Solder joint inspection device

Abstract

The utility model relates to a kind of welding point detection devices, for the height detection of the welding point of electronic pen, including pedestal, mounting platform and detection mechanism, pedestal is used to place electronic pen;Mounting platform is slidably connected in pedestal along first direction, at least one pressing part and at least one detection piece are provided on mounting platform, pressing part is used to press fit electronic pen and can be slidably connected in mounting platform along first direction, detection piece is slidably connected in mounting platform along first direction, and the end of detection piece is used to fit welding point;Detection mechanism is set to mounting platform, when pressing part press fits electronic pen and detection piece moves preset distance relative to mounting platform, detection piece and detection mechanism are connected, the welding point detection device can be positioned to electronic pen when the height of the welding point of electronic pen is measured, to improve the detection accuracy of electronic pen welding point height.

Description

Technical Field

[0001] This utility model relates to the field of electronic pen technology, specifically to a solder joint detection device. Background Technology

[0002] The printed circuit boards on existing electronic pen motherboards typically require soldering electrodes to ensure the pen can be powered on and used properly. However, during the electrode soldering process, solder joints often become excessively high, which can easily cause interference when assembling the upper and lower supports of the electronic pen. Furthermore, if the electronic pen is not positioned correctly or shifts during the measurement process, the solder joint height measurement results will also be affected. Therefore, how to stably position the electronic pen when measuring the height of its solder joints is a technical problem that urgently needs to be solved. Utility Model Content

[0003] To address the aforementioned technical problems, this disclosure provides a solder joint detection device that can stably position the electronic pen when measuring the height of its solder joints, thereby improving the accuracy of solder joint height detection and at least partially solving the aforementioned technical problems.

[0004] This disclosure provides a solder joint detection device for detecting the height of solder joints of an electronic pen, comprising: a base for placing the electronic pen; a mounting platform slidably connected to the base along a first direction, the mounting platform having at least one clamping member and at least one detection member, the clamping member for pressing the electronic pen and being slidably connected to the mounting platform along the first direction, the detection member being slidably connected to the mounting platform along the first direction, and the end of the detection member being used to abut the solder joint; and a detection mechanism disposed on the mounting platform, wherein the clamping member presses the electronic pen, and when the detection member moves a preset distance relative to the mounting platform, the detection member communicates with the detection mechanism.

[0005] Optionally, the detection mechanism includes: a mounting shell assembly connected to the mounting platform, the mounting shell assembly having at least one first mounting hole extending along the first direction; and a conductor passing through the first mounting hole and movable relative to the mounting shell assembly along the first direction, the conductor being disposed opposite to the detection element.

[0006] Optionally, the number of clamping elements is two; and / or the number of detection elements is two; the number of conducting elements corresponds one-to-one with the number of detection elements.

[0007] Optionally, the clamping member has an elastic element at one end near the electronic pen; and / or, the detection member has an elastic element at one end near the electronic pen.

[0008] Optionally, the height of the lowest point of the clamping member along the first direction is not higher than the height of the lowest point of the detection member along the first direction.

[0009] Optionally, the mounting housing assembly includes: a first housing connected to the mounting platform; and a second housing connected to the first housing via an adjusting member, wherein the first mounting hole is provided in the second housing, and the second housing can move closer to or further away from the first housing along the first direction via the adjusting member.

[0010] Optionally, the mounting housing assembly further includes a guide buffer connected to the first housing and the second housing, the guide buffer being used to provide a force to the second housing toward the first housing.

[0011] Optionally, the solder joint detection device further includes a housing connected to the mounting platform and at least partially shielding the mounting housing assembly.

[0012] Optionally, the mounting platform is provided with a guide hole, and the weld point detection device further includes a guide rail connected to the base and passing through the guide hole, and the mounting platform slides along the extension direction of the guide rail through the guide hole.

[0013] Optionally, the solder joint detection device further includes a control handle connected to the mounting platform, and a reset member connected to the guide rail and located between the mounting platform and the base. The control handle can drive the mounting platform to slide along the extension direction of the guide rail, and the reset member can drive the mounting platform to slide and reset along the extension direction of the guide rail.

[0014] Through the above technical solution, namely the solder joint detection device provided in this disclosure, when detecting the solder joint height of an electronic pen, the electronic pen can first be placed on the base, and the preset distance between the detection component and the detection mechanism can be initially adjusted. This preset distance can be the distance between the highest point of the solder joint and the surface of the electronic pen's motherboard when the solder joint height meets the standard. Then, the mounting platform is moved along the first direction, so that the clamping component first presses against the surface of the electronic pen's motherboard, thus achieving the initial positioning of the electronic pen. The mounting platform continues to move along the first direction. Since the clamping component can slide relative to the mounting platform in the first direction and under its own weight, one end of the clamping component will always press against the electronic pen. When the solder joint on the surface of the electronic pen is attached to the end of the detection component, the detection component is blocked by the solder joint. At this time, both the clamping component and the detection component are in contact with the electronic pen simultaneously. The mounting platform continues to move downward. Since the detection component can move relative to the mounting platform, As the mounting platform continues to move downwards, the testing component tends to move upwards relative to the mounting platform. Once the testing component is in contact with the testing mechanism, it is determined whether the distance the mounting platform has traveled from the position where the clamping component presses against the motherboard surface of the electronic pen to the distance when the testing component is in contact with the testing mechanism meets the preset distance. If the two match, it proves that the solder joint height of the electronic pen meets the standard. If the actual travel distance is less than the preset distance, it proves that the solder joint height of the electronic pen is too high. If the actual travel distance is greater than the preset distance, it proves that the solder joint height of the electronic pen is too low. When testing the height of the electronic pen solder joints using the aforementioned solder joint testing device, the clamping component can press the electronic pen in advance to stabilize its position. This reduces the positional deviation caused by shaking or lifting of the electronic pen during solder joint testing, thereby improving the accuracy of the electronic pen solder joint height testing results. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the weld joint detection device provided in an exemplary embodiment of this disclosure;

[0017] Figure 2 This is a schematic diagram of the weld joint detection device provided in an exemplary embodiment of this disclosure, excluding the outer casing;

[0018] Figure 3 yes Figure 2 A magnified view of a portion of position A in the middle;

[0019] Figure 4This is a schematic diagram of a portion of the internal structure of the weld joint detection device provided in an exemplary embodiment of this disclosure.

[0020] Explanation of reference numerals in the attached figures:

[0021] 1. Base;

[0022] 2. Mounting platform; 210. Clamping component; 211. Elastic component; 220. Testing component; 230. Guide hole;

[0023] 3. Testing mechanism; 310. Mounting housing assembly; 311. First housing; 312. Second housing; 313. First mounting hole; 314. Adjusting component; 3141. First screw; 3142. Second screw; 315. Guide buffer component; 320. Conductor component;

[0024] 4. Outer shell;

[0025] 5. Control handle; 501. Third hinge point; 510. First link; 511. First hinge point; 520. Second link; 521. Second hinge point;

[0026] 6. Reset component. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0028] In related technologies, the printed circuit board (PCB) on the motherboard of an electronic pen usually needs to have its electrodes (PCBA electrodes) soldered to ensure that the electronic pen can be powered on and used normally. However, during the electrode soldering process, the solder joint height often exceeds the standard value, which can easily cause interference when assembling the upper bracket and lower bracket (i.e., the shell fitted on the outside of the electronic pen motherboard), resulting in the electronic pen failing to assemble properly. If the electronic pen is not placed correctly when measuring the solder joint height, or if the electronic pen shifts or tilts during the measurement process, it will also affect the detection results of the solder joint height. Therefore, how to stably position the electronic pen when measuring the height of the solder joints is a technical problem that urgently needs to be solved.

[0029] Based on the above-mentioned technical problems, this embodiment provides a solder joint detection device, referring to... Figures 1 to 4As shown, the solder joint detection device includes a base 1, a mounting platform 2, and a detection mechanism 3. The base 1 is used to place an electronic pen. The mounting platform 2 is slidably connected to the base 1 along a first direction. The mounting platform 2 is provided with at least one clamping member 210 and at least one detection member 220. The clamping member 210 is used to press the electronic pen and can be slidably connected to the mounting platform 2 along the first direction. The detection member 220 is slidably connected to the mounting platform 2 along the first direction (the direction indicated by the X arrow in the figure can be the first direction). The end of the detection member 220 is used to fit the solder joint. The detection mechanism 3 is disposed on the mounting platform 2. The clamping member 210 presses the electronic pen, and when the detection member 220 moves a preset distance relative to the mounting platform 2, the detection member 220 is connected to the detection mechanism 3.

[0030] Through the above technical solution, namely the solder joint detection device provided in this embodiment, when detecting the solder joint height of an electronic pen, the electronic pen can first be placed on the base 1, and the preset distance between the detection component 220 and the detection mechanism 3 can be initially adjusted. This preset distance can be the distance between the highest point of the solder joint and the surface of the electronic pen's motherboard when the solder joint height meets the standard. Then, the mounting platform 2 is moved along the first direction, so that the clamping component 210 is pressed against the surface of the electronic pen's motherboard to achieve the initial positioning of the electronic pen. The mounting platform 2 continues to move along the first direction. Since the clamping component 210 can slide relative to the mounting platform 2 in the first direction and under its own weight, one end of the clamping component 210 will always press against the electronic pen. When the solder joint on the surface of the electronic pen is attached to the end of the detection component 220, the detection component 220 is blocked by the solder joint. At this time, both the clamping component 210 and the detection component 220 are in contact with the electronic pen at the same time. The mounting platform 2 continues to move down. Since the detection component 220 can slide relative to the mounting platform 2 in the first direction, the clamping component 210 is pressed against the surface of the electronic pen's motherboard to achieve the initial positioning of the electronic pen. As the mounting platform 2 moves, the detection component 220 tends to move upward relative to the mounting platform 2 during the downward movement of the mounting platform 2. When the detection component 220 is in contact with the detection mechanism 3, it is determined whether the distance the mounting platform 2 moves from the position where the clamping component 210 presses against the motherboard surface of the electronic pen to the distance when the detection component 220 is in contact with the detection mechanism 3 meets the preset distance. If the two meet, it proves that the solder joint height of the electronic pen meets the standard. If the actual moving distance is less than the preset distance, it proves that the solder joint height of the electronic pen is too high. If the actual moving distance is greater than the preset distance, it proves that the solder joint height of the electronic pen is too low. When the height of the electronic pen solder joint is detected by the above-mentioned solder joint detection device, the clamping component 210 can press the electronic pen in advance to stabilize the electronic pen. This can reduce the positional deviation caused by shaking or lifting of the electronic pen during the solder joint test, thereby improving the accuracy of the electronic pen solder joint height detection results.

[0031] It should be noted that the preset distance mentioned above is not limited to a standard value. Since the height of the solder joints inevitably has errors during the soldering process, the preset distance can also be a standard range. Correspondingly, the actual moving distance of the mounting stage 2 can also be a range that conforms to the solder joint height error range. That is, as long as the actual moving distance of the mounting stage 2 meets the range, it can be proven that the height of the solder joints of the electronic pen meets the standard. Under this predetermined range condition, it is easier to determine whether the height of the solder joints of the electronic pen meets the standard, which can improve the testing efficiency.

[0032] Furthermore, in the above embodiments, the detection mechanism 3 can also be constructed as any suitable controller or component. For example, the detection mechanism 3 can be a remote control computer or a PLC, and the detection element 220 can also be any suitable component capable of communicating with the detection mechanism 3, such as... Figure 3 As shown, the detection component 220 can be a probe structure capable of communicating with the detection mechanism 3. That is, when the mounting stage 2 moves along the first direction, the probe structure can contact and communicate with the detection mechanism 3 through the needle structure at one end after the mounting stage 2 has moved a preset distance, and transmit the displacement of the mounting stage 2 to the detection mechanism 3 in the form of an electrical signal, so that the detection mechanism 3 can determine whether the solder joint height of the electronic pen meets the standard. At the same time, the clamping component 210 can also be constructed as a probe structure with the same structure as the detection component 220, that is, as shown in the figure. Figure 3 As shown, during the movement of the clamping member 210 along the first direction with the mounting platform 2, the larger end of the clamping member 210, which is constructed as a probe structure, can be pressed against the motherboard surface of the electronic pen to position and clamp the electronic pen. Alternatively, the clamping member 210 can also be other structures that can be pressed against the motherboard surface of the electronic pen. For example, in an embodiment not shown in the figure, the clamping member 210 can also be a pressure plate or a positioning pin, etc. The end face of the pressure plate or the end face of the positioning pin can be directly attached to the motherboard surface of the electronic pen, which can also achieve the positioning and clamping of the electronic pen. This embodiment does not specifically limit this.

[0033] In some implementations, reference Figures 1 to 4 As shown, the detection mechanism 3 includes a mounting housing assembly 310 and a guide member 320. The mounting housing assembly 310 is connected to the mounting platform 2 and has at least one first mounting hole 313 extending along a first direction. The guide member 320 passes through the first mounting hole 313 and is movable relative to the mounting housing assembly 310 along the first direction. The guide member 320 is disposed opposite to the detection member 220. In this arrangement, the guide member 320 can be used to make contact with the detection member 220 to determine whether the actual moving distance of the mounting platform 2 matches the standard preset distance. Figure 3As shown, the conductive element 320 passes through the first mounting hole 313 of the mounting housing assembly 310. Therefore, the first mounting hole 313 of the mounting housing assembly 310 can limit and fix the conductive element 320, resulting in higher connection stability of the conductive element 320 when the mounting housing assembly 310 moves along the first direction with the mounting platform 2, and more accurate results for measuring the solder joint height of the electronic pen. Specifically, as... Figure 3 As shown, the conductive element 320 can also be a probe structure with the same construction as the clamping element 210 and / or the detection element 220. That is, when both the detection element 220 and the conductive element 320 are constructed as probe structures, when the large end of the detection element 220 touches the solder joint of the electronic pen and moves upward relative to the mounting platform 2, the small end of the detection element 220 will touch the large end of the conductive element 320. Both the small end of the detection element 220 and the small end of the conductive element 320 are connected to wires that are electrically connected to the detection mechanism 3. According to the transmission principle of probes and electrical signals, when the detection element 220 touches the conductive element 320, the movement distance of the mounting platform 2 relative to the detection element 220 can be transmitted to the detection mechanism 3 by means of an electrical signal, so that the staff can judge whether the solder joint height of the electronic pen being tested meets the standard through the detection mechanism 3.

[0034] In some implementations, reference Figure 3 As shown, there are two clamping components 210; and / or two detection components 220; the number of conductive components 320 corresponds one-to-one with the number of detection components 220. This arrangement improves the pressing stability of the electronic pen's motherboard with two clamping components 210, further reducing the occurrence of positional shifts such as shaking or tilting of the electronic pen due to external factors during solder joint height testing. Since electronic pens typically have two solder joints, the height of both solder joints can be simultaneously detected by two detection components 220. The positions of the detection components 220 also adapt to the positions of the two solder joints. In this way, the solder joint height can be measured at once, and the result can be obtained immediately, improving testing efficiency. Furthermore, the number of conductive components 320 corresponds one-to-one with the number of detection components 220, meaning each solder joint corresponds to one detection component 220 and one conductive component 320 for measurement. This allows for separate testing of multiple solder joints and improves the accuracy of the height test results for multiple solder joints.

[0035] It should be noted that the number of clamping components 210 and / or detection components 220 is two, which is exemplary. For electronic pens of different specifications with more or fewer solder joints, the number of clamping components 210 and / or detection components 220 can be increased or decreased adaptively. For example, the number of clamping components 210 and / or detection components 220 can be one, three, four or other suitable numbers, as long as the number of detection components 220 is the same as the number of solder joints, and the number of detection components 220 corresponds one-to-one with the number of conductive components 320. This embodiment does not make specific limitations in this regard.

[0036] In some implementations, reference Figures 1 to 4 As shown, the clamping member 210 has an elastic element 211 at one end near the electronic pen; and / or, the detection member 220 has an elastic element 211 at one end near the electronic pen. With this arrangement, the elastic element 211 can make soft contact when the larger end of the clamping member 210 and / or the detection member 220 contacts the electronic pen and / or the solder joint of the electronic pen. This reduces or avoids the possibility of the clamping member 210 making hard contact with the surface of the electronic pen, which could scratch the motherboard. Similarly, it reduces or avoids the possibility of the detection member 220 making hard contact with the solder joint of the electronic pen, which could cause friction on the solder joint. This avoids problems such as poor solder joint contact or affecting the accuracy of the solder joint height test results, thus better protecting the electronic pen under test and improving measurement accuracy. Considering that the elastic element 211 may cause inaccurate solder joint height testing due to its own elastic deformation when it comes into contact with the solder joint of the electronic pen, in this embodiment, when the standard solder joint height is within a reasonable range, the solder joint height test can be guaranteed to be accurate as long as the deformation of the elastic element 211 when it is in contact with the solder joint is not greater than the difference between the maximum and minimum values ​​of the solder joint height.

[0037] It should be further explained that the elastic element 211 can be any suitable structure capable of having a certain elastic deformation, for example... Figure 3 As shown, the elastic element 211 may be a rubber pad connected to the end of the clamping element 210 and / or the detection element 220, or it may be any other suitable material such as plastic, composite material, etc. As more embodiments are readily apparent to those skilled in the art, they will not be described in detail here.

[0038] In some implementations, reference Figure 3As shown, the height of the lowest point of the clamping member 210 along the first direction is not higher than the height of the lowest point of the detection member 220 along the first direction. In this way, the lowest point of the clamping member 210 is always lower than the lowest point of the detection member 220 in the first direction. With this arrangement, when the solder joint height of the electronic pen is detected by the solder joint detection device, the lowest point of the clamping member 210 always contacts the surface of the electronic pen first to fix and position it. Then, as the mounting platform 2 moves downward, the lowest point of the detection member 220 contacts the solder joint—a detection step of positioning before measurement. This reduces or avoids measuring the solder joint height before the electronic pen is properly positioned, thereby improving the accuracy of the solder joint height measurement results.

[0039] In some implementations, reference Figures 1 to 4 As shown, the mounting housing assembly 310 includes a first housing 311 and a second housing 312. The first housing 311 is connected to the mounting platform 2; the second housing 312 is connected to the first housing 311 via an adjusting member 314. A first mounting hole 313 is provided in the second housing 312, and the second housing 312 can move closer to or further away from the first housing 311 in a first direction via the adjusting member 314. With this arrangement, the position of the electronic pen motherboard relative to the height of the solder joints differs for different types of electronic pens. The relative positions of the first housing 311 and the second housing 312 can be adjusted via the adjusting member 314 to appropriately adjust for the different testing standards of the solder joints of different types of electronic pens. Figure 3 As shown, when the second housing 312 moves away from the first housing 311, that is, the height of the second housing 312 in the first direction increases, the solder joint height of the electronic pen with higher solder joints can be measured. Conversely, when the second housing 312 moves closer to the first housing 311, that is, the height of the second housing 312 in the first direction decreases, the solder joint height of the electronic pen with lower solder joints can be measured. Furthermore, the relative position movement of the two housings can be achieved by adjusting the adjusting member 314, which is convenient, quick, and saves time and effort.

[0040] It should be noted that the adjusting member 314 described in the above embodiments can be any suitable structure capable of adjusting the relative position of the first housing 311 and the second housing 312. For example, the adjusting member 314 can be a double-threaded screw passing through the first housing 311 and the second housing 312, that is, by rotating the double-threaded screw forward or backward, the first housing 311 and the second housing 312 can be moved closer to each other or further away from each other. Alternatively, it can be as follows: Figure 3 and Figure 4As shown, the adjusting member 314 includes a first screw 3141 that passes through the second housing 312 and is threaded to the first housing 311, and a second screw 3142 that passes through and is threaded to the second housing 312 with one end abutting against the first housing 311. In this arrangement, when it is necessary for the second housing 312 to move away from the first housing 311, the first screw 3141 can be rotated forward to reduce the depth of the first screw 3141 threaded into the first housing 311, thereby driving the second housing 312 to move along... Figure 4 The screw 3142 moves upwards in the direction of the first housing 311. Once in position, the second screw 3142 can be rotated in the forward direction so that its end face abuts against the top surface of the first housing 311 again. Conversely, when the second housing 312 needs to be closer to the first housing 311, the second screw 3142 can be rotated in the reverse direction until its end face is no longer against the top surface of the first housing 311, leaving sufficient room for movement. At this point, the first screw 3141 can be rotated in the reverse direction to increase the depth of its threaded connection to the first housing 311, thereby driving the second housing 312 along the first housing 311. Figure 4 Move the screw downwards until it is in place, then rotate the second screw 3142 in the forward direction until its end face abuts against the top surface of the first housing 311, thus achieving fixation. As can be seen from the above solution, the second screw 3142 can play a role in limiting and stabilizing the position in the above embodiment.

[0041] In some implementations, reference Figures 1 to 4 As shown, the mounting housing assembly 310 also includes a guide buffer 315 connected to the first housing 311 and the second housing 312. The guide buffer 315 provides a force to the second housing 312 toward the first housing 311. With this arrangement, the guide buffer 315 can act as a guide and buffer during the movement of the second housing 312 relative to the first housing 311, thereby reducing the possibility of the second housing 312 rotating horizontally and causing displacement of the conductor 320. This ensures that the detection element 220 can stably make contact with the conductor 320. Furthermore, the buffering effect can reduce or prevent the second housing 312 from colliding with the first housing 311 as it approaches it, improving the stability of the connection between the second housing 312 and the first housing 311.

[0042] It should be noted that the guide buffer 315 mentioned in the above embodiments can be any suitable structural component, for example, referring to Figure 3 and Figure 4As shown, the guide buffer 315 may include a guide post that passes through the second housing 312 and is partially inserted into the first housing 311, and a helical spring sleeved on the outer wall of the guide post. There are two guide buffers 315, which are arranged at intervals. In this way, the two guide posts can limit the second housing 312 in the first direction and prevent the second housing 312 from rotating in the horizontal direction. The two helical springs can provide cushioning for the second housing 312.

[0043] In some implementations, reference Figure 1 As shown, the solder joint detection device also includes a housing 4, which is connected to the mounting platform 2 and at least partially shields the mounting housing assembly 310. This arrangement protects the mounting housing assembly 310 inside the device, or further shields the detection element 220 and the conductive element 320, preventing internal structural components from being contaminated by dust and affected by external impacts, thus improving the safety and stability of the solder joint height measurement process and the accuracy of the solder joint height measurement.

[0044] In some implementations, reference Figure 1 and Figure 4 As shown, the mounting platform 2 is provided with a guide hole 230. The weld joint detection device also includes a guide rail 110 connected to the base 1 and passing through the guide hole 230. The mounting platform 2 slides along the extension direction of the guide rail 110 via the guide hole 230. In this way, through the cooperation of the guide rail 110 and the guide hole 230, the mounting platform 2 can be moved more conveniently and quickly along the first direction, and reference... Figure 1 As shown, in order to reduce or prevent the mounting platform 2 from rotating relative to the horizontal direction when moving along the first direction, two guide holes 230 can be provided on the surface of the mounting platform 2. Correspondingly, the base 1 is also provided with two guide rails 110 that pass through the guide holes 230 one by one. When the two guide rails 110 and the two guide holes 230 are engaged one by one, the mounting platform 2 will be limited by the two guide rails 110, that is, it can only move back and forth along the first direction, which improves the stability of the mounting platform 2 during the movement process.

[0045] It should be noted that the number of guide holes 230 and guide rails 110 is two each, which is exemplary. In embodiments not shown in the figure, the number of guide holes 230 and guide rails 110 can also be two or more other suitable numbers. For example, the number of guide holes 230 can be three, four or more, as long as the number of guide holes 230 and guide rails 110 corresponds one-to-one. There is no specific limitation in this regard.

[0046] In some implementations, reference Figures 1 to 4As shown, the solder joint detection device also includes a control handle 5 connected to the mounting platform 2, and a reset member 6 connected to the guide rail 110 and located between the mounting platform 2 and the base 1. The control handle 5 can drive the mounting platform 2 to slide along the extension direction of the guide rail 110, and the reset member 6 can drive the mounting platform 2 to slide and reset along the extension direction of the guide rail 110. In this way, before placing the electronic pen into the base 1, refer to... Figure 1 and Figure 2 As shown, the operator can first grasp the control handle 5 and rotate it around the third hinge point 501. Since the first connecting rod 510 is hinged to the control handle 5 through the first hinge point 511, and one end of the second connecting rod 520 is connected to the mounting platform 2, while the other end is hinged to the first connecting rod 510 through the second hinge point 521, when the control handle 5 is rotated, the hinged first connecting rod 510 will also drive the second connecting rod 520 to move upward, thereby driving the mounting platform 2 to move upward as well, that is, to move upward along the first direction. Figure 1 The control handle 5 corresponds to the detection component 220 below, which is already attached to the solder joint of the electronic pen. When the gripping end of the control handle 5 is perpendicular to the first direction, it means that the mounting platform 2 has moved up to the correct position. Place the electronic pen on the base 1. After the position is initially aligned, hold the control handle 5 and rotate it in the opposite direction. This will cause the control handle 5 to move the mounting platform 2 downward in the first direction. That is, the first connecting rod 510 rotates in the opposite direction around the third hinge point 501. The hinged first connecting rod 510 then drives the second connecting rod 520 to push the mounting platform 2 downward. The mounting platform 2 is moved into position when the detection component 220 is attached to the solder joint of the electronic pen. At this time, the control handle 5 can be finely adjusted to move the mounting platform 2 downward to detect the height of the solder joint of the electronic pen. After the detection is completed, the mounting platform 2 can be reset to the initial position under the action of the reset component 6. That is, after the detection component 220 is no longer attached to the solder joint of the electronic pen, the electronic pen can be taken out.

[0047] It should be noted that, in the above specific embodiments, the operating handle 5 can move the mounting platform 2 in any suitable manner, for example, in Figure 1 and Figure 2 In the example, a linkage assembly (including the first linkage 510 and the second linkage 520) connects the operating handle 5 and the mounting platform 2. That is, as the operating handle 5 rotates, the movement of the linkage assembly drives the mounting platform 2 to reciprocate along the first direction. Furthermore, the reset member 6 can be any structure capable of resetting the mounting platform 2, for example, in... Figure 1 and Figure 4 In the example, the reset element 6 can be a spring sleeved on the outer wall of the guide rail 110, and the two ends of the spring can respectively abut against the bottom surface of the mounting platform 2 and the top surface of the base 1 to elastically reset the mounting platform 2.

[0048] This embodiment exemplarily describes the specific process by which the solder joint detection device performs height detection on the solder joints of an electronic pen, and may include, for example, the following steps.

[0049] By rotating the operating handle 5, the mounting platform 2 is lifted upwards in the first direction. The solder joints of the electronic pen are then placed upwards into the groove of the base 1. The operating handle 5 is rotated in the opposite direction to move the mounting platform 2 downwards in the first direction. During this process, the elastic element 211 on the clamping element 210 first contacts the motherboard surface of the electronic pen. As the mounting platform 2 continues to move downwards, the elastic element 211 on the detection element 220 also contacts the solder joints of the electronic pen. The mounting platform 2 continues to move downwards until the upper end of the detection element 220 abuts against the lower end of the conductive element 320. At this time, the detection element 220 and the conductive element 320 jointly transmit the displacement of the mounting platform 2 in the first direction to the detection mechanism 3. The detection mechanism 3 can then determine whether the solder joint height of the electronic pen meets the standard. After the test is completed, the operating handle 5 is rotated to move the mounting platform 2 upwards in the first direction, and the tested electronic pen can be removed.

[0050] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present embodiments, and such modifications and variations all fall within the scope of protection claimed by the present embodiments.

Claims

1. A solder joint detection device for detecting the height of solder joints in an electronic pen, characterized in that, include: Base (1), for placing the electronic pen; Mounting platform (2) is slidably connected to base (1) along a first direction. Mounting platform (2) is provided with at least one clamping member (210) and at least one detection member (220). The clamping member (210) is used to press the electronic pen and can be slidably connected to mounting platform (2) along the first direction. The detection member (220) is slidably connected to mounting platform (2) along the first direction. The end of the detection member (220) is used to fit the solder joint. as well as The detection mechanism (3) is set on the mounting platform (2). The clamping member (210) presses against the electronic pen, and when the detection member (220) moves a preset distance relative to the mounting platform (2), the detection member (220) is connected to the detection mechanism (3).

2. The weld joint detection device according to claim 1, characterized in that, The testing organization (3) includes: Mounting housing assembly (310) is connected to the mounting platform (2). The mounting housing assembly (310) is provided with at least one first mounting hole (313), which extends along the first direction. A guide (320) is disposed through the first mounting hole (313) and is movable relative to the mounting housing assembly (310) along the first direction. The guide (320) is disposed opposite to the detection element (220).

3. The weld joint detection device according to claim 2, characterized in that, The number of clamping elements (210) is two; and / or, the number of detection elements (220) is two; The number of the conductive element (320) corresponds one-to-one with the number of the detection element (220).

4. The weld joint detection device according to claim 3, characterized in that, The clamping member (210) has an elastic element (211) at one end near the electronic pen; and / or, the detection member (220) has an elastic element (211) at one end near the electronic pen.

5. The weld joint detection device according to claim 4, characterized in that, The height of the lowest point of the clamping member (210) along the first direction is not higher than the height of the lowest point of the detection member (220) along the first direction.

6. The weld joint detection device according to claim 2, characterized in that, The mounting housing assembly (310) includes: The first housing (311) is connected to the mounting platform (2); The second housing (312) is connected to the first housing (311) via an adjusting member (314). The first mounting hole (313) is provided in the second housing (312). The second housing (312) can move closer to or further away from the first housing (311) in the first direction via the adjusting member (314).

7. The weld joint detection device according to claim 6, characterized in that, The mounting housing assembly (310) further includes a guide buffer (315) connected to the first housing (311) and the second housing (312), the guide buffer (315) being used to provide a force to the second housing (312) toward the first housing (311).

8. The weld joint detection device according to any one of claims 4-7, characterized in that, The weld point detection device also includes a housing (4) which is connected to the mounting platform (2) and at least partially shields the mounting housing assembly (310).

9. The weld joint detection device according to claim 1, characterized in that, The mounting platform (2) is provided with a guide hole (230), and the weld point detection device also includes a guide rail (110) connected to the base (1) and passing through the guide hole (230). The mounting platform (2) slides along the extension direction of the guide rail (110) through the guide hole (230).

10. The weld joint detection device according to claim 9, characterized in that, The weld point detection device further includes an operating handle (5) connected to the mounting platform (2) and a reset member (6) connected to the guide rail (110) and located between the mounting platform (2) and the base (1). The operating handle (5) can drive the mounting platform (2) to slide along the extension direction of the guide rail (110), and the reset member (6) can drive the mounting platform (2) to slide and reset along the extension direction of the guide rail (110).

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