industrial computer

Abstract

The embodiment of the application relates to the technical field of industrial computers, and discloses an industrial computer, which comprises a case, a mainboard and an extension card, the case comprises a box body and a side plate, a first opening is formed in one side of the box body, the side plate cover is arranged at the first opening, the mainboard is arranged in the box body and is perpendicular to the side plate, one side of the mainboard facing the first opening is extended to form a plug-in plate, the extension card is fixed to the inner wall of the side plate and is parallel to the side plate, a first slot is arranged on the side of the extension card away from the side plate, and the first slot is connected with the plug-in plate in a plug-in mode, so that the mainboard and the extension card are electrically connected. Through the above mode, while the volume of the industrial computer is reduced, the extension card can be supported and fixed through the side plate, so that the stability of the extension card is ensured.

Description

Technical Field

[0001] This application relates to the field of industrial control computer technology, specifically to an industrial control computer. Background Technology

[0002] Industrial control computers (ICCs), also known as industrial control computers, are computers specifically designed for industrial environments. With the development of AI technology, the role of ICCs is shifting from a simple "control brain" to an edge AI computing node with both "intelligent perception and decision-making" capabilities. Because AI inference processes such as deep learning involve massive matrix multiplications and convolution operations, ICCs require dedicated graphics cards, high-speed network cards, AI accelerator cards, and other expansion cards to improve their performance. This allows ICCs to perform data cleaning, analysis, modeling, and intelligent decision-making tasks at the source of data generation, reducing latency and ensuring data security.

[0003] Currently, expansion cards are primarily assembled by using slots exposed on the motherboard's surface, and selecting and inserting expansion cards into these slots based on the industrial PC's performance requirements. Specifically, these slots are typically located at the bottom of the industrial PC. When an expansion card is needed, an expansion box is installed at the bottom of the industrial PC. The expansion card is installed in the expansion box and then connected to the motherboard's slot from below via an adapter board within the expansion box. This results in the industrial PC needing to be expanded with the expansion box, adding to its original size, thus making the overall size of the industrial PC relatively large. Utility Model Content

[0004] In view of the above problems, this application provides an industrial control computer to solve the problem of the large size of existing industrial control computers after assembling expansion cards.

[0005] According to one aspect of the embodiments of this application, an industrial control computer is provided, comprising: a chassis, including a housing and a side panel, wherein a first opening is provided on one side of the housing, and a side panel cover is disposed at the first opening; a motherboard, disposed inside the housing and perpendicular to the side panel, wherein a plug-in board extends from the side of the motherboard toward the first opening; and an expansion card, fixed to the inner wall of the side panel and parallel to the side panel, wherein a first slot is provided on the side of the expansion card away from the side panel, and the first slot is plugged into and connected to the plug-in board to electrically connect the motherboard and the expansion card.

[0006] In one alternative approach, a connecting groove is provided on the inner wall of the housing, and a connecting component is movably provided on the inner wall of the side panel, the connecting component being detachably snapped into the connecting groove.

[0007] In one alternative embodiment, the connecting assembly includes a connecting block and a button; the connecting block is slidably disposed on the side panel and engaged in a connecting groove; the button is slidably disposed on the inner wall of the side panel and partially protrudes from the outer wall of the side panel, the button is drively connected to the connecting block, and the button is used to drive the connecting block to slide out of the connecting groove when pressed, so as to unlock the side panel.

[0008] In one alternative embodiment, the inner wall of the housing is slidably provided with an ejector, which abuts against the inner wall of the side panel; a first elastic element is connected between the ejector and the inner wall of the housing, and the first elastic element is in a compressed state; when the side panel is unlocked, the ejector pushes the side panel away from the housing under the elastic force of the first elastic element.

[0009] In one alternative embodiment, the expansion card has at least one second slot on the side facing the side panel, and a second opening is provided on the side panel opposite to the second slot; the industrial computer also includes an interface board and a mounting bracket, the interface board is fixedly mounted on the mounting bracket, the mounting bracket is detachably inserted into the second opening and covers the second opening, the interface board is inserted into the second slot through the second opening, and the interface board has at least one interface exposed from the mounting bracket, the interface being used to connect to external devices.

[0010] In one alternative embodiment, a heat dissipation groove is provided on the side of the side panel facing away from the enclosure, and an expansion card is attached to the inner wall of the side panel opposite to the heat dissipation groove. The industrial computer also includes a heat dissipation assembly, which is disposed in the heat dissipation groove. The heat dissipation assembly includes a heat dissipation base shell and heat dissipation components. The heat dissipation base shell is attached to the bottom of the heat dissipation groove. Multiple heat dissipation plates are spaced apart on the side of the heat dissipation base shell facing away from the bottom of the heat dissipation groove. Both ends of the multiple heat dissipation plates extend in the direction away from the bottom of the heat dissipation groove to form heat dissipation fins. The heat dissipation components are detachably disposed on the heat dissipation base shell and located between the heat dissipation fins on opposite sides to form a heat dissipation channel through the heat dissipation plates and heat dissipation fins.

[0011] In one alternative embodiment, a locking block is provided on the side wall of the heat dissipation base; an elastic locking mechanism is movably provided on the inner wall of the side plate, the elastic locking mechanism protruding from the inner side wall of the heat dissipation groove and being detachably engaged with the locking block.

[0012] In one alternative embodiment, a first elastic conductive element is vertically disposed on the expansion card, the first elastic conductive element passing through the side plate and partially extending into the heat sink; a second elastic conductive element is disposed through the heat sink bottom shell, the second elastic conductive element being in electrical contact with the first elastic conductive element, and a conductive part is disposed on the side of the heat sink facing the bottom of the heat sink, the conductive part being in electrical contact with the second elastic conductive element.

[0013] In one alternative embodiment, the second elastic conductive element is located at the edge of the heat dissipation base; there are multiple locking blocks, each of which is disposed on the side wall of the heat dissipation base near the second elastic conductive element and located on both sides of the second elastic conductive element; the elastic locking mechanism includes multiple locking blocks, each of which is detachably snapped into place in correspondence with the multiple locking blocks.

[0014] In one alternative embodiment, the resilient locking mechanism includes a pop-out block and a locking block. The pop-out block is slidably disposed on the inner wall of the side plate along the depth direction of the heat dissipation groove and has an abutment portion extending from the side wall of the heat dissipation groove. The abutment portion is used to slide towards the bottom of the heat dissipation groove under the force of the heat dissipation base shell when the heat dissipation base shell and heat dissipation components are installed in the heat dissipation groove. The locking block is slidably disposed on the inner wall of the side plate and has a snap-fit ​​portion extending from the side wall of the heat dissipation groove. The locking block and the pop-out block are engaged by inclined friction. The locking block is used to slide under the force of the pop-out block when the abutment portion slides towards the bottom of the heat dissipation groove, so that the snap-fit ​​portion avoids the path for the locking block to pass through. The locking block is also used to separate from the pop-out block when the heat dissipation components are installed in place. A second elastic element is also connected between the pop-up block and the side plate. The second elastic element is used to provide a second elastic force for sliding reset to the locking block. The locking block is also used to slide under the action of the second elastic force when it is separated from the pop-up block, so that the latching part is latched with the locking block. The elastic locking mechanism also includes an unlocking element, which is drivenly connected to the locking block and is used to drive the locking block to slide when force is applied, so that the latching part is separated from the locking block. A third elastic element is also connected between the pop-up block and the side plate. The third elastic element is used to provide a third elastic force to the abutment part in the direction away from the bottom of the heat sink. The pop-up block is used to slide in the direction away from the bottom of the heat sink under the action of the third elastic force when the latching part is separated from the locking block, so as to push the heat sink bottom shell and heat sink out of the heat sink through the abutment part.

[0015] This embodiment of the application, by setting a connector board on the motherboard and a first slot on the expansion card, ensures that only a portion of the expansion card's structure is integrated into the overall height of the chassis, thus reducing the overall height of the chassis and facilitating a reduction in overall chassis size. Furthermore, by placing the expansion card on the side panel, the assembly of the expansion card and motherboard can be completed simultaneously with the installation of the side panel, and the side panel can be used to support and secure the expansion card, ensuring a stable electrical connection between the expansion card and the motherboard.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of the industrial control computer provided in the embodiment of this utility model in its assembled state is shown;

[0019] Figure 2 A perspective view of the industrial control computer provided in the embodiment of this utility model in a disassembled state is shown;

[0020] Figure 3 An exploded view of an industrial control computer provided in an embodiment of this utility model is shown.

[0021] Figure 4 This invention illustrates a partial structure of an industrial control computer provided in an embodiment of the present invention;

[0022] Figure 5 A partial cross-sectional view of the industrial control computer provided in an embodiment of the present invention is shown;

[0023] Figure 6 It shows Figure 5 Enlarged view of point A in the middle;

[0024] Figure 7 An exploded view of the industrial control computer provided in an embodiment of this utility model is shown from another perspective;

[0025] Figure 8 It shows Figure 7 Enlarged view of point B in the middle;

[0026] Figure 9 This illustration shows another partial structure of the industrial control computer provided in an embodiment of the present invention;

[0027] Figure 10 This is an exploded view of the heat dissipation component in the industrial control computer provided in an embodiment of the present invention;

[0028] Figure 11 An exploded view of the heat dissipation component in the industrial control computer provided in this embodiment of the present invention is shown from another perspective;

[0029] Figure 12 It shows Figure 7 Enlarged view of point C in the middle;

[0030] Figure 13 This diagram shows a structural schematic of the first state of the elastic locking mechanism in the industrial control computer provided by an embodiment of the present invention;

[0031] Figure 14 This invention provides a schematic diagram of the second state of the elastic locking mechanism in an industrial control computer according to an embodiment of the present invention.

[0032] Figure 15 This invention provides a schematic diagram of the third state of the elastic locking mechanism in an industrial control computer.

[0033] Figure 16 This diagram illustrates the structure of the heat dissipation component in the industrial control computer provided in this embodiment of the invention, under the installation state.

[0034] The reference numerals in the detailed embodiments are as follows:

[0035] 1. Industrial control computer;

[0036] 10. Chassis; 11. Enclosure; 111. Receiving cavity; 112. First opening; 113. Connecting groove; 114. Ejector; 115. First elastic element; 12. Side plate; 121. Connecting assembly; 1211. Connecting block; 1212. Button; 1213. Angled surface; 1214. First spring; 122. Second opening; 123. Locking rod; 1231. Fixing pin; 1232. Paddle; 124. Elastic element; 125. Guide groove; 126. Heat dissipation groove; 127. Heat-conducting block; 13. Interface area;

[0037] 20. Motherboard; 21. Connector board;

[0038] 30. Expansion card; 31. First slot; 32. Second slot; 33. First elastic conductive element; 331. Ejector pin; 332. Second spring;

[0039] 40. Interface board; 41. Interface; 42. Connector;

[0040] 50. Fixing bracket; 51. Fixing hole; 52. Pressing part;

[0041] 60. Heat dissipation assembly; 61. Heat dissipation base shell; 611. Heat dissipation plate; 612. Heat dissipation fin; 613. Slot; 614. Locking block; 615. Second elastic conductive element; 616. Rubber sleeve; 62. Heat dissipation component; 621. Connecting hole; 622. Conductive part; 63. Fixing element; 631. Top plate; 632. Fixing block; 633. Connecting plate; 634. First hook; 635. Second hook;

[0042] 70. Elastic locking mechanism; 71. Locking block; 711. Snap-fit ​​part; 72. Second elastic element; 73. Unlocking element; 74. Pop-out block; 741. Abutting part; 75. Third elastic element. Detailed Implementation

[0043] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0045] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0046] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0047] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0048] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0049] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0050] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0051] To reduce the overall size of the industrial control computer, this application considers connecting the expansion card directly to the motherboard for configuration, instead of using an expansion box and adapter board, thus reducing the overall size of the industrial control computer. However, since the back of the motherboard has a large number of solder points and metal pins for installing CPU cards and expansion card slots, these solder points are usually raised, and direct contact between these solder points and the inner wall of the chassis can cause short circuits. Therefore, a certain gap usually needs to be left between the back of the motherboard and the inner wall of the chassis. Since the slots are located on the front of the motherboard, the expansion card will be located on the front of the motherboard after being inserted. This means that the overall height of the chassis needs to be added to the existing height between the motherboard and the chassis, plus the height of the expansion card, resulting in a relatively tall chassis.

[0052] Furthermore, since expansion cards are generally connected to slots on the motherboard via their gold fingers, the slot can only fix one end of the expansion card, leaving the other end suspended. Industrial PCs may be installed in environments such as production lines, mobile vehicles, and construction sites, requiring them to operate in harsh vibration environments. Long-term vibration may cause poor contact in the slot or damage to the gold fingers, thereby affecting the electrical connection between the expansion card and the motherboard.

[0053] Based on this, in order to further reduce the size of the industrial control computer, this application provides an industrial control computer that swaps the main configuration of the gold fingers and the slot. Specifically, the gold fingers are formed by extending outward from one edge of the motherboard, while the slot is set on the expansion card. This allows the slot and the gold fingers to be connected by interlocking, with structures located on both sides of the gold fingers. When the motherboard is inserted into the slot on the expansion card via the gold fingers, the part of the expansion card that is in contact with the slot will protrude from both sides of the motherboard. This causes part of the height of the expansion card to coincide with the gap between the back of the motherboard and the inner wall of the chassis. Only part of the height of the expansion card will be added to the height of the chassis, thus making the internal structure of the chassis more compact and helping to reduce the height of the chassis.

[0054] Furthermore, to facilitate the installation of expansion cards, the industrial computer chassis is designed to consist of a main body and a side panel. An opening is located on one side of the main body, with a side panel cover positioned at the opening. The motherboard is mounted inside the main body, perpendicular to the side panel, with its gold fingers located on the side facing the opening. The expansion card is fixed to the inner wall of the side panel, parallel to it, with its slot located on the side of the expansion card facing away from the side panel. By placing the side panel cover at the opening, the gold fingers on the motherboard can be inserted into the slot on the expansion card, thus establishing an electrical connection between the motherboard and the expansion card. This structure allows for expansion card installation simultaneously with the side panel installation, making installation more convenient. The side panel also provides support and stability for the expansion card within the chassis, ensuring a stable electrical connection between the motherboard and the expansion card.

[0055] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 and Figure 2 The three-dimensional structure of the industrial control computer is shown in two different states. Figure 3 The exploded structure of the industrial control computer is shown. The industrial control computer 1 includes a chassis 10, a motherboard 20, and an expansion card 30.

[0056] like Figure 2 and Figure 3 As shown, the chassis 10 includes a body 11 and a side panel 12. The body 11 is the main part of the chassis 10, and its interior forms a receiving cavity 111. The receiving cavity 111 is used to accommodate various functional components of the industrial control computer 1, such as the motherboard 20, expansion card 30, power supply, etc. A first opening 112 is provided on one side of the body 11. The first opening 112 is used for the expansion card 30 to enter the receiving cavity 111 so that the expansion card 30 can be plugged into and connected to the motherboard 20.

[0057] Furthermore, to avoid interference between the expansion card 30 and the interface area 13 on the motherboard 20 (such as COM serial port, multiple network ports, GPIO interface, etc.), Figure 2 and Figure 3 As shown, the first opening 112 can be opened on the side of the housing 11 opposite to the side where the interface area 13 is located. For example, the interface area 13 is set on the side of the housing 11 facing the negative direction of the X-axis, while the first opening 112 is set on the side of the housing 11 facing the positive direction of the X-axis.

[0058] The side panel 12 is positioned over the first opening 112 and connected to the housing 11 to seal the accommodating cavity 111, preventing dust and moisture from entering the cavity 111 through the first opening 112 and ensuring the normal operation of components such as the motherboard 20 and expansion card 30. The side panel 12 and the housing 11 can be connected by methods such as bonding, welding, or fixed fastening, or by methods such as threaded connection or snap fastening for easy removal.

[0059] The motherboard 20 is located inside the enclosure 11, specifically within the receiving cavity 111, and is perpendicular to the side panel 12. The motherboard 20 is the core framework and nerve center of the industrial control computer 1, serving as the connection carrier for all hardware (such as CPU, memory, storage, etc.). Specifically, chipsets, I / O interfaces, and other structures can be soldered onto the motherboard 20. Slots (such as PCIe slots, PCI slots, etc.) can also be provided on the motherboard 20, allowing CPU cards, memory cards, and other structures to be electrically connected to the motherboard 20 by plugging them into these slots.

[0060] In addition, please continue to refer to Figure 2 and Figure 3 and further combine Figure 4 , Figure 4 The partial structure of the industrial control computer is shown. A connector plate 21 (such as a gold finger) extends from the motherboard 20 towards the first opening 112. This connector plate 21 is used for electrical connection with the expansion card 30 to mount the expansion card 30 onto the motherboard 20. Specifically, the motherboard 20 can be fixedly mounted on the inner wall of the housing 11 facing the negative Z-axis direction, or fixedly mounted on the inner wall of the housing 11 facing the positive Z-axis direction and perpendicular to the Z-axis direction. The connector plate 21 is located on the side of the motherboard 20 facing the positive X-axis direction.

[0061] The expansion card 30 is fixedly mounted on the inner wall of the side panel 12 (i.e., the side of the side panel 12 facing the negative X-axis) and parallel to the side panel 12. A first slot 31 is located on the side of the expansion card 30 facing away from the side panel 12, and the position of the first slot 31 is opposite to the position of the connector plate 21. When the side panel 12 is covered by the first opening 112, the expansion card 30 moves closer to the motherboard 20 along with the side panel 12. When the side panel 12 is connected to the enclosure 11, the first slot 31 on the expansion card 30 will connect with the connector plate 21 on the motherboard 20, thus electrically connecting the motherboard 20 and the expansion card 30. The first slot 31 can be a PCIe slot, PCI slot, etc.

[0062] by Figure 2 and Figure 3 Taking the structure shown as an example, the first slot 31 is located on the side of the expansion card 30 facing the negative X-axis direction. After the CPU card, memory, and other functional components in the accommodating cavity 111 are installed, the side plate 12 can be placed on the first opening 112 facing the negative X-axis direction. At this time, the expansion card 30 will move closer to the motherboard 20 as the side plate 12 moves, and when the side plate 12 is connected to the chassis 11, it will be connected to the motherboard 20 through the first slot 31, that is, the connector plate 21 on the motherboard 20 will be inserted into the first slot 31. While connecting the side plate 12 to the chassis 11, the motherboard 20 and the expansion card 30 can also be connected through the first slot 31 and the connector plate 21. The assembly of the expansion card 30 and the motherboard 20 is simple and convenient, and the expansion card 30 can be supported and fixed by the side plate 12 to ensure that the connector plate 21 and the first slot 31 can maintain a stable connection.

[0063] The position of the first slot 31 on the expansion card 30 can be set according to the position of the motherboard 20 within the accommodating cavity 111. For example, if the motherboard 20 is located on the inner wall of the top of the enclosure 11, the first slot 31 can be located on the expansion card 30 in a position biased towards the positive X-axis direction. If the motherboard 20 is located on the inner wall of the bottom plate of the enclosure 11, the first slot 31 can be located on the expansion card 30 in a position biased towards the negative X-axis direction. If the motherboard 20 is located in the middle of the enclosure 11, the first slot 31 can be located in the middle of the expansion card 30.

[0064] Specifically, with Figure 2 and Figure 3 Taking the structure shown as an example, the motherboard 20 is located on the inner wall of the top of the enclosure 11, while the first slot 31 is located on the expansion card 30 at a position biased towards the positive X-axis direction. That is, the distance L1 from the side of the first slot 31 facing the positive X-axis to the edge of the expansion card 30 is less than the distance L2 from the side of the first slot 31 facing the negative X-axis to the edge of the expansion card 30. In addition, the sizes of L1 and L2 can be adjusted according to the setting position of the motherboard 20 so that after the side plate 12 is connected to the enclosure 11, the plug-in board 21 can be plugged into the first slot 31.

[0065] In addition, to ensure the normal operation of each component on the motherboard 20, there is usually a certain distance between the side of the motherboard 20 facing the positive Z-axis and the inner wall of the top of the chassis 11. When the expansion card 30 is electrically connected to the motherboard 20, in the direction shown by the Z-axis, the distance L1 from the side of the first slot 31 facing the positive Z-axis to the edge of the expansion card 30 will coincide with the distance from the side of the motherboard 20 facing the positive Z-axis to the inner wall of the chassis 11, while the distance L2 from the side of the first slot 31 facing the negative Z-axis to the edge of the expansion card 30 will be added to the overall height of the chassis 10.

[0066] In this structure, compared to a structure with slots on the motherboard 20 and gold fingers on the expansion card 30, by setting the connector board 21 on the motherboard 20 and the first slot 31 on the expansion card 30, only a portion of the structure on the expansion card 30 is superimposed on the overall height of the chassis 10, thus reducing the overall height of the chassis 10 and facilitating a reduction in overall chassis size. Furthermore, by placing the expansion card 30 on the side panel 12, the assembly of the expansion card 30 and the motherboard 20 can be completed simultaneously with the installation of the side panel 12. The side panel 12 can also be used to support and fix the expansion card 30, ensuring a stable electrical connection between the expansion card 30 and the motherboard 20.

[0067] Regarding the connection method between the side panel 12 and the housing 11, this application provides a specific feasible method, such as... Figure 2 and Figure 5 As shown, Figure 5 The diagram shows a partial cross-sectional view of the industrial control computer. A connecting groove 113 is provided on the inner wall of the housing 11, and a connecting component 121 is movably provided on the inner wall of the side plate 12. The side plate 12 and the housing 11 can be quickly assembled and disassembled through the detachable connection between the connecting component 121 and the connecting groove 113.

[0068] Specifically, with Figure 5 Taking the connecting component 121 located on the side plate 12 facing the negative Y-axis direction as an example in the structure shown, as follows: Figure 2 and Figure 6 As shown, Figure 6 It shows Figure 5 The enlarged structure at point A shows that the connecting component 121 includes a connecting block 1211 and a button 1212. The connecting block 1211 is disposed on the side plate 12 and can slide relative to the side plate 12 in the direction shown by the Y axis. Furthermore, the connecting block 1211 has an inclined surface 1213 on the side facing the negative Y-axis, and a first spring 1214 is connected between the connecting block 1211 and the side plate 12. When the side plate 12 is installed on the housing 11 facing the negative X-axis, the inclined surface 1213 will abut against the inner wall of the housing 11, causing the connecting block 1211 to slide in the positive Y-axis direction under the force of the inner wall of the housing 11, and causing the first spring 1214 to undergo elastic deformation, thereby providing the connecting block 1211 with an elastic force in the positive Y-axis direction. When the connecting block 1211 is opposite to the connecting groove 113, the connecting block 1211 can slide in the positive Y-axis direction under the action of the elastic force and be engaged in the connecting groove 113, thereby realizing the fixed connection between the side plate 12 and the housing 11.

[0069] Button 1212 can also be slidably disposed on the inner wall of side plate 12, and partially protrude from the outer wall of side plate 12. Button 1212 and connecting block 1211 can be connected by means of inclined plane, gear rack, or other structures. Figure 6 Taking the structure shown as an example, button 1212 and connecting block 1211 abut against each other via an inclined surface. When button 1212 is pressed, button 1212 slides in the negative X-axis direction, and the inclined surface drives connecting block 1211 to slide out of connecting groove 113 in the positive Y-axis direction, thereby unlocking side plate 12 and allowing side plate 12 to be removed from housing 11, thus enabling maintenance and replacement of expansion card 30 on side plate 12.

[0070] In this structure, when installing the expansion card 30, simply align the side plate 12 with the first opening 112 and push the side plate 12 in the negative X-axis direction. This allows the connecting block 1211 to slide against the inner wall of the housing 11 and engage with the connecting groove 113 on the inner wall of the housing 11 when the expansion card 30 is in place. This completes the installation of the side plate 12 and the expansion card 30, allowing the industrial computer 1 to start from the inside of the housing 11. Figure 2 The state changes shown are Figure 1 The state shown. When it is necessary to remove the expansion card 30, simply press the button 1212 on the side plate 12 to drive the connecting block 1211 out of the connecting slot 113, thereby allowing the side plate 12 and the expansion card 30 to be pulled out from the first opening 112, thus completing the disassembly of the side plate 12 and the expansion card 30, i.e., the industrial computer 1 can then be removed from the opening. Figure 1 The state changes shown are Figure 2 The side panel 12 and expansion card 30 are now easier to assemble and disassemble, thus improving the efficiency of maintenance and replacement of the expansion card 30.

[0071] Of course, the structure in the connecting assembly 121 used to drive the connecting block 1211 out of the connecting groove 113 can also be designed as a lever. The lever is fixedly connected to the connecting block 1211 and can slide relative to the side plate 12 in the direction shown by the Y axis. Thus, by moving the lever in the direction shown by the Y axis, the connecting block 1211 can be driven to slide in the direction shown by the Y axis. In addition, the connecting block 1211 and the side plate 12 can also be connected by elastic structures such as springs or elastic arms to provide elastic force to the connecting block 1211 when it abuts against the inner wall of the housing 11. Thus, when the connecting block 1211 is opposite to the connecting groove 113, it will automatically engage with the connecting groove 113 under the action of the elastic force.

[0072] Furthermore, to facilitate the disassembly of the side panel 12 and the expansion card 30, in some embodiments, such as Figure 7 and Figure 8 As shown, Figure 7 This shows another perspective of the exploded structure of the industrial control computer. Figure 8 It shows Figure 7In the enlarged structure at point B, an ejector 114 is slidably provided on the inner wall of the housing 11, and the ejector 114 abuts against the inner wall of the side plate 12. A first elastic member 115 connects the ejector 114 and the inner wall of the housing 11. The first elastic member 115 can be an elastic structure such as a spring or a sheet.

[0073] Specifically, the ejector 114 can slide along the X-axis. When the side plate 12 is pushed in the negative X-axis direction, the ejector 114 will slide in the negative X-axis direction under the force of the side plate 12, and compress the first elastic member 115, so that the first elastic member 115 is in a compressed state, so as to provide elastic force to the ejector 114 in the positive X-axis direction. Moreover, when the side plate 12 is installed in place, the connecting block 1211 will engage with the connecting groove 113, so as to lock the side plate 12 by providing a force in the negative X-axis direction through the connecting groove 113.

[0074] When the side panel 12 is unlocked, the connecting block 1211 separates from the connecting groove 113, and the force provided by the connecting groove 113 to the side panel 12 in the negative X-axis direction disappears. Under the elastic force provided by the first elastic member 115, the ejector 114 slides in the positive X-axis direction and pushes the side panel 12 to move away from the housing 11, so that the side panel 12 separates from the housing 11. This allows the expansion card 30 to be easily pulled out, thus completing the disassembly of the side panel 12 and the expansion card 30, making the maintenance and replacement of the expansion card 30 more convenient.

[0075] Furthermore, considering that different working environments require different external devices, in order to improve the compatibility of the expansion card 30, in some embodiments, such as Figure 4 and Figure 5 As shown, the expansion card 30 is provided with at least one second slot 32 on the side facing the side plate 12. A second opening 122 is provided on the side plate 12 opposite to the second slot 32. The industrial computer 1 also includes an interface board 40. The interface board 40 is inserted into the second slot 32 through the second opening 122. The interface board 40 is provided with at least one interface 41 exposed on the side plate 12. The interface 41 is used to connect external devices.

[0076] The specific type of interface 41 can be set according to the type of expansion card 30 and the application scenario of industrial computer 1. For example, if expansion card 30 is a graphics card, interface 41 can be a VGA, DVI, HDMI, DP and other output interfaces to connect external devices such as monitors, projectors, and TVs to display the data and analysis results collected by industrial computer 1. If expansion card 30 is a network card, interface 41 can be a network port, antenna interface, etc., to connect external devices such as network cables or WIFI antennas through interface 41.

[0077] The circuitry in the area corresponding to the second slot 32 on the expansion card 30 is designed to be compatible and can recognize multiple display interfaces. The second slot 32 can be a PCIE slot, an M.2 slot, a PCI slot, etc. If the expansion card 30 has multiple second slots 32, the multiple second slots 32 can adopt the same type and circuit design, so that the multiple second slots 32 on the expansion card 30 can freely match different interface boards 40.

[0078] After the expansion card 30 is fixed to the side plate 12, the required interface 41 can be determined according to the working scenario of the industrial computer 1, and the corresponding interface board 40 can be selected according to the interface 41. Then, the interface board 40 is inserted into the second slot 32 on the expansion card 30 through the second opening 122 along the negative X-axis direction. If the external device connected to the industrial computer 1 needs to be replaced, the interface board 40 can be pulled out through the second opening 122 to replace it with a new interface board 40. This structure allows for flexible replacement of different interface boards 40 according to different working scenario requirements, thereby expanding the number and specifications of interfaces and improving the applicability of the industrial computer 1.

[0079] The interface board 40 can be directly fixed via the second slot 32, or it can be fixed by setting up a bracket, fixing plate, or other structures. Figure 5 As shown, as an example, the industrial computer 1 also includes a fixed bracket 50, an interface board 40 is fixedly mounted on the fixed bracket 50, the fixed bracket 50 is detachably inserted into the second opening 122 and covers the second opening 122, and at least one interface 41 on the interface board 40 is exposed from the fixed bracket 50.

[0080] The fixed bracket 50 can be detachably inserted into the second opening 122 through a threaded connection, snap-fit ​​or other structure. When disassembling or assembling the interface plate 40, the interface plate 40 and the fixed bracket 50 can be installed on the side plate 12 as a whole or removed from the side plate 12.

[0081] As an example, such as Figure 7 and Figure 9 As shown, Figure 9 This illustrates another partial structure of the industrial control computer, specifically... Figure 7In the structure shown, a partial structure on the side plate 12 facing the negative Y-axis has a fixing hole 51 on the fixing bracket 50. A locking rod 123 that slides along the Y-axis is provided on the side plate 12. An elastic element 124 connects the locking rod 123 to the side plate 12. A fixing pin 1231 is provided on the side of the locking rod 123 facing the positive Y-axis, and part of the fixing pin 1231 is opposite to the second opening 122. After the interface plate 40 and the fixing bracket 50 are fixed, the fixing bracket 50 can be inserted into the second opening 122 along the negative X-axis. The fixing pin 1231 will abut against the fixing bracket 50 and be subjected to... The force applied to the fixed bracket 50 slides in the negative direction of the Y-axis, the elastic element 124 is compressed and provides an elastic force to the fixed pin 1231 in the positive direction of the Y-axis. When the fixed bracket 50 is inserted into place, that is, when the interface plate 40 is inserted into the second slot 32, the fixing hole 51 on the fixed bracket 50 will be opposite to the fixed pin 1231. At this time, the fixed pin 1231 slides in the positive direction of the Y-axis under the elastic force provided by the elastic element 124 and is inserted into the fixing hole 51, thereby locking the interface plate 40 and the fixed bracket 50 on the side plate 12 to ensure a stable electrical connection between the interface plate 40 and the second slot 32.

[0082] In addition, the locking lever 123 is also provided with a paddle 1232 that protrudes partially from the surface of the side plate 12. The paddle 1232 can be moved relative to the side plate 12 in the direction shown by the Y axis. When the interface board 40 needs to be replaced, the paddle 1232 is moved in the negative direction of the Y axis, so that the locking lever 123 and the fixing pin 1231 slide in the negative direction of the Y axis, thereby disengaging the fixing pin 1231 from the fixing hole 51 on the fixing bracket 50, and the interface board 40 and the fixing bracket 50 can be removed from the side plate 12. In addition, the paddle 1232 can protrude partially from the inner wall of the side plate 12. Therefore, before removing the interface board 40, the side plate 12 needs to be removed from the housing 11 first, so that the connection between the main board 20 and the expansion card 30 is disconnected. Only then can the paddle 1232 on the inner wall of the side plate 12 be moved to remove the interface board 40 from the expansion card 30, ensuring that the interface board 40 can be replaced while the expansion card 30 is powered off.

[0083] In this structure, not only can the interface board 40 be supported and fixed by the fixed bracket 50 to ensure a stable electrical connection between the interface board 40 and the expansion card 30, but the fixed bracket 50 can also block the second opening 122 to prevent dust, moisture and other external environmental elements from entering the chassis 10 through the second opening 122, thus ensuring the stability and reliability of the industrial computer 1.

[0084] In addition, to facilitate the installation of the fixed bracket 50, such as Figure 9As shown, a guide groove 125 extending along the X-axis can also be provided on the side plate 12. When installing the interface plate 40 and the fixed bracket 50, the fixed bracket 50 is inserted into the guide groove 125, and the fixed bracket 50 and the interface plate 40 are pushed into the second opening 122 along the negative X-axis direction. With the guiding effect of the guide groove 125, it is ensured that while the fixed bracket 50 is inserted into the second opening 122, the insertion part 42 on the interface plate 40 can be opposite to the second slot 32. Thus, while the fixed bracket 50 is pushed into the second opening 122, the insertion part 42 of the interface plate 40 is connected to the second slot 32.

[0085] Furthermore, the fixing bracket 50 also has a pressing part 52 that protrudes from the inner wall of the side plate 12. The pressing part 52 is used to bear the force in the positive X-axis direction when the fixing pin 1231 is disengaged from the fixing hole 51, so as to drive the interface plate 40 to move in the positive X-axis direction through the fixing bracket 50, thereby separating the interface plate 40 from the second slot 32, and then pulling the fixing bracket 50 and the interface plate 40 out of the second opening 122 in the positive X-axis direction.

[0086] Furthermore, considering that expansion cards such as discrete graphics cards, high-speed network cards, and AI accelerator cards have high power consumption and generate a lot of heat, in order to avoid the high internal temperature of the chassis 10 affecting the normal operation of the industrial control computer 1, in some embodiments, such as Figure 5 As shown, the expansion card 30 can be attached to the inner wall of the side panel 12, and heat dissipation components 60 such as heat sinks and fans can be installed on the outer wall of the side panel 12 to transfer the heat generated by the expansion card 30 to the external environment through the side panel 12 and the heat dissipation components 60.

[0087] like Figure 5 and Figure 7 As shown, a heat dissipation groove 126 is provided on the side of the side panel 12 facing away from the housing 11. The expansion card 30 is attached to the inner wall of the side panel 12 opposite to the heat dissipation groove 126. The industrial computer 1 also includes a heat dissipation component 60, which is disposed in the heat dissipation groove 126. The heat dissipation component 60 drives air into the heat dissipation groove 126, and after the air flows through the bottom of the heat dissipation groove 126, the air that has absorbed heat is discharged from the heat dissipation groove 126.

[0088] Regarding the method of attaching the expansion card 30 to the inner wall of the side panel 12, the heat-generating components on the expansion card 30 can be directly attached to the inner wall of the side panel 12, or a heat-conducting block 127 can be sandwiched between the expansion card 30 and the inner wall of the side panel 12. The heat generated by the heat-generating components is conducted to the bottom of the heat sink 126 through the heat-conducting block 127, and then the heat at the bottom of the heat sink 126 is carried away by the air, thereby dissipating heat from the heat-generating components on the expansion card 30. In this structure, the heat generated by the heat-generating components on the expansion card 30 can be conducted to the outer surface of the chassis 10 using the side panel 12, and then the expansion card 30 is dissipated by the external heat dissipation component 60. It is not necessary to place the heat dissipation component 60 inside the chassis 10, nor is it necessary to open a ventilation opening on the chassis 10, effectively preventing dust from entering the chassis 10 and improving the reliability of the industrial control computer 1.

[0089] Regarding the structure of the heat dissipation component 60, this application embodiment provides a specific implementation method, such as... Figure 5 , Figure 10 and Figure 11 As shown, Figure 10 and Figure 11 The exploded structure of the heat dissipation component is shown from two different perspectives. Figure 5 The heat sink 126 contains two heat dissipation components, and the two heat dissipation components 60 have the same structure, except that they are arranged symmetrically in the direction shown by the X-axis. Figure 10 and Figure 11 Specifically shown Figure 5 The exploded structure of the heat dissipation component 60 on the left side. In addition, protrusions and grooves are respectively provided on the sides of the two heat dissipation components 60 facing each other, so as to fix the two heat dissipation components 60 together by interlocking the protrusions and grooves.

[0090] It should be noted that the number of heat dissipation components 60 shown in the figure is for reference only. Only one heat dissipation component 60 matching the heat dissipation slot 126 may be provided, or other numbers of heat dissipation components 60 may be provided. Furthermore, multiple heat dissipation components 60 can be connected by magnetic attraction, snap-fit ​​structures, etc., in addition to protrusions and grooves. This embodiment is only used to describe the structure of the heat dissipation component 60 and does not limit the number of heat dissipation components 60 or the connection method between multiple heat dissipation components 60.

[0091] like Figure 10 and Figure 11As shown, the heat dissipation assembly 60 includes a heat dissipation base shell 61 and a heat dissipation element 62. The heat dissipation base shell 61 is in contact with the bottom of the heat dissipation slot 126 to conduct the heat generated by the expansion card 30 to the bottom of the heat dissipation slot 126, and then the heat is conducted from the bottom of the slot to the heat dissipation base shell 61. A plurality of heat dissipation plates 611 are arranged at intervals on the side of the heat dissipation base shell 61 away from the bottom of the heat dissipation slot 126, so that the intervals between the heat dissipation plates 611 form a channel for air to pass through, and the heat dissipation plates 611 increase the contact area between the heat dissipation base shell 61 and the air.

[0092] Please continue reading. Figure 10 and Figure 11 Multiple heat sinks 611 extend from both ends of their extension direction (i.e., the direction shown by the Y-axis) toward the direction away from the bottom of the heat sink 126 (i.e., the positive direction of the X-axis) to form heat sink fins 612. Heat sink 62 is detachably mounted on the heat sink base 61 and located between the heat sink fins 612 on opposite sides to form a heat dissipation channel between the heat sinks 611 and the heat sink fins 612.

[0093] Specifically, the heat sink 62 can be an intake fan to drive air to flow in the negative X-axis direction into the space between the heat sink plates 611 on the heat sink base 61, and flow along the extension direction of the heat sink plates 611 towards the heat sink fins 612 on both sides, finally exiting the heat sink through the gaps between the heat sink fins 612. The heat sink 62 can also be an exhaust fan to extract the air from the gaps between the heat sink plates 611 and exhaust it into the heat sink 126, thereby allowing air from the external environment to enter the heat sink 126 through the gaps between the heat sink fins 612 on both sides, and flow along the heat sink fins 612 in the negative X-axis direction into the gaps between the heat sink plates 611.

[0094] In this structure, when air flows through the heat sink 611, it will exchange heat with the heat sink 611, thereby carrying away the heat on the heat sink 611. Moreover, the heat sink 611 and the heat sink 612 are set on the heat sink base 61, making it easier to process the heat sink groove 126 when producing the side plate 12.

[0095] Of course, the heat sink 611 and heat fin 612 can also be placed directly on the inner wall of the heat sink 126. Only the heat sink 62 needs to be installed in the heat sink 126. The heat sink 62 can drive the air to flow in the heat dissipation channel formed by the heat sink 611 and heat fin 612. In this way, the heat dissipation component 60 has fewer parts and a simpler structure.

[0096] In addition, such as Figure 10 and Figure 11 As shown, the heat dissipation assembly 60 may further include a fixing member 63. The fixing member 63 can be detachably connected to the heat dissipation assembly 62 via a threaded connection, a snap hook, or other structure, so as to fix the heat dissipation assembly 60 in place. As an example, such as... Figure 10 and Figure 11 As shown, the fixing member 63 includes a top plate 631, on which a fixing block 632 is provided. The fixing block 632 is inserted into the connecting hole 621 on the heat sink 62. Connecting plates 633 are vertically arranged on opposite sides of the top plate 631. A first hook 634 is provided on one side of the connecting plates 633 facing each other. The first hook 634 engages with the side of the heat sink 62 facing the heat sink base 61 to secure the heat sink assembly 60 to the fixing member 63. The heat sink base 61 has slots 613 on both sides adjacent to the side where the heat sink 612 is located. A second hook 635 is also provided on the connecting plate 633, and the second hook 635 is detachably engaged in the slot 613.

[0097] When assembling the heat dissipation assembly 60, first place the heat sink 62 facing the positive X-axis direction on the fixing member 63, and secure it with the first hook 634. Then, place the fixing member 63 facing the negative X-axis direction on the heat dissipation base 61, and engage the second hook 635 on the connecting plate 633 with the slot 613 to complete the installation of the heat dissipation assembly 60. When maintenance or replacement of the heat sink 62 is required, apply a force along the Z-axis to the connecting plate 633 to expand the connecting plates 633 on opposite sides, thereby separating the second hook 635 from the slot 613. Then, move the heat dissipation base 61 in the negative X-axis direction to separate the heat dissipation base 61 from the fixing member 63. The disassembly process of the heat sink 62 is the same as that of the heat dissipation base 61, and will not be described again here.

[0098] Regarding the fixing method of the heat dissipation component 60, this application embodiment provides a specific feasible method, such as... Figure 7 , Figure 11 and Figure 12 As shown, Figure 12 It shows Figure 7 The enlarged structure at point C shows that the side wall of the heat sink base 61 is equipped with a locking block 614, and the inner wall of the side plate 12 is movably equipped with an elastic locking mechanism 70. The elastic locking mechanism 70 protrudes from the inner side wall of the heat sink groove 126 and is detachably engaged with the locking block 614. The elastic locking mechanism 70 makes the disassembly and installation of the heat sink base 61 more convenient, which helps to improve the efficiency of heat dissipation and assembly.

[0099] As an example, please continue reading Figure 7 , Figure 11 and Figure 12The elastic locking mechanism 70 includes a locking block 71, which has a latching portion 711 extending from the side wall of the heat dissipation groove 126. The latching portion 711 provides a force in the negative X-axis direction to the locking block 614 to fix the heat dissipation base shell 61 in the heat dissipation groove 126, ensuring a tight fit between the heat dissipation base shell 61 and the heat dissipation groove 126. Specifically, the locking block 71 is slidably mounted on the side plate 12, and the latching portion 711 and the locking block 614 can engage via an inclined surface or a curved surface. This allows the latching portion 711 to slide under the force of the locking block 614 when the heat dissipation base shell 61 enters the heat dissipation groove 126, thus clearing a path for the locking block 614 to pass through.

[0100] Regarding the method of the locking part 711 avoiding the locking block 614, an inclined surface facing the positive X-axis can be provided at one end of the locking part 711 facing the negative Y-axis direction, so that the locking part 711 can slide along the Y-axis direction and retract inward into the side plate 12 under the abutment of the locking block 614. Alternatively, an inclined surface facing the positive X-axis can be provided on at least one side of the locking part 711 facing the Z-axis direction, so that the locking part 711 can move upward or downward along the Z-axis direction under the abutment of the locking block 614. Of course, an inclined surface facing the negative X-axis direction can also be provided on the locking block 614.

[0101] like Figure 13 As shown, Figure 13 The specific structure of the elastic locking mechanism is shown. A second elastic element 72, such as a spring or a sheet, can be connected between the locking block 71 and the side plate 12. The second elastic element 72 is used to provide a second elastic force for sliding reset to the locking block 71, so that the locking block 71 can slide under the action of the second elastic force when the heat dissipation base 61 is installed in place, so that the snap-fit ​​part 711 snaps into the locking block 614. At this time, the locking block 614 is located on the side facing the positive X-axis direction, so as to prevent the locking block 614 from moving in the positive X-axis direction, thereby fixing the heat dissipation base 61 in the heat dissipation groove 126.

[0102] It should be noted that, Figure 13 The dashed lines represent the side plate 12, while the solid lines represent the specific structure of the elastic locking mechanism. Furthermore... Figure 14 and Figure 15 The structures of the elastic locking mechanism in two other states are shown respectively. The structure represented by the dashed line is also the side plate 12, and the structure represented by the solid line is also the specific structure of the elastic locking mechanism.

[0103] In addition, please continue to refer to Figure 13The elastic locking mechanism 70 also includes an unlocking component 73, which is pulsatorically connected to the locking block 71 and is used to drive the locking block 71 to slide under force, so that the latching part 711 separates from the locking block 614, thereby allowing the heat dissipation base 61 to move out of the heat dissipation groove 126 along the positive X-axis, thus realizing the disassembly and assembly of the heat dissipation base 61 and the side plate 12. The unlocking component 73 can be pulsatorically connected through a structure such as an inclined plane, gear rack, etc. Figure 13 Taking the structure shown as an example, and combining it with Figure 7 , Figure 11 and Figure 12 The unlocking element 73 abuts against the locking block 71 via an inclined surface. When the unlocking element 73 is pressed downwards, that is, when the unlocking element 73 is subjected to an directional force... Figure 7 When a force is applied in the negative X-axis direction, the locking blocks 71 on both sides will move towards the center, i.e. Figure 12 The two latching parts 711 will move closer together towards the center, and the two latching parts 711 are along the heat dissipation base 61. Figure 7 When the heat sink 126 is moved out of the negative X-axis direction, it will move from... Figure 11 The gap between the locking block M and the locking block N is moved out and separated from the locking block 614, thereby realizing the disassembly of the heat dissipation base 61.

[0104] Furthermore, for aesthetic reasons, such as Figure 1 As shown, the surface of the heat dissipation component 60 facing the positive X-axis is usually flush with the outer wall of the side plate 12. Therefore, to facilitate the disassembly of the heat dissipation component 60, in some embodiments, such as... Figure 7 , Figure 12 and Figure 13 As shown, the elastic locking mechanism 70 also includes a pop-out block 74. The pop-out block 74 is slidably disposed on the inner wall of the side plate 12 along the depth direction of the heat dissipation groove 126 (i.e., the direction shown by the X-axis), and has an abutment portion 741 extending from the side wall of the heat dissipation groove 126. When the heat dissipation base shell 61 and the heat dissipation component 62 are installed into the heat dissipation groove 126 (i.e., the heat dissipation base shell 61 and the heat dissipation component 62 are pushed into the heat dissipation groove 126 along the negative X-axis direction), the abutment portion 741 will abut against the heat dissipation base shell 61 and slide towards the side where the bottom of the heat dissipation groove 126 is located under the force of the heat dissipation base shell 61. That is, the abutment portion 741 will slide in the negative X-axis direction under the abutment of the heat dissipation base shell 61.

[0105] Moreover, such as Figure 13 As shown, a third elastic element 75 is also connected between the pop-out block 74 and the side plate 12. The third elastic element 75 is used to provide a third elastic force to the abutment portion 741 in the direction away from the bottom of the heat dissipation groove 126, so as to... Figure 13 Taking the structure shown as an example, when the contact part 741 is contacted by the heat dissipation base 61, it faces... Figure 7When sliding in the negative direction of the X-axis, the third elastic element 75 is compressed and provides an upward third elastic force to the abutment portion 741, that is, a third elastic force is provided to the abutment portion 741 in the positive direction of the X-axis.

[0106] When the snap-fit ​​part 711 separates from the locking block 614, the pop-out block 74 will slide away from the bottom of the heat dissipation groove 126 under the action of the third elastic force. That is, the pop-out block 74 will slide in the positive X-axis direction under the action of the third elastic force, so as to push the heat dissipation bottom shell 61 and the heat dissipation component 62 out of the heat dissipation groove 126 through the abutment part 741, thereby completing the separation of the heat dissipation component 60 from the side plate 12, making the disassembly of the heat dissipation component 60 more convenient.

[0107] In addition, the locking block 71 and the ejector block 74 can be engaged by inclined surface friction to achieve the desired effect. Figure 13 and Figure 14 Taking the structure shown as an example, Figure 14 This illustrates the structure of another state of the elastic locking mechanism, when the heat dissipation component 60 is facing... Figure 7 When the heat sink 126 is inserted in the negative X-axis direction, the pop-out block 74 slides downward under the abutment of the heat sink base 61. Normally, the pop-out blocks 74 on both sides will abut the locking block 71 towards the center via their inclined surfaces, allowing the locking part 711 of the locking block 71 to avoid the path for the locking block 614 on the heat sink base 61 to pass through. When the heat sink assembly 60 is installed in place, the inclined surface on the pop-out block 74 slides away from the inclined surface on the locking block 71, causing the pop-out block 74 to separate from the locking block 71. This allows the locking block 71 to slide outward and reset under the second elastic force provided by the second elastic member 72, causing the locking part 711 to engage with the locking block 614. The positional relationship between the pop-out block 74 and the locking block 71 changes from... Figure 13 The state transition shown is Figure 14 The state shown.

[0108] Furthermore, combined Figure 15 The structure of the elastic locking mechanism shown is such that when the unlocking member 73 is pressed downwards, the locking block 71 moves towards the center, and the positional relationship between the pop-out block 74 and the locking block 71 changes from... Figure 14 The state transition shown is Figure 15 In the state shown, the structure where the upper inclined surface of the locking block 71 is located will also move towards the center and separate from the structure where the upper inclined surface of the pop-out block 74 is located, so that the pop-out block 74 can slide upward normally under the action of the third elastic force provided by the third elastic element 75, and move the heat dissipation base 61 and the heat dissipation element 62 towards the center. Figure 7 A heat dissipation slot 126 extends out in the positive direction of the X-axis.

[0109] In this structure, while ensuring that the locking block 71 and the pop-out block 74 work together normally, the principle that the pop-out block 74 must abut against the heat dissipation base 61 in order to push out the heat dissipation base 61 and the heat sink 62 is utilized. The pop-out block 74 and the locking block 71 are made to contact each other through the inclined surface. This allows the pop-out block 74 to slide towards the bottom of the heat dissipation groove 126 under the force of the heat dissipation base 61, while driving the locking block 71 to slide and avoid the path for the locking block 614 on the heat dissipation base 61 to pass through. This eliminates the need to set additional inclined or curved surfaces on the locking block 71.

[0110] Furthermore, to better achieve quick disassembly of the heat dissipation components, in some embodiments, such as Figure 5 As shown, a first elastic conductive element 33 is vertically disposed on the expansion card 30. The first elastic conductive element 33 passes through the side plate 12 and partially extends into the heat dissipation groove 126. A second elastic conductive element 615 is disposed through the heat dissipation bottom shell 61, and the second elastic conductive element 615 is in electrical contact with the first elastic conductive element 33. A conductive part 622 is disposed on the side of the heat dissipation element 62 facing the bottom of the heat dissipation groove 126, and the conductive part 622 is electrically connected to the second elastic conductive element 615.

[0111] When the heat sink 62 is installed on the heat sink base 61 in the negative X-axis direction, the conductive part 622 on the heat sink 62 will directly abut against the second elastic conductive part 615 on the heat sink base 61. When the heat sink base 61 and the heat sink 62 are installed into the heat sink groove 126 in the negative X-axis direction, the end of the second elastic conductive part 615 on the heat sink base 61 facing the bottom of the heat sink groove 126 will directly abut against the end of the first elastic conductive part 33 that extends into the heat sink groove 126, so that the expansion card 30 can supply power to the heat sink 62 through the first elastic conductive part 33, the second elastic conductive part 615 and the conductive part 622.

[0112] Regarding the specific structure of the first elastic conductive element 33, this application provides a possible implementation method, such as... Figure 5 As shown, the first elastic conductive element 33 is soldered to the expansion card 30, and the end of the first elastic conductive element 33 that extends into the heat sink 126 is a retractable pin 331. The interior of the first elastic conductive element 33 contains a second spring 332 that abuts against the pin 331.

[0113] The specific structure of the second elastic conductive element 615 is the same as that of the first elastic conductive element 33. Meanwhile, in order to prevent the first elastic conductive element 33 from short-circuiting due to direct contact with the heat dissipation base 61, a rubber sleeve 616 can be provided on the heat dissipation base 61, and the second elastic conductive element 615 can be inserted into the rubber sleeve 616. In this way, the rubber sleeve 616 can not only isolate the second elastic conductive element 615 from the heat dissipation base 61, preventing the second elastic conductive element 615 from contacting the heat dissipation base 61 and short-circuiting, but the rubber sleeve 616 can also play a dustproof role, preventing the second elastic conductive element 615 from affecting its power supply to the heat dissipation element 62 due to dust accumulation.

[0114] In this structure, the heat sink 62 is powered through the contact of the first elastic conductive element 33, the second elastic conductive element 615, and the conductive part 622, without the need for a socket, pins, or cables. The electrical connection between the expansion card 30 and the heat sink 62 can be disconnected simply by removing the heat sink base 61 and the heat sink 62 from the heat sink slot 126. This makes the disassembly of the heat sink assembly 60 more convenient. Furthermore, the springs inside the first elastic conductive element 33 and the second elastic conductive element 615 have the advantages of shock absorption and anti-loosening, ensuring the stability of the electrical connection between the heat sink 62 and the expansion card 30.

[0115] To further ensure the stability of the electrical connection between the heat sink 62 and the expansion card 30, in some embodiments, such as Figure 7 and Figure 16 As shown, Figure 16 The structure of the heat dissipation assembly in its installed state is shown. The second elastic conductive element 615 is located at the edge of the heat dissipation base 61. There are multiple locking blocks 614, which are all disposed on the side wall of the heat dissipation base 61 near the second elastic conductive element 615 and are respectively located on both sides of the second elastic conductive element 615.

[0116] like Figure 16 As shown, the elastic locking mechanism 70 includes multiple locking blocks 71, which are detachably engaged with multiple locking blocks 614 in a one-to-one manner. Figure 16 Taking the structure shown as an example, when the heat dissipation component 60 along... Figure 7 When the heat sink 126 is installed in the negative X-axis direction, Figure 16 The locking blocks 71 on the left and right sides of the heat dissipation base 61 will respectively engage with the locking blocks 614 located on the left and right sides of the second elastic conductive member 615 on the heat dissipation base 61, so that the locking blocks 71 will respectively apply force to the heat dissipation base 61 on the left and right sides of the second elastic conductive member 615. Figure 7 The force applied in the negative X-axis direction ensures that the second elastic conductive element 615 and the first elastic conductive element 33 maintain a stable electrical connection, thereby ensuring that the expansion card 30 can stably supply power to the heat sink 62.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An industrial control computer, characterized in that, The industrial control computer includes: The chassis includes a housing and a side panel, wherein a first opening is provided on one side of the housing, and the side panel cover is disposed at the first opening; The motherboard is located inside the housing and is perpendicular to the side panel. The motherboard extends to the side facing the first opening to form a plug-in plate. An expansion card is fixed to the inner wall of the side panel and parallel to the side panel. The side of the expansion card facing away from the side panel has a first slot. The first slot is plugged into the connector to make the motherboard and the expansion card electrically connected.

2. The industrial control computer according to claim 1, characterized in that, A connecting groove is provided on the inner wall of the box, and a connecting component is movably provided on the inner wall of the side plate. The connecting component is detachably snapped into the connecting groove.

3. The industrial control computer according to claim 2, characterized in that, The connection component includes a connection block and a button; The connecting block can be slidably disposed on the side plate and snapped into the connecting groove; The button is slidably disposed on the inner wall of the side panel and partially protrudes from the outer wall of the side panel. The button is connected to the connecting block in a driving manner. When the button is pressed, it drives the connecting block to slide out of the connecting groove to unlock the side panel.

4. The industrial control computer according to claim 3, characterized in that, The inner wall of the box is slidably provided with an ejector, which abuts against the inner wall of the side plate; A first elastic element is connected between the ejector and the inner wall of the housing, and the first elastic element is in a compressed state. When the side panel is unlocked, the ejector pushes the side panel away from the housing under the elastic force of the first elastic member.

5. The industrial control computer according to claim 1, characterized in that, The expansion card has at least one second slot on the side facing the side panel, and a second opening is provided on the side panel opposite to the second slot; The industrial control computer also includes an interface board and a fixed bracket. The interface board is fixedly mounted on the fixed bracket. The fixed bracket is detachably inserted into the second opening and covers the second opening. The interface board is inserted into the second slot through the second opening. The interface board is provided with at least one interface exposed from the fixed bracket. The interface is used to connect to external devices.

6. The industrial control computer according to claim 1, characterized in that, The side panel facing away from the housing has a heat dissipation groove, and the expansion card is attached to the inner wall of the side panel opposite to the heat dissipation groove. The industrial computer also includes a heat dissipation component, which is disposed within the heat dissipation slot. The heat dissipation assembly includes a heat dissipation base and heat dissipation components. The heat dissipation base is attached to the bottom of the heat dissipation groove. Multiple heat dissipation plates are spaced apart on the side of the heat dissipation base away from the bottom of the heat dissipation groove. Both ends of the multiple heat dissipation plates extend in the direction away from the bottom of the heat dissipation groove to form heat dissipation fins. The heat dissipation components are detachably mounted on the heat dissipation base and located between the heat dissipation fins on opposite sides to form a heat dissipation channel through the heat dissipation plates and the heat dissipation fins.

7. The industrial control computer according to claim 6, characterized in that, The side wall of the heat dissipation base is provided with a locking block; The inner wall of the side plate is movably provided with an elastic locking mechanism, the elastic locking mechanism protruding from the inner side wall of the heat dissipation groove and being detachably engaged with the locking block.

8. The industrial control computer according to claim 7, characterized in that, The expansion card is vertically provided with a first elastic conductive element, which passes through the side plate and extends partially into the heat dissipation groove. A second elastic conductive element is provided through the heat dissipation base shell, and the second elastic conductive element is in electrical contact with the first elastic conductive element. A conductive part is provided on the side of the heat dissipation component facing the bottom of the heat dissipation groove, and the conductive part is in electrical contact with the second elastic conductive element.

9. The industrial control computer according to claim 8, characterized in that, The second elastic conductive element is located at the edge of the heat dissipation base shell; There are multiple locking blocks, and each locking block is disposed on the side wall of the heat dissipation base shell near the second elastic conductive element, and is located on both sides of the second elastic conductive element respectively. The elastic locking mechanism includes multiple locking blocks, and the multiple locking blocks correspond one-to-one with the multiple locking blocks and can be detachably snapped together.

10. The industrial control computer according to claim 7, characterized in that, The elastic locking mechanism includes a pop-out block and a locking block; The pop-out block is slidably disposed on the inner wall of the side plate along the depth direction of the heat dissipation groove, and has an abutting part extending from the side wall of the heat dissipation groove. The abutting part is used to slide towards the side where the bottom of the heat dissipation groove is located under the force of the heat dissipation bottom shell when the heat dissipation bottom shell and the heat dissipation component are installed in the heat dissipation groove. The locking block is slidably disposed on the inner wall of the side plate and has a snap-fit ​​portion extending from the side wall of the heat dissipation groove. The locking block and the pop-out block are engaged by inclined friction. The locking block is used to slide under the force of the pop-out block when the abutment portion slides toward the side where the bottom of the heat dissipation groove is located, so that the snap-fit ​​portion avoids the path for the locking block to pass through. The locking block is also used to separate from the pop-out block when the heat dissipation assembly is installed in place; A second elastic element is also connected between the locking block and the side plate. The second elastic element is used to provide a second elastic force for sliding reset to the locking block. The locking block is also used to slide under the action of the second elastic force when it is separated from the pop-out block, so that the latching part latches with the locking block. The elastic locking mechanism further includes an unlocking component, which is convexly connected to the locking block and is used to drive the locking block to slide when force is applied, so as to separate the latching part from the locking block; A third elastic element is also connected between the pop-out block and the side plate. The third elastic element is used to provide a third elastic force to the abutment portion in a direction away from the bottom of the heat dissipation groove. When the snap-fit ​​portion separates from the locking block, the pop-out block is slid in a direction away from the bottom of the heat dissipation groove under the action of the third elastic force, so as to push the heat dissipation bottom shell and the heat dissipation component out of the heat dissipation groove through the abutment portion.

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