Wafer inspection apparatus with support assembly

Abstract

The application relates to a wafer detection device with a supporting assembly. The wafer detection device comprises a mounting base, a flip cover and the supporting assembly. The mounting base is enclosed to form a containing cavity with an opening. The flip cover is arranged on one side of the containing cavity. The flip cover has a connecting end and a movable end. The connecting end is rotatably connected to the mounting base. The supporting assembly comprises a telescopic piece. The opposite ends of the telescopic piece are rotatably connected to the mounting base and the flip cover. The first connecting position of the telescopic piece and the flip cover is located between the connecting end and the movable end. When the flip cover is closed, the second connecting position of the telescopic piece and the mounting base is located between the connecting end and the first connecting position in the first direction. The telescopic piece and the first direction form a preset included angle. The opening of the preset included angle faces the flip cover. When the flip cover is closed, the preset included angle alpha satisfies the range of 75 DEG <= alpha <= 85 DEG. The first direction is the arrangement direction of the connecting end, the first connecting position and the movable end. The wafer detection device is convenient for the staff to open the flip cover.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, and more specifically to a wafer inspection device with support components. Background Technology

[0002] In wafer inspection equipment, a flip cover and a mounting base form a chamber for holding the sample to be inspected. The flip cover is used to mount probe cards for inspecting the sample. When it is necessary to repair or replace components within the chamber, the flip cover needs to be opened. However, when the probe cards are mounted on the flip cover, its weight and load-bearing capacity are considerable, making it difficult for operators to open. Therefore, how to design the wafer inspection equipment to facilitate the opening of the flip cover is a pressing problem that needs to be solved. Utility Model Content

[0003] In view of this, this application provides a wafer inspection device with a support component, which facilitates the opening of the flip cover by the operator.

[0004] This application provides a wafer inspection device with a support assembly. The wafer inspection device includes: a mounting base, a flip cover, and a support assembly. The mounting base forms an accommodating cavity with an opening. The flip cover is disposed on the side of the accommodating cavity with the opening. The flip cover has a connecting end and a movable end disposed opposite to each other. The connecting end is rotatably connected to the mounting base. The support assembly includes at least one telescopic member. The two opposite ends of the telescopic member are rotatably connected to the mounting base and the flip cover, respectively. A first connection position between the telescopic member and the flip cover is located between the connecting end and the movable end. When the flip cover is closed, a second connection position between the telescopic member and the mounting base is located between the connecting end and the first connection position along a first direction. The telescopic member forms a preset angle with the first direction. The opening of the preset angle faces the flip cover. When the flip cover is closed, the preset angle α satisfies the range: 75°≤α≤85°. The first direction is the arrangement direction of the connecting end, the first connection position, and the movable end.

[0005] Furthermore, along the first direction, the distance L1 between the connecting end and the movable end is in the range of 900mm≤L1≤960mm; the distance from the first connecting position to the connecting end is L2, which satisfies the relationship: 0.12≤L2 / L1≤0.17.

[0006] Furthermore, the wafer inspection device also includes a rotating shaft, which passes through the connecting end and the mounting base to enable the flip cover to rotate relative to the mounting base; the telescopic component includes a pressure tube, a piston, and a piston rod, the pressure tube has a cavity for dispensing gas, the piston is movably disposed within the cavity, the piston rod is connected to one side of the piston, the piston rod at least partially protrudes from the pressure tube, and the piston rod can drive the piston to move relative to the pressure tube along the extension direction of the pressure tube; the end of the pressure tube opposite to the piston rod is rotatably connected to the flip cover, and the end of the piston rod opposite to the piston is rotatably connected to the mounting base; the flip cover has a first state and a second state relative to the mounting base, when the flip cover is in the first state, the flip cover closes the opening, and the preset included angle is an acute angle; when the flip cover is in the second state, the flip cover and the mounting base are arranged at an angle; during the process of the flip cover changing from the first state to the second state, the piston rod drives the piston to move relative to the cavity to support the flip cover.

[0007] Furthermore, when the flip cover is in the second state, the included angle β between the flip cover and the mounting base satisfies the range: 40°≤β≤48°.

[0008] Furthermore, the mounting base includes two mounting members spaced apart, the two mounting members being arranged at intervals along the second direction, and the flip cover being rotatably connected to the two mounting members respectively; the number of support components is two sets, one set of support components corresponding to one set of mounting members, and different support components corresponding to different mounting members; the mounting member has a mounting cavity, the mounting cavity at least partially penetrating the surface of the mounting base facing the flip cover; the telescopic member is disposed in the mounting cavity; along the first direction, the distance L2 from the first connection position to the connection end satisfies the range: 120mm≤L2≤155mm, wherein the first direction intersects the second direction.

[0009] Furthermore, in the support assembly, there are two telescopic members, which are spaced apart in the mounting cavity. The two telescopic members include a first telescopic member and a second telescopic member. The first telescopic member is closer to the rotation axis than the second telescopic member. Along the first direction, the distance L3 from the first connection position of the first telescopic member to the connection end is in the range of 120mm≤L3≤125mm; the distance L4 from the first connection position of the second telescopic member to the connection end is in the range of 145mm≤L4≤155mm.

[0010] Furthermore, the wafer inspection device also includes a connector, which connects to the side of the flip cover facing the accommodating cavity, and the first connection position is located on the connector.

[0011] Furthermore, the wafer inspection device also includes a first accessory and a second accessory. The first accessory is connected to the connector and rotatably connected to the end of the pressure tube opposite to the piston rod. The second accessory is connected to the mounting base and rotatably connected to the end of the piston rod opposite to the piston.

[0012] Furthermore, along the second direction, the thickness d of the mounting component ranges from 60mm ≤ d ≤ 70mm.

[0013] Furthermore, the wafer inspection device also includes a chuck and a heat sink. The chuck is movably disposed in the receiving cavity and is used to carry the sample to be inspected. The mounting component has a through hole that penetrates two opposing surfaces of the mounting base along a second direction. The through hole is used to house the heat sink, which is used to dissipate heat from the receiving cavity.

[0014] In this application, the mounting base forms an open accommodating cavity to accommodate the sample to be tested and other components. The flip cover is used to house a probe card, which is used to contact the sample to be tested within the accommodating cavity and perform testing on the sample. When it is necessary to replace the sample to be tested or to repair other components within the accommodating cavity, the connecting end can rotate relative to the mounting base to at least partially open the opening of the accommodating cavity, facilitating operation by the operator. During this process, the opposite ends of the telescopic member are rotatably connected to the mounting base and the flip cover, respectively. The length of the telescopic member is constantly changing, and the telescopic member provides support for the flip cover, reducing the force required for the operator to support the movable end and rotate the flip cover relative to the mounting base, thus facilitating the opening of the flip cover. Furthermore, when the flip cover is opened or during the process of adjusting the flip cover from the open state to the closed state, the telescopic component provides support for the flip cover to slow down the rotation speed of the flip cover towards the mounting base, preventing the flip cover from falling directly towards the mounting base and avoiding accidental injury to personnel. It also prevents the flip cover from falling directly and damaging the probe cards on the flip cover or other structures on the mounting base, thus improving the safety performance and extending the service life of the wafer inspection device. In this application, when the flip cover is closed, the preset included angle α satisfies the range: 75°≤α≤85°. This preset included angle is within a reasonable range, so that when the movable end is supported to rotate the connecting end to connect to the mounting base, the support component can provide appropriate support force for the flip cover. This reduces the force exerted by the personnel supporting the movable end to rotate the flip cover relative to the mounting base, and prevents the flip cover from popping out rapidly and accidentally injuring personnel or damaging the probe cards on the flip cover, further improving the usability and safety performance of the wafer inspection device. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementations of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a partial structural schematic diagram of the wafer inspection device according to the first embodiment of this application; Figure 2 This is a top view of a wafer inspection apparatus according to an embodiment of this application; Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure along the AA direction; Figure 4 This is a partial structural schematic diagram of the wafer inspection device according to the second embodiment of this application; Figure 5 This is a partial structural schematic diagram of the wafer inspection device according to the third embodiment of this application; Figure 6 This is a simplified structural diagram of a telescopic component according to an embodiment of this application; Figure 7 for Figure 1 Enlarged structural diagram of the dashed box in section B; Figure 8 This is a partial structural schematic diagram of the wafer inspection device according to the fourth embodiment of this application; Figure 9 This is a partial structural schematic diagram of the wafer inspection device according to the fifth embodiment of this application; Figure 10 This is a simplified structural schematic diagram of a wafer inspection device according to an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: 100-Wafer inspection device, 110-Mounting base, 111-Opening, 112-Receiving cavity, 113-Mounting component, 114-Mounting cavity, 115-Through hole, 116-Second connection position, 120-Flip cover, 121-Connecting end, 122-Moving end, 123-First connection position, 130-Support assembly, 131-Telescopic component, 1311-Pressure tube, 1312-Piston, 1313-Piston rod, 1314-Setting cavity, 1315-First telescopic component, 1316-Second telescopic component, 1317-Through hole, 140-Rotating shaft, 150-Connector, 160-First accessory, 170-Second accessory, 180-Chuck, 190-Heat sink, 210-Probe card. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0020] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0021] In wafer inspection equipment, a flip cover and a mounting base form a chamber for holding the sample to be inspected. The flip cover is used to mount probe cards for inspecting the sample. When it is necessary to repair or replace components within the chamber, the flip cover needs to be opened. However, when the probe cards are mounted on the flip cover, its weight and load-bearing capacity are considerable, making it difficult for operators to open. Therefore, how to design the wafer inspection equipment to facilitate the opening of the flip cover is a pressing problem that needs to be solved.

[0022] Please see Figures 1 to 5 This application provides a wafer inspection device 100 with a support assembly 130. The wafer inspection device 100 includes: a mounting base 110, a flip cover 120, and a support assembly 130. The mounting base 110 forms a receiving cavity 112 with an opening 111. The flip cover 120 is disposed on the side of the receiving cavity 112 with the opening 111. The flip cover 120 has a connecting end 121 and a movable end 122 disposed opposite to each other. The connecting end 121 is rotatably connected to the mounting base 110. The support assembly 130 includes at least one telescopic member 131. The two opposite ends of the telescopic member 131 are rotatably connected to the mounting base 110 and the flip cover 120, respectively. The first connection position 123 of the telescopic member 131 and the flip cover 120 is located between the connecting end 121 and the movable end 122. When the flip cover 120 is closed, it moves along a first direction (e.g., ...). Figure 1In the direction shown in the X direction, the second connection position 116 of the telescopic member 131 and the mounting base 110 is located between the connecting end 121 and the first connection position 123; the telescopic member 131 forms a preset angle with the first direction, and the opening 111 of the preset angle faces the flip cover 120. When the flip cover 120 is closed, the preset angle α satisfies the range: 75°≤α≤85°. The first direction is the arrangement direction of the connecting end 121, the first connection position 123 and the movable end 122.

[0023] Specifically, the preset included angle can be, but is not limited to, 75°, 76°, 77°, 78°, 79°, 80°, 81°, 82°, 83°, 84° and 85°.

[0024] Understandably, when the flip cover 120 is closed, the flip cover 120 closes the opening 111.

[0025] Understandably, the second connection position 116 is closer to the connection end 121 than the first connection position 123.

[0026] Understandably, the length of the telescopic member 131 is adjustable.

[0027] Understandably, the first direction is the arrangement direction of the connecting end 121, the first connecting position 123 and the movable end 122. When the flip cover 120 rotates relative to the mounting base 110, the first direction changes continuously; when the flip cover 120 is closed, the first direction is parallel to the horizontal plane.

[0028] Understandably, the opposite ends of the telescopic member 131 are respectively connected to the mounting base 110 and the flip cover 120.

[0029] Understandably, when the flip cover 120 is closed, the second connection position 116 of the telescopic member 131 and the mounting base 110 is located between the connection end 121 and the first connection position 123. This can be achieved by the telescopic member 131 tilting towards the side closer to the movable end 122 when the flip cover 120 is closed.

[0030] Understandably, in the terminology of this application, "at least one" means one or more, and may be, but is not limited to, one, two, three, four or six, etc.

[0031] Understandably, the accommodating cavity 112 is used to place the sample to be tested, which may be, but is not limited to, wafers, circuit boards, etc.

[0032] Optionally, the wafer inspection device 100 further includes a probe card 210, which is carried on the flip cover 120 and has its tip facing the receiving cavity 112 to inspect the sample to be inspected.

[0033] Understandably, in this application Figure 4 In this embodiment, the flip cover 120 is closed; in this application Figure 5 In this embodiment, the flip cover 120 is opened.

[0034] In this embodiment, the mounting base 110 forms a receiving cavity 112 with an opening 111 to accommodate the sample to be tested and other components. The flip cover 120 is used to house a probe card 210, which is used to contact the sample to be tested within the receiving cavity 112 and perform testing on the sample. When it is necessary to replace the sample to be tested or to repair other components within the receiving cavity 112, the connecting end 121 can rotate relative to the mounting base 110 to at least partially open the opening 111 of the receiving cavity 112, facilitating operation by personnel. During this process, the opposite ends of the telescopic member 131 are rotatably connected to the mounting base 110 and the flip cover 120, respectively. The length of the telescopic member 131 is constantly changing, and the telescopic member 131 provides support for the flip cover 120 to reduce the force exerted by the personnel supporting the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, making it easier for personnel to open the flip cover 120. Furthermore, when the flip cover 120 is opened or when the operator adjusts the flip cover 120 from the open state to the closed state, the telescopic member 131 can provide support for the flip cover 120 to slow down the rotation speed of the flip cover 120 toward the mounting base 110, preventing the flip cover 120 from falling directly toward the mounting base 110 and avoiding accidental injury to the operator. It can also prevent the flip cover 120 from falling directly and damaging the probe card 210 on the flip cover 120, other structures on the mounting base 110, etc., which helps to improve the safety performance of the wafer inspection device 100 and extend the service life of the wafer inspection device 100. In this embodiment, when the flip cover 120 is closed, the preset included angle α satisfies the range of 75°≤α≤85°. The preset included angle is within a reasonable range so that when the connecting end 121 is rotated to connect to the mounting base 110 by supporting the movable end 122, the support component 130 can provide appropriate support force for the flip cover 120. This can reduce the force exerted by the operator supporting the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, and also prevent the flip cover 120 from popping out quickly and accidentally injuring the operator or damaging the probe card 210 on the flip cover 120. This further improves the usability and safety performance of the wafer inspection device 100.

[0035] Optionally, the telescopic component 131 is a nitrogen spring, meaning that the telescopic component 131 contains high-pressure nitrogen gas. The extension or shortening of the telescopic component 131 is achieved by utilizing the compression and expansion process of the nitrogen gas. Nitrogen gas is an inert gas, which allows the length of the telescopic component 131 to change slowly. This allows the flip cover 120 to open or close slowly relative to the mounting base 110, preventing the flip cover 120 from popping out or falling directly and impacting the mounting base 110, thereby improving the safety performance of the wafer inspection device 100.

[0036] Optionally, if the sum of the first weight of the flip cover 120 and the second weight borne by the flip cover 120 is m, then the range of m is: 90kg≤m≤100kg.

[0037] Understandably, the second weight borne by the flip cover 120 includes at least the weight of the probe card 210 and the weight of the probe card clamp, wherein the probe card clamp is used to set the probe card 210 and the probe card clamp is connected to the flip cover 120.

[0038] Understandably, the greater the sum of the first weight of the flip cover 120 and the second weight borne by the flip cover 120, the greater the force exerted by the operator to support the movable end 122 to achieve the rotation of the connecting end 121 relative to the mounting base 110. In this embodiment, when the sum m of the first weight of the flip cover 120 and the second weight borne by the flip cover 120 satisfies the range of 90kg≤m≤100kg, and the preset included angle α satisfies the range of 75°≤α≤85°, the telescopic member 131 can effectively support the flip cover 120, so that the force exerted by the operator supporting the movable end 122 to rotate the connecting end 121 relative to the mounting base 110 is within a reasonable range. This reduces the force exerted by the operator supporting the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, and also prevents the flip cover 120 from popping out quickly and accidentally injuring the operator or damaging the probe card 210 on the flip cover 120, further improving the usability and safety performance of the wafer inspection device 100.

[0039] In some embodiments, along the first direction, the distance L1 between the connecting end 121 and the movable end 122 is in the range of 900mm≤L1≤960mm; the distance from the first connecting position 123 to the connecting end 121 is L2, which satisfies the relationship: 0.12≤L2 / L1≤0.17.

[0040] Specifically, the distance L1 between the connecting end 121 and the movable end 122 can be, but is not limited to, 900mm, 905mm, 910mm, 915mm, 920mm, 925mm, 930mm, 935mm, 940mm, 945mm, 950mm, 955mm and 960mm.

[0041] Specifically, the value of L2 / L1 can be, but is not limited to, 0.12, 0.13, 0.14, 0.15, 0.16, and 0.17.

[0042] In this embodiment, along the first direction, the distance between the connecting end 121 and the movable end 122 is L1, and the distance from the first connecting position 123 to the connecting end 121 is L2. When the distance L1 between the connecting end 121 and the movable end 122 satisfies the range 900mm≤L1≤960mm and satisfies the relationship: 0.12≤L2 / L1≤0.17, the setting position of the first connecting position 123 is within a reasonable range. During the process of connecting the mounting base 110 by supporting the movable end 122 to rotate the connecting end 121, the distance from the first connection position 123 of the telescopic member 131 and the flip cover 120 to the movable end 122 and the distance to the connecting end 121 are both within a reasonable range. This allows the telescopic member 131 to provide appropriate support for the flip cover 120, which can reduce the force exerted by the operator supporting the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, and also prevent the flip cover 120 from popping out rapidly due to excessive support force. This prevents the flip cover 120 from accidentally injuring the operator or damaging the probe card 210 on the flip cover 120, further improving the usability and safety of the wafer inspection device 100.

[0043] Optionally, in some embodiments, the distance from the center of gravity of the flip cover 120 to the connecting end 121 along the first direction is 550mm to 560mm.

[0044] Specifically, the distance from the center of gravity of the flip cover 120 to the connecting end 121 can be, but is not limited to, 550mm, 551mm, 552mm, 553mm, 554mm, 555mm, 556mm, 557mm, 558mm, 559mm and 560mm.

[0045] In this embodiment, the distance from the center of gravity of the flip cover 120 to the connecting end 121 is within a reasonable range. The telescopic member 131 can provide suitable support for the flip cover 120, which can reduce the force required for the operator to support the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, and also prevent the flip cover 120 from popping out rapidly due to excessive support force, thus preventing the flip cover 120 from accidentally injuring the operator or damaging the probe card 210 on the flip cover 120. This further improves the usability and safety performance of the wafer inspection device 100. In addition, in this embodiment, the operator only needs to provide a force of 5 kg to 15 kg to open the flip cover 120, reducing the force required for the operator to open the flip cover 120 and improving the usability of the wafer inspection device 100.

[0046] Preferably, in some embodiments, the distance from the center of gravity of the flip cover 120 to the connecting end 121 is 554 mm.

[0047] Please see also Figure 6 and Figure 7 In some embodiments, the wafer inspection device 100 further includes a rotating shaft 140, which passes through the connecting end 121 and the mounting base 110 to enable the flip cover 120 to rotate relative to the mounting base 110. The telescopic member 131 includes a pressure tube 1311, a piston 1312, and a piston rod 1313. The pressure tube 1311 has a settling cavity 1314 for setting gas. The piston 1312 is movably disposed within the settling cavity 1314. The piston rod 1313 is connected to one side of the piston 1312 and at least partially protrudes from the pressure tube 1311. The piston rod 1313 can drive the piston 1312 to move relative to the pressure tube 1311 along the extending direction of the pressure tube 1311. The pressure tube 1311 is rotatably connected to the flip cover 120 at one end away from the piston rod 1313, and the piston rod 1313 is rotatably connected to the mounting base 110 at one end away from the piston 1312. The flip cover 120 has a first state and a second state relative to the mounting base 110. When the flip cover 120 is in the first state, the flip cover 120 closes the opening 111, and the preset included angle is an acute angle. When the flip cover 120 is in the second state, the flip cover 120 and the mounting base 110 are set at an included angle. During the process of the flip cover 120 changing from the first state to the second state, the piston rod 1313 drives the piston 1312 to move relative to the setting cavity 1314 to support the flip cover 120.

[0048] Understandably, the setting cavity 1314 is used to set a gas, which can be, but is not limited to, a high-pressure inert gas, such as nitrogen.

[0049] Understandably, the piston 1312 has a through hole 1317 such that the pressure on the side of the setting cavity 1314 with the piston rod 1313 is equal to the pressure on the side of the setting cavity 1314 without the piston rod 1313.

[0050] Understandably, the connection position between the pressure tube 1311 and the flip cover 120 is the first connection position 123, and the connection position between the piston rod 1313 and the mounting base 110 is the second connection position 116.

[0051] Understandably, Figure 4 The embodiment is in the first state. Figure 5 The embodiment is in the second state.

[0052] In this embodiment, the flip cover 120 rotates relative to the mounting base 110 when the movable end 122 is supported, with the rotating shaft 140 as the axis. During this process, the opposite ends of the telescopic member 131 are connected to the flip cover 120 and the mounting base 110 respectively. As the flip cover 120 rotates, the length of the telescopic member 131 is extended or shortened to support the flip cover 120. Specifically, the setting cavity 1314 is used to set gas. The pressure on the side of the setting cavity 1314 with the piston rod 1313 is equal to the pressure on the side of the setting cavity 1314 without the piston rod 1313. However, there is a difference in the force-bearing area on both sides of the piston 1312, which creates a pressure difference on both sides of the piston 1312, thereby pushing the piston 1312 to move relative to the pressure tube 1311. When the flip cover 120 is in the first state, the preset included angle is an acute angle. When the flip cover 120 is in the second state, the length of the telescopic member 131 in the first state is less than the length of the telescopic member 131 in the second state. During the transition of the flip cover 120 from the first state to the second state, the length of the telescopic member 131 continuously increases. The force exerted on the side of the setting cavity 1314 with the piston rod 1313 is less than the force exerted on the side of the setting cavity 1314 without the piston rod 1313. Therefore, when the flip cover 120 rotates in a direction away from the mounting base 110, the flip cover 120 pulls the pressure tube 1311 to move relative to the piston rod 1313 in a direction away from the mounting base 110. The telescopic member 131 can provide a supporting force for the flip cover 120 in a direction away from the mounting base 110, thereby reducing the force exerted by the operator holding the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, making it easier for the operator to open the flip cover 120. Furthermore, the telescopic member 131 changes its length through the compression and expansion of high-pressure gas. This process is relatively slow, preventing the flip cover 120 from popping out rapidly and injuring personnel or damaging the probe card 210 on the flip cover 120. Similarly, during the transition of the flip cover 120 from the first state to the second state, the telescopic member 131 still provides support for the flip cover 120 towards the side away from the mounting base 110, thereby slowing down the rotation speed of the flip cover 120 towards the mounting base 110. This prevents the flip cover 120 from falling directly towards the mounting base 110, avoiding injury to personnel, and also preventing damage to the probe card 210 on the flip cover 120 or other structures on the mounting base 110 from a direct fall. The wafer inspection device 100 provided in this embodiment has high safety performance and a long service life.

[0053] Optionally, because nitrogen gas is provided inside the telescopic member 131, and a damping element is provided inside the telescopic member 131, the piston 1312 moves relatively slowly relative to the pressure tube 1311. Therefore, the time taken for the flip cover 120 to switch from the first state to the second state is greater than or equal to 20 seconds. This helps to slow down the opening or closing of the flip cover 120 relative to the mounting base 110, preventing the flip cover 120 from rapidly falling or popping out and accidentally injuring personnel, thus improving the safety performance of the wafer inspection device 100.

[0054] In some embodiments, when the flip cover 120 is in the second state, the included angle β between the flip cover 120 and the mounting base 110 satisfies the range: 40°≤β≤48°.

[0055] Specifically, the angle β between the flip cover 120 and the mounting base 110 can be, but is not limited to, 40°, 41°, 42°, 42.5°, 43°, 44°, 44.5°, 45°, 46°, 47° and 48°.

[0056] In this embodiment, when the flip cover 120 is in the second state, the flip cover 120 can no longer move away from the mounting base 110. At this time, the angle between the flip cover 120 and the mounting base 110 is the largest. When the angle β between the flip cover 120 and the mounting base 110 satisfies the range of 40°≤β≤48°, the angle between the flip cover 120 and the mounting base 110 is within a reasonable range, which facilitates the operation of the staff to repair or replace the components in the accommodating cavity 112 or the sample to be tested, thereby improving the performance of the wafer inspection device 100. Furthermore, if the angle between the flip cover 120 and the mounting base 110 is too large, the flip cover 120 will be too tilted, and the probe card 210 mounted on the flip cover 120 may fall off or be damaged due to excessive tilt, increasing the risk of damage to the wafer inspection device 100. Moreover, as the angle between the flip cover 120 and the mounting base 110 increases, the length of the telescopic member 131 continuously increases, requiring a further increase in the travel of the telescopic member 131, thus increasing the assembly cost of the wafer inspection device 100. If the angle between the flip cover 120 and the mounting base 110 is too small, the opening 111 will be too small, making it inconvenient for personnel to repair or replace the components within the accommodating cavity 112 through the opening 111.

[0057] In some embodiments, the mounting base 110 includes two mounting members 113 spaced apart, the two mounting members 113 being aligned along a second direction (e.g., Figure 1Arranged at intervals (as shown in the Y direction), the flip cover 120 is rotatably connected to two mounting parts 113 respectively; there are two sets of support components 130, one set of support components 130 corresponds to one set of mounting parts 113, and different support components 130 correspond to different mounting parts 113; the mounting part 113 has a mounting cavity 114, which at least partially penetrates the surface of the mounting base 110 facing the flip cover 120; the telescopic member 131 is disposed in the mounting cavity 114; along the first direction, the distance L2 from the first connection position 123 to the connection end 121 satisfies the range: 120mm≤L2≤155mm, wherein the first direction intersects the second direction.

[0058] Specifically, along the first direction, the distance L2 from the first connection position 123 to the connection end 121 can be, but is not limited to, 120mm, 122mm, 125mm, 128mm, 130mm, 132mm, 135mm, 138mm, 140mm, 142mm, 145mm, 148mm, 150mm, 152mm, 153mm, 154mm, and 155mm.

[0059] Understandably, the support component 130 corresponds one-to-one with the mounting component 113, and the two sets of support components 130 are spaced apart along the second direction.

[0060] Understandably, the mounting cavity 114 extends at least partially through the surface of the mounting base 110 facing the flip cover 120, so that the telescopic member 131 partially protrudes from the mounting cavity 114 and connects to the flip cover 120.

[0061] Understandably, when each of the support components 130 includes one telescopic member 131, the telescopic member 131 is disposed in the mounting cavity 114; when each of the support components 130 includes multiple telescopic members 131, the multiple telescopic members 131 are disposed at intervals in the mounting cavity 114.

[0062] Optionally, the first direction is perpendicular to the second direction.

[0063] In this embodiment, the telescopic member 131 is disposed in the mounting cavity 114. Along the first direction, when the distance L2 from the first connection position 123 to the connection end 121 satisfies the range 120mm≤L2≤155mm, the distance from the first connection position 123 to the connection end 121 is within a reasonable range. On one hand, when the flip cover 120 switches between the first state and the second state, the telescopic member 131 can still be disposed within the mounting cavity 114, and the space of the mounting cavity 114 is within a reasonable range, avoiding the space of the mounting cavity 114 being too large and reducing the structural strength of the mounting base 110. On the other hand, in the wafer inspection device 100, the mounting member 113 also has a conveying port, which communicates with the receiving cavity 112 to facilitate the conveying of the sample to be tested into the receiving cavity 112 through the conveying port. The distance from the first connection position 123 to the connection end 121 is within a reasonable range, which can avoid the first connection position 123 occupying the space of the conveying port due to the excessive distance between the first connection position 123 and the connection end 121. This reduces the difficulty of conveying the sample to be tested into the accommodating cavity 112 through the conveying port and improves the performance of the wafer inspection device 100.

[0064] In some embodiments, the support assembly 130 includes two telescopic members 131, which are spaced apart in the mounting cavity 114. Each telescopic member 131 includes a first telescopic member 1315 and a second telescopic member 1316. The first telescopic member 1315 is closer to the rotation axis 140 than the second telescopic member 1316. Along the first direction, the distance L3 from the first connection position 123 of the first telescopic member 1315 to the connection end 121 ranges from 120mm to 125mm; the distance L4 from the first connection position 123 of the second telescopic member 1316 to the connection end 121 ranges from 145mm to 155mm.

[0065] Specifically, along the first direction, the distance L3 from the first connection position 123 of the first telescopic member 1315 to the connection end 121 can be, but is not limited to, 120mm, 120.5mm, 121mm, 121.5mm, 122mm, 122.5mm, 123mm, 123.5mm, 124mm, 124.5mm, and 125mm.

[0066] Specifically, along the first direction, the distance L4 from the first connection position 123 of the second telescopic member 1316 to the connection end 121 can be, but is not limited to, 145mm, 145.5mm, 146mm, 147mm, 148mm, 149mm, 150mm, 151mm, 152mm, 153mm, 154mm and 155mm.

[0067] Understandably, the first connection position 123 of the first telescopic member 1315 is closer to the connection end 121 than the first connection position 123 of the second telescopic member 1316.

[0068] Understandably, both the first telescopic member 1315 and the second telescopic member 1316 include the structure of the telescopic member 131 described above, that is, both the first telescopic member 1315 and the second telescopic member 1316 include a pressure tube 1311, a piston 1312 and a piston rod 1313.

[0069] In this embodiment, there are two telescopic members 131, and the first telescopic member 1315 and the second telescopic member 1316 are spaced apart in the mounting cavity 114. When the flip cover 120 switches between the first state and the second state, the first telescopic member 1315 and the second telescopic member 1316 can provide support for the flip cover 120, thereby improving the stability of the support assembly 130 in supporting the flip cover 120 and greatly reducing the force required for workers to open the flip cover 120. Along the first direction, when the distance L3 from the first connection position 123 of the first telescopic member 1315 to the connection end 121 satisfies the range of 120mm≤L3≤125mm, and the distance L4 from the first connection position 123 of the second telescopic member 1316 to the connection end 121 satisfies the range of 145mm≤L4≤155mm, on the one hand, when the flip cover 120 switches between the first state and the second state, the first telescopic member 1315 and the second telescopic member 1316 can still be set in the mounting cavity 114, and the space of the mounting cavity 114 is within a reasonable range, avoiding the space of the mounting cavity 114 being too large and reducing the structural strength of the mounting base 110. On the other hand, the distance from the first connection position 123 of the first telescopic member 1315 to the connection end 121 and the distance from the first connection position 123 of the second telescopic member 1316 to the connection end 121 are both within a reasonable range. When the flip cover 120 is in the second state, it can avoid the distance from the first connection position 123 of the first telescopic member 1315 to the connection end 121 being too large and / or the distance from the first connection position 123 of the second telescopic member 1316 to the connection end 121 being too large, thus occupying the space of the conveying port. This reduces the difficulty of conveying the sample to be tested into the accommodating cavity 112 through the conveying port and improves the performance of the wafer inspection device 100. Furthermore, the distance from the first connection position 123 of the first telescopic member 1315 to the connection end 121 and the distance from the first connection position 123 of the second telescopic member 1316 to the connection end 121 are within a reasonable range, so that when the flip cover 120 is in the second state, the angle between the flip cover 120 and the mounting base 110 is also within a reasonable range, which facilitates the maintenance or replacement of other components in the accommodating cavity 112 by the staff, so that the wafer inspection device 100 has better performance.

[0070] Preferably, when the flip cover 120 is closed, the two telescopic members 131 are parallel, so that when the flip cover 120 switches between the first state and the second state, the two telescopic members 131 can avoid interference with each other, thereby improving the stability of the support assembly 130 in supporting the flip cover 120.

[0071] In some embodiments, the wafer inspection device 100 further includes a connector 150, which connects to the side of the flip cover 120 facing the receiving cavity 112, and the first connection position 123 is located on the connector 150.

[0072] In this embodiment, the telescopic member 131 and the flip cover 120 are connected by the connector 150. Furthermore, the end of the pressure tube 1311 facing away from the piston rod 1313 is connected to the connector 150, so that the end of the pressure tube 1311 facing away from the piston rod 1313 can be rotatably connected to the flip cover 120. The connector 150 improves the connection performance and connection stability between the telescopic member 131 and the flip cover 120, making it easier to place the telescopic member 131 in the mounting cavity 114.

[0073] When there are multiple telescopic members 131, there are multiple connecting members 150. One telescopic member 131 corresponds to one connecting member 150, and different telescopic members 131 correspond to different connecting members 150.

[0074] Please see also Figure 8 In some embodiments, the wafer inspection device 100 further includes a first accessory 160 and a second accessory 170. The first accessory 160 is connected to the connector 150 and rotatably connected to the end of the pressure tube 1311 opposite to the piston rod 1313. The second accessory 170 is connected to the mounting base 110 and rotatably connected to the end of the piston rod 1313 opposite to the piston 1312.

[0075] Optionally, the first accessory 160 is a ball joint, and the second accessory 170 is a ball joint.

[0076] Understandably, this application Figure 8 The embodiment illustrates the assembly relationship between the telescopic component 131 and the first accessory 160 and the second accessory 170.

[0077] In this embodiment, the first accessory 160 is connected to the connector 150 and is rotatably connected to the end of the pressure tube 1311 opposite to the piston rod 1313, thereby achieving a rotatable connection between the telescopic member 131 and the connector 150; the second accessory 170 is connected to the mounting base 110 and is rotatably connected to the end of the piston rod 1313 opposite to the piston 1312, thereby achieving a rotatable connection between the telescopic member 131 and the mounting base 110. The first accessory 160 and the second accessory 170 cooperate to ensure that the opposite ends of the telescopic member 131 are rotatably connected to the flip cover 120 and the mounting base 110, respectively. When the flip cover 120 switches between the first state and the second state, the length of the telescopic member 131 changes. As the angle between the flip cover 120 and the mounting base 110 changes, the opposite ends of the telescopic member 131 can still be tightly connected to the flip cover 120 and the mounting base 110 by rotational connection. This improves the stability of the connection between the telescopic member 131 and the flip cover 120 and the mounting base 110, so that the support component 130 can fully play its supporting role for the flip cover 120. This reduces the force required for the operator to hold the movable end 122 to rotate the flip cover 120 relative to the mounting base 110, and prevents the flip cover 120 from falling directly towards the mounting base 110 and damaging the flip cover 120 or the probe card 210 set on the flip cover 120. This improves the safety performance of the wafer inspection device 100.

[0078] When there are multiple telescopic components 131, there are multiple first accessories 160 and multiple second accessories 170. One telescopic component 131 corresponds to one first accessory 160 and one second accessory 170. Different telescopic components 131 correspond to different first accessories 160 and different second accessories 170.

[0079] Please see also Figure 9 In some embodiments, the thickness d of the mounting member 113 along the second direction ranges from 60mm ≤ d ≤ 70mm.

[0080] Specifically, along the second direction, the thickness d of the mounting member 113 can be, but is not limited to, 60mm, 61mm, 62mm, 63mm, 64mm, 65mm, 66mm, 67mm, 68mm, 69mm and 70mm.

[0081] In this embodiment, along the second direction, when the thickness d of the mounting member 113 satisfies the range of 60mm≤d≤70mm, the thickness of the mounting member 113 is within a reasonable range. On the one hand, the thickness of the mounting member 113 is not too thin, thus reducing the structural strength of the mounting member 113, so that the two mounting members 113 cooperate sufficiently to support the flip cover 120 and the probe card 210 disposed on the flip cover 120, thereby improving the structural performance of the wafer inspection device 100. On the other hand, the thickness of existing mounting members is greater than 70mm, while in the wafer inspection device 100 of this embodiment, the thickness of the mounting member 113 is reduced. Therefore, while the maximum distance between the two mounting members 113 along the second direction remains unchanged, in other words, while the space occupied by the wafer inspection device 100 in the second direction remains unchanged, the reduced thickness of the mounting member 113 increases the space of the receiving cavity 112, thereby facilitating the movement of the sample to be inspected within the receiving cavity 112 and improving the usability of the wafer inspection device 100. Furthermore, if the space of the accommodating cavity 112 is large enough and does not need to be further increased, the thickness of the mounting member 113 can be reduced, which is beneficial to reducing the space occupied by the wafer inspection device 100 in the second direction and to realizing the miniaturization design of the wafer inspection device 100.

[0082] Please see also Figure 10 In some embodiments, the wafer inspection device 100 further includes a chuck 180 and a heat sink 190. The chuck 180 is movably disposed in the receiving cavity 112 and is used to carry the sample to be inspected. The mounting member 113 has a through hole 115 that passes through two opposing surfaces of the mounting base 110 along a second direction. The through hole 115 is used to house the heat sink 190, which is used to dissipate heat from the receiving cavity 112.

[0083] Understandably, the through hole 115 connects to the receiving cavity 112.

[0084] Optionally, the heat sink 190 may be, but is not limited to, a fan.

[0085] In this embodiment, the chuck 180 is movably disposed in the receiving cavity 112 and is used to carry the sample to be tested. Specifically, the chuck 180 can move along a plane perpendicular to the arrangement direction of the flip cover 120 and the mounting base 110 to move the sample to be tested carried on the chuck 180 and to set the sample to be tested in relation to the probe card 210, facilitating the setting of the probe card 210 for the sample to be tested. When it is necessary to test the performance of the sample to be tested at high temperature, the chuck 180 can heat the sample to be tested to increase the temperature of the sample to be tested and the receiving cavity 112. The mounting component 113 also has a through hole 115 that connects to the accommodating cavity 112. The through hole 115 is used to house a heat sink 190. When the heat sink 190 is turned on, it can dissipate heat from the accommodating cavity 112 and the sample to be tested, thereby achieving rapid cooling of the sample after testing and improving the testing efficiency of the wafer testing device 100. Furthermore, the heat sink 190 is embedded in the mounting component 113, which prevents the heat sink 190 from protruding from the two opposing surfaces of the mounting component 113 along the second direction, and prevents the heat sink 190 from occupying the space of the mounting base 110 along the second direction.

[0086] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A wafer inspection device with a support assembly, characterized in that, The wafer inspection device includes: Mounting base, the mounting base enclosing a receiving cavity with an opening; A flip cover, disposed on the side of the accommodating cavity having the opening, the flip cover having a connecting end and a movable end disposed opposite to each other, the connecting end being rotatably connected to the mounting base; and A support assembly includes at least one telescopic member, with its opposite ends rotatably connected to the mounting base and the flip cover, respectively. A first connection position between the telescopic member and the flip cover is located between the connecting end and the movable end. When the flip cover is closed, along a first direction, a second connection position between the telescopic member and the mounting base is located between the connecting end and the first connection position. The telescopic member forms a preset angle with the first direction, with the opening of the preset angle facing the flip cover. When the flip cover is closed, the preset angle α satisfies the range: 75°≤α≤85°. The first direction is the arrangement direction of the connecting end, the first connection position, and the movable end.

2. The wafer inspection apparatus according to claim 1, characterized in that, Along the first direction, the distance L1 between the connecting end and the movable end is in the range of 900mm≤L1≤960mm; the distance from the first connecting position to the connecting end is L2, which satisfies the relationship: 0.12≤L2 / L1≤0.

17.

3. The wafer inspection apparatus according to claim 1, characterized in that, The wafer inspection device further includes a rotating shaft, which passes through the connecting end and the mounting base to enable the flip cover to rotate relative to the mounting base; The telescopic component includes a pressure tube, a piston, and a piston rod. The pressure tube has a cavity for discharging gas. The piston is movably disposed within the cavity. The piston rod is connected to one side of the piston and at least partially protrudes from the pressure tube. The piston rod can drive the piston to move relative to the pressure tube along its extension direction. The end of the pressure tube opposite to the piston rod is rotatably connected to the flip cover, and the end of the piston rod opposite to the piston is rotatably connected to the mounting base. The flip cover has a first state and a second state relative to the mounting base. When the flip cover is in the first state, the flip cover closes the opening, and the preset included angle is an acute angle. When the flip cover is in the second state, the flip cover and the mounting base are set at an angle; during the process of the flip cover changing from the first state to the second state, the piston rod drives the piston to move relative to the mounting cavity to support the flip cover.

4. The wafer inspection apparatus according to claim 3, characterized in that, When the flip cover is in the second state, the included angle β between the flip cover and the mounting base satisfies the range: 40°≤β≤48°.

5. The wafer inspection apparatus according to claim 3, characterized in that, The mounting base includes two mounting components spaced apart, the two mounting components are arranged at intervals along a second direction, and the flip cover is rotatably connected to the two mounting components respectively; the number of the support components is two sets, one set of support components corresponds to one set of mounting components, and different support components correspond to different mounting components. The mounting component has a mounting cavity, which at least partially extends through the surface of the mounting base facing the flip-top component; the telescopic component is disposed in the mounting cavity; along the first direction, the distance L2 from the first connection position to the connection end satisfies the range: 120mm≤L2≤155mm, wherein the first direction intersects with the second direction.

6. The wafer inspection apparatus according to claim 5, characterized in that, In the support assembly, there are two telescopic members, which are spaced apart in the mounting cavity. The two telescopic members include a first telescopic member and a second telescopic member. The first telescopic member is closer to the rotation axis than the second telescopic member. Along the first direction, the distance L3 from the first connection position of the first telescopic member to the connection end is in the range of 120mm≤L3≤125mm; the distance L4 from the first connection position of the second telescopic member to the connection end is in the range of 145mm≤L4≤155mm.

7. The wafer inspection apparatus according to any one of claims 3 to 6, characterized in that, The wafer inspection device further includes a connector that connects to the side of the flip cover facing the accommodating cavity, and the first connection position is located on the connector.

8. The wafer inspection apparatus according to claim 7, characterized in that, The wafer inspection device further includes a first accessory and a second accessory. The first accessory is connected to the connector and is rotatably connected to the end of the pressure tube opposite to the piston rod. The second accessory is connected to the mounting base and is rotatably connected to the end of the piston rod opposite to the piston.

9. The wafer inspection apparatus according to claim 5, characterized in that, Along the second direction, the thickness d of the mounting component ranges from 60mm to 70mm.

10. The wafer inspection apparatus according to claim 5, characterized in that, The wafer inspection device further includes a chuck and a heat sink. The chuck is movably disposed in the accommodating cavity and is used to carry the sample to be inspected. The mounting component has a through hole that passes through two opposing surfaces of the mounting base along a second direction. The through hole is used to house the heat sink, which is used to dissipate heat from the accommodating cavity.

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