Board card structure

Abstract

The application provides a board structure, which comprises a packaging board frame, a first mounting board frame and a second mounting board frame connected with the bottom of the packaging board frame respectively, the first mounting board frame and the second mounting board frame are arranged side by side to form an assembly space between the two, a first board card assembly connected with the side of the first mounting board frame away from the assembly space, and a second board card assembly comprising a first main control board connected with the first mounting board frame in the assembly space and a second main control board connected with the side of the second mounting board frame away from the assembly space, the first main control board is electrically connected with the first board card assembly and the second main control board respectively; the application can improve the compactness between parts and realize the miniaturized design of the board structure under the premise of guaranteeing the overall performance.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a board structure. Background Technology

[0002] A circuit board structure is a modular hardware architecture composed of multiple functional circuit boards combined through slots or interfaces, including at least a signal transmission board, a main control power supply board, and a main control core board. The main control core board contains a control chip, and its operating state is affected by factors such as power supply timing, data line layout, impedance control, and memory chip clock synchronization. Therefore, the signal transmission board and the main control power supply board need to be placed close to the main control core board to meet the complex wiring requirements between boards. However, while this wiring requirement helps the circuit board structure achieve high-performance operation, the complexity of the circuit board structure is relatively high, which is not conducive to the assembly of functional boards and the control of structural dimensions, making it difficult to meet the needs of miniaturization design. Utility Model Content

[0003] In view of this, the purpose of this application is to propose a board structure to solve some or all of the technical problems mentioned above.

[0004] To achieve the above objectives, this application provides a board structure, including:

[0005] The encapsulation board frame, and a first mounting board frame and a second mounting board frame respectively connected to the bottom of the encapsulation board frame, wherein the first mounting board frame and the second mounting board frame are arranged side by side to form an assembly space between them:

[0006] The first board assembly is connected to the packaging board frame and the side of the first mounting board frame facing away from the assembly space, respectively.

[0007] The second board assembly includes a first main control board connected to the first mounting frame within the assembly space, and a second main control board connected to the side of the second mounting frame away from the assembly space. The first main control board is electrically connected to the first board assembly and the second main control board.

[0008] As can be seen from the above, the circuit board structure provided in this application, by respectively setting the first main control board in the first circuit board assembly and the second circuit board assembly on opposite sides of the first mounting frame, allows the second mounting frame to provide independent installation areas for each, reducing installation difficulty and shortening the wiring path between the first and second circuit board assemblies; by installing the second main control board on the side of the second mounting frame away from the assembly space, the second circuit board assembly can be assembled in steps, further reducing installation difficulty; and by arranging each mounting frame and circuit board assembly sequentially along the direction parallel to the packaging frame, the compactness between each part can be improved while ensuring the high performance of the circuit board structure, thus achieving a miniaturized design of the circuit board structure. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is an exploded view of the board structure in an embodiment of this application;

[0011] Figure 2 This is a three-dimensional schematic diagram of the encapsulation board frame in the embodiments of this application;

[0012] Figure 3 This is a bottom view of the encapsulation board frame in an embodiment of this application;

[0013] Figure 4 This is a schematic diagram of the first mounting plate frame in an embodiment of this application;

[0014] Figure 5 This is a schematic diagram of the second mounting plate frame at a first angle in an embodiment of this application;

[0015] Figure 6 This is a schematic diagram of the second mounting plate frame at a second angle in an embodiment of this application;

[0016] Figure 7 This is a schematic diagram of the first board component in an embodiment of this application;

[0017] Figure 8 This is a schematic diagram of the second board component in an embodiment of this application.

[0018] Explanation of reference numerals in the attached figures:

[0019] 100. Encapsulation board frame; 101. Mating groove; 102. Heat dissipation section; 103. Mounting slot; 104. Assembly hole;

[0020] 200. First mounting plate frame; 201. First heat-conducting protrusion; 202. Positioning pin; 203. First connecting part; 2031. Positioning protrusion; 204. Reserved hole; 205. First clearance groove;

[0021] 300. Second mounting plate frame; 301. Second heat-conducting protrusion; 302. Groove; 303. Support column; 304. Second connecting part; 305. Second clearance groove;

[0022] 400, First board assembly; 410, Board body; 411, First flexible circuit; 420, Signal connection board; 430, Inter-board connector; 440, Signal transmission terminal; 450, Indicator light;

[0023] 500, Second board assembly; 510, First main control board; 511, First chip; 520, Second main control board; 522, Second chip; 530, Second flexible circuit board. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0025] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0027] A board structure is a modular hardware architecture, typically composed of multiple circuit boards with different functions interconnected and combined through slots or interfaces. Key components of a board structure include at least a signal transmission board, a main control power supply board, and a main control core board. The main control core board, as the core control unit of the board structure, usually houses main control chips such as ARM (Acorn RISC Machine) and MCU (Micro Controller Unit), responsible for data processing and instruction control. For the main control chip, to ensure the normal operation of the main control core board, precise matching of power supply timing, reasonable data line layout, precise control of line impedance, and synchronization of memory chips and clock signals, the placement of the main control core board, signal transmission board, and main control power supply board must be strictly constrained. The signal transmission board and main control power supply board should be placed as close as possible to the main control core board to ensure signal transmission integrity and system stability.

[0028] For circuit board structures, while strict restrictions on the placement of various functional boards help ensure overall performance, they also present corresponding challenges to the design. To ensure stable performance, cross-board wiring is required between functional boards. Due to the influence of board layout and wiring arrangement, the complexity of wiring in circuit board structures is relatively large, and the installation difficulty of functional boards is also correspondingly greater. This makes it difficult to effectively compress the overall size of the circuit board structure, which is not conducive to the miniaturization design of the structure.

[0029] For example, for test board structures used in aircraft flight testing, the installation space of the airframe data acquisition chassis is limited, requiring the chassis size to be controlled within the range of 60mm × 76mm. However, if the test board structure needs to have corresponding testing functions, its design size is too large to be accommodated in a chassis of this size. On the other hand, reducing the size by decreasing the types and number of components in the board structure or using smaller packages may affect processing performance and fail to achieve the required testing functions. In other words, it is difficult to achieve an effective balance between miniaturization and high performance.

[0030] A circuit board structure includes an encapsulation frame 100 and a first mounting frame 200 and a second mounting frame 300 respectively connected to the bottom of the encapsulation frame 100. The first mounting frame 200 and the second mounting frame 300 are arranged side by side to form an assembly space between them. The structure also includes a first circuit board assembly 400 and a second circuit board assembly 500. The first circuit board assembly 400 is respectively connected to the encapsulation frame 100 and the side of the first mounting frame 200 away from the assembly space. The second circuit board assembly 500 includes a first main control board 510 connected to the first mounting frame 200 within the assembly space and a second main control board 520 connected to the side of the second mounting frame 300 away from the assembly space. The first main control board 510 is electrically connected to the first circuit board assembly 400 and the second main control board 520.

[0031] Specifically, such as Figures 1-6 As shown, the board structure includes an encapsulation frame 100, a first mounting frame 200, and a second mounting frame 300. The first mounting frame 200 and the second mounting frame 300 are respectively connected to the bottom of the encapsulation frame 100 to form a stable board structure. The first mounting frame 200 and the second mounting frame 300 provide corresponding mounting positions for the first board assembly 400 and the second board assembly 500, respectively. During the assembly of the board structure, the encapsulation frame 100 provides a mounting base for the entire board structure. The board structure can be fixed through the mounting holes 104 opened on the encapsulation frame 100, and it also provides shielding and protection for the first board assembly 400 and the second board assembly 500 located at its bottom and respectively mounted on the first mounting frame 200 and the second mounting frame 300.

[0032] Furthermore, such as Figure 1 As shown, the first mounting frame 200 and the second mounting frame 300 are arranged side by side, forming an assembly space between them. The opposite sides of the first mounting frame 200 and the second mounting frame 300 provide more mounting positions and heat dissipation areas for the first board assembly 400 and the second board assembly 500, effectively dividing the area between them and increasing their independence. This prevents interference between the two board assemblies during installation and helps reduce the installation difficulty of each board assembly.

[0033] Furthermore, such as Figure 1 and Figure 7As shown, the board structure also includes a first board assembly 400. A portion of the first board assembly 400 is connected to the encapsulation frame 100, and another portion is connected to the side of the first mounting frame 200 away from the assembly space. In this way, the encapsulation frame 100 and the first mounting frame 200 can simultaneously provide a stable connection position for the first board assembly 400, enhancing its installation firmness. At the same time, since the first board assembly 400 is installed on one side of the first mounting frame 200, the first board assembly 400 and the second board assembly 500 can be partially isolated, thereby improving the rationality of space allocation in the board structure and the stability of the overall structure.

[0034] It should be noted that, in order to meet the functional requirements of the board structure, the first board component 400 can serve as the signal transmission board of the board structure, responsible for signal transmission and reception, and establishing communication connections with external devices through interfaces such as Ethernet, CAN bus, RS-232 serial port and JTAG (Joint Test Action Group). At this time, by connecting the first board component 400 to the package frame 100, it is helpful to build a transmission port in the package frame 100, shorten the signal transmission path, and improve transmission efficiency and stability.

[0035] Furthermore, such as Figure 1 and Figure 8 As shown, the second board assembly 500 includes a first main control board 510 connected to the first mounting frame 200 within the assembly space, and a second main control board 520 connected to the side of the second mounting frame 300 away from the assembly space. The first main control board 510 is electrically connected to the first board assembly 400 and the second main control board 520. By placing the first main control board 510 of the second board assembly 500 within the assembly space and connecting it to the first mounting frame 200, the first mounting frame 200 can provide an independent mounting area for the second main control board 520, which helps to shorten the distance between the first main control board 510 and the first board assembly 400, facilitating the establishment of a stable electrical connection between the two. Meanwhile, by connecting the second main control board 520 of the second board assembly 500 to the side of the second mounting frame 300 away from the assembly space, the second mounting frame 300 can provide an independent installation area for the second main control board 520, which facilitates the step-by-step assembly of the second board assembly 500, reduces the assembly difficulty of the second board assembly 500, and avoids mutual interference between the first main control board 510 and the second main control board 520 during the installation process.

[0036] It should be noted that, in order to meet the functional requirements of the board structure, the second board assembly 500 can serve as the main control system of the board structure. To reduce the complexity of wiring, shorten the information transmission path, and ensure the timeliness of data processing, when the first main control board 510 and the second main control board 520 are electrically connected, the first main control board 510 can serve as the main control core board of the board structure, responsible for signal processing and control, while the second main control board 520 serves as the main control power supply board to drive the main control core board to operate stably. At the same time, the first main control board 510, as the core main control system, is also electrically connected to the first board assembly 400 to realize signal transmission between the two, thereby enabling data interaction with external devices through the first board assembly 400.

[0037] In summary, the board structure provided in this application, by respectively placing the first main control board 510 of the first board assembly 400 and the second board assembly 500 on opposite sides of the first mounting frame 200, provides independent mounting areas for both boards within the first mounting frame 200, thereby reducing the installation difficulty on the first mounting frame 200 and effectively shortening the wiring path between them. Simultaneously, the second main control board 520 of the second board assembly 500 is mounted on the side of the second mounting frame 300 away from the assembly space, providing independent mounting space for the second main control board 520. This facilitates the step-by-step assembly of the second board assembly 500 and reduces its installation difficulty. Furthermore, this layout arranges the first board assembly 400, the first mounting frame 200, the first main control board 510, the second mounting frame 300, and the second main control board 520 in parallel along a direction parallel to the encapsulation frame 100, improving the overall structural compactness and facilitating miniaturized board structure design, meeting miniaturization requirements while ensuring high performance.

[0038] In some embodiments, such as Figure 8 As shown, a first chip 511 is provided on the side of the first main control board 510 facing the first mounting frame 200. Specifically, taking the first main control board 510 as the core main control board of this board structure as an example, the first chip 511 provided on the first main control board 510 can adopt chip structures such as ARM and MCU to ensure that the board structure has good data processing capabilities.

[0039] Furthermore, such as Figure 1 , Figure 4 and Figure 8As shown, the first mounting frame 200 protrudes towards the second mounting frame 300 to form a first thermally conductive protrusion 201, which abuts against the first chip 511 within the assembly space. Since the first chip 511 generates a large amount of heat during operation, by abutting the first chip 511 against the surface of the first thermally conductive protrusion 201, the heat generated by the first chip 511 can be transferred to the first thermally conductive protrusion 201. The first mounting frame 200, with its large heat dissipation area, further conducts and dissipates the heat, preventing the heat generated by the first chip 511 from accumulating in the board structure and ensuring the heat dissipation efficiency and operational stability of the first main control board 510.

[0040] For example, the first mounting frame 200 can be made of a hollow board structure using a metal material with good thermal conductivity and heat dissipation properties, which helps to improve the thermal conductivity and heat dissipation performance of the first mounting frame 200 and the first thermally conductive protrusion 201 to the first chip 511. Furthermore, the first mounting frame 200 and the first thermally conductive protrusion 201 can be fabricated using an integral molding process (such as CNC machining or die casting) to ensure the machining accuracy and molding quality of the first thermally conductive protrusion 201 on the mounting frame, further improving structural reliability and heat conduction.

[0041] In some embodiments, a second chip 522 is provided on the side of the second main control board 520 facing the second mounting frame 300. Specifically, taking the second main control board 520 as a main control power supply board as an example, the second chip 522 on the second main control board 520 can integrate at least one chip with power management function, so that the second main control board 520 can provide stable power support to the first main control board 510 by adjusting the power supply state, thereby ensuring the stability and reliability of the operation of the second main control board 520.

[0042] Furthermore, such as Figure 1 , Figure 5 and Figure 8 As shown, the second mounting frame 300 protrudes from the side opposite to the assembly space to form a second heat-conducting protrusion 301, which abuts against the second chip 522. Since the second chip 522 generates a lot of heat during operation, by abutting the second chip 522 against the surface of the second heat-conducting protrusion 301, the heat generated by the second chip 522 can be transferred to the second heat-conducting protrusion 301. The heat is further conducted and dissipated by the second mounting frame 300, which has a large heat dissipation area, preventing the heat generated by the second chip 522 from accumulating in the board structure and ensuring the heat dissipation efficiency and operational stability of the second main control board 520.

[0043] For example, the second mounting frame 300 can be made of a hollow board structure using a metal material with good thermal conductivity and heat dissipation properties, which helps to improve the thermal conductivity and heat dissipation performance of the second mounting frame 300 and the second thermally conductive protrusion 301 to the second chip 522. Furthermore, the second mounting frame 300 and the second thermally conductive protrusion 301 can be manufactured using an integral molding process (such as CNC machining or die casting) to ensure the machining accuracy and molding quality of the second thermally conductive protrusion 301 on the mounting frame, further improving structural reliability and heat conduction effect.

[0044] In some embodiments, such as Figure 5 As shown, the first mounting plate frame 200 is provided with a positioning pin 202 on the side facing the second mounting plate frame 300 for positioning and connecting the first main control board 510. The positioning pin 202 cooperates and penetrates the first main control board 510 in the assembly space.

[0045] Specifically, taking the first main control board 510 as the main control core board as an example, since the first main control board 510 is equipped with a first chip 511 for data processing, which is relatively sensitive to mechanical stress, compared with using fasteners or other methods to fix the first main control board 510 in the assembly space, the positioning pin 202 can limit and fix the first main control board 510, avoiding the first main control board 510 from being affected by excessive constraint force, and ensuring its stability and reliability; in addition, the positioning pin 202 also has the positioning function to penetrate the first main control board 510 in the assembly space, reducing the installation difficulty on the first mounting frame 200 and improving the positioning accuracy during the assembly process.

[0046] In some embodiments, there is a gap between the second mounting frame 300 and the first main control board 510. During the operation of the board structure, the second main control board 520 can dissipate the heat it generates through the second mounting frame 300 and release it into the gap between the second mounting frame 300 and the first main control board 510. At the same time, the first main control board 510 can also transfer heat to the gap between the second mounting frame 300 and the first main control board 510 by moving its side toward the second mounting frame 300. In this way, when a fan or other device is used to provide airflow, the heat dissipation in the first main control board 510 and the second mounting frame 300 is accelerated, so as to prevent the second board assembly 500 from being affected by heat accumulation, thus improving its working efficiency and stability.

[0047] Furthermore, such as Figure 1 and Figure 6 As shown, the second mounting frame 300 is recessed on the side facing the first mounting frame 200 to form a plurality of grooves 302 for heat dissipation; by providing a plurality of grooves 302 on the second mounting frame 300, its heat dissipation area can be effectively increased and the heat dissipation efficiency of the second mounting frame 300 can be improved.

[0048] In some embodiments, such as Figure 1 and Figure 6 As shown, the second mounting plate frame 300 has a support column 303 on the side facing the first mounting plate frame 200. The end of the support column 303 abuts against the first mounting plate frame 200. The support column 303 has fasteners inside for fixing the support column 303 to the side of the first mounting plate frame 200.

[0049] Specifically, since the first mounting frame 200 and the second mounting frame 300 are respectively connected to the bottom of the encapsulation frame 100, forming a first assembly space between them, the structural stability of the assembly space can be enhanced by providing a support post 303 on the second mounting frame 300 and having its end abut against the first mounting frame 200 within the assembly space. Furthermore, the fasteners provided inside the support post 303 can be used to fix the support post 303 to the side of the first mounting frame 200, further improving the connection strength between the first mounting frame 200 and the second mounting frame 300, ensuring the stability and reliability of the installation of the first board assembly 400 and the second board assembly 500.

[0050] In some embodiments, such as Figure 1 and Figure 4 As shown, the top of the first mounting plate frame 200 is provided with a first connecting part 203 for connecting with the encapsulation plate frame 100. Specifically, the first connecting part 203 and the encapsulation plate frame 100 are respectively provided with corresponding connecting holes. By connecting the screws with the connecting holes, the first connecting part 203 can be fixed to the encapsulation plate frame 100, thereby realizing a stable connection between the first mounting plate frame 200 and the encapsulation plate frame 100. Furthermore, the positioning protrusion 2031 formed by the top protrusion of the first connecting part 203 is used to position the first connecting part 203. The mating groove 101 provided at the bottom of the encapsulation plate frame 100 is adapted to the positioning protrusion 2031. Therefore, during the assembly process, the positioning protrusion 2031 on the first connecting part 203 can be embedded into the mating groove 101 to achieve pre-assembly between the first mounting plate frame 200 and the encapsulation plate frame 100, ensuring that the connecting hole of the first connecting part 203 is accurately aligned with the connecting hole of the encapsulation plate frame 100, thereby improving the connection accuracy and assembly reliability between the first mounting plate frame 200 and the encapsulation plate frame 100.

[0051] Similarly, as Figure 1 , Figure 5 and Figure 6As shown, the top of the second mounting plate frame 300 is provided with a second connecting part 304 that connects to the encapsulation plate frame 100. The second connecting part 304 and the encapsulation plate frame 100 are provided with corresponding connecting holes. By using screws in conjunction with the connecting holes, the second connecting part 304 can be fixed to the encapsulation plate frame 100, thereby achieving a stable connection between the second mounting plate frame 300 and the encapsulation plate frame 100.

[0052] In some embodiments, such as Figure 1 and Figure 7 As shown, the first board assembly 400 includes a board body 410 connected to the first mounting frame 200, used to realize data communication and signal transmission between the second board assembly 500 and external devices. The first board assembly 400 includes a signal connection board 420 electrically connected to the board body 410 via a first flexible circuit 411, so that data transmission can be realized between the board body 410 and the signal connection board 420 through the first flexible circuit 411, reducing the space limitation when installing the first board assembly 400. The first board assembly 400 is electrically connected to the board body 410 and the first main control board 510 via inter-board connectors 430 to realize data communication and signal transmission between the first main control board 510 and the board body 410. The first board assembly 400 also includes a signal transmission terminal 440 and an indicator light 450, which are electrically connected to the signal connection board 420. The signal transmission terminal 440 can serve as a data transmission interface for communication with external devices, while the indicator light 450 serves as a data transmission status indicator to reflect the operating status of the board structure.

[0053] Furthermore, such as Figure 1 and Figure 4 As shown, a reserved hole 204 is provided on the first mounting plate frame 200 to accommodate the inter-board connector 430, and the inter-board connector 430 is disposed through the reserved hole 204; this allows the inter-board connector 430 to be reasonably distributed on the first mounting plate frame 200, which helps to shorten the wiring path between the first board assembly 400 and the first main control board 510, reduce wiring difficulty, and ensure the stability and quality of signal transmission.

[0054] Furthermore, such as Figure 1 , Figure 2 , Figure 3 as well as Figure 7As shown, the signal connection board 420 is connected to the bottom of the encapsulation frame 100, and the signal transmission terminal 440 and indicator light 450 are respectively embedded in the encapsulation frame 100. Specifically, both the encapsulation frame 100 and the signal connection board 420 have connection holes, which can be used to fix the two together with screws. The encapsulation frame 100 provides corresponding installation positions for the signal connection board 420 and its electrically connected signal transmission terminal 440 and indicator light 450, so that the transmission terminal and indicator light 450 are embedded in the encapsulation frame 100 and partially exposed outside the board structure, so as to facilitate the establishment of electrical connection with external devices and allow users to understand the working status of the board structure through the indicator light 450.

[0055] In some embodiments, such as Figure 1 As shown, the tops of the first mounting frame 200 and the second mounting frame 300 are recessed to form a first clearance groove 205 and a second clearance groove 305, respectively. Since the signal connection plate 420 in the first board assembly 400 is connected to the bottom of the encapsulation frame 100, the connection area between the signal connection plate 420 and the encapsulation frame 100 partially overlaps with the connection area between the first mounting frame 200 and the second mounting frame 300 and the encapsulation frame 100. Therefore, the first clearance groove 205 and the second clearance groove 305 on the tops of the first mounting frame 200 and the second mounting frame 300 allow the first mounting frame 200 and the second mounting frame 300 to avoid obstructing the signal connection plate 420, and also provide a corresponding installation gap for the signal connection plate 420. This prevents the first mounting frame 200 and the second mounting frame 300 from squeezing the signal connection plate 420, ensuring the stability and structural integrity of the signal connection plate 420 in the corresponding connection area.

[0056] Furthermore, such as Figure 1 , Figure 5 and Figure 6 As shown, the first main control board 510 and the second main control board 520 are electrically connected through a second flexible circuit board 530, and part of the second flexible circuit board 530 is housed within the second clearance groove 305. Since the second mounting frame 300 also provides heat dissipation for the second board assembly 500, by passing the second flexible circuit board 530 through the second clearance groove 305 and mounting it on top of the second mounting frame 300, it not only helps maintain the signal transmission stability of the second board assembly 500 but also avoids it occupying the effective heat dissipation area of ​​the second mounting frame 300, thus ensuring the heat dissipation performance of the board structure.

[0057] In some embodiments, such as Figure 1 and Figure 2As shown, the top of the encapsulation board frame 100 protrudes to form multiple heat dissipation parts 102. The encapsulation board frame 100 can receive heat conducted from the first mounting board frame 200, the second mounting board frame 300, the signal output terminal and the signal connection board 420, and dissipate the heat through the heat dissipation parts 102, thereby reducing the accumulation of heat in the board structure and improving the overall heat dissipation efficiency.

[0058] Furthermore, such as Figure 1 , Figure 2 and Figure 7 As shown, the encapsulation frame 100 has a mounting groove 103 and an assembly hole 104. The signal transmission terminal 440 can be fitted into the mounting groove 103 and fixed to the top of the encapsulation frame 100 by tightening the bolts, ensuring that it is firmly installed and easy to assemble. At the same time, an indicator light 450 board is provided at the bottom of the encapsulation frame 100. The indicator light 450 is fixed to the encapsulation frame 100 by the indicator light 450 board and is embedded in the assembly hole 104, which can improve the overall stability and aesthetics of the installation.

[0059] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0060] The various embodiments in this application are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0061] The description in this application is given for illustrative purposes and is not intended to be exhaustive or to limit the application to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of this application and to enable those skilled in the art to understand this application and design various embodiments with various modifications suitable for a particular purpose.

[0062] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0063] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0064] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A board structure, characterized in that, include: The encapsulation board frame, and a first mounting board frame and a second mounting board frame respectively connected to the bottom of the encapsulation board frame, wherein the first mounting board frame and the second mounting board frame are arranged side by side to form an assembly space between them: The first board assembly is connected to the packaging board frame and the side of the first mounting board frame facing away from the assembly space, respectively. The second board assembly includes a first main control board connected to the first mounting frame within the assembly space, and a second main control board connected to the side of the second mounting frame away from the assembly space. The first main control board is electrically connected to the first board assembly and the second main control board.

2. The board structure according to claim 1, characterized in that, The first chip is provided on the side of the first main control board facing the first mounting board frame; The first mounting plate frame protrudes to one side of the second mounting plate frame to form a first thermally conductive protrusion, which abuts against the first chip within the assembly space.

3. The board structure according to claim 1, characterized in that, The second main control board has a second chip on the side facing the second mounting board frame; The second mounting plate frame protrudes from the side opposite to the assembly space to form a second thermally conductive protrusion, which abuts against the second chip.

4. The board structure according to claim 1, characterized in that, The first mounting plate frame has a positioning pin on the side facing the second mounting plate frame for positioning and connecting the first main control board. The positioning pin cooperates and passes through the first main control board in the assembly space.

5. The board structure according to claim 1, characterized in that, There is a gap between the second mounting plate frame and the first main control board. The second mounting plate frame is recessed on the side facing the first mounting plate frame to form a plurality of grooves for heat dissipation.

6. The board structure according to claim 1, characterized in that, The second mounting frame has a support column on the side facing the first mounting frame, and the end of the support column abuts against the first mounting frame. The support column is provided with fasteners for fixing the support column to the side of the first mounting plate frame.

7. The board structure according to claim 1, characterized in that, The top of the first mounting plate frame is provided with a first connecting part that connects to the encapsulation plate frame. The top of the first connecting part protrudes to form a positioning protrusion for positioning the first connecting part. The bottom of the encapsulation plate frame is provided with a mating groove that matches the positioning protrusion. The top of the second mounting plate frame is provided with a second connecting part that connects to the encapsulation plate frame.

8. The board structure according to claim 1, characterized in that, The first board assembly includes a board body connected to the first mounting frame, a signal connection board electrically connected to the board body via a first flexible circuit, an inter-board connector electrically connected to the board body and the first main control board respectively, and a signal transmission terminal and an indicator light electrically connected to the signal connection board respectively. The first mounting plate frame has a reserved hole for accommodating the inter-board connector, and the inter-board connector passes through the reserved hole. The signal connection board is connected to the bottom of the packaging board frame. The signal transmission terminal and the indicator light are respectively embedded in the encapsulation board frame.

9. The board structure according to claim 8, characterized in that, The top of the first mounting plate frame and the top of the second mounting plate frame are recessed to form a first clearance groove and a second clearance groove. The signal connection board is located in the first clearance slot and the second clearance slot, respectively. The first main control board and the second main control board are electrically connected through a second flexible circuit board, and a portion of the second flexible circuit board is located within the second clearance groove.

10. The board structure according to claim 8, characterized in that, The top of the encapsulation board frame protrudes to form multiple heat dissipation sections; The encapsulation board frame is provided with mounting slots and assembly holes. The signal transmission terminals are fitted into the mounting slots and the indicator lights are fitted into the assembly holes.

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