A 400g dr4 silicon optical engine

Abstract

The utility model relates to a 400G DR4 silicon light engine, include: base and kovan support, kovan support adopts the mode of laser penetration welding and is welded on the base, the upper surface of kovan support has two protruding blocks that are distributed side by side, a collimating lens is suspendedly arranged in the gap between the two protruding blocks, the two side surfaces of the collimating lens are respectively fixed by adhesive bonding, there is a gap between the lower surface of the collimating lens and the upper surface of kovan support, a light isolator is fixed by adhesive bonding on the light exit surface of the collimating lens, and the two side surfaces of the light isolator are respectively fixed by adhesive bonding. Advantageous effects: because the thermal expansion of kovan support is low, far less than the adhesive, and it is welded on the base by the mode of laser penetration welding, and only the side surface of the collimating lens is fixed by adhesive bonding with the protruding blocks on the kovan support, therefore, the collimating lens has small high-low displacement, and the light path is stable.

Description

Technical Field

[0001] This utility model relates to the field of silicon photonics engine technology, specifically to a 400G DR4 silicon photonics engine. Background Technology

[0002] The structural diagram of a traditional 400G DR4 silicon photonics engine is shown below. Figure 1 , Figure 2 As shown, it includes: a base, a laser chip, a collimating lens, an optical isolator, a converging lens, a silicon photonic chip, a fiber array, a ceramic heat sink, and a ceramic pad. The silicon photonic chip is fixed to the upper surface of the base, and the laser chip is fixed to the upper surface of the base via the ceramic heat sink. The collimating lens, optical isolator, and converging lens are sequentially coupled between the laser chip and the silicon photonic chip along the light propagation direction. That is, the emitted light from the laser chip is coupled into the silicon photonic chip after passing through the collimating lens, optical isolator, and converging lens in sequence. The collimating lens is bonded to the upper surface of the base with adhesive, and the optical isolator is fixed to the upper surface of the base via the ceramic pad. On the surface, the converging lens is bonded to the upper surface of the base with adhesive, preferably UV adhesive. The base is made of tungsten copper. The output waveguide of the silicon photonic chip is coupled to the fiber array, that is, the light emitted from the silicon photonic chip is coupled into the fiber array through the output waveguide. The output waveguide of the silicon photonic chip is obliquely distributed, and the end face of the fiber array is oblique, and the oblique angle of the end face of the fiber array is the same as the oblique angle of the output waveguide. There are four output waveguides of the silicon photonic chip. Due to the expansion of the adhesive, the lens will shift. In particular, the collimating lens has a 0.5dB tolerance of only ±0.5μm, and the converging lens has a 0.5dB tolerance of ±2μm. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a 400G DR4 silicon photonics engine to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A 400G DR4 silicon photonics engine includes a base and a Kovar bracket. The Kovar bracket is welded to the base using laser penetration welding. The upper surface of the Kovar bracket has two protrusions arranged side by side. A collimating lens is suspended in the gap between the two protrusions. The two sides of the collimating lens are respectively bonded to the protrusions with adhesive. There is a gap between the lower surface of the collimating lens and the upper surface of the Kovar bracket. An optical isolator is bonded to the light-emitting surface of the collimating lens. The two sides of the optical isolator are respectively bonded to the protrusions with adhesive.

[0005] Based on the above technical solution, the present invention can be further improved as follows.

[0006] Furthermore, the gap between the lower surface of the collimating lens and the upper surface of the Kovar support is 50μm to 100μm.

[0007] Furthermore, the gap between the side of the collimating lens and the side of the protrusion is less than 10 μm, and the gaps on both sides are equal.

[0008] Furthermore, a laser chip coupled to the incident surface of the collimating lens is arranged above the base. The laser chip is fixed to the upper surface of the base by a heat sink. A converging lens coupled to the output surface of the optical isolator is fixed on the upper surface of the Kovar bracket. A silicon photonic chip coupled to the output surface of the converging lens is fixed on the upper surface of the base.

[0009] Furthermore, the converging lens is bonded and fixed to the Kovar bracket with adhesive.

[0010] Furthermore, the output waveguide of the silicon photonics chip is coupled to the fiber array.

[0011] Furthermore, the output waveguide of the silicon photonics chip is tilted; the end face of the fiber array is inclined, and the tilt angle is the same as that of the output waveguide.

[0012] Furthermore, the silicon photonics chip has four output waveguides.

[0013] Furthermore, the base is made of tungsten copper.

[0014] The beneficial effects of this utility model are as follows: In this solution, a Kovar bracket is added between the collimating lens and the base, and the Kovar bracket is welded to the base using laser penetration welding. When coupling the collimating lens, the collimating lens is suspended in the gap between the two protrusions. After coupling is completed, the two sides of the collimating lens are respectively bonded to the protrusions with glue, that is, the lower surface of the collimating lens does not contact the upper surface of the Kovar bracket. Since the thermal expansion of the Kovar bracket is low, much less than that of the glue, and it is welded to the base using laser penetration welding, the vertical displacement of the collimating lens is small, the optical path is stable, and the optical isolator is bonded to the light-emitting surface of the collimating lens, which can save a ceramic pad and save costs. At the same time, the two sides of the optical isolator are also respectively bonded to the protrusions with glue, which is equivalent to increasing the bonding area between the collimating lens and the protrusions in the Kovar bracket, and the glue bonding force is stronger. Attached Figure Description

[0015] Figure 1 This is a front view of a portion of the structure of a 400G DR4 silicon photonics engine in the prior art; Figure 2 A top view of a 400G DR4 silicon photonics engine in the prior art; Figure 3 This is a top view of the 400G DR4 silicon photonics engine in this utility model; Figure 4 This is a front view of the 400G DR4 silicon photonics engine structure in this utility model; Figure 5 This is a side view of the partial structure of the 400G DR4 silicon photonics engine in this utility model; Figure 6 This is a structural diagram of the Kovar support in this utility model.

[0016] The attached diagram lists the components represented by each number as follows: 1. Base, 2. Kovar bracket, 210. Protrusion, 3. Collimating lens, 4. Adhesive, 5. Optical isolator, 6. Laser chip, 7. Heat sink, 8. Converging lens, 9. Silicon photonics chip, 10. Fiber optic array. Detailed Implementation

[0017] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0018] Example 1 like Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, a 400G DR4 silicon photonics engine includes: a base 1 and a Kovar bracket 2. The Kovar bracket 2 is welded to the base 1 by laser penetration welding. The number of welding points can be one, two, three, etc. For example, as shown in the figure, there are nine welding points. The thermal expansion is low, and the CTE of the Kovar bracket can be 4.5ppm / ℃. There are two protrusions 210 arranged side by side on the upper surface of the Kovar bracket 2. A collimating lens 3 is suspended in the gap between the two protrusions 210. The two sides of the collimating lens 3 are respectively bonded and fixed to the protrusions 210 by adhesive 4. There is a gap between the lower surface of the collimating lens 3 and the upper surface of the Kovar bracket 2, that is, the lower surface of the collimating lens 3 does not contact the upper surface of the Kovar bracket 2. An optical isolator 5 is bonded and fixed on the light-emitting surface of the collimating lens 3. The two sides of the optical isolator 5 are respectively bonded and fixed to the protrusions 210 by adhesive 4. The material of the base 1 can be tungsten copper, that is, it is still consistent with the existing technology.

[0019] In this design, a Kovar bracket 2 is added between the collimating lens 3 and the base 1, and the Kovar bracket 2 is welded to the base 1 using laser penetration welding. When coupling the collimating lens 3, the collimating lens 3 is suspended in the gap between the two protrusions 210. After coupling is completed, the two sides of the collimating lens 3 are respectively bonded to the protrusions 210 with glue 4, so that the lower surface of the collimating lens 3 does not contact the upper surface of the Kovar bracket 2. Since the thermal expansion of the Kovar bracket 2 is low, much smaller than that of the glue, and it is welded to the base 1 using laser penetration welding, the vertical displacement of the collimating lens 3 is small, and the optical path is stable. The optical isolator 5 is bonded to the light-emitting surface of the collimating lens 3, which can save a ceramic pad and save costs. At the same time, the two sides of the optical isolator 5 are also bonded to the protrusions 210 with glue 4, which is equivalent to increasing the bonding area between the collimating lens 3 and the protrusions 210 in the Kovar bracket 2, and the glue bonding force is stronger.

[0020] Example 2 like Figure 5 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The gap between the lower surface of the collimating lens 3 and the upper surface of the Kovar support 2 is 50μm to 100μm.

[0021] Furthermore, the gap between the side of the collimating lens 3 and the side of the protrusion 210 is less than 10μm, and the gaps on both sides are equal, which can ensure that the two sides of the collimating lens 3 and the glue 4 between the two protrusions 210 are symmetrical.

[0022] Example 3 like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: A laser chip 6 is arranged above the base 1 and coupled to the light-incident surface of the collimating lens 3. The laser chip 6 is fixed to the upper surface of the base 1 via a heat sink 7. A converging lens 8 coupled to the light-outceasing surface of the optical isolator 5 is fixed on the upper surface of the Kovar bracket 2. A silicon photonic chip 9 coupled to the light-outceasing surface of the converging lens 8 is fixed on the upper surface of the base 1. That is, the emitted light of the laser chip 6 is coupled into the silicon photonic chip 9 after passing through the collimating lens 3, the optical isolator 5 and the converging lens 8 in sequence.

[0023] Furthermore, the converging lens 8 is bonded and fixed to the Kovar bracket 2 with glue 4. Since the converging lens 8 has a large tolerance, it can be fixed using a traditional dispensing process.

[0024] Example 4 like Figure 3 As shown, this embodiment is a further improvement on embodiment 3, as detailed below: The output waveguide of the silicon photonic chip 9 is coupled to the fiber array 10, that is, the output light in the silicon photonic chip 9 is coupled into the fiber array 10 through the output waveguide.

[0025] As a preferred embodiment, the output waveguides of the silicon photonic chip 9 are tilted, the end face of the fiber array 10 is inclined, and the tilt angle of the end face of the fiber array 10 is the same as the tilt angle of the output waveguides. The number of output waveguides of the silicon photonic chip 9 is four.

[0026] The coupling process of the entire 400G DR4 silicon photonics engine is as follows: First, fix the silicon photonic chip 9 and the heat sink 7 with the laser chip 6 on it at the corresponding positions on the upper surface of the base 1; Then, place the Kovar bracket 2 at the corresponding position on the upper surface of the base 1, and couple the collimating lens 3 with the light-emitting surface bonded to the optical isolator 5 at the designated position. During coupling, let the optical isolator 5 and the collimating lens 3 contact the side of one of the protrusions 210 of the Kovar bracket 2, which can drive the Kovar bracket 2 to move. The Kovar bracket 2 was welded to the base 1 using laser penetration welding. After the laser welding temperature drops to room temperature, the converging lens 8 is inserted and coupled to the maximum optical power. Then, glue 4 is applied to bond and fix the two sides of the collimating lens 3 to the two protrusions 210, the two sides of the optical isolator 5 to the two protrusions 210, and the converging lens 8 to the Kovar bracket 2. The gap between the side of the collimating lens 3 and the side of the protrusion 210 is less than 10μm, and the gaps on both sides are equal to ensure that the glue 4 between the two sides of the collimating lens 3 and the two protrusions 210 is symmetrical. The lower surface of the collimating lens 3 does not contact the upper surface of the Kovar bracket 2. Finally, the fixed fiber array 10 can be coupled.

[0027] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A 400G DR4 silicon photonics engine, characterized in that, include: The base (1) and Kovar bracket (2) are welded to the base (1) by laser penetration welding. The upper surface of the Kovar bracket (2) has two protrusions (210) arranged side by side. A collimating lens (3) is suspended in the gap between the two protrusions (210). The two sides of the collimating lens (3) are respectively bonded to the protrusions (210) by glue (4). There is a gap between the lower surface of the collimating lens (3) and the upper surface of the Kovar bracket (2). An optical isolator (5) is bonded to the light-emitting surface of the collimating lens (3). The two sides of the optical isolator (5) are respectively bonded to the protrusions (210) by glue (4).

2. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The gap between the lower surface of the collimating lens (3) and the upper surface of the Kovar support (2) is 50μm to 100μm.

3. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The gap between the side of the collimating lens (3) and the side of the protrusion (210) is less than 10 μm, and the gaps on both sides are equal.

4. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, A laser chip (6) coupled to the light-incident surface of a collimating lens (3) is arranged above the base (1). The laser chip (6) is fixed on the upper surface of the base (1) by a heat sink (7). A converging lens (8) coupled to the light-out surface of an optical isolator (5) is fixed on the upper surface of the Kovar bracket (2). A silicon photonic chip (9) coupled to the light-out surface of the converging lens (8) is fixed on the upper surface of the base (1).

5. A 400G DR4 silicon photonics engine according to claim 4, characterized in that, The converging lens (8) is bonded to the Kovar bracket (2) with glue (4).

6. A 400G DR4 silicon photonics engine according to claim 4, characterized in that, The output waveguide of the silicon photonic chip (9) is coupled to the fiber array (10).

7. A 400G DR4 silicon photonics engine according to claim 6, characterized in that, The output waveguide of the silicon photonic chip (9) is tilted; the end face of the fiber array (10) is inclined, and the tilt angle is the same as the tilt angle of the output waveguide.

8. A 400G DR4 silicon photonics engine according to claim 7, characterized in that, The silicon photonic chip (9) has four output waveguides.

9. A 400G DR4 silicon photonics engine according to any one of claims 1 to 8, characterized in that, The base (1) is made of tungsten copper.

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