Power module and temperature acquisition circuit thereof, high-voltage motor controller

Abstract

The utility model provides a kind of power module and its temperature acquisition circuit, high voltage motor controller, the temperature acquisition circuit includes: temperature sensor, close to power module setting, for converting temperature signal into analog voltage signal;Conversion circuit, one end is connected with temperature sensor, the other end is connected with the analog quantity acquisition pin AIP of the drive isolation chip of power module, conversion circuit is used to collect analog voltage signal, to make drive isolation chip acquire analog voltage signal by analog quantity acquisition pin AIP, and after analog voltage signal is converted into PWM digital signal, it is output via data input / output pin DATA.The utility model does not need to introduce linear isolation chip additionally, using the drive isolation chip of power module itself can realize the collection of temperature, can greatly reduce cost while saving space, and temperature acquisition result adopts the transmission mode of digital type PWM wave output, and the anti-interference ability is strong.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, specifically to a temperature acquisition circuit for a power module, a power module, and a high-voltage motor controller. Background Technology

[0002] In high-voltage motor controllers, real-time monitoring of the power module temperature can promptly detect abnormalities such as overheating, enabling the MCU (Microcontroller Unit) to take timely protective control measures to prevent the power module from failing due to overheating. This is a crucial step in improving the overall system reliability.

[0003] Currently, temperature acquisition circuits mostly use an analog signal transmission method with resistor voltage division. After voltage division and conditioning, the signal is sent to the MCU's ADC (Analog-to-Digital Converter) port for acquisition and processing. This analog signal transmission method has poor anti-interference capability. Furthermore, as the voltage of vehicle systems increases (1000V high-voltage systems already exist), considering system reliability, applying this method to high-voltage systems requires high-voltage and low-voltage isolation in the temperature acquisition circuit. Therefore, linear isolation chips are needed for temperature acquisition. If a set of inverters has three modules requiring temperature acquisition circuits, three linear isolation chips are needed. Multi-function motor controllers with multiple sets of inverters require even more linear isolation chips, significantly impacting cost. Utility Model Content

[0004] This invention provides a temperature acquisition circuit for a power module to solve the above-mentioned technical problems.

[0005] This utility model also proposes a power module.

[0006] This utility model also proposes a high-voltage motor controller.

[0007] The technical solution adopted in this utility model is as follows: This invention proposes a temperature acquisition circuit for a power module, comprising: a temperature sensor disposed close to the power module for detecting a temperature signal; a conversion circuit, one end of which is connected to the temperature sensor, and the other end of which is connected to the analog signal acquisition pin AIP of the power module's drive isolation chip, the conversion circuit converting the temperature signal into an analog voltage signal so that the drive isolation chip acquires the analog voltage signal through the analog signal acquisition pin AIP, and converts the analog voltage signal into a PWM digital signal, which is then output through the data input / output pin DATA; and an MCU connected to the input / output pin DATA of the drive isolation chip, the MCU calculating the temperature of the power module based on the PWM digital signal.

[0008] The temperature acquisition circuit of the power module described above in this utility model also has the following additional technical features: Specifically, the conversion circuit includes: a resistor network, one end of which is connected to the temperature sensor, and the resistor network is used to acquire the analog voltage signal; and an RC (resistor-capacitor) filter circuit, one end of which is connected to the other end of the resistor network, and the other end of which is connected to the analog signal acquisition pin AIP of the driver isolation chip, and the RC filter circuit is used to filter the analog voltage signal.

[0009] Further, the resistor network includes: a first resistor, one end of which is connected to one end of the temperature sensor, and the other end of which is connected to the other end of the temperature sensor and then grounded; and a second resistor, one end of which is connected to one end of the first resistor and one end of the temperature sensor, and the other end of which is connected to one end of the RC filter circuit.

[0010] Specifically, the temperature acquisition circuit of the power module also includes a Zener diode, one end of which is connected to the analog acquisition pin AIP of the driver isolation chip, and the other end of which is grounded.

[0011] Furthermore, the analog signal acquisition pin (AIP) of the drive isolation chip has a built-in constant current source.

[0012] Specifically, the temperature sensor includes one of the following: NTC (Negative Temperature Coefficient) and a diode.

[0013] This utility model also proposes a power module, including the temperature acquisition circuit of the power module described above.

[0014] This utility model also proposes a high-voltage motor controller, which includes the power module described above.

[0015] The beneficial effects of this utility model are: This invention eliminates the need for an additional linear isolation chip; temperature acquisition can be achieved using the power module's own built-in driver isolation chip. This significantly reduces costs and saves space. Furthermore, the temperature acquisition results are transmitted via digital PWM wave output, providing strong anti-interference capabilities.

[0016] It is compatible with both NTC and diode temperature sensors, making it highly versatile. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the temperature acquisition circuit of a power module according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the temperature acquisition circuit of a power module according to another embodiment of the present invention; Figure 3 This is a graph showing the relationship between AIP voltage value and NTC resistance value according to a specific embodiment of the present invention; Figure 4 This is a graph showing the relationship between NTC resistance value and temperature according to a specific embodiment of the present invention. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Figure 1 This is a schematic diagram of the temperature acquisition circuit of a power module according to an embodiment of the present invention, as shown below. Figure 1 As shown, the temperature acquisition circuit of the power module includes: temperature sensor 1, conversion circuit 2 and MCU.

[0020] Temperature sensor 1 is positioned close to the power module. It detects temperature signals and converts them into analog voltage signals. One end of conversion circuit 2 is connected to temperature sensor 1, and the other end is connected to the analog signal acquisition pin AIP of the drive isolation chip 3 of the power module. Conversion circuit 2 is used to acquire analog voltage signals so that the drive isolation chip 3 can obtain analog voltage signals through the analog signal acquisition pin AIP. After converting the analog voltage signals into PWM digital signals, the signals are output to the MCU via the data input / output pin DATA. The MCU is connected to the input / output pin DATA of the drive isolation chip 3 and is used to calculate the temperature of the power module based on the PWM digital signals.

[0021] Specifically, such as Figure 1 As shown, conversion circuit 2 converts the temperature signal detected by temperature sensor 1 into an analog voltage signal. The power module's drive isolation chip 3 acquires this analog voltage signal through the analog input pin AIP and converts it into a PWM digital signal, which is then output through the data input / output pin DATA and filtered before being connected to the MCU. The MCU acquires the duty cycle of the PWM digital signal and calculates or looks up the voltage value at the AIP pin using a linear relationship. Based on the relationship between the voltage value and temperature, it then determines the temperature of the power module. As an example, the PWM duty cycle = V... AIP / 3.5*50*100%, where: V AIP This refers to the voltage at the AIP pin.

[0022] Therefore, there is no need to introduce an additional linear isolation chip. Temperature acquisition can be achieved by using the power module's own built-in driver isolation chip, which can greatly reduce costs and save space. Furthermore, the temperature acquisition results are transmitted using a digital PWM wave output method, which has strong anti-interference capabilities.

[0023] According to one embodiment of the present invention, such as Figure 2 As shown, the conversion circuit 2 includes a resistor network 21 and an RC filter circuit 22.

[0024] One end of the resistor network 21 is connected to the temperature sensor 1, and the resistor network 21 is used to acquire analog voltage signals; one end of the RC filter circuit 22 is connected to the other end of the resistor network 21, and the other end of the RC filter circuit 22 is connected to the analog signal acquisition pin AIP of the driver isolation chip 3, and the RC filter circuit 22 is used to filter the analog voltage signals.

[0025] Furthermore, such as Figure 2As shown, the resistor network 21 includes a first resistor R1 and a second resistor R2. One end of the first resistor R1 is connected to one end of the temperature sensor 1, and the other end of the first resistor R1 is connected to the other end of the temperature sensor 1 and then grounded; one end of the second resistor R2 is connected to one end of the first resistor R1 and one end of the temperature sensor 1, and the other end of the second resistor R2 is connected to one end of the RC filter circuit 22.

[0026] Specifically, the AIP recommends a sampling voltage range of 0.4V to 3.2V. To adapt to this voltage range, the resistor network 21 is connected in series and parallel with the temperature sensor, and then the signal passes through the RC filter circuit 22 before being connected to the AIP pin.

[0027] Furthermore, such as Figure 2 As shown, the temperature acquisition circuit of the power module mentioned above also includes a Zener diode D1. One end of the Zener diode D1 is connected to the analog signal acquisition pin AIP of the driver isolation chip 3, and the other end of the Zener diode D1 is grounded.

[0028] Specifically, Zener diode D1 can provide overvoltage protection for the AIP pin. The Zener diode can be an MMSZ4688T3G with a Zener voltage of 4.7V.

[0029] In one embodiment of this utility model, the analog signal acquisition pin (AIP) of the driver isolation chip has a built-in constant current source.

[0030] Temperature sensor 1 includes one of the following: NTC and diode.

[0031] Specifically, the analog input pin (AIP) of the driver isolation chip has a built-in constant current source output, making the temperature sensor compatible with both NTC and diode temperature acquisition methods, thus offering strong applicability. Figure 2 The NTC temperature sampling method is shown in the figure.

[0032] If NTC temperature sampling is used, the MCU can deduce the power module's temperature value based on the relationship between the AIP voltage value, the NTC resistance value, and the temperature. The relationship curve can be found in [reference needed]. Figure 3 and Figure 4 As shown, Figure 3 This is a graph showing the relationship between AIP voltage and NTC resistance in a specific embodiment. Figure 4 This is a graph showing the relationship between the NTC resistance value and temperature in a specific embodiment.

[0033] As an example, this utility model can be adapted to power modules that use the 1EDI3035AS driver isolation chip. The 1EDI3035AS has both power device driving function and analog quantity acquisition function. In the design of high voltage motor controller, the power module temperature acquisition function can be realized without adding an isolation chip, effectively reducing costs.

[0034] In summary, the temperature acquisition circuit of the power module according to this embodiment of the invention does not require an additional linear isolation chip; the temperature acquisition can be achieved using the power module's own built-in driver isolation chip. This significantly reduces costs and saves space. Furthermore, the temperature acquisition results are transmitted using a digital PWM wave output, providing strong anti-interference capabilities. This invention is compatible with both NTC and diode temperature sensors, making it highly versatile.

[0035] This utility model also proposes a power module, including the temperature acquisition circuit of the power module described above.

[0036] According to the power module of this invention, using the aforementioned temperature acquisition circuit, there is no need to introduce an additional linear isolation chip. Temperature acquisition can be achieved using the power module's own built-in driver isolation chip, which can greatly reduce costs and save space. Furthermore, the temperature acquisition results are transmitted using a digital PWM wave output method, which has strong anti-interference capabilities. This invention is compatible with the two most common temperature sensors, NTC and diode, making it highly versatile.

[0037] This utility model also proposes a high-voltage motor controller, which includes the power module described above.

[0038] According to the high-voltage motor controller of this invention, the power module eliminates the need for an additional linear isolation chip; temperature acquisition can be achieved using the power module's built-in drive isolation chip. This significantly reduces costs and saves space. Furthermore, the temperature acquisition results are transmitted via digital PWM wave output, providing strong anti-interference capabilities. This invention is compatible with both NTC and diode temperature sensors, making it highly versatile.

[0039] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0042] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A temperature acquisition circuit for a power module, characterized in that, include: A temperature sensor is disposed near the power module and is used to detect temperature signals. A conversion circuit is provided, one end of which is connected to the temperature sensor and the other end of which is connected to the analog signal acquisition pin AIP of the drive isolation chip of the power module. The conversion circuit is used to convert the temperature signal into an analog voltage signal so that the drive isolation chip can obtain the analog voltage signal through the analog signal acquisition pin AIP, and convert the analog voltage signal into a PWM digital signal and output it through the data input / output pin DATA. The MCU is connected to the input / output pin DATA of the driver isolation chip, and the MCU is used to calculate the temperature of the power module based on the PWM digital signal.

2. The temperature acquisition circuit of the power module according to claim 1, characterized in that, The conversion circuit includes: A resistor network, one end of which is connected to the temperature sensor, is used to acquire the analog voltage signal; An RC filter circuit is provided, with one end connected to the other end of the resistor network and the other end connected to the analog signal acquisition pin AIP of the driver isolation chip. The RC filter circuit is used to filter the analog voltage signal.

3. The temperature acquisition circuit of the power module according to claim 2, characterized in that, The resistor network includes: A first resistor, one end of which is connected to one end of the temperature sensor, and the other end of which is connected to the other end of the temperature sensor and then grounded; The second resistor has one end connected to one end of the first resistor and one end of the temperature sensor, and the other end connected to one end of the RC filter circuit.

4. The temperature acquisition circuit of the power module according to claim 1, characterized in that, Also includes: A Zener diode, one end of which is connected to the analog signal acquisition pin AIP of the driver isolation chip, and the other end of which is grounded.

5. The temperature acquisition circuit of the power module according to claim 1, characterized in that, The analog signal acquisition pin (AIP) of the driver isolation chip has a built-in constant current source.

6. The temperature acquisition circuit of the power module according to any one of claims 1-3, characterized in that, The temperature sensor includes one of the following: NTC and diode.

7. A power module, characterized in that, It includes the temperature acquisition circuit of the power module according to any one of claims 1-6.

8. A high-voltage motor controller, characterized in that, Includes the power module according to claim 7.

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