A small-sized four-wavelength light source for CPO silicon photonic engines

Abstract

This utility model relates to a small-sized four-wavelength light source for a CPO silicon photonics engine. Multiple light emitters are distributed in upper and lower layers. The upper layer emitters emit light with different wavelengths and are coupled to multiple light inlets on the upper layer of a dual-layer Z-block component. Similarly, the lower layer emitters emit light with different wavelengths and are coupled to multiple light inlets on the lower layer of the dual-layer Z-block component. The light outlets of both the upper and lower layers of the dual-layer Z-block component are sequentially coupled to the light inlets of the upper and lower layers of a dual-layer fiber array via a dual-layer converging lens and an optical isolator. The advantages are: merging two single-layer Z-block components into a single dual-layer Z-block component; distributing the light emitters in upper and lower layers; and employing a dual-layer fiber array and a dual-layer converging lens, thereby effectively reducing the overall width and achieving the goal of saving PCB layout space.

Description

Technical Field

[0001] This utility model relates to the field of optical engine technology, specifically to a small-sized four-wavelength light source for CPO silicon photonic engines. Background Technology

[0002] CPO silicon photonics engines come in two schemes. One scheme uses all wavelengths the same, for example, all at 1310nm. The other scheme is a four-wavelength scheme, with two sets of four-wavelength light sources, each set emitting light at different wavelengths, for example, 1270nm, 1290nm, 1310nm, and 1330nm respectively. The structure of the second scheme is as follows... Figure 1 , Figure 2 As shown, the system includes: a base and a TEC cooler mounted on top of the base. The hot side panel of the TEC cooler is fixed to the base. Two single-layer Z-block components, a dual-channel converging lens, an optical isolator, a dual-channel fiber array, and eight optical emitters are fixed to the upper surface of the hot side panel of the TEC cooler. The two single-layer Z-block components are arranged side-by-side along the width of the base, with the width of the side-by-side arrangement being the same as the width of the TEC cooler and the base, respectively. A dual-channel converging lens and an optical isolator are sequentially arranged between the dual-channel fiber array and the output ports of the two single-layer Z-block components along the light propagation direction. That is, the output port of one of the two single-layer Z-block components passes sequentially through the dual-channel converging lens and the optical isolator before connecting with the output port of one of the two single-layer Z-block components in the dual-channel fiber array. One optical input port is coupled to the other single-layer Z-block component, and the output port of the other single-layer Z-block component is coupled to the other optical input port in the dual-channel fiber array after passing through a dual-channel converging lens and an optical isolator in sequence. Four of the eight optical emitters are coupled to the four optical input ports of one single-layer Z-block component in sequence, and the other four optical emitters are coupled to the four optical input ports of another single-layer Z-block component in sequence. The emitted light wavelengths of the four optical emitters coupled to the same single-layer Z-block component are different. Each optical emitter includes: a laser chip, which is fixed on a ceramic heat sink. The laser chip is coupled to the optical input port of the single-layer Z-block component through a collimating lens. The ceramic heat sink and the collimating lens are respectively fixed to the cold side of the TEC cooler. A base supports a PCB board that is electrically connected to the TEC cooler and the optical emitters.

[0003] The second approach takes into account the minimum size of the collimating lens in the light emitter, so the minimum width of the four-wavelength light source is 9mm. The CPO silicon photonics engine requires the four-wavelength light source to be as small as possible to save PCB layout space. Currently, the second approach has a large width, which results in a large layout space being occupied. Utility Model Content

[0004] The technical problem to be solved by this invention is to provide a small-size four-wavelength light source for CPO silicon photonics engines, so as to overcome the shortcomings of the prior art.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A small-sized four-wavelength light source for CPO silicon photonics engines includes: a dual-layer Z-block component, a dual-layer fiber array, and multiple optical emitters. The multiple optical emitters are distributed in upper and lower layers. The optical emitters in the upper layer emit different wavelengths and are coupled to multiple optical input ports in the upper layer of the dual-layer Z-block component. The optical emitters in the lower layer emit different wavelengths and are coupled to multiple optical input ports in the lower layer of the dual-layer Z-block component. The optical output ports of the upper and lower layers of the dual-layer Z-block component are coupled to the optical input ports of the upper and lower layers of the dual-layer fiber array, respectively, through a dual-layer converging lens and an optical isolator.

[0006] The beneficial effects of this utility model are: by merging two single-layer Z-block components into one double-layer Z-block component, only one Z-block component needs to be used. At the same time, the light emitting end coupled to the double-layer Z-block component is also distributed in upper and lower layers. Furthermore, by using a double-layer fiber array and a double-layer converging lens, the width of the overall space occupied is effectively reduced, thereby achieving the goal of saving PCB board layout space.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] Furthermore, multiple light emitting ends in the upper layer are fixed on the upper surface of the cold surface block in the TEC cooler, and multiple light emitting ends in the lower layer are fixed on the lower surface of the cold surface block in the TEC cooler.

[0009] The further beneficial effect of adopting the above is that a small-sized TEC cooler can be used to dissipate heat from the light emitting ends distributed on the upper and lower layers simultaneously.

[0010] Furthermore, the TEC cooler includes: a cold surface block, a hot surface block at each of the two ends of the cold surface block, and a TEC chip between each hot surface block and the cold surface block.

[0011] Furthermore, the cold surface block is an H-shaped block, and the hot surface block is a C-shaped block. The side plates at both ends of the cold surface block enter the concave cavities of the two hot surface blocks respectively. Multiple light emitting ends in the upper layer are fixed on the upper surface of the web plate in the cold surface block, and multiple light emitting ends in the lower layer are fixed on the lower surface of the web plate in the cold surface block.

[0012] The further beneficial effect of adopting the above is that the hot surface block is a C-shaped block, which allows the hot surface block to dissipate heat from three sides, thereby improving the heat dissipation speed of the light emitting end.

[0013] Furthermore, the TEC cooler has a width of 5.6mm, and both the cold and hot sides are made of ceramic.

[0014] The further beneficial effect of adopting the above is that, compared with the 9mm in the prior art, it is reduced by 3.4mm, which effectively reduces the width of the space occupied by the whole.

[0015] Furthermore, the dual-layer Z-block assembly, dual-layer fiber array, dual-layer converging lens, and the hot surface block in the TEC cooler are respectively fixed on the base, the optical isolator is fixed to the dual-layer fiber array, and the width of the TEC cooler is the same as the width of the base.

[0016] Furthermore, the base is made of tungsten copper.

[0017] Furthermore, a platform is provided on each side of one end of the base near the hot surface block. The upper surface of each platform is higher than the mounting surface of the base used to fix the double-layer Z-block component, the double-layer fiber array, the double-layer converging lens and the optical isolator. The two platforms of the base support the PCB board used to electrically connect to the TEC cooler and the optical transmitter respectively. Multiple optical transmitters on the upper layer and multiple optical transmitters on the lower layer are distributed along the center surface of the PCB board.

[0018] Furthermore, the optical emitting end includes a laser chip, which is fixed on a ceramic heat sink and coupled to the light inlet of the double-layer Z-block assembly via a collimating lens.

[0019] Furthermore, the dual-layer Z-block component has four light inlets in the upper layer and four light inlets in the lower layer, as well as four light emitters in both the upper and lower layers. Attached Figure Description

[0020] Figure 1 A front view of a four-wavelength light source used in existing CPO silicon photonics engines; Figure 2 This is a top view of the four-wavelength light source section structure used in the CPO silicon photonics engine in the prior art; Figure 3 This is a front view of the small-sized four-wavelength light source used in the CPO silicon photonics engine of this invention; Figure 4 This is a top view of the small-sized four-wavelength light source used in the CPO silicon photonics engine of this invention; Figure 5This is an assembly diagram of the TEC cooler and the light emitting end in this utility model; Figure 6 This is a top view of the base in this utility model.

[0021] The attached diagram lists the components represented by each number as follows: 1. Dual-layer Z-block assembly; 2. Dual-layer fiber array; 3. Optical emitter; 310. Laser chip; 320. Ceramic heat sink; 330. Collimating lens; 4. Dual-layer converging lens; 5. Optical isolator; 6. TEC cooler; 610. Cold side panel; 620. Hot side panel; 630. TEC chip; 7. Base; 710. Platform; 8. PCB board. Detailed Implementation

[0022] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0023] Example 1 like Figure 3 , Figure 4 , Figure 5 As shown, a small-sized four-wavelength light source for a CPO silicon photonics engine includes: a dual-layer Z-block component 1, a dual-layer fiber array 2, and multiple optical emitters 3. The multiple optical emitters 3 are distributed in an upper and lower layer configuration. There are multiple optical emitters 3 in the upper layer and multiple optical emitters 3 in the lower layer. The number of optical emitters 3 in the upper layer is the same as the number of optical emitters 3 in the lower layer. The emitted light wavelengths of the multiple optical emitters 3 in the upper layer are different. For example, if there are four optical emitters 3 in the upper layer, the emitted light wavelengths of the four optical emitters 3 can be 1270nm, 1290nm, 1310nm, and 1330nm. This is just an example. The multiple optical emitters 3 in the upper layer are coupled to multiple light inlets in the upper layer of the dual-layer Z-block component 1. The multiple light emitting ends 3 in the lower layer emit different wavelengths of light. Similarly, taking four light emitting ends 3 in the lower layer as an example, the light emitting wavelengths of the four light emitting ends 3 can be 1270nm, 1290nm, 1310nm and 1330nm. This is just an example. The multiple light emitting ends 3 in the lower layer are coupled to multiple light inlet ports in the lower layer of the double-layer Z-block component 1. A dual-layer Z-block component 1 and a dual-layer fiber array 2 are coupled sequentially along the light propagation direction by a dual-layer converging lens 4 and an optical isolator 5. The upper light output port of the dual-layer Z-block component 1 is coupled to the upper light input port of the dual-layer fiber array 2 via the dual-layer converging lens 4 and the optical isolator 5. The lower light output port of the dual-layer Z-block component 1 is coupled to the lower light input port of the dual-layer fiber array 2 via the dual-layer converging lens 4 and the optical isolator 5.

[0024] By merging two single-layer Z-block components into a single double-layer Z-block component 1, only one Z-block component is needed. At the same time, the light emitting end 3 coupled to the double-layer Z-block component 1 is also distributed in upper and lower layers. In addition, a double-layer fiber array 2 and a double-layer converging lens 4 are used, thereby effectively reducing the width of the overall space occupied and achieving the goal of saving PCB layout space.

[0025] Example 2 like Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: Multiple light emitting ends 3 located in the upper layer are fixed on the upper surface of the cold surface block 610 in the TEC cooler 6, while multiple light emitting ends 3 located in the lower layer are fixed on the lower surface of the cold surface block 610 in the TEC cooler 6.

[0026] Example 3 like Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 2, as detailed below: The TEC cooler 6 includes a cold surface 610, with a hot surface 620 arranged at each of the two ends of the cold surface 610, and a TEC chip 630 arranged between each hot surface 620 and the cold surface 610, that is, the cold surface 610 and the two hot surface 620 form an H-shaped structure.

[0027] Furthermore, the cold surface block 610 is an H-shaped block, and the hot surface block 620 is a C-shaped block. The side plates at both ends of the cold surface block 610 enter the concave cavities of the two hot surface blocks 620 respectively. The multiple light emitting ends 3 in the upper layer are fixed on the upper surface of the web plate in the cold surface block 610, and the multiple light emitting ends 3 in the lower layer are fixed on the lower surface of the web plate in the cold surface block 610.

[0028] The width of the TEC cooler 6 is 5.6mm, which means that the distance between the outer surfaces of the two hot surfaces 620 in the TEC cooler 6 is 5.6mm, which is 3.4mm smaller than the 9mm in the prior art. The material of the cold surface 610 is preferably ceramic, and the material of the hot surface 620 is also preferably ceramic.

[0029] Example 4 like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 3, as detailed below: The dual-layer Z-block assembly 1, the dual-layer fiber array 2, the dual-layer converging lens 4, and the hot surface block 620 in the TEC cooler 6 are respectively fixed on the base 7, while the optical isolator 5 is fixed to the dual-layer fiber array 2. The width of the TEC cooler 6 is the same as the width of the base 7.

[0030] Furthermore, the base 7 is preferably made of tungsten copper.

[0031] Example 5 like Figure 3 , Figure 4 , Figure 6 As shown, this embodiment is a further improvement on embodiment 4, as detailed below: At one end of the base 7 near the hot surface block 620, there is a platform 710 on each side. The upper surface of each platform 710 is higher than the mounting surface of the base 7 used to fix the double-layer Z-block component 1, the double-layer fiber array 2, the double-layer converging lens 4 and the optical isolator 5. The two platforms 710 of the base 7 support the PCB board 8 which is electrically connected to the TEC cooler 6 and the optical emitter 3 respectively. When the two platforms 710 of the base 7 support the PCB board 8, the multiple optical emitters 3 on the upper layer and the multiple optical emitters 3 on the lower layer are distributed vertically along the center surface of the PCB board 8.

[0032] Example 6 like Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below: The light emitting end 3 includes a laser chip 310, which is fixed on a ceramic heat sink 320. The laser chip 310 is coupled to the light inlet of the double-layer Z-block assembly 1 through a collimating lens 330. That is, the emitted light of the laser chip 310 is coupled into the light inlet of the double-layer Z-block assembly 1 through the collimating lens 330. For a scheme containing a TEC cooler 6, the ceramic heat sink 320 and the collimating lens 330 are respectively fixed to the cold surface block 610 in the TEC cooler 6.

[0033] Example 7 like Figure 4 , Figure 5 As shown, this embodiment is a further improvement on any one of embodiments 1 to 6, as detailed below: In the dual-layer Z-block component 1, there are four light inlets in the upper layer and four light inlets in the lower layer. There are also four light emitting ends 3 in both the upper and lower layers. The emitted light wavelengths of the four light emitting ends 3 in the upper layer can be 1270nm, 1290nm, 1310nm and 1330nm, and the emitted light wavelengths of the four light emitting ends 3 in the lower layer can also be 1270nm, 1290nm, 1310nm and 1330nm.

[0034] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A small-sized four-wavelength light source for CPO silicon photonic engines, characterized in that, include: The double-layer Z-block component (1), the double-layer fiber array (2), and multiple optical emitters (3) are distributed in two layers, upper and lower. The multiple optical emitters (3) in the upper layer emit different wavelengths and are coupled to multiple optical inlets in the upper layer of the double-layer Z-block component (1). The multiple optical emitters (3) in the lower layer emit different wavelengths and are coupled to multiple optical inlets in the lower layer of the double-layer Z-block component (1). The optical outlets of the upper and lower layers of the double-layer Z-block component (1) are coupled to the optical inlets of the upper and lower layers of the double-layer fiber array (2) in sequence through a double-layer converging lens (4) and an optical isolator (5).

2. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 1, characterized in that, Multiple light emitting ends (3) located in the upper layer are fixed on the upper surface of the cold surface block (610) in the TEC cooler (6), and multiple light emitting ends (3) located in the lower layer are fixed on the lower surface of the cold surface block (610) in the TEC cooler (6).

3. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 2, characterized in that, The TEC cooler (6) includes: a cold surface block (610), a hot surface block (620) is arranged at each of the two ends of the cold surface block (610), and a TEC chip (630) is arranged between each hot surface block (620) and the cold surface block (610).

4. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 3, characterized in that, The cold surface block (610) is an H-shaped block, and the hot surface block (620) is a C-shaped block. The side plates at both ends of the cold surface block (610) enter the concave cavities of the two hot surface blocks (620) respectively. Multiple light emitting ends (3) in the upper layer are fixed on the upper surface of the web plate in the cold surface block (610), and multiple light emitting ends (3) in the lower layer are fixed on the lower surface of the web plate in the cold surface block (610).

5. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 3, characterized in that, The TEC cooler (6) has a width of 5.6 mm, the cold side panel (610) is made of ceramic, and the hot side panel (620) is made of ceramic.

6. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 3, 4, or 5, characterized in that, The hot surface (620) of the dual-layer Z-block assembly (1), dual-layer fiber array (2), dual-layer converging lens (4) and TEC cooler (6) are respectively fixed on the base (7). The optical isolator (5) is fixed to the dual-layer fiber array (2). The width of the TEC cooler (6) is the same as the width of the base (7).

7. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 6, characterized in that, The base (7) is made of tungsten copper.

8. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 6, characterized in that, The base (7) has a platform (710) on each side near the end of the hot surface block (620). The upper surface of each platform (710) is higher than the mounting surface of the base (7) used to fix the double-layer Z-block assembly (1), the double-layer fiber array (2), the double-layer converging lens (4) and the optical isolator (5). The two platforms (710) of the base (7) support the PCB board (8) used to electrically connect to the TEC cooler (6) and the light emitting end (3) respectively. The multiple light emitting ends (3) on the upper layer and the multiple light emitting ends (3) on the lower layer are distributed on the center surface of the PCB board (8).

9. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 1, characterized in that, The light emitting end (3) includes a laser chip (310), which is fixed on a ceramic heat sink (320) and is coupled to the light inlet of the double-layer Z-block assembly (1) via a collimating lens (330).

10. A small-size four-wavelength light source for a CPO silicon photonic engine according to claim 1, characterized in that, The dual-layer Z-block component (1) has four light inlets in the upper layer and four light inlets in the lower layer, and four light emitting ends (3) in the upper layer and four light emitting ends (3) in the lower layer.

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