1.6 tl po silicon light engine

Abstract

The utility model relates to a 1.6T LPO silicon light engine, and the silicon light chip and the electric chip are pasted on the upper surface of the PCB board near the gold finger area, the optical fiber array is fixed on the side surface of the silicon light chip, the optical fiber in the optical fiber array is coupled with the first waveguide of the silicon light chip, the PD coupled with the first waveguide is integrated in the silicon light chip, the through slot is set up on the PCB board near the tail end area, the pedestal is below the through slot and holds the PCB board, the light emission end and the polarization maintaining optical fiber array fixed with the pedestal are arranged in the through slot, the light emission end is coupled with the polarization maintaining optical fiber array, the polarization maintaining optical fiber of the polarization maintaining optical fiber array is accessed into the optical fiber array and is coupled with the second waveguide of the silicon light chip, and the second waveguide is coupled with the first waveguide. Advantageous effects are that since the polarization maintaining optical fiber array and the light emission end are not on the PCB board, even if the PCB board is deformed, the optical path can be guaranteed not to displace, the performance is stable, and the pedestal can be used for heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of silicon photonics engine technology, specifically to a 1.6T LPO silicon photonics engine. Background Technology

[0002] To ensure performance, the 1.6T LPO silicon photonics engine uses a flip-chip process to mount the silicon photonics chip onto the PCB board. Black glue is then filled into the gap between the silicon photonics chip and the PCB board to reinforce their adhesion. The light-emitting end is also located on the PCB board, and includes a DFB chip, a lens, and a polarization-independent optical isolator. The DFB chip is coupled to the polarization-independent optical isolator via the lens and is fixed to a ceramic heat sink. In this configuration, if the PCB board deforms, it can easily cause optical path displacement, thus affecting performance. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a 1.6T LPO silicon photonics engine to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A 1.6T LPO silicon photonics engine includes a PCB board and a base. On the upper surface of the PCB board, a silicon photonic chip and an electrical chip are invertedly attached near its gold finger area. An optical fiber array is fixed on the side of the silicon photonic chip. The optical fibers in the optical fiber array are coupled to the first waveguide of the silicon photonic chip. A PD coupled to the first waveguide is integrated inside the silicon photonic chip. A through slot is formed on the PCB board near its tail area. The base is located below the through slot and supports the PCB board. An optical transmitter and a polarization-maintaining fiber array fixed to the base are arranged in the through slot. Multiple optical transmitters are coupled to the polarization-maintaining fiber array respectively. The polarization-maintaining fibers of the polarization-maintaining fiber array are connected to the optical fiber array and coupled to the second waveguide of the silicon photonic chip. The second waveguide is coupled to the first waveguide.

[0005] Based on the above technical solution, the present invention can be further improved as follows.

[0006] Furthermore, the optical transmitter includes a DFB chip, a lens, and a polarization-independent optical isolator. The DFB chip is coupled to the polarization-maintaining fiber array after passing through the lens and the polarization-independent optical isolator in sequence. The lens and the polarization-independent optical isolator are fixed on the base respectively, and the DFB chip is fixed on the base by a heat sink.

[0007] Furthermore, there are two silicon photonic chips and two fiber arrays, with the two silicon photonic chips arranged side by side along the width of the PCB board.

[0008] Furthermore, each silicon photonic chip has two second waveguides and eight first waveguides. One of the two second waveguides on each silicon photonic chip is coupled to four of the first waveguides, and the other second waveguide is coupled to the other four first waveguides. Of the four polarization-maintaining fibers in the polarization-maintaining fiber array, two polarization-maintaining fibers are connected to one fiber array and coupled to two second waveguides of one silicon photonic chip, and the other two polarization-maintaining fibers are connected to another fiber array and coupled to two second waveguides of another silicon photonic chip. The number of optical transmitters is four.

[0009] Furthermore, the base, optical transmitter, and polarization-maintaining fiber array are located between two silicon photonic chips or fiber arrays.

[0010] Furthermore, the upper surface of the base has a platform in the area facing the through slot, into which the optical transmitter and polarization-maintaining fiber array are fixed. The base is made of tungsten copper.

[0011] Furthermore, the pigtails of the optical fibers in each fiber array are respectively connected to a ferrule.

[0012] Furthermore, on the upper surface of the PCB board, grooves are formed between each silicon photonic chip and the fiber array to allow the end of the silicon photonic chip to be open and the fiber array to be suspended. The cover plate in the fiber array is bonded to both sides of a fixing block that is suspended in the groove and located below the open end of the silicon photonic chip with thick adhesive. The upper surface of the fixing block is lower than the center of the fiber core in the fiber array. The fixing block, silicon photonic chip and fiber array are bonded together with adhesive.

[0013] Furthermore, the upper surface of the fixing block is 20 μm lower than the center of the fiber core within the fiber array.

[0014] Furthermore, the thick adhesive is a thick UV adhesive.

[0015] The beneficial effects of this utility model are as follows: the polarization-maintaining fiber of the polarization-maintaining fiber array is connected to the fiber array and coupled to the second waveguide of the silicon photonic chip. Then, a through slot is opened on the PCB board near its tail end, and a base supporting the PCB board is arranged below the through slot. Finally, the polarization-maintaining fiber array and the optical transmitter are fixed on the base, thereby extending the optical transmitter. Since the polarization-maintaining fiber array and the optical transmitter are not on the PCB board, even if the PCB board is deformed, the optical path can be guaranteed not to shift, thus ensuring stable performance. The base can also be used to dissipate heat from the optical transmitter. Attached Figure Description

[0016] Figure 1 This is a top view of the 1.6T LPO silicon photonics engine in this utility model; Figure 2 for Figure 1 Top view of the first partial structure in the middle; Figure 3 for Figure 1 Cross-sectional view of the second partial structure in the middle; Figure 4 for Figure 1 Cross-sectional view of the third part of the structure.

[0017] The attached diagram lists the components represented by each number as follows: 1. PCB board, 110. Through slot, 120. Recessed slot, 2. Base, 210. Platform, 3. Silicon photonics chip, 310. First waveguide, 320. Second waveguide, 4. Electrical chip, 5. Fiber array, 510. Fiber, 6. Optical transmitter, 610. DFB chip, 620. Lens, 630. Polarization-independent optical isolator, 640. Heat sink, 7. Polarization-maintaining fiber array, 710. Polarization-maintaining fiber, 8. Filament, 9. Fixing block, 10. Thick adhesive. Detailed Implementation

[0018] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0019] Example 1 like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a 1.6T LPO silicon photonics engine includes: a PCB board 1, a base 2, a silicon photonic chip 3, an electrical chip 4, an optical fiber array 5, an optical transmitter 6, and a polarization-maintaining optical fiber array 7. The silicon photonic chip 3 is flip-chip mounted (using a flip-chip process) on the upper surface of the PCB board 1 near its gold finger area. The electrical chip 4 is also flip-chip mounted (using a flip-chip process) on the upper surface of the PCB board 1 near its gold finger area. The optical fiber array 5 is fixed to the side of the silicon photonic chip 3, and the optical fiber 510 within the optical fiber array 5 is coupled to the first waveguide 310 of the silicon photonic chip 3. The optical fiber 510 uses ordinary optical fiber. The silicon photonic chip 3 integrates the first waveguide 310... A PD coupled to waveguide 310; a through slot 110 is opened on the PCB board 1 near its tail end, and the base 2 is located below the through slot 110 and supports the PCB board 1. Multiple optical transmitters 6 and a polarization-maintaining fiber array 7 are arranged in the through slot 110. The optical transmitters 6 and the polarization-maintaining fiber array 7 are fixed to the base 2 respectively. The multiple optical transmitters 6 are coupled to the polarization-maintaining fiber array 7 respectively. The polarization-maintaining fiber 710 of the polarization-maintaining fiber array 7 is connected to the fiber array 5 and coupled to the second waveguide 320 of the silicon photonic chip 3. The second waveguide 320 in each silicon photonic chip 3 is coupled to the first waveguide 310.

[0020] When coupling the fiber array 5, first attach the silicon photonic chip 3 and the electrical chip 4 upside down on the PCB board 1, then connect the pigtail of the fiber 510 in the fiber array 5 to an external light source, and then couple the fiber 510 in the fiber array 5 to the first waveguide 310 of the silicon photonic chip 3 respectively, monitor the photocurrent value of the PD in the silicon photonic chip 3, and fix the fiber array 5 and the silicon photonic chip 3 when the photocurrent value of the PD is the maximum. When coupling the optical transmitter 6, connect the pigtail of the optical fiber 510 in the optical fiber array 5 to an external optical power meter, then couple the optical transmitter 6, and let the emitted light from the optical transmitter 6 be coupled into the second waveguide 320 of the silicon photonic chip 3 through the polarization-maintaining fiber 710 in the polarization-maintaining fiber array 7. The second waveguide 320 splits the emitted light into the first waveguide 310, and then couples it into the optical fiber 510 from the first waveguide 310. Finally, it enters the optical power meter through the optical fiber 510 to monitor the optical power value. When the optical power value of the optical power meter is at its maximum, fix all the devices of the optical transmitter 6.

[0021] The polarization-maintaining fiber 710 of the polarization-maintaining fiber array 7 is connected into the fiber array 5 and coupled to the second waveguide 320 of the silicon photonic chip 3. Then, a through slot 110 is opened on the PCB board 1 near its tail area, and a base 2 supporting the PCB board 1 is arranged below the through slot 110 on the PCB board 1. Finally, the polarization-maintaining fiber array 7 and the optical transmitter 6 are fixed on the base 2, thereby pulling the optical transmitter 6 further away. Since the polarization-maintaining fiber array 7 and the optical transmitter 6 are not on the PCB board 1, even if the PCB board 1 is deformed, the optical path can be guaranteed not to shift, so that its performance is stable. The base 2 can also be used to dissipate heat from the optical transmitter 6.

[0022] Example 2 like Figure 1 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The optical transmitter 6 includes a DFB chip 610, a lens 620, and a polarization-independent optical isolator 630. The DFB chip 610 is coupled to the polarization-maintaining fiber array 7 after passing through the lens 620 and the polarization-independent optical isolator 630. Specifically, the reflected light from the DFB chip 610 is coupled into the polarization-maintaining fiber 710 in the polarization-maintaining fiber array 7 after passing through the lens 620 and the polarization-independent optical isolator 630. The lens 620 is fixed on the base 2, and the lens 620 can be fixed by adhesive bonding. On the base 2; the polarization-independent optical isolator 630 is fixed on the base 2, and the polarization-independent optical isolator 630 can be fixed on the base 2 by adhesive bonding; the DFB chip 610 is fixed on the base 2 via the heat sink 640, and the heat sink 640 can be fixed on the base 2 by adhesive bonding. The heat sink 640 is preferably made of ceramic. During coupling, the DFB chip 610 is first fixed on the base 2 via the heat sink 640, then the polarization-independent optical isolator 630 is coupled and fixed, and finally the lens 620 is coupled and fixed.

[0023] Example 3 like Figure 1 , Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: There are two silicon photonic chips 3 and two fiber arrays 5. The two silicon photonic chips 3 are arranged side by side along the width of the PCB board 1.

[0024] Furthermore, each silicon photonic chip 3 has two second waveguides 320 and eight first waveguides 310. The single-channel wavelength of each silicon photonic chip 3 is 100G, 100G × 8 channels × 2 = 1.6T. One of the two second waveguides 320 on each silicon photonic chip 3 is coupled to four of the first waveguides 310, and the other second waveguide 320 on each silicon photonic chip 3 is coupled to the other four first waveguides 310. The polarization-maintaining fiber array 7 contains four polarization-maintaining fibers 710. Two of the four polarization-maintaining fibers 710 in the polarization-maintaining fiber array 7 are connected to a fiber array 5 and coupled to two second waveguides 320 of a silicon photonic chip 3. The other two of the four polarization-maintaining fibers 710 in the polarization-maintaining fiber array 7 are connected to another fiber array 5 and coupled to two second waveguides 320 of another silicon photonic chip 3. There are four optical transmitters 6, and the four optical transmitters 6 are coupled to the four polarization-maintaining fibers 710 in the polarization-maintaining fiber array 7 respectively.

[0025] The base 2, the optical transmitter 6, and the polarization-maintaining fiber array 7 are located between two silicon photonic chips 3 or two fiber arrays 5.

[0026] Example 4 like Figure 1 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The upper surface of the base 2 has a platform 210 that enters the slot 110 in the area facing the slot 110, and the optical transmitter 6 and the polarization-maintaining fiber array 7 are respectively fixed on the platform 210 of the base 2. The base 2 is preferably made of tungsten copper.

[0027] Example 5 like Figure 1 As shown, this embodiment is a further improvement on embodiment 1, 2, 3, or 4, as detailed below: Each fiber optic array 5 has its own pigtail connected to a ferrule 8. Since there are two fiber optic arrays 5, there are two ferrules 8.

[0028] Example 6 like Figure 1 , Figure 3 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below: On the upper surface of PCB board 1, a recessed groove 120 is formed between each silicon photonic chip 3 and the fiber array 5. The recessed groove 120 on PCB board 1 allows the end of the silicon photonic chip 3 to be suspended and the fiber array 5 to be suspended. The cover plate in the fiber array 5 is bonded to both sides of a fixing block 9 suspended within the recessed groove 120 and located below the suspended end of the silicon photonic chip 3 using thick adhesive 10. In other words, a fixing block 9 is suspended below the suspended end of the silicon photonic chip 3 within the recessed groove 120, and the two sides of the fixing block 9 are bonded to the cover plate in the fiber array 5 using thick adhesive 10. The thickness of the fixing block 9 is greater than that of the silicon photonic chip 3. The distance between chip 3 and the bottom of the sink 120 is small. After the fixing block 9 is bonded to the cover plate in the fiber array 5, its overall length is smaller than the distance between silicon photonic chip 3 and the sink 120 and its opposite wall. The upper surface of the fixing block 9 is lower than the center of the fiber core in the fiber array 5. The fixing block 9, silicon photonic chip 3 and fiber array 5 are bonded together with glue. By adding a fixing block 9 and bonding the two sides of the fixing block 9 to the cover plate in the fiber array 5 with thick glue 10, and bonding the fixing block 9, silicon photonic chip 3 and fiber array 5 with glue, the bonding force can be strengthened, and performance degradation or fiber array 5 detachment due to fiber bending stress can be avoided.

[0029] Furthermore, the upper surface of the fixing block 9 is 20 μm lower than the center of the fiber core in the fiber array 5. There is a gap between the fixing block 9 and the cover plate in the fiber array 5, which is reserved to allow the thick adhesive 10 to penetrate, so that the adhesive can fix the cover plate and the fixing block 9 in the fiber array 5 at the same time and form a T-shaped bond. The thick adhesive 10 is preferably a thick UV adhesive with a viscosity of 50,000 cp to 100,000 cp.

[0030] Black glue is filled in the gap between the silicon photonics chip 3 and the PCB board 1 to reinforce and bond the silicon photonics chip 3 to the PCB board 1. Black glue is also filled in the gap between the electrical chip 4 and the PCB board 1 to reinforce and bond the electrical chip 4 to the PCB board 1.

[0031] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A 1.6T LPO silicon photonic engine, characterized in that, include: A PCB board (1) and a base (2) are provided. On the upper surface of the PCB board (1), a silicon photonic chip (3) and an electrical chip (4) are attached upside down near the gold finger area. An optical fiber array (5) is fixed on the side of the silicon photonic chip (3). The optical fiber (510) in the optical fiber array (5) is coupled to the first waveguide (310) of the silicon photonic chip (3). A PD coupled to the first waveguide (310) is integrated in the silicon photonic chip (3). A through slot (110) is opened on the PCB board (1) near its tail end area. The base (2) is located below the through slot (110) and supports the PCB board (1). The through slot (110) is equipped with an optical transmitter (6) fixed to the base (2) and a polarization-maintaining fiber array (7). Multiple optical transmitters (6) are coupled to the polarization-maintaining fiber array (7) respectively. The polarization-maintaining fiber (710) of the polarization-maintaining fiber array (7) is connected to the fiber array (5) and coupled to the second waveguide (320) of the silicon photonic chip (3). The second waveguide (320) is coupled to the first waveguide (310).

2. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The optical transmitter (6) includes a DFB chip (610), a lens (620), and a polarization-independent optical isolator (630). The DFB chip (610) is coupled to the polarization-maintaining fiber array (7) after passing through the lens (620) and the polarization-independent optical isolator (630) in sequence. The lens (620) and the polarization-independent optical isolator (630) are respectively fixed on the base (2). The DFB chip (610) is fixed on the base (2) by a heat sink (640).

3. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The number of silicon photonic chips (3) is two, the number of fiber arrays (5) is two, and the two silicon photonic chips (3) are arranged side by side along the width direction of the PCB board (1).

4. A 1.6T LPO silicon photonic engine according to claim 3, characterized in that, Each silicon photonic chip (3) has two second waveguides (320) and eight first waveguides (310). One of the two second waveguides (320) on each silicon photonic chip (3) is coupled to four of the first waveguides (310), and the other second waveguide (320) is coupled to the other four first waveguides (310). Two of the four polarization-maintaining fibers (710) in the polarization-maintaining fiber array (7) are connected to a fiber array (5) and coupled to the two second waveguides (320) of one silicon photonic chip (3). The other two polarization-maintaining fibers (710) are connected to another fiber array (5) and coupled to the two second waveguides (320) of another silicon photonic chip (3). The number of optical transmitters (6) is four.

5. A 1.6T LPO silicon photonic engine according to claim 3, characterized in that, The base (2), the optical transmitter (6), and the polarization-maintaining fiber array (7) are located between two silicon photonic chips (3) or fiber arrays (5).

6. A 1.6T LPO silicon photonic engine according to any one of claims 1 to 5, characterized in that, The upper surface of the base (2) has a platform (210) in the area facing the through slot (110) to enter the through slot (110). The optical emitting end (6) and the polarization-maintaining fiber array (7) are fixed on the platform (210) of the base (2). The base (2) is made of tungsten copper.

7. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The pigtails of the optical fibers (510) in each optical fiber array (5) are respectively connected to a ferrule (8).

8. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, On the upper surface of the PCB board (1), a recess (120) is opened between each silicon photonic chip (3) and the fiber array (5) to allow the end of the silicon photonic chip (3) to be open and the fiber array (5) to be suspended. The cover plate of the fiber array (5) is bonded to both sides of a fixing block (9) which is suspended in the recess (120) and located below the open end of the silicon photonic chip (3) with thick glue (10). The upper surface of the fixing block (9) is lower than the center of the fiber core in the fiber array (5). The fixing block (9), the silicon photonic chip (3) and the fiber array (5) are bonded together with glue.

9. A 1.6T LPO silicon photonic engine according to claim 8, characterized in that, The upper surface of the fixed block (9) is 20 μm lower than the center of the fiber core in the fiber array (5).

10. A 1.6T LPO silicon photonic engine according to claim 8, characterized in that, The thick adhesive (10) is a thick UV adhesive.

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