sensor (20) is used to acquire temperature signals; Magnetic field sensor (21) is used to collect magnetic field signals to obtain angle information; The main PCB board (5) is equipped with a microcontroller MCU (10), a wireless transceiver chip (11), a power management module, and a storage unit (12). The acquisition PCB board (4) is horizontally set at the bottom of the housing and is used to install the triaxial MEMS accelerometer (17), temperature sensor (20) and magnetic field sensor (21), and is electrically connected to the main PCB board (5); The microphone module (9) is mounted on a separate microphone board (6) and electrically connected to the acquisition PCB board (4) via an FPC cable.

2. The wireless acoustic vibration angle temperature sensor according to claim 1, characterized in that, The housing includes a lower base plate (1) and an upper box (7). The lower base plate (1) has a mounting hole (22) for connecting to the device under test. The upper box (7) contains a battery (2).

3. A wireless acoustic vibration angle temperature sensor according to claim 2, characterized in that, The power management module includes a switching regulator (16), a first low-dropout linear regulator (14), and a second low-dropout linear regulator (23). The input terminal of the switching regulator (16) is connected to the battery (2), and its output terminal is connected to the input terminals of the first low-dropout linear regulator (14) and the second low-dropout linear regulator (23), respectively. The output of the first low-dropout linear regulator (14) is electrically connected to the triaxial MEMS accelerometer (17), temperature sensor (20) and microphone module (9) to provide a 3.3V voltage; The output of the second low-dropout linear regulator (23) is electrically connected to the magnetic field sensor (21) to provide a 5.0V voltage.

4. A wireless acoustic vibration angle temperature sensor according to claim 1, characterized in that, The power management module also includes a boost regulator chip (15), whose output terminal is electrically connected to the power input terminal of the microcontroller MCU (10), the storage unit (12) and the wireless transceiver chip (11) to provide a 3.3V operating voltage; The microcontroller MCU (10) signal input terminal is electrically connected to the acquisition PCB (16) through a terminal connector to receive signals from the triaxial MEMS accelerometer (17), temperature sensor (20) and magnetic field sensor (21), and is electrically connected to the microphone module (9) through an FPC line.

5. A wireless acoustic vibration angle temperature sensor according to claim 4, characterized in that, The signal output terminal of the microcontroller MCU (10) is connected to the signal of the external data collector through the wireless transceiver chip (11).

6. A wireless acoustic vibration angle temperature sensor according to claim 1, characterized in that, The wireless transceiver chip (11) is a Zigbee chip module.

7. A wireless acoustic vibration angle temperature sensor according to claim 1, characterized in that, The storage unit (12) is a NOR flash memory chip.

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