A high-reliability 800G SR8 optical module

Abstract

The utility model relates to a kind of high-reliability 800G SR8 optical modules, lens is laid on the front of PCB, two opposite sides of lens are respectively provided with step near PCB, at least one through hole is respectively provided in the region of each lens each side having step on PCB, each lens is respectively provided with cylinder into the through hole and extends out the reverse surface of PCB at the region corresponding each through hole;Black glue is dotted between the front of PCB and the outer side of lens, and the black glue is wrapped on the step of lens side at the same time, and after flowing into the through hole and wrapping cylinder, it flows to the reverse surface of PCB.The beneficial effect is that the black glue is wrapped on the step of lens side at the same time, and after flowing into the through hole and wrapping cylinder, it flows to the reverse surface of PCB, black glue can form sandwich rivet type structure after solidification, so that black glue can be firmly fixed with PCB, and black glue and lens will not fall off from PCB, effectively improve reliability.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to a high-reliability 800G SR8 optical module. Background Technology

[0002] A traditional 800G SR8 optical module includes a PCB board and lenses. The lenses are mounted on the front of the PCB board. Steps are provided on the two opposite sides of the lenses near the PCB board. As shown in the diagram, steps are provided on the left and right sides of the lenses near the PCB board. Black adhesive is applied between the front of the PCB board and the outer side of the lenses to fix the lenses to the PCB board. The adhesive covers the steps on the sides of the lenses, preventing the lenses from detaching even if the adhesion between the lenses and the adhesive is weak. On the front of the PCB board, each lens has a recessed cavity for accommodating the chip, containing an optical chip coupled to the lens. Also on the front of the PCB board, each lens has a recessed cavity for accommodating the chip, containing an electrical chip electrically connected to the optical chip. Specifically... Figure 1 As shown, although the above solution prevents the lens from detaching from the black adhesive even when the adhesion between the lens and the black adhesive is poor, if the adhesion between the black adhesive and the PCB board is poor, the lens and black adhesive as a whole will still detach from the PCB board, so the reliability is low. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a high-reliability 800G SR8 optical module to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A high-reliability 800G SR8 optical module includes: a PCB board and lenses disposed on the front side of the PCB board. Steps are provided on the two opposite sides of the lenses near the PCB board. At least one through hole penetrating the front and back sides of each lens is opened in the area corresponding to the step on each side of the lens. Each lens has a column that enters the through hole and extends out of the back side of the PCB board at the corresponding through hole. Black glue is applied between the front side of the PCB board and the outer side of the lens. The black glue wraps the step on the side of the lens and flows into the through hole to wrap the column before flowing to the back side of the PCB board.

[0005] The beneficial effects of this utility model are as follows: By opening through holes on the PCB board and adding a column on the lens that enters the through holes and extends out of the reverse side of the PCB board, when applying black glue, the applied black glue wraps around the upper step on the side of the lens. At the same time, the applied black glue flows into the through holes, wraps around the column, and flows to the reverse side of the PCB board. In this way, after the black glue cures, a sandwich rivet-like structure can be formed, which makes the black glue firmly fixed to the PCB board. Even if the adhesion between the black glue and the PCB board is poor, the black glue and the lens as a whole will not fall off the PCB board, effectively improving reliability.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the inner diameter of the through hole is 0.8mm ± 0.05mm, and the outer diameter of the column is 0.5mm ± 0.05mm.

[0008] Furthermore, the length of the column extending beyond the reverse side of the PCB board is 0.2mm ± 0.05mm.

[0009] Furthermore, the PCB board has three through holes in the area corresponding to the step on each side of each lens, and each lens has three pillars on each side corresponding to the three through holes.

[0010] Furthermore, two lenses are arranged side by side on the front of the PCB board.

[0011] Furthermore, each lens has a sealing structure with a through-hole on the cavity wall used to accommodate the chip.

[0012] The further beneficial effect of adopting the above is that it can effectively prevent black glue from entering the cavity of the lens used to accommodate the chip, thereby avoiding contamination of the optical chip and the electrical chip.

[0013] Furthermore, on the front side of the PCB board, there is an optical chip coupled to the lens in the recess of each lens used to accommodate the chip.

[0014] Furthermore, on the front side of the PCB board, there is an electrical chip that is electrically connected to the optical chip in the recess of each lens used to accommodate the chip. Attached Figure Description

[0015] Figure 1 This is a structural diagram of an 800G SR8 optical module in the existing technology; Figure 2 This is a structural diagram of the high-reliability 800G SR8 optical module without black adhesive in this utility model; Figure 3 This is a structural diagram of the high-reliability 800G SR8 optical module of this utility model.

[0016] The attached diagram lists the components represented by each number as follows: 1. PCB board, 110, through hole; 2. Lens, 210, step; 220, column; 230, adhesive barrier structure; 3. Black adhesive; 4. Optical chip. Detailed Implementation

[0017] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0018] Example 1 like Figure 2 , Figure 3 As shown, a high-reliability 800G SR8 optical module includes a PCB board 1 and a lens 2. The lens 2 is disposed on the front side of the PCB board 1. Steps 210 are provided on two opposite sides of the lens 2 near the PCB board 1. As shown in the figure, steps 210 are provided on the left and right sides of the lens 2 near the PCB board 1. At least one through-hole 110 is formed on the PCB board 1 in the area corresponding to each lens 2 with step 210 on each side. This can be understood as: at least one through-hole 110 is formed on the PCB board 1 in the area corresponding to the step 210 on the left side of each lens 2, and at least one through-hole 110 is formed on the PCB board 1 in the area corresponding to the step 210 on the right side of each lens 2. Each through-hole 110 penetrates both the front and back sides of the PCB board 1. Each lens 2 has a corresponding through-hole 110. Each part is provided with a column 220 that enters the through hole 110 and extends out of the reverse side of the PCB board 1. That is, the outer diameter of the column 220 is smaller than the inner diameter of the through hole 110. The black glue 3 can flow into the through hole 110 and the column 220 extends out of the reverse side of the PCB board 1. The black glue 3 is applied between the front side of the PCB board 1 and the outer side of the lens 2, and the applied black glue 3 wraps around the upper step 210 on the side of the lens 2. At the same time, the applied black glue 3 flows into the through hole 110, wraps around the column 220 and flows to the reverse side of the PCB board 1. In this way, after the black glue 3 cures, a sandwich rivet-like structure can be formed. Of course, black glue 3 can also be applied to the reverse side of the PCB board 1 so that the black glue 3 can be firmly fixed to the PCB board 1. Even if the adhesion between the black glue 3 and the PCB board 1 is poor, the black glue 3 and the lens 2 will not fall off the PCB board 1 as a whole, effectively improving reliability.

[0019] Example 2 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The inner diameter of the through hole 110 is 0.8mm ± 0.05mm, and the outer diameter of the column 220 is 0.5mm ± 0.05mm.

[0020] Furthermore, the column 220 extends 0.2mm ± 0.05mm beyond the reverse side of the PCB board 1.

[0021] Example 3 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: The number of through holes 110 opened on the PCB board 1 in the area corresponding to the step 210 on each side of each lens 2 is three, that is, the PCB board 1 has six through holes 110 that penetrate the front and back of each lens 2. Each lens 2 has three pillars 220 on each side corresponding to the three through holes 110, that is, each lens 2 has six pillars 220.

[0022] Furthermore, two lenses 2 are arranged side by side on the front side of the PCB board 1, that is, twelve through holes 110 are opened on the PCB board 1 to penetrate its front and back sides.

[0023] Example 4 like Figure 2 , Figure 3 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: Each lens 2 has a sealing through-hole 110 and a glue-blocking structure 230 on the cavity wall of the cavity used to accommodate the chip, which can effectively prevent the black glue 3 from entering the cavity of the lens 2 used to accommodate the chip, thereby avoiding contamination of the optical chip 4 and the electrical chip.

[0024] Furthermore, on the front side of the PCB board 1, an optical chip 4 coupled to the lens 2 is provided in the recess of each lens 2 used to accommodate the chip, and an electrical chip electrically connected to the optical chip 4 is provided in the recess of each lens 2 used to accommodate the chip.

[0025] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A high-reliability 800G SR8 optical module, comprising: The PCB board (1) and the lens (2) arranged on the front side of the PCB board (1) are characterized in that the two opposite sides of the lens (2) are provided with steps (210) near the PCB board (1), and the PCB board (1) is characterized in that at least one through hole (110) is opened in the area corresponding to the step (210) on each side of each lens (2) through its front and back sides, and each lens (2) is provided with a column (220) that enters the through hole (110) and extends out of the back side of the PCB board (1) at the corresponding through hole (110); black glue (3) is applied between the front side of the PCB board (1) and the outer side of the lens (2), and the black glue (3) wraps the step (210) on the side of the lens (2) and flows into the through hole (110) to wrap the column (220) and then flows to the back side of the PCB board (1).

2. The high-reliability 800G SR8 optical module according to claim 1, characterized in that, The inner diameter of the through hole (110) is 0.8mm ± 0.05mm, and the outer diameter of the column (220) is 0.5mm ± 0.05mm.

3. A high-reliability 800G SR8 optical module according to claim 1, characterized in that, The column (220) extends 0.2mm ± 0.05mm beyond the reverse side of the PCB board (1).

4. A high-reliability 800G SR8 optical module according to claim 1, characterized in that, The PCB board (1) has three through holes (110) in the area corresponding to the step (210) on each side of each lens (2), and each lens (2) has three pillars (220) on each side corresponding to the three through holes (110).

5. A high-reliability 800G SR8 optical module according to any one of claims 1 to 4, characterized in that, Two lenses (2) are arranged side by side on the front side of the PCB board (1).

6. A high-reliability 800G SR8 optical module according to claim 1, characterized in that, Each lens (2) has a sealing structure (230) with a sealing through hole (110) on the cavity wall for accommodating the chip.

7. A high-reliability 800G SR8 optical module according to claim 1, characterized in that, On the front side of the PCB board (1), there is an optical chip (4) coupled to the lens (2) in the cavity of each lens (2) for accommodating the chip.

8. A high-reliability 800G SR8 optical module according to claim 7, characterized in that, On the front side of the PCB board (1), there is an electrical chip that is electrically connected to the optical chip (4) in the recess of each lens (2) for accommodating the chip.

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