A reflow soldering resistant fiber array for a CPO silicon light engine

Abstract

The utility model relates to a kind of CPO silicon light engine is used to resist reflow soldering optical fiber array, comprising: cover plate, substrate and optical fiber, at least one upper V groove is opened on the lower surface of cover plate, each lower V groove is opened on the upper surface of substrate at corresponding each upper V groove, the bare optical fiber of optical fiber is located between cover plate and substrate and simultaneously in upper V groove and lower V groove, an upper support and lower support are respectively arranged above cover plate and below substrate, upper support and lower support are welded to tighten substrate and cover plate and let substrate cooperate cover plate bare optical fiber of the fiber of being clamped, the gap between cover plate and substrate is filled with hard glue, the thermal expansion coefficient of upper support and lower support is lower than the thermal expansion coefficient of substrate and cover plate.Affirmative effect is: when the optical fiber array of the resistance reflow soldering is applied in reflow soldering high temperature (260℃±5℃) condition, upper support and lower support can tightly tighten substrate and cover plate, to ensure that the position of bare optical fiber clamped between substrate and cover plate is not moved.

Description

Technical Field

[0001] This utility model relates to the field of fiber optic array technology, specifically to a reflow-resistant fiber optic array for CPO silicon photonic engines. Background Technology

[0002] Traditional CPO silicon photonics engines are soldered to the switch motherboard using high-temperature reflow soldering. The solder used is SAC305 (96.5% tin, 3% silver, 0.5% copper, melting point 217℃~221℃). The peak temperature of the high-temperature reflow soldering is 260℃±5℃, lasting for 10 seconds. Ordinary fiber optic arrays cannot withstand this high temperature for such a short time because the rigid adhesive between the cover plate and the substrate cannot withstand it, causing displacement of the bare optical fibers. The structure of an ordinary fiber optic array is as follows... Figure 1 , Figure 2 As shown, ordinary fiber arrays cannot be used in CPO silicon photonics engines that require high-temperature reflow soldering. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a reflow-resistant fiber array for CPO silicon photonics engines, so as to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A reflow-resistant fiber array for CPO silicon photonics engines includes: a cover plate, a substrate, and optical fibers. At least one upper V-groove is formed on the lower surface of the cover plate, and a lower V-groove is formed on the upper surface of the substrate at each corresponding upper V-groove. The bare optical fibers are located between the upper and lower cover plates and the substrate and are simultaneously located within the upper and lower V-grooves. An upper support and a lower support are respectively arranged above the cover plate and below the substrate. The upper support and the lower support are welded together to clamp the substrate and the cover plate and allow the substrate to cooperate with the cover plate to clamp the bare optical fibers. The gap between the cover plate and the substrate is filled with rigid adhesive. The coefficient of thermal expansion of the upper support and the lower support is lower than that of the substrate and the cover plate.

[0005] The beneficial effects of this utility model are: Because the thermal expansion coefficient of the upper bracket is lower than that of the substrate, and the thermal expansion coefficient of the upper bracket is lower than that of the cover plate, and the thermal expansion coefficient of the lower bracket is lower than that of the substrate, and the thermal expansion coefficient of the lower bracket is lower than that of the cover plate, the reduction ratio of the upper and lower brackets is relatively small, while the reduction ratio of the substrate and the cover plate is relatively large. This ensures that the upper and lower brackets can be fitted with the substrate and the cover plate with zero clearance when producing reflow soldering resistant fiber arrays. After the upper and lower brackets are welded, when the reflow soldering resistant fiber array is applied under the high temperature (260℃±5℃) conditions of reflow soldering, the upper and lower brackets can firmly clamp the substrate and the cover plate to ensure that the position of the bare fiber clamped between the substrate and the cover plate does not move. Since the cover plate and the substrate are clamped together by the upper and lower supports, the filling hard glue only plays an auxiliary role in preventing dirt from entering the gap between the bare optical fiber and the upper and lower V-grooves during the polishing of the fiber array end face.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the upper support has an upward arched structure, and the lower support has a downward arched structure.

[0008] Furthermore, there is a gap between the lower surface of the upper support and the upper surface of the lower support.

[0009] The further beneficial effect of adopting the above is that it can effectively clamp the substrate and the cover plate to ensure that the position of the bare optical fiber clamped between the substrate and the cover plate remains unchanged.

[0010] Furthermore, the gap between the lower surface of the upper support and the upper surface of the lower support is less than or equal to 20 μm.

[0011] Furthermore, the thickness of the upper support is 0.2mm±0.03mm, and the thickness of the lower support is 0.2mm±0.03mm. The upper and lower supports are welded together using laser penetration welding.

[0012] The further beneficial effect of adopting the above is that it can ensure that the deformation stress is small at high temperature, so as not to damage the substrate and cover plate.

[0013] Furthermore, the gap between the cover plate and the substrate is less than or equal to 20 μm.

[0014] Furthermore, the cover plate has an upper inclined surface between its upper surface and each of its two sides, the two upper inclined surfaces being symmetrically distributed in a figure-eight shape with the opening facing upwards; the substrate has a lower inclined surface between its lower surface and each of its two sides, the two lower inclined surfaces being symmetrically distributed in a figure-eight shape with the opening facing downwards; the cover plate is located in the upper groove in the middle area of ​​the upper support, and its two upper inclined surfaces are respectively in close contact with the two inclined side walls of the upper groove; the substrate is located in the lower groove in the middle area of ​​the lower support, and its two lower inclined surfaces are respectively in close contact with the two inclined side walls of the lower groove; there are gaps between the cover plate and the bottom of the upper groove, and between the substrate and the bottom of the lower groove.

[0015] The further beneficial effect of adopting the above is that the structure can ensure that the clamping force is evenly distributed on the top, bottom, left and right.

[0016] Furthermore, the upper inclined surface, the lower inclined surface, the inclined sidewall of the upper groove, and the inclined sidewall of the upper groove are all inclined at 45°.

[0017] Furthermore, the upper and lower supports are made of Invar alloy, while the substrate and cover are made of Schott 33 glass.

[0018] Furthermore, the upper and lower supports are made of Invar alloy, grade 4J36. Attached Figure Description

[0019] Figure 1 This is a front view of a fiber optic array in the prior art; Figure 2 This is a side view of a fiber optic array in the prior art; Figure 3 This is a structural diagram of the reflow-resistant fiber array for the CPO silicon photonic engine in this utility model; Figure 4 This is a top view of the reflow-resistant fiber array for the CPO silicon photonics engine in this utility model. Figure 5 This is an assembly drawing of the cover plate and the base plate; Figure 6 This is an assembly drawing of the upper and lower supports.

[0020] The attached diagram lists the components represented by each number as follows: 1. Cover plate, 110. Upper V-groove, 120. Upper bevel, 2. Substrate, 210. Lower V-groove, 220. Lower bevel, 3. Optical fiber, 310. Bare optical fiber, 4. Upper bracket, 410. Upper groove, 5. Lower bracket, 510. Upper groove, 6. Rigid adhesive. Detailed Implementation

[0021] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0022] Example 1 like Figures 3-6 As shown, a reflow-resistant fiber array for a CPO silicon photonics engine includes: The cover plate 1, the substrate 2, and the optical fiber 3 are provided. At least one upper V-groove 110 is formed on the lower surface of the cover plate 1. For example, there can be four or eight upper V-grooves 110. All upper V-grooves 110 are preferably distributed side by side at equal intervals. If there are four, the optical fiber array will eventually be a four-channel optical fiber array. If there are eight, the optical fiber array will eventually be an eight-channel optical fiber array. Of course, this is just an example and does not exclude other numbers. On the upper surface of the substrate 2, a lower V-groove 210 is formed at each corresponding upper V-groove 110. That is, the number of lower V-grooves 210 is the same as the number of upper V-grooves 110. The bare optical fiber 310 of the optical fiber 3 is located between the upper and lower cover plates 1 and the substrate 2, and the bare optical fiber 310 of the optical fiber 3 is simultaneously located in the upper V groove 110 of the cover plate 1 and the lower V groove 210 of the substrate 2. An upper support 4 is arranged above the cover plate 1 and a lower support 5 is arranged below the substrate 2. The upper support 4 and the lower support 5 are welded together to clamp the substrate 2 and the cover plate 1. When the substrate 2 and the cover plate 1 are clamped by the upper support 4 and the lower support 5, the substrate 2 cooperates with the cover plate 1 to clamp the bare optical fiber 310 of the optical fiber 3. The gap between the cover plate 1 and the substrate 2 is filled with hard glue 6, because the cover plate 1 and the substrate 2 rely on... The upper bracket 4 and the lower bracket 5 are clamped together, so the hard glue 6 that is filled only plays an auxiliary role in preventing dirt from entering the gap between the bare fiber 310 and the upper V-groove 110 and the lower V-groove 210 during the fiber array end face grinding process. The coefficient of thermal expansion of the upper support 4 is lower than that of the substrate 2, and the coefficient of thermal expansion of the upper support 4 is lower than that of the cover plate 1. The coefficient of thermal expansion of the lower support 5 is lower than that of the substrate 2, and the coefficient of thermal expansion of the lower support 5 is lower than that of the cover plate 1.

[0023] The production of this reflow-resistant fiber array can be carried out in an environment of 5℃~10℃. Since the thermal expansion coefficient of the upper bracket 4 is lower than that of the substrate 2, and lower than that of the cover plate 1, and the thermal expansion coefficient of the lower bracket 5 is lower than that of the substrate 2 and lower than that of the cover plate 1, the reduction ratio of the upper bracket 4 and the lower bracket 5 is relatively small, while the reduction ratio of the substrate 2 and the cover plate 1 is relatively large. This ensures that the upper bracket 4 and the lower bracket 5 can be fitted with the substrate 2 and the cover plate 1 with zero clearance during the production of the reflow-resistant fiber array. After the upper bracket 4 and the lower bracket 5 are welded, when the application environment temperature of the reflow-resistant fiber array is above room temperature (above 10℃), or under the high temperature conditions of reflow soldering (260℃±5℃), the upper bracket 4 and the lower bracket 5 can firmly clamp the substrate 2 and the cover plate 1 to ensure that the position of the bare fiber 310 clamped between the substrate 2 and the cover plate 1 remains unchanged.

[0024] Example 2 like Figure 3 , Figure 6 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The upper support 4 has an upper arched structure, and the lower support 5 has a lower arched structure. Of course, it can also be non-arched, but it is preferred to be arched, which is convenient for processing and at the same time reduces its thickness and weight.

[0025] Furthermore, there is a gap between the lower surface of the upper bracket 4 and the upper surface of the lower bracket 5, which can effectively clamp the substrate 2 and the cover plate 1. The gap between the lower surface of the upper bracket 4 and the upper surface of the lower bracket 5 is less than or equal to 20μm. If the gap is too large, it will lead to poor welding quality. If the gap is too small, the material precision cannot be guaranteed.

[0026] The upper support 4 and the lower support 5 are preferably welded together by laser penetration welding.

[0027] The thickness of the upper bracket 4 is 0.2mm±0.03mm, and the thickness of the lower bracket 5 is 0.2mm±0.03mm, which can ensure that the deformation stress is small at high temperature and will not damage the base plate 2 and the cover plate 1.

[0028] Example 3 like Figure 3 , Figure 5 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: The gap between cover plate 1 and substrate 2 is less than or equal to 20 μm.

[0029] Example 4 like Figure 3 , Figure 5As shown in Figure 6, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The cover plate 1 has an upper inclined surface 120 between its upper surface and two side surfaces, forming an angled corner between the upper surface and side surfaces. The two upper inclined surfaces 120 are symmetrically distributed in a V-shape with their openings facing upwards. The substrate 2 has a lower inclined surface 220 between its lower surface and two side surfaces, forming an angled corner between the lower surface and side surfaces. The two lower inclined surfaces 220 are symmetrically distributed in a V-shape with their openings facing downwards. The cover plate 1 is located within the upper groove 410 in the middle area of ​​the upper support 4, and the two upper inclined surfaces 120 on the cover plate 1 are respectively... The two inclined sidewalls of the upper groove 410 are closely attached, that is, the inclination angle of the upper inclined surface 120 is the same as the inclination angle of the inclined sidewall of the upper groove 410; the substrate 2 is located in the lower groove 510 in the middle area of ​​the lower support 5 and the two lower inclined surfaces 220 on it are closely attached to the two inclined sidewalls of the lower groove 510 respectively, that is, the inclination angle of the lower inclined surface 220 is the same as the inclination angle of the inclined sidewall of the lower groove 510; there is a gap between the cover plate 1 and the bottom of the upper groove 410, and there is a gap between the substrate 2 and the bottom of the lower groove 510. This structure can ensure that the clamping force is evenly distributed on the top, bottom, left and right.

[0030] If the area where the upper V-groove 110 is opened on the preferred cover plate 1 is the same width and thickness as the area where the lower V-groove 210 is opened on the substrate 2, then the structure of the upper support 4 and the structure of the lower support 5 can be the same, and only one type of support needs to be produced. At this time, the upper groove 410 and the lower groove 510 have the same dimensions, that is, the width and depth are the same.

[0031] Furthermore, the upper inclined surface 120 is inclined at 45°, the lower inclined surface 220 is inclined at 45°, the inclined sidewall of the upper groove 410 is inclined at 45°, and the inclined sidewall of the upper groove 410 is inclined at 45°. 45° is just an example, and other degrees are not excluded in actual applications, such as 30°, 60°, etc.

[0032] Example 5 like Figures 3-6 As shown, this embodiment is a further improvement on embodiment 1, 2, 3, or 4, as detailed below: The upper support 4 is made of Invar alloy, the lower support 5 is made of Invar alloy, the substrate 2 is made of Schott 33 glass, and the cover plate 1 is made of Schott 33 glass. The coefficient of thermal expansion of Schott 33 glass is 3.3 ppm / ℃.

[0033] Furthermore, the upper support 4 is made of Invar alloy, grade 4J36, and the lower support 5 is made of Invar alloy, grade 4J36. The coefficient of thermal expansion of Invar alloy 4J36 is 1ppm / ℃~1.8ppm / ℃.

[0034] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A reflow-resistant fiber array for CPO silicon photonics engines, characterized in that, include: The cover plate (1), substrate (2), and optical fiber (3) are provided. At least one upper V-groove (110) is formed on the lower surface of the cover plate (1). A lower V-groove (210) is formed on the upper surface of the substrate (2) at each corresponding upper V-groove (110). The bare optical fiber (310) of the optical fiber (3) is located between the upper and lower distributed cover plate (1) and substrate (2) and is simultaneously situated within the upper V-groove (110) and the lower V-groove (210). The cover plate (1) is located above and... An upper bracket (4) and a lower bracket (5) are respectively arranged below the substrate (2). The upper bracket (4) and the lower bracket (5) are welded together to clamp the substrate (2) and the cover plate (1) and allow the substrate (2) to clamp the bare optical fiber (310) of the optical fiber (3) in conjunction with the cover plate (1). The gap between the cover plate (1) and the substrate (2) is filled with hard glue (6). The coefficient of thermal expansion of the upper bracket (4) and the lower bracket (5) is lower than that of the substrate (2) and the cover plate (1).

2. The reflow-resistant fiber array for a CPO silicon photonic engine according to claim 1, characterized in that, The upper support (4) has an upper arched structure, and the lower support (5) has a lower arched structure.

3. The reflow-resistant fiber array for a CPO silicon photonic engine according to claim 1, characterized in that, There is a gap between the lower surface of the upper support (4) and the upper surface of the lower support (5).

4. The reflow-resistant fiber array for a CPO silicon photonic engine according to claim 3, characterized in that, The gap between the lower surface of the upper support (4) and the upper surface of the lower support (5) is less than or equal to 20 μm.

5. A reflow-resistant fiber array for a CPO silicon photonic engine according to claim 2, characterized in that, The thickness of the upper bracket (4) is 0.2mm ± 0.03mm, and the thickness of the lower bracket (5) is 0.2mm ± 0.03mm. The upper bracket (4) and the lower bracket (5) are welded together by laser penetration welding.

6. The reflow-resistant fiber array for a CPO silicon photonic engine according to claim 1, characterized in that, The gap between the cover plate (1) and the substrate (2) is less than or equal to 20 μm.

7. A reflow-resistant fiber array for a CPO silicon photonic engine according to any one of claims 1 to 6, characterized in that, The cover plate (1) has an upper inclined surface (120) between its upper surface and two side surfaces. The two upper inclined surfaces (120) are symmetrically distributed in a figure-eight shape with their openings facing upwards. The substrate (2) has a lower inclined surface (220) between its lower surface and two side surfaces. The two lower inclined surfaces (220) are symmetrically distributed in a figure-eight shape with their openings facing downwards. The cover plate (1) is located in the upper groove (410) in the middle area of ​​the upper support (4), and its two upper inclined surfaces (120) are respectively in close contact with the two inclined side walls of the upper groove (410). The substrate (2) is located in the lower groove (510) in the middle area of ​​the lower support (5), and its two lower inclined surfaces (220) are respectively in close contact with the two inclined side walls of the lower groove (510). There are gaps between the cover plate (1) and the bottom of the upper groove (410) and between the substrate (2) and the bottom of the lower groove (510).

8. A reflow-resistant fiber array for a CPO silicon photonic engine according to claim 7, characterized in that, The inclined sidewalls of the upper inclined surface (120), lower inclined surface (220), upper groove (410), and upper groove (410) are all inclined at 45°.

9. A reflow-resistant fiber array for a CPO silicon photonic engine according to claim 1, characterized in that, The upper support (4) and lower support (5) are made of Invar alloy, and the substrate (2) and cover plate (1) are made of Schott 33 glass.

10. A reflow-resistant fiber array for a CPO silicon photonic engine according to claim 9, characterized in that, The upper support (4) and lower support (5) are made of Invar alloy, grade 4J36.

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