An auxiliary device for debugging packaging modules

Abstract

This utility model relates to the field of electronic packaging and testing, and discloses an auxiliary device for debugging packaging modules. The auxiliary device for debugging packaging modules includes: a pressing device, a test base, and a printed circuit board; the printed circuit board is fixedly connected to the test base; the pressing device is detachably connected to the test base; the packaging module to be tested is placed between the pressing device and the test base; the pressing device has a pressing component inside for pressing the packaging module to be tested tightly against the test base. Because the packaging module to be tested is fixed by the pressing device and tightly fitted against the test base, it eliminates the need for welding during testing, effectively reducing the number of manual soldering operations. This significantly reduces the frequency of high-temperature exposure to the motherboard (PCB) and module, extending the component's lifespan and effectively avoiding the costs of repeated procurement and replacement due to equipment damage.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging and testing, and in particular to an auxiliary device for debugging packaging modules. Background Technology

[0002] LGA stands for Land Grid Array, a type of electronic component package. LGA modules are electronic component modules that use this packaging method. A key feature of LGA modules is the absence of traditional pins on the bottom; instead, they have regularly arranged metal pads that make contact with corresponding pads on the motherboard (PCB) to achieve electrical connections. LGA modules have a wide range of applications, commonly found in consumer electronics, such as processor modules in smartphones and tablets. These processors utilize LGA packaging to achieve stable circuit connections within a limited space, meeting the demands for miniaturization and high performance. In the computer field, LGA modules are also used in some chipset modules on motherboards (PCBs) and core functional modules in small industrial computers, facilitating signal transmission within a compact structure. Furthermore, LGA modules are widely used in medical electronic devices, portable testing instruments, and other applications where size and stability are critical, due to their packaging advantages.

[0003] However, in actual debugging, cross-module testing is often required to pinpoint the problem when issues arise. In related technologies, the common procedure for conducting such experiments is to first desolder and remove the old module from the motherboard (PCB), and then solder the new module onto the motherboard (PCB). During cross-module verification, LGA module verification presents significant operational challenges: the LGA module's pads are primarily located on the bottom side of the motherboard (PCB), meaning that the module must be soldered onto the motherboard (PCB) before any adjustments can be made. Furthermore, the LGA module's large size and rapid heat dissipation necessitate high-temperature soldering, significantly increasing the difficulty of the soldering process. Repeated high temperatures during multiple soldering operations pose a significant risk of damaging the motherboard (PCB), which not only affects the normal function of the entire device but also increases repair and replacement costs. Furthermore, modules removed from the soldering process are often unusable, leading to unnecessary waste of module resources and contributing to module misuse. This violates the principle of efficient resource utilization and indirectly increases overall operation and debugging costs. Moreover, many interfaces on the motherboard (PCB), such as USB and LAN ports, are made of plastic. Under the high temperatures of soldering, these plastic interfaces are easily damaged by heat, further increasing operational risks and costs. Therefore, an auxiliary device for debugging packaged modules is urgently needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide an auxiliary device for debugging packaged modules, which can effectively reduce the number of manual soldering operations, improve debugging efficiency, reduce the risk of damage to the motherboard (PCB board) and module caused by repeated high-temperature soldering of the module, thereby reducing debugging costs.

[0005] To address the aforementioned technical problems, this utility model provides an auxiliary device for debugging a packaged module, comprising: a pressing device, a test base, and a printed circuit board; the printed circuit board is fixedly connected to the test base; the pressing device is detachably connected to the test base; a packaged module to be tested is disposed between the pressing device and the test base; the pressing device has a pressing component inside for pressing the packaged module to be tested tightly against the test base.

[0006] Compared to existing technologies, this invention eliminates the need for welding during testing because the packaged module under test is fixed by the pressing device and tightly fitted to the test base. This significantly reduces the number of manual welding operations, directly lowering the reliance on operator welding skills and minimizing welding quality instability caused by variations in manual operation. It also drastically shortens the welding time during each debugging session. Furthermore, reducing the number of welding operations significantly reduces the frequency of high-temperature exposure to the motherboard (PCB) and module, extending component lifespan and effectively avoiding the hassle of repeated procurement and replacement due to equipment damage. This reduces unnecessary resource waste and costs associated with replacing damaged components. The improved debugging efficiency also shortens the time spent on manual labor, indirectly reducing labor costs.

[0007] In addition, the pressing assembly includes an elastic element and a pressing baffle connected to the elastic element; the pressing baffle is arranged parallel to the printed circuit board.

[0008] In addition, the pressing baffle is detachably connected to the elastic element.

[0009] In addition, the size of the pressing baffle is the same as the size of the packaged module under test.

[0010] In addition, the pressing device is provided with a pressing key on the outside for restricting the movement of the pressing assembly; the pressing key is connected to the elastic element through the housing of the pressing device.

[0011] In addition, the pressing device includes a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, and a top wall that are connected to each other in sequence; the first sidewall is opposite to the third sidewall; the second sidewall is opposite to the fourth sidewall; the top wall is connected to the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall to form a hollow structure without a bottom surface; the top wall includes a control area; the elastic element is connected to the inner side of the control area and is disposed between the hollow structures.

[0012] In addition, the press button is connected to the outside of the control area.

[0013] In addition, the test base is provided with a limiting groove for restricting the pressing device.

[0014] In addition, the number of the limiting grooves is 4; the bottom end of the pressing device includes a support foot corresponding to the limiting groove, and the number of the support foot is the same as the number of the limiting grooves.

[0015] In addition, the elastic element is a metal elastic spring. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an auxiliary device for debugging a packaging module provided in one embodiment of the present invention.

[0017] In the diagram: 1-Printed circuit board; 201-Elastic element; 202-Press baffle; 203-Press button; 204-Control area; 205-Support foot; 3-Test base; 301-Limiting groove; 4-Package module under test. Detailed Implementation

[0018] In actual debugging, cross-module testing is often required to pinpoint the root cause of problems. A common procedure for this type of testing is to first desolder and remove the old module from the motherboard (PCB), and then solder the new module onto the motherboard (PCB). However, LGA module verification presents significant operational challenges: the LGA module pads are primarily located on the bottom side of the motherboard (PCB), meaning that the module must be soldered onto the motherboard (PCB) before any adjustments can be made. Furthermore, the large size and rapid heat dissipation of LGA modules necessitate high-temperature soldering, significantly increasing the difficulty of the soldering process. Repeated high temperatures during multiple soldering operations pose a significant risk of damaging the motherboard (PCB), which not only affects the overall functionality of the device but also increases repair and replacement costs. Furthermore, modules removed from the soldering process are often unusable, leading to unnecessary waste of module resources and contributing to module misuse. This violates the principle of efficient resource utilization and indirectly increases overall operation and debugging costs. Moreover, many interfaces on the motherboard (PCB), such as USB and LAN ports, are made of plastic. Under the high temperatures of soldering, these plastic interfaces are easily damaged by heat, further increasing operational risks and costs. Therefore, an auxiliary device for debugging packaged modules is urgently needed to address these issues.

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0020] One embodiment of this utility model relates to an auxiliary device for debugging a packaged module. For example... Figure 1As shown. The auxiliary device for debugging the packaging module includes: a pressing device, a test base 3 and a printed circuit board 1; the printed circuit board 1 is fixedly connected to the test base 3; the pressing device is detachably connected to the test base 3; the packaging module 4 to be tested is placed between the pressing device and the test base 3; the pressing device is equipped with a pressing component inside for pressing the packaging module 4 to be tested and the test base 3 tightly together.

[0021] In some embodiments, the pressing assembly includes an elastic element 201 and a pressing baffle 202 connected to the elastic element 201; the pressing baffle 202 is arranged parallel to the printed circuit board 1. By arranging the baffle parallel to the printed circuit board 1, a better and more uniform contact can be achieved with the pins of the test base 3 when the packaging module is pressed and attached to the test base 3.

[0022] In some embodiments, the elastic element 201 is a metal elastic spring. It should be noted that the elastic element 201 can be made of other elastic materials, as long as it is ensured that the elastic element 201 can undergo elastic deformation and generate a certain elastic force in the longitudinal direction due to compression. This utility model does not impose any limitations on this.

[0023] In some embodiments, the pressing baffle 202 is detachably connected to the elastic element 201. Specifically, the elastic element 201 and the pressing baffle 202 can be detachably connected through a limiting buckle or similar means; the pressing baffle 202 is made of an insulating material. It is worth noting that the pressing baffle 202 can be adjusted to the actual size of the packaged module 4 under test, and its material can be changed according to testing requirements, such as plastic, ceramic, or resin, thereby expanding the applicability of the auxiliary device for packaged module debugging. Using an insulating material to press the packaged module effectively prevents conductivity caused by contact or other reasons during the auxiliary device's debugging process, thus improving the safety of the testing procedure.

[0024] In some embodiments, the size of the pressing baffle 202 is the same as the size of the packaged module 4 under test. Having the pressing baffle 202 the same size as the packaged module 4 under test ensures that the packaged module is pressed evenly and completely, achieving good contact and avoiding inaccurate test results due to poor contact. Furthermore, to ensure effective contact during testing, the size of the pressing baffle 202 can be slightly larger than the size of the packaged module 4 under test; this is not a limitation of the present invention.

[0025] In some embodiments, the pressing device is provided with a pressing key 203 on its exterior for limiting the movement of the pressing component; the pressing key 203 is connected to the elastic element 201 through the housing of the pressing device.

[0026] In some embodiments, the pressing device includes a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, and a top wall that are sequentially connected to each other; the first sidewall is opposite to the third sidewall; the second sidewall is opposite to the fourth sidewall; the top wall is connected to the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall to form a hollow structure without a bottom surface; the top wall includes a control area 204; an elastic element 201 is connected to the inner side of the control area 204 and is disposed between the hollow structures.

[0027] In some embodiments, the press button 203 is connected to the outside of the control area 204. Specifically, during the process of the auxiliary device for packaging module debugging pressing the packaging module 4 under test, after the press baffle 202 contacts the packaging module 4 under test, the elastic element 201 will move in the opposite direction to the printed circuit board 1 due to the longitudinal force; by pressing the press button 203, the elastic element 201 is squeezed to apply pressure to the packaging module 4 under test in the direction of the printed circuit board 1, so that the packaging module 4 under test can fit more tightly against the pins of the printed circuit board 1, thereby ensuring good contact during the test and avoiding inaccurate test results caused by poor contact.

[0028] In addition, to avoid excessive pressure applied to the packaging module 4 under test during the pressing process of the elastic element 201, which could lead to physical structural damage to the packaging module, the elastic coefficient and length of the elastic element 201 can be adjusted adaptively according to the actual testing requirements. This utility model does not impose any limitations on this.

[0029] In some embodiments, the test base 3 is provided with a limiting groove 301 for limiting the pressing device.

[0030] In some embodiments, the number of limiting grooves 301 is four; the bottom end of the pressing device includes support feet 205 corresponding to the limiting grooves 301, and the number of support feet 205 is the same as the number of limiting grooves 301, and the structural shape and size of the support feet 205 are the same as those of the limiting grooves 301. In some specific embodiments, the structural shape of the support feet 205 and the structural shape of the limiting grooves 301 are both cylindrical. It should be noted that the number and structural shape of the limiting grooves 301, as well as the number and structural shape of the support feet 205, can be adaptively adjusted and changed according to actual testing requirements, and this utility model does not impose any limitations on them.

[0031] In addition, support feet 205 are respectively disposed at the bottom ends of two opposite side walls of the pressing device. For example, support feet 205 are respectively disposed at the bottom ends of the first side wall and the third side wall, and two support feet 205 are disposed on each side wall; or, support feet 205 are respectively disposed at the bottom ends of the second side wall and the fourth side wall, and two support feet 205 are disposed on each side wall. It should be noted that the positions of the support feet 205 and the limiting grooves 301 can be adjusted according to actual testing requirements, as long as the support feet 205 can stably support the main body structure of the pressing device and have corresponding limiting grooves 301 with the test base 3. This utility model does not impose any limitations on this.

[0032] It should be noted that the embodiments of this utility model are not only applicable to the testing scenarios of LGA modules, but also to the testing scenarios of other packaged modules. Those skilled in the art will understand that the embodiments of this utility model can achieve a stable connection between the packaged module under test 4 and the printed circuit board 1 through physical compression during the testing process of the packaged module, thereby enabling testing of the packaged module under test 4 and reducing damage to surrounding components caused by the soldering process. The same structure can be applied to any packaged module that can be connected by compression, and this utility model does not impose any limitations on this.

[0033] Compared with the prior art, this utility model embodiment, because the packaged module 4 under test is fixed by the pressing device and tightly attached to the test base 3, eliminates the need for fixing and testing through welding during the testing process. This effectively reduces the number of manual welding operations, which not only directly reduces the high frequency of reliance on the welding skills of operators and reduces the instability of welding quality that may be caused by differences in manual operation, but also significantly shortens the time spent on welding during a single debugging process. Furthermore, after reducing the number of welding operations, the frequency of the motherboard (PCB board) and module being affected by high temperature is greatly reduced, and the service life of components is extended. This effectively avoids the trouble of repeated procurement and replacement due to equipment damage, reduces unnecessary resource waste and costs incurred from replacing damaged parts, and at the same time, the improved debugging efficiency also shortens the time spent on manual labor, indirectly reducing labor costs.

[0034] The structural divisions in the above embodiments are only for clarity of description. In practice, they can be merged into one structure or some structures can be split into multiple structures. As long as they include the same connection relationship, they are all within the protection scope of this patent. Adding insignificant modifications or introducing insignificant designs to the structure, but without changing its core structural design, are also within the protection scope of this patent.

[0035] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0036] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0037] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0038] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. An auxiliary device for debugging a packaged module, characterized in that, Includes: a pressing device, a test base (3), and a printed circuit board (1); The printed circuit board (1) is fixedly connected to the test base (3); The pressing device is detachably connected to the test base (3); The packaging module (4) to be tested is disposed between the pressing device and the test base (3); The pressing device is equipped with a pressing component inside for pressing the packaged module (4) under test and the test base (3) tightly together.

2. The auxiliary device for debugging the packaging module according to claim 1, characterized in that, The pressing assembly includes an elastic element (201) and a pressing baffle (202) connected to the elastic element (201). The pressing baffle (202) is arranged parallel to the printed circuit board (1).

3. The auxiliary device for debugging the packaging module according to claim 2, characterized in that, The pressing baffle (202) is detachably connected to the elastic element (201).

4. The auxiliary device for debugging the packaging module according to claim 2, characterized in that, The size of the pressing baffle (202) is the same as the size of the packaged module (4) to be tested.

5. The auxiliary device for debugging the packaging module according to claim 2, characterized in that, The pressing device is provided with a pressing key (203) on its exterior to restrict the movement of the pressing component; The pressing key (203) is connected to the elastic element (201) through the housing of the pressing device.

6. The auxiliary device for debugging the packaging module according to claim 5, characterized in that, The pressing device includes a first side wall, a second side wall, a third side wall, a fourth side wall, and a top wall that are connected to each other in sequence; The first sidewall is opposite to the third sidewall; The second sidewall is opposite to the fourth sidewall; The top wall is connected to the first side wall, the second side wall, the third side wall and the fourth side wall to form a hollow structure without a bottom surface; The top wall includes a control area (204); The elastic element (201) is connected to the inner side of the control area (204) and is disposed between the hollow structures.

7. The auxiliary device for debugging the packaging module according to claim 6, characterized in that, The press button (203) is connected to the outside of the control area (204).

8. The auxiliary device for debugging the packaging module according to any one of claims 6 to 7, characterized in that, The test base (3) is provided with a limiting groove (301) for limiting the pressing device.

9. The auxiliary device for debugging the packaging module according to claim 8, characterized in that, The number of the limiting grooves (301) is 4; The bottom end of the pressing device includes a support foot (205) corresponding to the limiting groove (301), and the number of the support feet (205) is the same as the number of the limiting groove (301).

10. The auxiliary device for debugging the packaging module according to any one of claims 2 to 7, characterized in that, The elastic element (201) is a metal elastic spring.

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