Multi-point temperature control induction and new composite membrane heating device for immunohistochemical staining system

Abstract

The application provides a multipoint temperature control induction and novel composite film heating device of an immunohistochemical staining system and relates to the field of biological detection instruments. The device comprises a heat dissipation base, a mounting groove is formed in the heat dissipation base. A thin film heating element is attached to the mounting groove. A temperature sensing element is arranged close to the thin film heating element. A flexible circuit board is arranged around the thin film heating element. The temperature sensing element is arranged on the flexible circuit board. The thin film heating element, the temperature sensing element and the flexible circuit board are electrically connected. The thin film heating element has small temperature deviation and fast temperature rising and falling rates.

Description

Technical Field

[0001] This invention relates to the field of biological detection instruments, and in particular to a multi-point temperature control sensor and a novel composite membrane heating device for an immunohistochemical staining system. Background Technology

[0002] Automated immunohistochemical staining systems are used in medical diagnostics and biological research to detect specific proteins or molecules in tissue sections or cell samples. They typically feature functions such as tissue and reagent scanning, barcode scanning and management of sections and reagents, reagent and probe cleaning, elution buffer container level alarms, and waste liquid container level alarms.

[0003] Currently, the heating system of immunohistochemical staining instruments is based on ceramic heating elements, which have problems such as large temperature deviation, slow heating rate, easy damage under stress, low temperature control accuracy, easy temperature overshoot, and frequent feedback from the application. Summary of the Invention

[0004] The purpose of this invention is at least to provide a multi-point temperature control sensing and novel composite membrane heating device for an immunohistochemical staining system, which uses thin-film heating elements, has small temperature deviation, and fast heating and cooling rates.

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0006] One embodiment of the present invention provides a multi-point temperature control sensor and a novel composite membrane heating device for an immunohistochemical staining system. The multi-point temperature control sensor and novel composite membrane heating device for the immunohistochemical staining system includes a temperature control heating component, which comprises:

[0007] A heat dissipation base with mounting slots.

[0008] Thin-film heating element, which is pressed into the mounting groove.

[0009] Temperature sensing element, which is positioned close to the thin-film heating element.

[0010] A flexible circuit board is arranged around a thin-film heating element, and a temperature sensing element is arranged on the flexible circuit board. The thin-film heating element, the temperature sensing element and the flexible circuit board are electrically connected.

[0011] In some embodiments, a high-temperature resistant thermally conductive adhesive is applied to the back of the thin-film heating element near the heat dissipation base, and the thin-film heating element is pressed against the bottom of the mounting groove by the high-temperature resistant thermally conductive adhesive.

[0012] In some embodiments, a through hole is formed on the flexible circuit board, and a thin-film heating element is disposed in the through hole. The shape of the through hole is adapted to the shape of the thin-film heating element, so that the side of the thin-film heating element is in close contact with the hole wall.

[0013] In some embodiments, a groove is provided on the heat sink base, and the side of the flexible circuit board is slidably engaged with the groove. When the flexible circuit board is slidably fixed to the heat sink base, the thin film heating element is located in the through hole.

[0014] In some embodiments, the temperature-controlled heating assembly includes two temperature sensing elements, and the flexible circuit board is provided with two slots, in which the temperature sensing elements are embedded one-to-one with the slots, and the two temperature sensing elements are respectively located on both sides of the thin-film heating element.

[0015] In some embodiments, the material of the thin-film heating element includes polyimide.

[0016] In some embodiments, the multi-point temperature control sensor and novel composite membrane heating device of the immunohistochemical staining system further includes:

[0017] A glass slide is located on the front side of the heat dissipation base away from the thin-film heating element. The thin-film heating element and the flexible circuit board are located on the back side of the heat dissipation base away from the glass slide. The glass slide and the temperature control heating component are arranged in a one-to-one correspondence. The temperature control heating component is used to heat the glass slide.

[0018] In some embodiments, the glass slide is in close contact with the front side of the heat sink base.

[0019] The glass slide, heat dissipation base, and thin-film heating element are stacked vertically, and the projection of the heat dissipation base in the vertical direction covers the projection of the glass slide in the vertical direction.

[0020] In some embodiments, the projection of the glass slide along the vertical direction covers the projection of the temperature sensing element along the vertical direction.

[0021] In some embodiments, the multi-point temperature control sensing and novel composite membrane heating device of the immunohistochemical staining system further includes a control unit, which outputs a PWM dot matrix signal to control the operation of the thin film heating element through a flexible circuit board, so as to control the heating temperature of the temperature control heating component within the range of ±0.5°C of the set temperature.

[0022] This invention relates to a multi-point temperature control sensing and novel composite membrane heating device for immunohistochemical staining systems, proposing high-precision novel heating technology and precise temperature control technology.

[0023] 1. High-precision new heating technology

[0024] The high-precision new heating technology consists of a self-designed polyimide (PI) thin film heating element, two 1 / 3B grade PT100 temperature sensing elements, a highly conductive heat dissipation base, and a high-temperature resistant flexible circuit board (FPC).

[0025] The resistance of polyimide (PI) film heating elements can be controlled within ±0.5Ω, and they have the characteristics of ultra-high precision, fast heating rate and strong resistance to physical impact. Under the condition that multiple polyimide (PI) film heating elements are operating at the same time, the temperature uniformity is good.

[0026] During operation, the polyimide (PI) film heating element heats to the set temperature. The temperature is collected and controlled by two complementary 1 / 3B grade PT100 temperature sensing elements. The set temperature is then rapidly conducted to the high-conductivity heat dissipation base, which distributes it evenly on the base surface and then conducts it to the tissue slide, enabling the immunohistochemical staining system to achieve the expected staining target.

[0027] 2. Precision temperature control technology

[0028] The precise temperature control technology uses two 1 / 3B grade PT100 temperature sensing elements to collect data in real time, and then uses AD conversion and control algorithms to precisely control the temperature of the polyimide (PI) film heating element.

[0029] The precise temperature control technology adopts a self-developed three-segment matrix temperature control algorithm. The three temperature control points include: a 30℃ low temperature zone calibration point, a 74℃ tissue dewaxing temperature zone calibration point, and a 102℃ tissue repair staining temperature zone calibration point.

[0030] During the temperature rise and fall process, when the temperature approaches the set temperature, the control unit outputs a PWM dot matrix signal to control the operating status of the polyimide (PI) film heating element, thereby achieving efficient temperature control and preventing overheating. The temperature control accuracy can be controlled within ±0.5℃. Attached Figure Description

[0031] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related properties or features may have the same or similar reference numerals. Wherein:

[0032] Figure 1 This is a structural schematic diagram of a temperature-controlled heating assembly according to some embodiments;

[0033] Figure 2 This is an exploded view of a temperature-controlled heating assembly according to some embodiments;

[0034] Figure 3 This is a schematic diagram of the structure of a multi-point temperature control sensor and a novel composite membrane heating device for an immunohistochemical staining system, as shown in some embodiments.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100-Temperature-controlled heating element;

[0037] 10-Heat dissipation base;

[0038] 11-Mounting slot;

[0039] 12-Slide groove;

[0040] 20 - Thin-film heating element;

[0041] 30 - Temperature sensing element;

[0042] 40 - Flexible circuit board;

[0043] 41 - Through hole;

[0044] Multi-point temperature control sensing and novel composite membrane heating device for 1000-immunohistochemical staining system;

[0045] 200-glass slide;

[0046] 300-Control Unit;

[0047] 400-Loading rack;

[0048] 500-Tablet press stand. Detailed Implementation

[0049] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the aspects described below with reference to the accompanying drawings and specific embodiments are merely exemplary and should not be construed as limiting the scope of protection of the present invention in any way.

[0050] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other words can achieve the same purpose, they may be replaced by other expressions.

[0051] It is understood that the technical terms that may be used in the description of this specification, such as “center,” “longitudinal,” “lateral,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the implementation method and do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of the invention.

[0052] It should be noted that the use of terms such as "first" and "second" to define features in this document is merely for the purpose of distinguishing the corresponding features. Unless otherwise stated, these terms have no special meaning and should not be construed as limiting the scope of protection of this invention. As shown in this specification and claims, the terms "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural, unless the context clearly indicates otherwise. Generally, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements.

[0053] In the description of this specification, it should also be noted that, unless otherwise expressly specified or limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or a connection within two components, etc. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0054] This specification proposes a multi-point temperature control sensor and a novel composite membrane heating device for an immunohistochemical staining system, as detailed below:

[0055] This invention is based on the loading rack in the immunohistochemical staining system. The temperature control system mainly consists of a polyimide (PI) film heating element, two 1 / 3B grade PT100 temperature sensing elements, a high-conductivity heat dissipation base, a high-temperature resistant flexible circuit board, and a control unit.

[0056] During operation, the polyimide (PI) film heating element heats to the set temperature. The temperature is collected and controlled by two complementary 1 / 3B grade PT100 temperature sensing elements. The set temperature is then rapidly conducted to the high-conductivity heat dissipation base, which distributes it evenly on the base surface and then conducts it to the tissue slide, enabling the immunohistochemical staining system to achieve the expected staining target.

[0057] During the temperature rise and fall process, when the temperature approaches the set temperature, the control unit outputs a PWM dot matrix signal to control the operating status of the polyimide (PI) film heating element, thereby achieving efficient temperature control and preventing overheating. The temperature control accuracy can be controlled within ±0.5℃.

[0058] This invention proposes two important development points: high-precision novel heating technology and precise temperature control technology.

[0059] The high-precision new heating technology solves the problems of large temperature deviation, slow heating rate and easy damage under stress in existing immunohistochemical staining systems.

[0060] Precise temperature control technology solves the problems of low control precision, easy temperature overshoot, and large temperature deviation in low-temperature regions in existing immunohistochemical staining systems.

[0061] The following description, in conjunction with the accompanying drawings, will explain the multi-point temperature control sensor and the novel composite membrane heating device of the immunohistochemical staining system.

[0062] This specification presents an embodiment of a multi-point temperature control sensing and novel composite film heating device, including a temperature control heating component.

[0063] Figure 1 This is a structural schematic diagram of a temperature-controlled heating assembly according to some embodiments. Figure 2 This is an exploded view of a temperature-controlled heating assembly as shown in some embodiments.

[0064] The temperature-controlled heating assembly 100 includes a heat dissipation base 10 with a mounting groove 11. A thin-film heating element 20 is pressed into the mounting groove 11. A temperature sensing element 30 is positioned close to the thin-film heating element 20 and is used to collect the temperature of the thin-film heating element 20 and its surroundings. A flexible printed circuit board (FPC) 40 is positioned around the thin-film heating element 20 to facilitate electrical connection between the thin-film heating element 20 and the FPC 40. The temperature sensing element 30 is mounted on the FPC 40 and is also electrically connected to the FPC 40.

[0065] In some embodiments, the heat dissipation base 10 is made of a metal material with high thermal conductivity, such as aluminum alloy. In some embodiments, a mounting groove 11 of a certain depth is cut out on the back side of the heat dissipation base 10, and the mounting groove 11 completely accommodates the thin-film heating element 20. In some embodiments, the size of the mounting groove 11 is slightly larger than the size of the thin-film heating element 20, and the shape of the mounting groove 11 is adapted to the shape of the thin-film heating element 20; for example, the mounting groove 11 is a rectangle approximately similar to the thin-film heating element 20. Because the mounting groove 11 itself has a certain depth, the thickness of the heat dissipation base 10 at the mounting groove 11 is reduced, and more heat from the thin-film heating element 20 can be transferred away through the front side of the heat dissipation base 10, reducing heat loss. It should be noted that the front and back sides of the heat dissipation base 10 are two opposite sides in the vertical direction.

[0066] In some embodiments, the temperature sensing element 30 is based on a thermocouple or a thermistor to achieve temperature acquisition. In some embodiments, the flexible circuit board 40 is made of polyimide (PI) substrate. The temperature sensing element 30 is fixed on the flexible circuit board 40. The thin-film heating element 20 and the temperature sensing element 30 are connected to the power supply circuit and its control circuit through the flexible circuit board 40. The control unit controls the heating of the thin-film heating element 20 in real time according to the temperature signal acquired by the temperature sensing element 30.

[0067] This embodiment of the specification optimizes the heat conduction path by setting a heat dissipation base 10, allowing the heat from the thin-film heating element 20 to be transferred outward through the heat dissipation base 10, thus solving the problem of uneven heating temperature in traditional heating components. Furthermore, the heating element uses thin-film heating, resulting in rapid heating and cooling rates, stable temperature maintenance, and high temperature control precision.

[0068] In some embodiments, the back of the thin-film heating element 20 near the heat dissipation base 10 is pre-coated with a high-temperature resistant thermally conductive adhesive, which is a high-temperature resistant thermally conductive material, such as silicone-based. The thin-film heating element 20 is pressed against the bottom of the mounting groove 11 by the high-temperature resistant thermally conductive adhesive. Under pressure, the high-temperature resistant thermally conductive adhesive deforms and fills the micro-gap between the thin-film heating element 20 and the bottom of the mounting groove 11, forming a seamless thermal interface. After the high-temperature resistant thermally conductive adhesive cures, the thin-film heating element 20 can be fixed to the heat dissipation base 10.

[0069] The embodiments in this specification use high-temperature resistant thermally conductive adhesive to not only fix the thin-film heating element 20 to the heat dissipation base 10, but also to eliminate the thermal resistance of the air layer between the thin-film heating element 20 and the heat dissipation base 10, thereby increasing the heat conduction efficiency to over 95%. This solves the temperature drift problem caused by the installation gap between the thin-film heating element 20 and the heat dissipation base 10. Under high temperature conditions, the heat dissipation base 10 may also experience an increase in the installation gap due to thermal expansion.

[0070] In some embodiments, a through hole 41 is formed on the flexible circuit board 40, and a thin-film heating element 20 is disposed in the through hole 41. The shape of the through hole 41 is adapted to the shape of the thin-film heating element 20, for example, as shown in the figure. Figure 2 As shown, the shape of the through-hole 41 is adapted to the shape of the thin-film heating element 20, and is similar to a rectangle. The size of the through-hole 41 is slightly larger than the size of the thin-film heating element 20, so that the side of the thin-film heating element 20 is in close contact with the wall of the through-hole 41. Specifically, when the thin-film heating element 20 is fixed in the mounting groove 11 of the heat sink 10, the thin-film heating element 20 protrudes slightly from the back of the heat sink 10. The thin-film heating element 20 is inserted into the through-hole 41 from the side of the flexible circuit board 40 near the heat sink 10. In some embodiments, the side of the thin-film heating element 20 is in close contact with the wall of the through-hole 41, and a conductive coating (e.g., silver paste) is applied to the wall of the through-hole 41. The thin-film heating element 20 is electrically connected to the flexible circuit board 40 through the conductive coating to enhance electrical insulation and thermal contact. After the thin-film heating element 20 is inserted into the through-hole 41, the thin-film heating element 20 and the side of the flexible circuit board 40 away from the heat sink 10 remain flat.

[0071] In this embodiment, the through-hole 41 provides mechanical support for the thin-film heating element 20 via the flexible circuit board 40. Furthermore, because the flexible circuit board 40 is positioned from the side of the thin-film heating element 20, lateral heat loss from the thin-film heating element 20 is reduced, improving thermal efficiency by 10% to 15%.

[0072] In some embodiments, a groove 12 is provided on the heat dissipation base 10, and the arrangement direction of the groove 12 is parallel to the long side of the thin film heating element 20. The long side of the flexible circuit board 40 is slidably engaged with the groove 12. After the flexible circuit board 40 slides to the end of the groove 12 and stops, the flexible circuit board 40 and the heat dissipation base 10 are fixed relative to each other, and the thin film heating element 20 is located in the through hole 41.

[0073] Specifically, a groove 12 is milled into the side of the heat dissipation base 10. The height of the groove 12 in the vertical direction is adapted to the thickness of the flexible circuit board 40 in the vertical direction. The side of the flexible circuit board 40 can slide into the groove 12, which is beneficial for the rapid assembly and maintenance of the flexible circuit board 40. Moreover, since the flexible circuit board 40 is flexible and prone to deformation, the groove 12 provides overall restraint for the side of the flexible circuit board 40, which helps to maintain the rigidity of the flexible circuit board 40 and ensures the connection between the flexible circuit board 40 and the thin-film heating element 20.

[0074] In some embodiments, the temperature-controlled heating assembly 100 includes at least two temperature sensing elements 30. At least two slots are provided on the flexible circuit board, and the temperature sensing elements 30 are embedded in the slots. Each temperature sensing element 30 corresponds to one slot, facilitating the replacement of the temperature sensing elements 30. Two of the at least two temperature sensing elements 30 are respectively located on opposite sides of the thin-film heating element 20, for example, as... Figure 1 The two sides of the long side of the thin film heating element 20, or the two sides of the short side of the thin film heating element 20, are shown.

[0075] Two temperature sensing elements 30 complementarily acquire temperature signals and output them to the control unit 300 to achieve multi-point comparison and temperature control. The acquisition range covered by the two temperature sensing elements 30 covers the heating area of ​​the heat dissipation base 10 as much as possible.

[0076] Figure 3 This is a schematic diagram of the structure of a multi-point temperature control sensor and a novel composite membrane heating device for an immunohistochemical staining system, as shown in some embodiments.

[0077] This specification provides an embodiment of a multi-point temperature control sensor and a novel composite membrane heating device 1000 for an immunohistochemical staining system, such as... Figure 3 As shown, in addition to the temperature-controlled heating component 100, it also includes a glass slide 200.

[0078] In some embodiments, the temperature-controlled heating assembly 100 includes a polyimide (PI) film heating element 20, two 1 / 3B grade PT100 temperature sensing elements 30, a high-conductivity heat dissipation base 10, and a high-temperature resistant flexible circuit board 40. Using the high-conductivity heat dissipation base 10 as a base, the polyimide (PI) film heating element 20, with high-temperature resistant thermally conductive adhesive applied to its back, is evenly pressed into the mounting groove 11 in the middle of the high-conductivity heat dissipation base 10. The two 1 / 3B grade PT100 temperature sensing elements 30 are placed at both ends of the heat dissipation base 10. The high-temperature resistant flexible circuit board 40 is then attached. Finally, the polyimide (PI) film heating element 20, the two 1 / 3B grade PT100 temperature sensing elements 30, and the high-temperature resistant flexible circuit board 40 are electrically connected.

[0079] The temperature control heating component 100 is connected to the control unit 300, and a self-developed three-segment dot matrix temperature control algorithm is introduced to realize a new temperature control technology.

[0080] The glass slide 200 is located on the front side of the heat dissipation base 10 away from the thin-film heating element 20. The thin-film heating element 20 and the flexible circuit board 40 are located on the back side of the heat dissipation base 10 away from the glass slide 200. The temperature-controlled heating assembly 100 is used to heat the glass slide 200. The tissue section or cell sample to be tested is placed on the glass slide 200.

[0081] The heat from the thin-film heating element 20 is transferred to the glass slide 200 through the heat dissipation base 10. The heat generated by the thin-film heating element 20 is evenly distributed on the heat dissipation base 10 and evenly transferred to the glass slide 200, so that the tissue section or cell sample carried on the glass slide 200 is uniformly heated. The multi-point temperature control sensing and novel composite membrane heating device 1000 of the immunohistochemical staining system includes several glass slides 200 and several temperature control heating components 100, with each temperature control heating component 100 corresponding to a glass slide 200. The temperature of each glass slide 200 can be controlled individually and specifically by the control unit 300.

[0082] In some embodiments, the glass slide 200 is in close contact with the front surface of the heat dissipation base 10 to reduce heat loss. In some embodiments, the glass slide 200, the heat dissipation base 10, and the thin-film heating element 20 are aligned vertically (see [link]). Figure 3 , and Figure 2 The heat dissipation base 10 is stacked in the same vertical direction as shown. The projection of the heat dissipation base 10 in the vertical direction covers the projection of the glass slide 200 in the vertical direction. The heat of the thin film heating element 20 can be evenly distributed to the entire area of ​​the glass slide 200, avoiding cold areas at the edges. This ensures that the heat dissipation base 10 can evenly heat the entire glass slide 200, thus avoiding or reducing the problem of uneven staining.

[0083] In some embodiments, the vertical projection of the glass slide 200 overlaps the vertical projection of the temperature sensing element 30. This ensures that the temperature collected by the temperature sensing element 30 is as close as possible to the temperature of the glass slide 200, guaranteeing the accuracy of the temperature signal. In some embodiments, the vertical projection of the glass slide 200 overlaps the vertical projection of the thin-film heating element 20, maximizing the transfer of heat generated by the thin-film heating element 20 to the glass slide 200 and minimizing heat loss.

[0084] In some embodiments, the multi-point temperature control sensing and novel composite membrane heating device 1000 of the immunohistochemical staining system includes a control unit 300. The control unit 300 is used to output a PWM dot matrix signal to control the operation of the thin film heating element 20 through the flexible circuit board 40, so as to control the heating temperature of the temperature control heating component 100 within the range of ±0.5°C of the set temperature.

[0085] Specifically, the control unit 300 adjusts the heating power of the thin-film heating element 20 in real time based on the feedback from the temperature sensing element 30. When the temperature signal fed back by the temperature sensing element 30 approaches the set temperature, the control unit 300 outputs a PWM dot matrix signal to control the operating state of the thin-film heating element 20, avoiding temperature overshoot and ensuring that the actual temperature of the temperature-controlled heating assembly 100 is controlled within the range of ±0.5℃ of the set temperature, resulting in high temperature control accuracy.

[0086] In some embodiments, the multi-point temperature control sensing and novel composite membrane heating device 1000 of the immunohistochemical staining system further includes a loading rack 400 and a slide holder 500. The loading rack 400 supports the remaining components of the multi-point temperature control sensing and novel composite membrane heating device 1000, including the glass slide 200 and the temperature control heating assembly 100. The slide holder 500 presses the coverslip and the glass slide 200 together to keep the cavity formed between the coverslip and the glass slide 200 sealed.

[0087] The basic concepts have been described above. It is clear that the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification, especially for those skilled in the art. Furthermore, unless expressly stated in the claims, the order of elements and sequences, the use of numbers and letters, or other names in this specification are not intended to limit the order of the processes and methods described herein. Although various examples of currently considered useful embodiments of the invention have been discussed in the foregoing disclosure, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments described herein.

Claims

1. A multi-point temperature control sensor and novel composite membrane heating device for an immunohistochemical staining system, characterized in that, The multi-point temperature control sensing and novel composite membrane heating device of the immunohistochemical staining system includes a temperature control heating component, which comprises: A heat dissipation base, wherein an installation groove is provided on the heat dissipation base; A thin-film heating element, wherein the thin-film heating element is pressed into the mounting groove; A temperature sensing element is disposed close to the thin-film heating element; A flexible circuit board is provided, which surrounds the thin-film heating element and the temperature sensing element is disposed on the flexible circuit board. The thin-film heating element and the temperature sensing element are electrically connected to the flexible circuit board.

2. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 1, characterized in that, The thin-film heating element is attached to the back of the heat dissipation base with high-temperature resistant thermally conductive adhesive, and the thin-film heating element is pressed against the bottom of the mounting groove through the high-temperature resistant thermally conductive adhesive.

3. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 1, characterized in that, Through holes are formed on the flexible circuit board, and the thin-film heating element is disposed in the through holes. The shape of the through holes is adapted to the shape of the thin-film heating element, so that the side of the thin-film heating element is in close contact with the hole wall of the through holes.

4. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 3, characterized in that, The heat dissipation base is provided with a sliding groove, and the side of the flexible circuit board is slidably engaged with the sliding groove. When the flexible circuit board is slidably fixed to the heat dissipation base, the thin film heating element is located in the through hole.

5. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 1, characterized in that, The temperature control heating assembly includes two temperature sensing elements. The flexible circuit board is provided with two slots, and the temperature sensing elements are embedded in the slots in a one-to-one correspondence. The two temperature sensing elements are respectively located on both sides of the thin film heating element.

6. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to any one of claims 1 to 4, characterized in that, The material of the thin-film heating element includes polyimide.

7. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 1, characterized in that, Also includes: A glass slide is located on the front side of the heat dissipation base away from the thin-film heating element. The thin-film heating element and the flexible circuit board are located on the back side of the heat dissipation base away from the glass slide. The glass slide and the temperature control heating assembly are arranged in a one-to-one correspondence. The temperature control heating assembly is used to heat the glass slide.

8. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 7, characterized in that, The glass slide is in close contact with the front side of the heat dissipation base; The glass slide, the heat dissipation base, and the thin-film heating element are stacked vertically, and the projection of the heat dissipation base along the vertical direction covers the projection of the glass slide along the vertical direction.

9. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 8, characterized in that, The projection of the glass slide along the vertical direction covers the projection of the temperature sensing element along the vertical direction.

10. The multi-point temperature control sensing and novel composite membrane heating device for the immunohistochemical staining system according to claim 7, characterized in that, It also includes a control unit, which outputs a PWM dot matrix signal to control the operation of the thin-film heating element through the flexible circuit board, so as to control the heating temperature of the temperature-controlled heating assembly within the range of ±0.5℃ of the set temperature.

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