Intelligent high-temperature melt pressure transmitter based on IO-Link communication

Abstract

The utility model discloses an intelligent high temperature melt pressure transmitter based on IO -Link communication, including pressure sensing module, signal processing module, IO -Link communication module, heat dissipation structure and environmental protection filling medium. Pressure sensing module passes through elastic element and strain gauge and converts melt pressure into electric signal, signal processing module carries out conditioning and digitization to signal, IO -Link communication module realizes digital communication, heat dissipation structure ensures that electronic component works in the allowable temperature range, and environmental protection filling medium adopts nontoxic gallium indium tin alloy solution. The utility model solves the problem that traditional analog output pressure transmitter is susceptible to interference in high temperature melt pressure measurement, and the information is single and lacks diagnostic function, and improves the adaptability of equipment under high temperature and environmental protection requirement, and is especially suitable for high temperature melt pressure measurement of plastic, chemical fibre and the industry.

Description

Technical Field

[0001] This utility model relates to the field of industrial process pressure measurement technology, and in particular to an intelligent high-temperature melt pressure transmitter based on IO-Link communication, specifically a transmitter for pressure measurement of high-temperature, high-viscosity fluids (such as plastic melts, chemical fiber melts, etc.). Background Technology

[0002] In industrial processes such as plastic extrusion and chemical fiber spinning, accurate monitoring of melt pressure is crucial for ensuring product quality, improving production efficiency, and guaranteeing equipment safety. Traditional high-temperature melt pressure transmitters typically use analog signal outputs, such as 4-20mA current signals or 0-10V voltage signals.

[0003] However, analog signal output has the following inherent drawbacks: Signals are susceptible to interference: During long-distance transmission, analog signals are easily affected by electromagnetic interference at the scene, which can cause fluctuations or distortions in the measured values. Single information transmission: It can usually only transmit a single pressure process variable and cannot obtain other status information of the equipment (such as sensor temperature, health status, etc.). The debugging and maintenance are complex: on-site adjustments to the zero point and range are required, and the maintenance and calibration workload is large. Lack of diagnostic capabilities: Predictive maintenance is difficult to achieve, and troubleshooting equipment failures is challenging.

[0004] IO-Link is a point-to-point serial communication protocol with advantages such as simple structure, low cost, and strong anti-interference capability. In recent years, the application of IO-Link technology in the field of industrial sensors has become increasingly widespread. Some existing technologies have proposed pressure transmitters with IO-Link communication capabilities. However, these existing technologies are not specifically optimized for the special operating conditions of high-temperature melt pressure measurement (such as high temperature, high viscosity, and easy solidification), lacking targeted solutions in areas such as filling medium selection, high-temperature heat dissipation design, and process connection methods.

[0005] In addition, there are still products in the existing technology that use mercury as a medium. Due to the toxic nature of mercury and its low boiling point, its use is subject to certain limitations. For example, it cannot be used in environments that require non-toxicity or in environments with high temperatures (above 350°C).

[0006] Therefore, there is an urgent need for a high-temperature melt pressure transmitter that can adapt to the high-temperature melt measurement environment, has digital communication capabilities, and is environmentally friendly and safe.

[0007] Furthermore, existing technologies also have shortcomings in long-term stability under high-temperature environments. For example, in traditional transmitters operating at continuous high temperatures, electronic components are prone to drift or even failure due to overheating, and the filling medium may vaporize or solidify at high temperatures, leading to pressure transmission failure. In addition, the linearity and repeatability of analog signals are difficult to guarantee under alternating high and low temperature environments, affecting the accuracy and reliability of measurements.

[0008] On the other hand, existing IO-Link pressure transmitters are mostly designed for normal or low-temperature environments, and their heat dissipation structures and material selection do not take into account the heat accumulation problem under long-term high-temperature conditions. In equipment such as plastic extruders, the melt temperature is often above 300°C, or even above 400°C, which places extremely high demands on the thermal management of sensors.

[0009] Furthermore, existing equipment presents numerous inconveniences in terms of installation and maintenance. For instance, replacing or calibrating sensors often requires disassembling the entire measuring head, which is not only time-consuming and labor-intensive but also prone to introducing installation errors, affecting measurement accuracy.

[0010] In summary, existing technologies have significant shortcomings in industrial scenarios characterized by high temperature, high viscosity, and strong interference, whether in terms of communication methods, structural design, or material selection. There is an urgent need for a comprehensive solution that integrates digital communication, efficient heat dissipation, environmentally friendly media, and intelligent diagnostics. Utility Model Content

[0011] To address the shortcomings of existing technologies, the purpose of this invention is to provide an intelligent high-temperature melt pressure transmitter based on IO-Link communication, which solves the problems of traditional analog output pressure transmitters in high-temperature melt pressure measurement, such as signal susceptibility to interference, limited information content, lack of diagnostic functions, and insufficient adaptability of existing equipment under high temperature and environmental protection requirements.

[0012] The above-mentioned utility model objective is achieved through the following technical solution: This invention provides an intelligent high-temperature melt pressure transmitter based on IO-Link communication, comprising: a pressure sensing module for sensing the pressure of a high-temperature melt and converting it into an electrical signal; a signal processing module connected to the pressure sensing module for conditioning and digitizing the electrical signal; an IO-Link communication module connected to the signal processing module for implementing IO-Link protocol communication; a heat dissipation structure for reducing the operating temperature of electronic components; and an environmentally friendly filling medium, using a gallium indium tin alloy solution, for transmitting pressure.

[0013] According to one embodiment of the present invention, the pressure sensing module includes a process connection part, an elastic element, and a strain gauge; the process connection part includes a threaded rod, a rear end rod, and a hose connection component; the elastic element is a diaphragm made of nickel-based high-temperature alloy with a thickness of 0.5 mm; the strain gauge is a high-temperature strain gauge, forming a Wheatstone bridge.

[0014] According to one embodiment of the present invention, the signal processing module includes a temperature compensation circuit, a signal amplification circuit, and an A / D conversion circuit; the temperature compensation circuit uses a platinum resistance temperature sensor; the signal amplification circuit uses an instrumentation amplifier; and the A / D conversion circuit uses a 24-bit ΣΔ ADC.

[0015] According to one embodiment of the present invention, the IO-Link communication module includes a microprocessor, an IO-Link protocol stack, and a physical layer interface chip; it supports COM2 communication rate and is capable of transmitting process data, device data, event data, and parameter data.

[0016] According to one embodiment of the present invention, the heat dissipation structure includes a stacked heat sink and a heat insulation structure; the stacked heat sink is made of copper; the heat insulation structure includes a heat insulation groove and a heat insulation pad, which are disposed between the heat sink and the electronic component compartment.

[0017] According to one embodiment of the present invention, the environmentally friendly filling medium is a gallium indium tin alloy solution, which is filled into the first capillary and the second capillary.

[0018] According to one embodiment of the present invention, it further includes a housing and a sealing structure; the housing is made of stainless steel and has an IP67 protection rating; the sealing structure includes a first gasket and a second gasket.

[0019] According to one embodiment of the present invention, the device data that the IO-Link communication module can transmit includes device serial number, device ID, firmware version, sensor temperature, running time, number of power-on cycles, and alarm history.

[0020] According to one embodiment of the present invention, the signal processing module has a temperature compensation function, which digitally compensates for the zero point and sensitivity temperature drift of the sensor by means of the temperature characteristic curve stored in the device.

[0021] According to one embodiment of the present invention, the transmitter receives parameter configuration instructions issued by the master station through the IO-Link interface to remotely configure the range, output filter time constant, alarm threshold, and output unit.

[0022] According to one embodiment of this utility model, the elastic element of the pressure sensing module is made of a nickel-based high-temperature alloy (such as Inconel 600 or Hastelloy C-276), with a high-temperature yield strength of not less than 500 MPa, ensuring excellent elastic recovery characteristics even under operating conditions above 400°C. The strain gauge is a ceramic-based high-temperature strain gauge with a maximum operating temperature of 500°C, and is tightly bonded to the elastomer using a high-temperature curing adhesive, ensuring stable adhesion even under high-vibration environments.

[0023] According to one embodiment of the present invention, the temperature compensation circuit of the signal processing module adopts a platinum resistance thermometer PT1000, whose temperature measurement range covers -50℃ to 400℃, and performs real-time temperature drift compensation by means of table lookup or polynomial fitting, so that the zero drift in the entire temperature range is less than ±0.02%FS / ℃.

[0024] According to one embodiment of this utility model, the microprocessor of the IO-Link communication module is a 32-bit ARM Cortex-M series chip, with built-in Flash memory and SRAM, capable of storing multiple temperature-pressure characteristic curves and historical operating data of the equipment. The physical layer interface chip supports the IEC 61131-9 standard and has short-circuit protection and reverse connection protection functions to ensure stable operation in harsh industrial electrical environments.

[0025] According to one embodiment of this utility model, the stacked heat sink of the heat dissipation structure is made of copper, with a fin spacing of 2mm and a height of 15mm, and a total heat dissipation area of ​​not less than 200cm². Its layout is optimized through finite element thermal simulation to ensure that the temperature inside the electronic compartment does not exceed 85℃ when the ambient temperature is 70℃. The heat insulation pad in the insulation structure is made of ceramic fiber material with a thermal conductivity of less than 0.05 W / m·K, effectively blocking heat conduction paths.

[0026] According to one embodiment of this utility model, the specific composition of the environmentally friendly filling medium gallium indium tin alloy is: gallium (Ga) 68.5%, indium (In) 21.5%, tin (Sn) 10%, with a melting point of -19℃, a boiling point of over 1300℃, and a viscosity of less than 2mPa·s. It has excellent pressure transmission performance and high temperature stability, and can completely replace toxic mercury medium.

[0027] According to one embodiment of this utility model, the housing is made of 316L stainless steel, and the surface is electrolytically polished for enhanced corrosion resistance. The gasket in the sealing structure is made of fluororubber, which can withstand temperatures up to 250°C, ensuring a long-term leak-proof seal under high temperature and high pressure conditions.

[0028] This invention also has a self-diagnostic function, which can report abnormal states such as open circuit, short circuit, over-temperature, and over-pressure of the sensor in real time through IO-Link event data, and supports remote reset and parameter recovery, which greatly improves the maintainability of the equipment.

[0029] In summary, compared with the prior art, the present invention has at least one of the following beneficial technical effects: This utility model discloses an intelligent high-temperature melt pressure transmitter based on IO-Link communication, which has strong anti-interference capabilities: adopting IO-Link digital communication fundamentally solves the problem of analog signal transmission being susceptible to interference; rich information: in addition to pressure values, it can also transmit equipment status, temperature information, alarm information, etc., providing a data foundation for predictive maintenance; simplified wiring: adopting a standard three-wire connection, eliminating the need for separate signal and configuration lines, reducing wiring costs and complexity; high reliability: a heat dissipation system and heat insulation structure specially designed for high-temperature environments ensure long-term stable operation of electronic components; environmentally friendly and safe: using a non-toxic gallium indium tin alloy solution as the filling medium, suitable for applications with environmental protection requirements; flexible configuration: equipment parameters can be remotely configured through the IO-Link master station, eliminating the need for on-site debugging and greatly reducing maintenance time and costs.

[0030] In addition, this utility model has the following advantages: High precision and high stability: Achieves high precision of ±0.2%FS across the entire range and temperature range through a 24-bit ΣΔ ADC and digital temperature compensation, with long-term drift of less than ±0.1%FS / year.

[0031] Strong environmental adaptability: Its IP67 protection rating and wide temperature range make it suitable for harsh industrial environments with high humidity, dust, and fluctuating high and low temperatures.

[0032] Intelligent early warning and maintenance: By using data such as running time, number of power-on cycles, and alarm history, the lifespan of sensors can be predicted, and replacement can be arranged in advance to avoid sudden downtime.

[0033] Easy installation: The process connection part adopts a standard thread design (such as M20×1.5), which is compatible with existing extruders and melt pipeline interfaces, and can be installed without modification.

[0034] Energy-saving and environmentally friendly: The mercury-free design complies with RoHS and REACH environmental directives and is suitable for high-standard industries such as food and pharmaceuticals. Attached Figure Description

[0035] Figure 1 This is a schematic cross-sectional view of the overall structure of this utility model; Figure 2 This is a system principle block diagram of this utility model; Figure 3This is a schematic diagram of the high-temperature heat dissipation structure of this utility model; Figure 4 This is a schematic diagram of the IO-Link communication data frame structure of this utility model.

[0036] Reference numerals: 1. Housing; 2. Hose connector; 3. Hose; 4. Hose hexagonal connector; 5. Rear end bar; 6. Threaded bar; 7. Cover diaphragm; 8. Screw; 9. Aviation insert; 10. Top cover; 11. First washer; 12. Circuit mounting plate; 13. Silicone wire; 14. Pressure sensor; 15. Elastomer; 16. Compensation plate; 17. First capillary tube; 18. Second capillary tube; 19. Connecting seat; 20. Second washer; 21. Sealing pin. Detailed Implementation

[0037] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0038] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] Example 1: Reference Figures 1-4This utility model discloses an intelligent high-temperature melt pressure transmitter based on IO-Link communication, comprising: a pressure sensing module for sensing the pressure of a high-temperature melt and converting it into an electrical signal; a signal processing module connected to the pressure sensing module for conditioning and digitizing the electrical signal, specifically for amplifying, compensating, and digitizing the weak electrical signal output by the pressure sensing module; an IO-Link communication module connected to the signal processing module for implementing IO-Link protocol communication, specifically implemented using a microprocessor, for encapsulating the digitized pressure signal into an IO-Link protocol frame and conducting bidirectional data communication with the master station through the IO-Link physical interface; a heat dissipation structure for reducing the operating temperature of electronic components, comprising a heat sink, a heat insulation layer, and a housing 1, ensuring that the internal electronic components are within the allowable operating temperature range; and an environmentally friendly filling medium, using a gallium indium tin alloy solution, for transmitting pressure, with the gallium indium tin alloy solution filling the pressure transmission path as the transmission medium.

[0041] The pressure sensing module includes a process connection part that directly contacts the high-temperature molten metal, an elastic element that senses pressure, and a strain gauge that converts pressure into an electrical signal. The process connection part includes a threaded rod 6, a rear section rod 5, and a hose 3 connecting component. The process connection part uses a threaded rod 6, made of high-temperature and corrosion-resistant stainless steel. The elastic element is a 0.5mm thick diaphragm made of a nickel-based high-temperature alloy, capable of withstanding high temperatures and maintaining stable elastic properties. The strain gauge is a high-temperature strain gauge, bonded to the elastomer 15 with a high-temperature adhesive to form a Wheatstone bridge.

[0042] The signal processing module includes a temperature compensation circuit, a signal amplification circuit, and an A / D conversion circuit. The temperature compensation circuit uses a platinum resistance temperature sensor to monitor the sensor temperature in real time and compensate for temperature drift. The signal amplification circuit uses an instrumentation amplifier to initially amplify the millivolt-level signal. The A / D conversion circuit uses a 24-bit ΣΔ ADC to convert the analog signal into a digital signal.

[0043] The IO-Link communication module includes a microprocessor, an IO-Link protocol stack, and a physical layer interface chip; it supports COM2 (38.4 kbaud) communication rate and can transmit process data, device data, event data, and parameter data. Specifically, its operating mode can be configured to transmit single-byte process data or multi-byte device data. This module can transmit: Process data: Real-time pressure values; Device data: Serial number, device ID, firmware version; Event data: Over-range alarm, sensor malfunction, temperature exceeding limit; Parameter data: upper and lower limits of measurement range, filter time constant, alarm threshold.

[0044] The heat dissipation structure includes a finned heat sink and a thermal insulation structure. The finned heat sink is made of copper. The thermal insulation structure includes thermal insulation grooves and thermal insulation pads, which are installed between the heat sink and the electronic component compartment. A finned heat sink, made of copper, is installed between the process connection and the electronic component compartment to increase the heat dissipation area. Thermal insulation grooves and thermal insulation pads are installed between the heat sink and the electronic component compartment to create thermal resistance and reduce heat conduction. The housing 1 is made of stainless steel, achieving an IP67 protection rating.

[0045] The environmentally friendly filling medium is a gallium indium tin alloy solution, which is filled in the first capillary 17 and the second capillary 18. The gallium indium tin alloy solution is used as the pressure transmission medium, replacing the traditional toxic mercury medium. This alloy solution is non-toxic, has a high boiling point, and good fluidity, making it suitable for high-temperature applications and environments with stringent environmental requirements.

[0046] The high-temperature molten pressure is transmitted to the diaphragm 7 via the threaded rod 6, and then to the elastic body 15 inside the pressure-sensing head 14 via the gallium indium tin alloy solution, causing the elastic body 15 to deform. The strain gauges adhering to the elastic body 15 deform accordingly, causing their resistance to change, disrupting the balance of the Wheatstone bridge, and outputting a millivolt-level voltage signal proportional to the pressure.

[0047] After being amplified and digitized by the signal processing module, the signal is sent to the microprocessor. The microprocessor encapsulates the pressure data, temperature data, and equipment status information according to the IO-Link protocol and sends them to the IO-Link master station via the IO-Link communication module. Simultaneously, the microprocessor can also receive instructions from the master station to perform functions such as parameter configuration and diagnostic control.

[0048] The heat dissipation system dissipates process heat through finned heat sinks, while the insulation structure prevents residual heat from being transferred to the electronic component compartment, ensuring that the internal temperature does not exceed the allowable range of the components.

[0049] The transmitter further includes a housing 1 and a sealing structure; the housing 1 is made of stainless steel with an IP67 protection rating; the sealing structure includes a first gasket 11 and a second gasket 20. The IO-Link communication module can transmit device data including device serial number, device ID, firmware version, sensor temperature, running time, power-on count, and alarm history. The signal processing module has a temperature compensation function, digitally compensating for the sensor's zero point and sensitivity temperature drift using the temperature characteristic curve stored within the device. The transmitter receives parameter configuration commands from the master station via the IO-Link interface, enabling remote configuration of the measurement range, output filter time constant, alarm threshold, and output unit.

[0050] This embodiment describes an intelligent high-temperature melt pressure transmitter based on IO-Link communication, the structure of which is as follows: Figure 1As shown. The process connection consists of a threaded rod 6, a rear section rod 5, a hexagonal hose connector 4, a hose 3, and a hose connector 2, all made of 304 stainless steel. A cover diaphragm 7, made of nickel-based high-temperature alloy with a thickness of 0.5 mm, is welded to the end of the threaded rod 6 and can withstand temperatures up to 450°C.

[0051] The pressure transmission channel consists of a first capillary tube 17 and a second capillary tube 18, with an inner diameter of 1.8 mm. The interior is filled with a gallium indium tin alloy solution as the pressure transmission medium. One end of the first capillary tube 17 is sealed by a sealing pin 21 and an end cap. This threaded sealing method is safer and more reliable than traditional argon arc welding and can seal pressures up to 300 MPa.

[0052] The sensing unit includes a pressure head 14, an elastomer 15, and strain gauges. The elastomer 15 is welded to the pressure head 14, and the strain gauges are bonded to the surface of the elastomer 15 using high-temperature curing adhesive, forming a Wheatstone full-bridge circuit. A temperature compensation resistor and a laser adjustment circuit are mounted on the compensation plate 16 to compensate for the sensor's zero point and sensitivity temperature drift.

[0053] The signal processing and IO-Link communication unit is mounted on the circuit mounting plate 12 and includes: A 24-bit ΣΔ ADC is used to acquire sensor signals; A 32-bit ARM Cortex-M0 microprocessor running the IO-Link protocol stack; IO-Link physical layer transceiver chip, supporting 24V IO-Link communication; EEPROM memory is used to store device parameters, calibration data, and event logs.

[0054] The heat dissipation system uses a finned heat sink (not shown separately in the figure, but integrated between the housing 1 and the connecting part), made of copper, which greatly increases the heat dissipation area. A heat insulation groove and a heat insulation pad are installed between the heat sink and the electronic component compartment to effectively block heat conduction.

[0055] The housing 1 is made of stainless steel and has an IP67 protection rating. The top cover 10 is sealed to the housing 1 by a first gasket 11, and the connector 19 is sealed to the housing 1 by a second gasket 20. The aviation plug-in 9 provides an IO-Link communication interface and a 24V power input.

[0056] In practical applications, this transmitter is mounted on the measuring point of the extruder or melt pipeline via a threaded rod 6. The high-temperature melt pressure acts on the diaphragm 7, and is transmitted through the gallium indium tin alloy solution to the elastic element 15 within the pressure-sensing head 14, causing a change in the resistance of the strain gauge. After amplification and digitization, the signal is packaged by a microprocessor according to the IO-Link protocol and transmitted to the IO-Link master station via the aviation plug-in 9.

[0057] The pressure transmitter in this embodiment has a range of 0-100MPa, an accuracy of ±0.2%FS, long-term stability better than ±0.1%FS / year, an operating temperature range of -20℃ to 125℃ (electronic components), and a maximum process temperature of 400℃.

[0058] Furthermore, the working principle of this utility model is as follows: When the high-temperature molten metal acts on the diaphragm 7 through the process connection, the diaphragm undergoes slight deformation. This deformation is transmitted to the elastic body 15 inside the pressure sensing head 14 via the gallium indium tin alloy solution. The deformation of the elastic body 15 causes a change in the resistance value of the high-temperature strain gauge attached to it, resulting in an imbalance in the Wheatstone bridge and the output of a millivolt-level differential voltage signal proportional to the pressure. This signal is amplified by an instrumentation amplifier and then converted into a digital signal by a 24-bit ΣΔ ADC. The microprocessor reads this digital signal and performs digital temperature compensation in conjunction with temperature data acquired by a platinum resistance thermometer, ultimately obtaining a precise pressure value.

[0059] Pressure data, equipment status, and event information are encapsulated into IO-Link protocol frames and sent to the IO-Link master station via the physical layer interface chip. The master station can issue configuration commands to modify parameters such as the transmitter's range, filter constant, and alarm threshold, enabling remote debugging and monitoring.

[0060] The heat dissipation system uses copper finned heat sinks to quickly dissipate process heat to the surrounding air, while the heat insulation structure uses ceramic fiber pads to block heat flow to the electronics compartment, ensuring that sensitive components such as microprocessors and ADCs operate at safe temperatures.

[0061] The environmentally friendly filler medium, gallium indium tin alloy, remains liquid throughout the pressure transmission process. Its low viscosity and high boiling point characteristics ensure rapid pressure response and stability at high temperatures.

[0062] Through the above-mentioned integrated design, this utility model achieves high-precision and high-reliability pressure measurement in high-temperature and strong interference environments, and has rich diagnostic and remote management functions.

[0063] Example 2: In another embodiment of this invention, the elastic element of the pressure sensing module can be made of titanium alloy TC4, and its diaphragm thickness can be adjusted to 0.3mm, making it suitable for higher frequency pressure fluctuation measurement scenarios. The A / D conversion circuit of the signal processing module can be a 32-bit ADC, increasing the sampling rate to 1kSPS, which is suitable for dynamic pressure monitoring.

[0064] The IO-Link communication module supports COM3 (230.4 kbaud) communication rate, enabling the transmission of larger amounts of device status and waveform data. The stacked heat sink in the heat dissipation structure can be replaced with an aluminum alloy material, which is lighter and suitable for mobile devices or space-constrained applications.

[0065] Environmentally friendly filling media can also be made of gallium indium tin zinc quaternary alloy, whose freezing point is further reduced to -30℃, making it suitable for extremely cold environments.

[0066] The transmitter in this embodiment has a range of 0-60MPa and an accuracy improved to ±0.1%FS, making it particularly suitable for high-frequency and high-precision applications such as pressure monitoring before chemical fiber spinning pumps.

[0067] The implementation principle of this utility model is as follows: This utility model discloses an intelligent high-temperature melt pressure transmitter based on IO-Link communication, including a pressure sensing module, a signal processing module, an IO-Link communication module, a heat dissipation structure, and an environmentally friendly filling medium. The pressure sensing module converts the melt pressure into an electrical signal through elastic elements and strain gauges; the signal processing module conditions and digitizes the signal; the IO-Link communication module realizes digital communication; the heat dissipation structure ensures that the electronic components operate within the allowable temperature range; and the environmentally friendly filling medium uses a non-toxic gallium indium tin alloy solution. This utility model solves the problems of traditional analog output pressure transmitters in high-temperature melt pressure measurement, such as susceptibility to signal interference, limited information content, and lack of diagnostic functions. It also improves the adaptability of the equipment under high temperature and environmental protection requirements, making it particularly suitable for high-temperature melt pressure measurement in industries such as plastics and chemical fibers.

[0068] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A smart high-temperature melt pressure transmitter based on IO-Link communication, characterized in that, include: The pressure sensing module is used to sense the pressure of the high-temperature melt and convert it into an electrical signal; A signal processing module, connected to the pressure sensing module, is used to condition and digitize the electrical signal; An IO-Link communication module, connected to the signal processing module, is used to implement IO-Link protocol communication; Heat dissipation structure, used to reduce the operating temperature of electronic components; The environmentally friendly filling medium uses a gallium indium tin alloy solution to transmit pressure.

2. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The pressure sensing module includes a process connection part, an elastic element, and a strain gauge; the process connection part includes a threaded rod (6), a rear end rod (5), and a hose connection component; the elastic element is a diaphragm made of nickel-based high-temperature alloy with a thickness of 0.5 mm; the strain gauge is a high-temperature strain gauge, forming a Wheatstone bridge.

3. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The signal processing module includes a temperature compensation circuit, a signal amplification circuit, and an A / D conversion circuit; the temperature compensation circuit uses a platinum resistance temperature sensor; the signal amplification circuit uses an instrumentation amplifier; and the A / D conversion circuit uses a 24-bit ΣΔ ADC.

4. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The IO-Link communication module includes a microprocessor, an IO-Link protocol stack, and a physical layer interface chip; It supports COM2-38.4kbaud communication rate and can transmit process data, device data, event data and parameter data.

5. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The heat dissipation structure includes a finned heat sink and a heat insulation structure; the finned heat sink is made of copper; the heat insulation structure includes a heat insulation groove and a heat insulation pad, which are disposed between the heat sink and the electronic component compartment.

6. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The environmentally friendly filling medium is a gallium indium tin alloy solution, which is filled in the first capillary (17) and the second capillary (18).

7. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, It further includes a housing (1) and a sealing structure; the housing (1) is made of stainless steel and has an IP67 protection rating; the sealing structure includes a first gasket (11) and a second gasket (20).

8. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The IO-Link communication module can transmit device data including device serial number, device ID, firmware version, sensor temperature, running time, number of power-on cycles, and alarm history.

9. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The signal processing module has a temperature compensation function, which digitally compensates for the zero point and sensitivity temperature drift of the sensor by using the temperature characteristic curve stored in the device.

10. The intelligent high-temperature melt pressure transmitter based on IO-Link communication according to claim 1, characterized in that, The transmitter receives parameter configuration commands from the master station via the IO-Link interface, enabling remote configuration of the measurement range, output filter time constant, alarm threshold, and output unit.

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