High cleanliness cushion conductive foam assembly

Abstract

The utility model discloses a high cleanliness buffering conductive foam assembly, including by lower to upper setting's protection film, release film I and release film II, be provided with conductive double -sided adhesive tape and double -sided adhesive tape I on release film II, be provided with conductive foam single -sided adhesive tape on conductive double -sided adhesive tape, by lower to upper setting super -soft slow rebound polyurethane foam and double -sided adhesive tape II on double -sided adhesive tape I. The high cleanliness buffering conductive foam assembly provided by the utility model is used on the mainboard in the microcomputer host, and the bottom protection film is the support layer, and the release film of the same shape is arranged in the foam area, and the foam cutting waste can be removed together with the release film, avoids the foam debris residue near the incision, and the blue film is shielded again in the protection film area, reduces the exposed adhesive area, and the cleanliness of the product is improved significantly, a plurality of foams with two different functions are integrated on the same film, the mounting steps are reduced during use, and the operation efficiency is improved, and the structure is simple and reasonable, and is suitable for industrial popularization and use.

Description

Technical Field

[0001] This utility model belongs to the field of conductive foam technology, specifically relating to a high-purity cushioning conductive foam assembly. Background Technology

[0002] The motherboard inside a microcomputer host integrates a large number of precision electronic components, and foam is usually added to provide cushioning and protection. However, the cutting of the foam will generate dust, which can pose a great risk if it is not removed. If the precision electronic components are contaminated by dust or conductive particles, it can easily cause equipment failure, and in severe cases, even burn out the equipment. Utility Model Content

[0003] To address the problems in the existing technology, the purpose of this utility model is to provide a high-cleanliness buffer conductive foam assembly.

[0004] To achieve the above objectives and technical effects, the technical solution adopted by this utility model is as follows: A high-cleanliness cushioning conductive foam assembly includes a protective film, a release film I, and a release film II arranged sequentially from bottom to top. The release film II is provided with conductive double-sided adhesive and double-sided adhesive I. The conductive double-sided adhesive is provided with conductive foam single-sided adhesive. The double-sided adhesive I is provided with ultra-soft slow-rebound polyurethane foam and double-sided adhesive II arranged sequentially from bottom to top.

[0005] Furthermore, the protective film has several positioning holes of different sizes, and the thickness of the protective film is 70-90µm.

[0006] Furthermore, the release film I has release holes that correspond to the positions of the positioning holes, are the same in number, and are compatible with them. The release film I also has a first adhesive hole, a second adhesive hole, a third adhesive hole, a fourth adhesive hole, and a fifth adhesive hole.

[0007] Furthermore, the release film II includes a first release film, a second release film, a third release film, a fourth release film, and a fifth release film, wherein the first release film corresponds to the position of the first adhesive hole and is adapted in shape, the second release film corresponds to the position of the second adhesive hole and is adapted in shape, the third release film corresponds to the position of the third adhesive hole and is adapted in shape, the fourth release film corresponds to the position of the fourth adhesive hole and is adapted in shape, and the fifth release film corresponds to the position of the fifth adhesive hole and is adapted in shape.

[0008] Furthermore, the conductive double-sided adhesive includes a first conductive double-sided adhesive and a second conductive double-sided adhesive, wherein the first conductive double-sided adhesive corresponds to the position of the third release film and the third adhesive hole and is adapted in shape, and the second conductive double-sided adhesive corresponds to the position of the fourth release film and the fourth adhesive hole and is adapted in shape.

[0009] Furthermore, the conductive foam single-sided adhesive includes a first conductive foam single-sided adhesive and a second conductive foam single-sided adhesive, wherein the first conductive foam single-sided adhesive corresponds to the first conductive double-sided adhesive, the third release film, and the third adhesive hole in position and is adapted in shape, and the second conductive foam single-sided adhesive corresponds to the second conductive double-sided adhesive, the fourth release film, and the fourth adhesive hole in position and is adapted in shape.

[0010] Furthermore, the double-sided adhesive I includes a first double-sided adhesive, a second double-sided adhesive, and a third double-sided adhesive, wherein the first double-sided adhesive corresponds to the position of the first release film and the first adhesive hole and is adapted in shape, the second double-sided adhesive corresponds to the position of the second release film and the second adhesive hole and is adapted in shape, and the third double-sided adhesive corresponds to the position of the fifth release film and the fifth adhesive hole and is adapted in shape.

[0011] Furthermore, the ultra-soft slow-rebound polyurethane foam includes a first polyurethane foam, a second polyurethane foam, and a third polyurethane foam. The first polyurethane foam is positioned and shaped to correspond with the first double-sided adhesive, the first release film, and the first adhesive hole. The second polyurethane foam is positioned and shaped to correspond with the second double-sided adhesive, the second release film, and the second adhesive hole. The third polyurethane foam is positioned and shaped to correspond with the third double-sided adhesive, the fifth release film, and the fifth adhesive hole.

[0012] Furthermore, the double-sided adhesive II includes a fourth double-sided adhesive, a fifth double-sided adhesive, and a sixth double-sided adhesive. The fourth double-sided adhesive corresponds to and is shaped with the first polyurethane foam, the first double-sided adhesive, the first release film, and the first adhesive hole. The fifth double-sided adhesive corresponds to and is shaped with the second polyurethane foam, the second double-sided adhesive, the second release film, and the second adhesive hole. The sixth double-sided adhesive corresponds to and is shaped with the third polyurethane foam, the third double-sided adhesive, the fifth release film, and the fifth adhesive hole.

[0013] Furthermore, the protective film has a thickness of 70-90µm, the release film I has a thickness of 70-80µm, the release film II has a thickness of 45-55µm, the 180° peel force is 7.5±2.5g / inch, the conductive double-sided adhesive has a thickness of 0.05±0.005mm, the 180° peel force is >1300g / 2.5cm, and the vertical conduction resistance is <0.05Ω, the conductive foam single-sided adhesive has a thickness of 1.3-1.8mm, the double-sided adhesive I has a thickness of 0.05mm, the 180° peel force is >15N / 25mm, the ultra-soft slow-rebound polyurethane foam has a thickness of 1.5±0.1mm, the double-sided adhesive II has a thickness of 0.05mm, and the 180° peel force is >15N / 25mm.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model discloses a high-cleanliness cushioning conductive foam assembly for use on the motherboard inside a microcomputer host. It serves to cushion and protect the components while improving cleanliness. The bottom protective film acts as a support layer, and a release film of the same shape is set in the foam area. When the foam is cut and waste is discharged, the release film can be removed together, avoiding foam debris residue near the cut. The protective film area is then covered with a blue film around the perimeter to reduce the exposed adhesive area and significantly improve the cleanliness of the product. By integrating multiple foam pieces with two different functions onto the same film, the installation steps can be reduced, improving work efficiency. The overall structure is simple and the design is reasonable, making it suitable for industrial-scale promotion and use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of the protective film of this utility model; Figure 3 This is a schematic diagram of the structure of the release film I of this utility model; Figure 4 This is a schematic diagram of the release film II of this utility model; Figure 5 This is a schematic diagram of the structure of the conductive double-sided adhesive of this utility model; Figure 6 This is a schematic diagram of the structure of the conductive foam single-sided adhesive of this utility model; Figure 7 This is a schematic diagram of the structure of the double-sided adhesive I of this utility model; Figure 8 This is a schematic diagram of the structure of the ultra-soft slow-rebound polyurethane foam of this utility model. Figure 9 This is a schematic diagram of the structure of the double-sided adhesive II of this utility model. Detailed Implementation

[0016] The present invention will now be described in detail so that its advantages and features can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of the present invention.

[0017] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0018] like Figure 1-9As shown, this utility model discloses a high-cleanliness cushioning conductive foam assembly for use on the motherboard inside a microcomputer host. It includes a protective film 1, a release film I2 and a release film II3 arranged sequentially from bottom to top. The release film II3 is provided with conductive double-sided adhesive 4 and double-sided adhesive I6. The conductive double-sided adhesive 4 is provided with conductive foam single-sided adhesive 5. The double-sided adhesive I6 is provided with ultra-soft slow-rebound polyurethane foam 7 and double-sided adhesive II8 arranged sequentially from bottom to top.

[0019] The protective film 1 is model TS-5001-HP, with a thickness of 70-90µm. The protective film 1 has several positioning holes 11 of different sizes, which not only allows for precise positioning and application but also facilitates easy removal of the film.

[0020] Release film I2 is model 7530B with a thickness of 70-80µm. Release film I2 also has release holes 21 corresponding to the positions of positioning holes 11, which not only allows for precise positioning and mounting but also facilitates film removal. Release film I2 also has a first adhesive hole 22, a second adhesive hole 23, a third adhesive hole 24, a fourth adhesive hole 25, and a fifth adhesive hole 26.

[0021] Release film II3 is model SYB5008, with a thickness of 45-55µm and a 180° peel force of 7.5±2.5g / inch. It includes a first release film 31, a second release film 32, a third release film 33, a fourth release film 34, and a fifth release film 35. The first release film 31 corresponds to the first adhesive hole 22 in position and is adapted in shape. The second release film 32 corresponds to the second adhesive hole 23 in position and is adapted in shape. The third release film 33 corresponds to the third adhesive hole 24 in position and is adapted in shape. The fourth release film 34 corresponds to the fourth adhesive hole 25 in position and is adapted in shape. The fifth release film 35 corresponds to the fifth adhesive hole 26 in position and is adapted in shape.

[0022] The conductive double-sided adhesive 4 is model TT-219, with a thickness of 0.05±0.005mm, a 180° peel force >1300g / 2.5cm, and a vertical conduction resistance <0.05Ω. It includes a first conductive double-sided adhesive 41 and a second conductive double-sided adhesive 42. The first conductive double-sided adhesive 41 is positioned and shaped to correspond with the third release film 33 and the third adhesive hole 24. The second conductive double-sided adhesive 42 is positioned and shaped to correspond with the fourth release film 34 and the fourth adhesive hole 25.

[0023] The conductive foam single-sided adhesive 5 is model LY-XYZ-D-15, with a thickness of 1.3-1.8mm. It includes a first conductive foam single-sided adhesive 51 and a second conductive foam single-sided adhesive 52. The first conductive foam single-sided adhesive 51 corresponds to the first conductive double-sided adhesive 41, the third release film 33, and the third adhesive hole 24 in terms of position and shape. The second conductive foam single-sided adhesive 52 corresponds to the second conductive double-sided adhesive 42, the fourth release film 34, and the fourth adhesive hole 25 in terms of position and shape.

[0024] The first conductive foam single-sided adhesive 51 and the second conductive foam single-sided adhesive 52 are conductive foams with conductive adhesive on one side. Adding a layer of conductive adhesive to the foam surface can provide both bonding and conductivity functions, maintaining the stable operation of the equipment.

[0025] Double-sided adhesive I6 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a first double-sided adhesive 61, a second double-sided adhesive 62, and a third double-sided adhesive 63. The first double-sided adhesive 61 corresponds to the first release film 31 and the first adhesive hole 22 in position and is adapted in shape. The second double-sided adhesive 62 corresponds to the second release film 32 and the second adhesive hole 23 in position and is adapted in shape. The third double-sided adhesive 63 corresponds to the fifth release film 35 and the fifth adhesive hole 26 in position and is adapted in shape.

[0026] The ultra-soft, slow-rebound polyurethane foam 7 has the model number 4790-92-12059-04P and a thickness of 1.5±0.1mm. It includes a first polyurethane foam 71, a second polyurethane foam 72, and a third polyurethane foam 73. The first polyurethane foam 71 is positioned and shaped to correspond with the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The second polyurethane foam 72 is positioned and shaped to correspond with the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The third polyurethane foam 73 is positioned and shaped to correspond with the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0027] The first polyurethane foam 71, the second polyurethane foam 72, and the third polyurethane foam 73 are ultra-soft slow-rebound foams that can provide cushioning protection for the precision electronic components on the motherboard. Double-sided adhesive is provided on the top and bottom sides for easy fixation.

[0028] Double-sided adhesive II 8 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a fourth double-sided adhesive 81, a fifth double-sided adhesive 82, and a sixth double-sided adhesive 83. The fourth double-sided adhesive 81 corresponds to and is shaped with the first polyurethane foam 71, the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The fifth double-sided adhesive 82 corresponds to and is shaped with the second polyurethane foam 72, the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The sixth double-sided adhesive 83 corresponds to and is shaped with the third polyurethane foam 73, the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0029] This invention integrates two different types of foam (conductive foam single-sided adhesive 5 and ultra-soft slow-rebound polyurethane foam 7) onto the same film, which can reduce the installation steps and improve work efficiency during use.

[0030] The motherboard integrates a large number of precision electronic components. Contamination by dust or conductive particles can easily cause equipment malfunctions, and in severe cases, even burn out the equipment. Furthermore, foam punching generates dust, which poses a significant risk if not removed. Therefore, an innovative double-layer design was implemented. The bottom protective film 1 serves as a support layer, with a release film of the same shape placed in the foam area. When waste is discharged after foam punching, the release film can be removed along with the foam, preventing foam debris residue near the cut. A blue film is then used to cover the protective film area around the perimeter, reducing exposed adhesive areas and improving product cleanliness.

[0031] Example 1 like Figure 1-9 As shown, a high-cleanliness cushioning conductive foam assembly is used on the motherboard inside a microcomputer host. It includes a protective film 1, a release film I 2 and a release film II 3 arranged sequentially from bottom to top. The release film II 3 is provided with conductive double-sided adhesive 4 and double-sided adhesive I 6. The conductive double-sided adhesive 4 is provided with conductive foam single-sided adhesive 5. The double-sided adhesive I 6 is provided with ultra-soft slow-rebound polyurethane foam 7 and double-sided adhesive II 8 arranged sequentially from bottom to top.

[0032] The protective film 1 is model TS-5001-HP and has a thickness of 90µm. The protective film 1 has several positioning holes 11 of different sizes, which not only allows for precise positioning and application but also facilitates easy removal of the film.

[0033] Release film I2 is model 7530B and has a thickness of 80µm. Release film I2 also has release holes 21 corresponding to the positions of positioning holes 11. During use, it can not only accurately position the mounting, but also easily remove the film. Release film I2 also has a first adhesive hole 22, a second adhesive hole 23, a third adhesive hole 24, a fourth adhesive hole 25, and a fifth adhesive hole 26.

[0034] Release film II3, model SYB5008, has a thickness of 55µm and a 180° peel force of 7.5g / inch. It includes a first release film 31, a second release film 32, a third release film 33, a fourth release film 34, and a fifth release film 35. The first release film 31 corresponds to the first adhesive hole 22 in position and is adapted in shape. The second release film 32 corresponds to the second adhesive hole 23 in position and is adapted in shape. The third release film 33 corresponds to the third adhesive hole 24 in position and is adapted in shape. The fourth release film 34 corresponds to the fourth adhesive hole 25 in position and is adapted in shape. The fifth release film 35 corresponds to the fifth adhesive hole 26 in position and is adapted in shape.

[0035] The conductive double-sided adhesive 4 is model TT-219, with a thickness of 0.05mm, a 180° peel force >1300g / 2.5cm, and a vertical conduction resistance <0.05Ω. It includes a first conductive double-sided adhesive 41 and a second conductive double-sided adhesive 42. The first conductive double-sided adhesive 41 is positioned and shaped to correspond with the third release film 33 and the third adhesive hole 24. The second conductive double-sided adhesive 42 is positioned and shaped to correspond with the fourth release film 34 and the fourth adhesive hole 25.

[0036] The conductive foam single-sided adhesive 5 is model LY-XYZ-D-15, with a thickness of 1.3mm. It includes a first conductive foam single-sided adhesive 51 and a second conductive foam single-sided adhesive 52. The first conductive foam single-sided adhesive 51 corresponds to the first conductive double-sided adhesive 41, the third release film 33, and the third adhesive hole 24 in terms of position and shape. The second conductive foam single-sided adhesive 52 corresponds to the second conductive double-sided adhesive 42, the fourth release film 34, and the fourth adhesive hole 25 in terms of position and shape.

[0037] The first conductive foam single-sided adhesive 51 and the second conductive foam single-sided adhesive 52 are conductive foams with conductive adhesive on one side. Adding a layer of conductive adhesive to the foam surface can provide both bonding and conductivity functions, maintaining the stable operation of the equipment.

[0038] Double-sided adhesive I6 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a first double-sided adhesive 61, a second double-sided adhesive 62, and a third double-sided adhesive 63. The first double-sided adhesive 61 corresponds to the first release film 31 and the first adhesive hole 22 in position and is adapted in shape. The second double-sided adhesive 62 corresponds to the second release film 32 and the second adhesive hole 23 in position and is adapted in shape. The third double-sided adhesive 63 corresponds to the fifth release film 35 and the fifth adhesive hole 26 in position and is adapted in shape.

[0039] The ultra-soft, slow-rebound polyurethane foam 7 has the model number 4790-92-12059-04P and a thickness of 1.5mm. It includes a first polyurethane foam 71, a second polyurethane foam 72, and a third polyurethane foam 73. The first polyurethane foam 71 is positioned and shaped to correspond with the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The second polyurethane foam 72 is positioned and shaped to correspond with the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The third polyurethane foam 73 is positioned and shaped to correspond with the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0040] The first polyurethane foam 71, the second polyurethane foam 72, and the third polyurethane foam 73 are ultra-soft slow-rebound foams that can provide cushioning protection for the precision electronic components on the motherboard. Double-sided adhesive is provided on the top and bottom sides for easy fixation.

[0041] Double-sided adhesive II 8 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a fourth double-sided adhesive 81, a fifth double-sided adhesive 82, and a sixth double-sided adhesive 83. The fourth double-sided adhesive 81 corresponds to and is shaped with the first polyurethane foam 71, the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The fifth double-sided adhesive 82 corresponds to and is shaped with the second polyurethane foam 72, the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The sixth double-sided adhesive 83 corresponds to and is shaped with the third polyurethane foam 73, the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0042] This invention integrates two different types of foam (conductive foam single-sided adhesive 5 and ultra-soft slow-rebound polyurethane foam 7) onto the same film, which can reduce the installation steps and improve work efficiency during use.

[0043] The motherboard integrates a large number of precision electronic components. Contamination by dust or conductive particles can easily cause equipment malfunctions, and in severe cases, even burn out the equipment. Furthermore, foam punching generates dust, which poses a significant risk if not removed. Therefore, an innovative double-layer design was implemented. The bottom protective film 1 serves as a support layer, with a release film of the same shape placed in the foam area. When waste is discharged after foam punching, the release film can be removed along with the foam, preventing foam debris residue near the cut. A blue film is then used to cover the protective film area around the perimeter, reducing exposed adhesive areas and improving product cleanliness.

[0044] The parts or structures not specifically described in this utility model can be made using existing technology or existing products, and will not be elaborated here.

[0045] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-purity cushioning conductive foam assembly, characterized in that, It includes a protective film, release film I and release film II arranged sequentially from bottom to top. The release film II is provided with conductive double-sided adhesive and double-sided adhesive I. The conductive double-sided adhesive is provided with conductive foam single-sided adhesive. The double-sided adhesive I is provided with ultra-soft slow rebound polyurethane foam and double-sided adhesive II arranged sequentially from bottom to top.

2. A high-cleanliness cushioning conductive foam assembly according to claim 1, characterized in that, The protective film has several positioning holes of different sizes, and the thickness of the protective film is 70-90µm.

3. A high-purity cushioning conductive foam assembly according to claim 2, characterized in that, The release film I has release holes that correspond to the positions of the positioning holes, are the same in number, and are compatible with them. The release film I also has a first adhesive hole, a second adhesive hole, a third adhesive hole, a fourth adhesive hole, and a fifth adhesive hole.

4. A high-purity cushioning conductive foam assembly according to claim 3, characterized in that, The release film II includes a first release film, a second release film, a third release film, a fourth release film, and a fifth release film. The first release film corresponds to the position of the first adhesive hole and is adapted in shape. The second release film corresponds to the position of the second adhesive hole and is adapted in shape. The third release film corresponds to the position of the third adhesive hole and is adapted in shape. The fourth release film corresponds to the position of the fourth adhesive hole and is adapted in shape. The fifth release film corresponds to the position of the fifth adhesive hole and is adapted in shape.

5. A high-purity cushioning conductive foam assembly according to claim 4, characterized in that, The conductive double-sided adhesive includes a first conductive double-sided adhesive and a second conductive double-sided adhesive, wherein the first conductive double-sided adhesive corresponds to the third release film and the third adhesive hole in position and is adapted in shape, and the second conductive double-sided adhesive corresponds to the fourth release film and the fourth adhesive hole in position and is adapted in shape.

6. A high-cleanliness cushioning conductive foam assembly according to claim 5, characterized in that, The conductive foam single-sided adhesive includes a first conductive foam single-sided adhesive and a second conductive foam single-sided adhesive. The first conductive foam single-sided adhesive corresponds to the first conductive double-sided adhesive, the third release film, and the third adhesive hole in terms of position and shape. The second conductive foam single-sided adhesive corresponds to the second conductive double-sided adhesive, the fourth release film, and the fourth adhesive hole in terms of position and shape.

7. A high-cleanliness cushioning conductive foam assembly according to claim 4, characterized in that, The double-sided adhesive I includes a first double-sided adhesive, a second double-sided adhesive, and a third double-sided adhesive. The first double-sided adhesive corresponds to the position of the first release film and the first adhesive hole and is adapted in shape. The second double-sided adhesive corresponds to the position of the second release film and the second adhesive hole and is adapted in shape. The third double-sided adhesive corresponds to the position of the fifth release film and the fifth adhesive hole and is adapted in shape.

8. A high-cleanliness cushioning conductive foam assembly according to claim 7, characterized in that, The ultra-soft, slow-rebound polyurethane foam includes a first polyurethane foam, a second polyurethane foam, and a third polyurethane foam. The first polyurethane foam is positioned and shaped to correspond with the first double-sided adhesive, the first release film, and the first adhesive hole. The second polyurethane foam is positioned and shaped to correspond with the second double-sided adhesive, the second release film, and the second adhesive hole. The third polyurethane foam is positioned and shaped to correspond with the third double-sided adhesive, the fifth release film, and the fifth adhesive hole.

9. A high-purity cushioning conductive foam assembly according to claim 8, characterized in that, The double-sided adhesive II includes a fourth double-sided adhesive, a fifth double-sided adhesive, and a sixth double-sided adhesive. The fourth double-sided adhesive corresponds to and is shaped with the first polyurethane foam, the first double-sided adhesive, the first release film, and the first adhesive hole. The fifth double-sided adhesive corresponds to and is shaped with the second polyurethane foam, the second double-sided adhesive, the second release film, and the second adhesive hole. The sixth double-sided adhesive corresponds to and is shaped with the third polyurethane foam, the third double-sided adhesive, the fifth release film, and the fifth adhesive hole.

10. A high-cleanliness cushioning conductive foam assembly according to claim 1, characterized in that, The protective film has a thickness of 70-90µm, release film I has a thickness of 70-80µm, release film II has a thickness of 45-55µm, and a 180° peel force of 7.5±2.5g / inch. The conductive double-sided adhesive has a thickness of 0.05±0.005mm, a 180° peel force >1300g / 2.5cm, and a vertical conduction resistance <0.05Ω. The conductive foam single-sided adhesive has a thickness of 1.3-1.8mm, double-sided adhesive I has a thickness of 0.05mm, and a 180° peel force >15N / 25mm. The ultra-soft slow-rebound polyurethane foam has a thickness of 1.5±0.1mm, double-sided adhesive II has a thickness of 0.05mm, and a 180° peel force >15N / 25mm.

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