An inductance mounting structure, integrated heat-dissipation inductance structure and converter

Abstract

The utility model discloses a kind of inductance mounting structure, integrated radiating inductance structure, current transformer, the inductance mounting structure includes: radiator, it has radiating surface;And inductance shell, it is formed by circumferential enclosure by side wall, and it is located in radiating surface, to form the accommodating chamber suitable for accommodating inductance body with radiator cooperation;The bottom surface of accommodating chamber is at least partly radiating surface.The integrated radiating inductance structure includes above-mentioned inductance mounting structure;And, still include: inductance body, it is accommodated in accommodating chamber, and its position corresponds to the portion of the bottom surface of accommodating chamber by radiating surface constitutes;And heat-conducting medium, it is filled between radiating surface and inductance body.The inductance mounting structure can improve the radiating effect of inductance.

Description

Technical Field

[0001] This utility model relates to the field of inductor heat dissipation technology, specifically to an inductor mounting structure, an integrated heat dissipation inductor structure, and a converter. Background Technology

[0002] In the field of power electronics, power inductors, as key energy storage and filtering components, are widely used in converters, inverters, power supplies, and other equipment. During operation, power inductors generate a significant amount of heat due to copper losses from current flowing through the windings and iron losses in the magnetic core under high-frequency magnetic fields, becoming a major heat source in the system. If this heat cannot be dissipated effectively and in a timely manner, the inductor's temperature will become excessively high, potentially causing problems such as aging of the winding insulation layer, degradation of the magnetic properties of the core material, and inductance value deviation, thereby affecting the performance, reliability, and lifespan of the entire power electronic device. Currently, a common encapsulation and heat dissipation method in the industry involves placing the inductor body, consisting of the inductor coil and magnetic core, inside a metal casing (usually aluminum or its alloy), then injecting liquid potting compound (such as epoxy resin, polyurethane, or silicone) into the casing. After curing, the inductor body is completely encapsulated and fixed. In this structure, the potting compound mainly serves to provide electrical insulation, moisture and dust protection, and absorb mechanical vibration. Heat generated in the inductor body passes through the potting compound layer and is conducted to the metal casing, which has better thermal conductivity. Finally, it is transferred to the outside environment through the contact between the casing and an external heat sink (such as a liquid cooling plate). However, in traditional potted heat dissipation structures, the poor thermal conductivity of the potting compound itself leads to the formation of a significant thermal resistance layer between the inductor coil and the metal casing. Under high-load operation of the power inductor, the heat dissipation effect of the inductor coil cannot meet the requirements. Utility Model Content

[0003] The purpose of this utility model is to overcome the above-mentioned defects or problems in the background art and provide an inductor mounting structure, an integrated heat dissipation inductor structure, and a converter. The inductor mounting structure can improve the heat dissipation effect of the inductor.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] Technical Solution 1: An inductor mounting structure includes: a heat sink having a heat dissipation surface; and an inductor housing formed by sidewalls surrounding the inductor circumferentially and situated on the heat dissipation surface to cooperate with the heat sink to form a receiving cavity suitable for accommodating the inductor body; the bottom surface of the receiving cavity is at least partially the heat dissipation surface.

[0006] Technical Solution 2 based on Technical Solution 1: The bottom of the inductor housing is completely open so that the bottom surface of the accommodating chamber is entirely formed by the heat dissipation surface.

[0007] Technical Solution 3, based on Technical Solution 1: The inductor shell is welded to the heat sink.

[0008] Technical Solution 4 based on Technical Solution 1: The radiator is a liquid-cooled radiator, and at least the portion of the bottom surface of the heat dissipation surface that forms the accommodating chamber has a flow channel for the passage of liquid cooling fluid.

[0009] In addition, this utility model also includes technical solution five: an integrated heat dissipation inductor structure, including the inductor mounting structure described in any one of technical solutions one to four; and further including: an inductor body, which is housed in the accommodating cavity and whose position corresponds to the portion of the bottom surface of the accommodating cavity formed by the heat dissipation surface; and a thermally conductive medium, which fills the space between the heat dissipation surface and the inductor body.

[0010] Technical solution six based on technical solution five: The thermally conductive medium includes potting compound, which is poured into the space in the accommodating chamber excluding the inductor body.

[0011] Technical solution seven based on technical solution five: The heat-conducting medium includes a bottom heat-conducting block, which is correspondingly disposed between the bottom of the inductor body and the heat dissipation surface and is in contact with both.

[0012] Technical solution eight based on technical solution seven: The heat-conducting medium includes a top heat-conducting block, which has a contact portion that is adapted to at least a portion of the top of the inductor body, and is correspondingly contacted and disposed on the top of the inductor body through the contact portion; the top heat-conducting block has a heat-conducting portion extending toward the inductor shell, and the heat-conducting portion is in contact with the inner wall of the inductor shell.

[0013] Technical solution nine based on technical solution eight: The bottom heat-conducting and top heat-conducting blocks are made of heat-conducting ceramic material.

[0014] In addition, the present invention also provides technical solution ten: a converter including a power component, which further includes the integrated heat dissipation inductor structure described in any one of technical solutions five to nine, wherein at least a portion of the power component dissipates heat through the heat sink.

[0015] As can be seen from the above description of this utility model, compared with the prior art, this utility model has the following beneficial effects:

[0016] In traditional inductor heat dissipation structures, the inductor body is typically encapsulated within a separate inductor housing with a complete bottom wall, and then the entire inductor housing is placed on a separate heat sink. Due to limitations in machining precision, neither the bottom surface of the inductor housing nor the heat dissipation surface of the heat sink can be perfectly flat. When they come into contact, the macroscopically mating surfaces contain numerous microscopically air-filled gaps. Air is a poor conductor of heat, and these gaps severely impede heat conduction from the inductor housing to the heat sink, creating significant interfacial thermal resistance. To address this issue, existing technologies require filling the space between the two surfaces with thermally conductive interface materials such as thermal grease to eliminate air and improve heat conduction. However, the thermally conductive interface material itself also possesses a certain thermal resistance, and the bottom wall of the inductor housing itself constitutes a layer of thermal resistance in the heat conduction path. Therefore, the heat transfer path in the traditional structure is: inductor body - potting compound - inductor housing bottom wall - thermally conductive interface material - heat sink. This multi-layered, series-connected path accumulates a high total thermal resistance, limiting overall heat dissipation performance.

[0017] Technical Solution 1 provides an inductor mounting structure in which the inductor casing is enclosed by side walls and sits directly on the heat dissipation surface of a heat sink. The heat dissipation surface of the heat sink directly forms the bottom surface of the receiving chamber, or at least the main part of the bottom surface. In this way, the inductor casing and the heat sink, originally two separate components, cooperate to form a unified receiving chamber with its bottom directly facing the heat dissipation core. When the inductor body is placed in this receiving chamber, the thermally conductive medium used for fixation, such as potting compound, can be directly filled between the inductor body and the heat dissipation surface of the heat sink, achieving direct thermal contact between the two. Through this structure, the path of heat conduction from the inductor body to the heat sink is changed. The new heat conduction path no longer needs to pass through the bottom wall of the inductor casing, nor does it require additional thermal interface materials to overcome the contact thermal resistance between the casing and the heat sink. Heat can directly reach the heat dissipation surface of the heat sink from the inductor body through a single thermally conductive medium layer. This effectively improves the overall heat dissipation capacity of the inductor assembly, enhancing its operational stability and lifespan.

[0018] In technical solution two, the bottom of the inductor housing is completely open, so that the bottom surface of the accommodating chamber is entirely formed by the heat dissipation surface of the heat sink, thereby completely eliminating the influence of the bottom wall of the inductor housing on the heat conduction effect, maximizing the effective heat conduction area, and ensuring the bottom heat dissipation efficiency.

[0019] In technical solution three, the inductor casing is welded to the heat sink. This welding method achieves a high-strength, permanent mechanical fixation between the inductor casing and the heat sink, while simultaneously establishing a solid-state heat conduction path between them. Heat from the inductor's sides is transferred to the sidewall of the inductor casing via the heat-conducting medium, and then directly conducted to the heat sink through the gapless weld joint between the sidewall and the heat sink. This connection method eliminates interfacial thermal resistance and gaps at the mechanical contact surface, enhancing not only the overall mechanical reliability and vibration resistance of the structure, but also, in conjunction with the main heat dissipation channel at the bottom, achieving more comprehensive heat dissipation for the inductor.

[0020] In technical solution four, the heat sink is a liquid-cooled heat sink, and a flow channel for the liquid cooling fluid is provided below its heat dissipation surface. Compared with traditional methods such as air cooling, liquid cooling has higher heat exchange efficiency and heat capacity, and can efficiently remove heat from the inductor body.

[0021] Technical solution five provides an integrated heat dissipation inductor structure, which, based on the above solutions, clarifies that a thermally conductive medium is also filled within the accommodating cavity. The heat from the inductor body, which serves as a heat source, can be transferred to the heat dissipation surface and the inductor casing through the thermally conductive medium, and then carried away by the heat sink, ensuring effective heat dissipation of the inductor body.

[0022] In technical solution six, the thermally conductive medium includes potting compound. As a fluid material, the potting compound can fully fill the irregular gaps on the surface of the inductor body and all the empty spaces within the accommodating cavity during the potting process, forming a dense filler without voids after curing. In this way, the potting compound can form a large-area, gapless wetting contact between the inductor body and the heat dissipation surface, maximizing the effective contact area for heat conduction. At the same time, the potting compound also has excellent electrical insulation properties and mechanical fixing function, which can ensure the electrical safety of the system and suppress the vibration generated during inductor operation while achieving efficient heat conduction.

[0023] In technical solution seven, the thermally conductive medium may further include a bottom thermally conductive block. This bottom thermally conductive block can be made of a solid material with high thermal conductivity and designed to fit the shape of the inductor body. This allows the bottom thermally conductive block to simultaneously contact the bottom of the inductor body and the heat dissipation surface, creating an efficient thermal conduction path. Compared to completely filling with potting compound, using a solid bottom thermally conductive block can transfer heat from the inductor body to the heat sink more quickly and efficiently.

[0024] In technical solution eight, the heat-conducting medium may also include a top heat-conducting block. The top of the inductor body is also an important heat-generating area, but it is far from the heat dissipation surface, making it difficult to dissipate heat. By setting a top heat-conducting block and ensuring it contacts both the top of the inductor body and the inner wall of the inductor casing, a new heat conduction path is created. Heat is collected by the top heat-conducting block and then laterally conducted through its heat-conducting parts to the side wall of the inductor casing, and finally transferred to the heat sink via the connection between the side wall and the heat sink. This improves the heat dissipation problem of the inductor body, resulting in a more uniform temperature distribution throughout the inductor body.

[0025] In technical solution nine, the bottom and top heat-conducting blocks are made of thermally conductive ceramic. Thermally conductive ceramic materials possess extremely high thermal conductivity and excellent electrical insulation properties. The high thermal conductivity is a prerequisite for ensuring that the constructed solid heat conduction path has extremely low thermal resistance. The excellent electrical insulation properties ensure that, under high-voltage operating conditions, the top heat-conducting block, while acting as a thermal bridge, will not cause electrical short circuits. Thus, an efficient heat conduction path is constructed while ensuring electrical safety.

[0026] Technical solution ten provides a converter that employs the aforementioned integrated heat-dissipating inductor structure. Applying this heat dissipation structure to the converter improves the performance and reliability of the power inductor. Due to the significantly enhanced heat dissipation capacity of the inductor, its temperature rise is effectively controlled, allowing the converter to operate at higher switching frequencies or larger currents, thereby increasing the converter's power density and efficiency. Simultaneously, the improved inductor operating stability also enhances the long-term reliability and extends the lifespan of the entire converter system. When the inductor shares the same heat sink with other power components, this integrated heat dissipation design also helps simplify the overall heat dissipation system layout of the converter, optimizing system cost and size. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is an exploded view of the integrated heat dissipation inductor structure involved in the embodiment of this utility model;

[0029] Figure 2 for Figure 1 Schematic diagram of the structure of the inductor housing;

[0030] Figure 3 for Figure 1 Top view of the inductor mounting structure;

[0031] Figure 4 for Figure 3 Schematic diagram of section AA.

[0032] Explanation of key figure labels:

[0033] Inductor housing 100; accommodating chamber 101; chamber bottom surface 102; side wall 110;

[0034] Inductor body 200; iron core 210; side core 211; shaft core 212; coil 220; bending part 221; bracket 230;

[0035] Radiator 300; Heat dissipation surface 310; Flow channel 320;

[0036] Top heat-conducting block 400. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are preferred embodiments of the present utility model and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0038] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and drawings of this utility model is for distinguishing different objects and not for describing a specific order.

[0039] Unless otherwise expressly defined, in the claims, description and accompanying drawings of this utility model, the use of directional terms such as "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise" to indicate orientation or positional relationship is based on the orientation and positional relationship shown in the accompanying drawings, and is only for the convenience of describing this utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific protection scope of this utility model.

[0040] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this utility model shall be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection through other devices or components.

[0041] In the claims, description and accompanying drawings of this utility model, the terms "comprising", "having", and variations thereof are used to mean "including but not limited to".

[0042] Example

[0043] This invention relates to a converter, which includes a power component and an integrated heat dissipation inductor structure, as shown in the following embodiments. Figure 1 The integrated inductor structure includes an inductor mounting structure, an inductor body 200, and a heat-conducting medium. The inductor mounting structure includes a heat sink 300 and an inductor housing 100.

[0044] First, the structure of the converter will be described. At least a portion of the power components in the converter are cooled by a heat sink 300 in the inductor mounting structure, or in other words, the inductor mounting structure reuses the heat sink 300 originally used for the power components as its own heat sink 300. A converter is a power electronic device used to convert electrical energy into its physical form. Typical applications include, but are not limited to, photovoltaic inverters, electric vehicle drive systems, rail transit traction converters, and industrial uninterruptible power supplies (UPS). In these applications, the converter typically includes multiple power semiconductor devices (such as IGBTs and MOSFETs), DC bus capacitors, filter inductors, and control circuits. The power semiconductor devices are part of the aforementioned power components, which are one of the main heat sources in the converter. In this embodiment, the power semiconductor devices in the power components, such as the IGBT module, are cooled by the heat sink 300. Furthermore, the power inductor, as a key energy storage and filtering element, generates significant copper and iron losses under high-frequency, high-current conditions, also becoming one of the main heat sources. In traditional structures, power inductors are often encapsulated with potting compound and then mounted on a heatsink 300. However, due to the low thermal conductivity of the potting compound, the thermal resistance is too high, which severely restricts the inductor's temperature rise control capability and the overall power density improvement of the system.

[0045] The heat sink 300 has a heat dissipation surface 310, on which power components can be attached for heat dissipation. Specifically, the heat dissipation surface 310 of the heat sink 300 refers to a planar or near-planar area on the heat sink 300 that is in direct contact with an external heat source (such as the bottom wall of the inductor housing 100) for heat conduction. It has low surface roughness and good flatness error to ensure close contact with the external heat source. In some embodiments, silicone is coated between the heat dissipation surface 310 and the external heat source to ensure tight contact and improve heat conduction efficiency. In this embodiment, the power semiconductor devices in the power components are also mounted on the heat dissipation surface 310 of the heat sink 300, thus forming the heat sink 300 in the converter. The heat dissipation surface 310 can be the machining reference surface of the heat sink 300 body, or it can be a dedicated thermally conductive bonding area formed by die casting, machining, or surface treatment. Its material is preferably a high thermal conductivity aluminum alloy (such as A380, 6063) or copper alloy, and it can be configured as an air-cooled finned substrate, a liquid-cooled channel panel, or a heat pipe evaporation end bearing surface, depending on the cooling method. (Refer to...) Figure 1 In this embodiment, the radiator 300 is a liquid-cooled radiator 300, which has several flow channels 320 for the passage of liquid cooling fluid. The liquid cooling fluid here can be a conventional coolant. At the same time, the liquid-cooled radiator 300 can be connected to an external coolant circulation device through an inlet and an outlet. The coolant circulation device then exchanges heat through an external heat exchange device to reduce the coolant temperature.

[0046] The inductor mounting structure also includes an inductor housing 100. The inductor housing 100 is circumferentially enclosed by side walls 110 and sits on the heat dissipation surface 310 to cooperate with the heat sink 300 to form a receiving cavity 101 suitable for accommodating the inductor body 200; the bottom surface of the receiving cavity 101 is at least partially the heat dissipation surface 310. Specifically, refer to... Figure 1 and Figure 2The inductor housing 100, viewed from above, is roughly rectangular and can be considered as being formed by four side walls 110 joined end to end, thus making both the top and bottom of the inductor housing 100 open. The top of the inductor housing 100 can be completely open to facilitate the placement of the inductor body 200 into the receiving chamber 101. The bottom of the inductor housing 100 can be partially open; for example, a bottom wall can be provided at the bottom of the inductor housing 100, but with openings corresponding to the inductor body 200, allowing the bottom of the inductor body 200 to contact the heat dissipation surface 310 of the heat sink 300. Of course, as a preferred embodiment, the bottom of the inductor housing 100 can also be completely open, so that the bottom surface of the receiving chamber 101 is entirely formed by the heat dissipation surface 310. At this point, the inductor housing 100 rests on the heat dissipation surface 310 of the heat sink 300 via the bottom wall of the side wall 110. The heat dissipation surface 310 completely covers the open bottom opening of the inductor housing 100, thus forming a top-open accommodating chamber 101 through the cooperation of the inductor housing 100 and the heat sink 300. After the inductor body 200 is placed into this accommodating chamber 101, it can fully and directly contact the heat dissipation surface 310. The completely open bottom structure of the inductor housing 100 can completely eliminate the influence of the bottom wall of the inductor housing 100 on the heat conduction effect, maximize the effective heat conduction area, and ensure the bottom heat dissipation efficiency.

[0047] Furthermore, referring to Figure 3 and Figure 4 In this inductor mounting structure, the inductor housing 100 is enclosed by side walls 110 and sits directly on the heat dissipation surface 310 of the heat sink 300. The heat dissipation surface 310 of the heat sink 300 directly forms the bottom surface of the receiving chamber 101, or at least the main part of the bottom surface. In this way, the inductor housing 100 and the heat sink 300, which were originally independent components, cooperate to form a unified receiving chamber 101 with its bottom directly facing the heat dissipation core. The heat dissipation surface 310 forms the bottom surface 102 of the receiving chamber 101. When the inductor body 200 is placed in this receiving chamber 101, the thermally conductive medium used for fixing, such as potting compound, can be directly filled between the inductor body 200 and the heat dissipation surface 310 of the heat sink 300, achieving direct thermal contact between the two. This structure alters the heat transfer path from the inductor body 200 to the heat sink 300. The new heat path no longer requires passing through the bottom wall of the inductor housing 100, nor does it necessitate the use of additional thermal interface material to overcome the contact thermal resistance between the housing and the heat sink 300. Heat can directly reach the heat dissipation surface 310 of the heat sink 300 from the inductor body 200 via a single thermally conductive layer. This effectively improves the overall heat dissipation capacity of the inductor assembly, enhancing its operational stability and lifespan.

[0048] In this embodiment, the inductor housing 100 is welded to the heat sink 300. Specifically, the inductor housing 100 can be continuously welded circumferentially to the edge of the heat dissipation surface 310 of the heat sink 300 using laser welding, argon arc welding, or resistance welding. This creates a metallurgical bond between the bottom edge of the sidewall 110 of the inductor housing 100 and the surface of the heat sink 300, ensuring no macroscopic gaps and a stable mechanical connection strength. This welding method achieves a high-strength, permanent mechanical fixation between the inductor housing 100 and the heat sink 300, while also establishing a solid-state heat conduction path between them. Heat from the sides of the inductor body 200, after being transferred to the sidewall 110 of the inductor housing 100 through the heat-conducting medium, can be directly conducted to the heat sink 300 through the gapless weld joint between the sidewall 110 and the heat sink 300. This connection method eliminates interfacial thermal resistance and gaps at the mechanical contact surface, enhancing not only the overall mechanical reliability and vibration resistance of the structure but also, in conjunction with the main heat dissipation channel at the bottom, achieving more three-dimensional heat dissipation for the inductor body 200. Of course, welding is only a preferred implementation method. The inductor housing 100 can also be connected to the heat sink 300 using other fixing structures. For example, it can be connected by brazing with a metal solder with a high thermal conductivity, or by setting an elastic thermally conductive pad and supplementing it with a mechanical clamping structure in the contact area between the bottom edge of the side wall 110 and the heat dissipation surface 310, so that the inductor housing 100 can maintain a low contact thermal resistance while obtaining reliable mechanical positioning; or by using an integrated molding process, so that the side wall 110 of the inductor housing 100 and the heat sink 300 body form an integral structure during the manufacturing stage, completely eliminating the interface between the two.

[0049] In this design, the heat sink 300 serves as a liquid-cooled heat sink, and at least the portion of the bottom surface of the heat dissipation surface 310 that forms the accommodating chamber 101 has a flow channel 320 for the passage of liquid cooling fluid. Specifically, the flow channel 320 can be disposed through the interior of the heat sink 300 in a left-right direction and located directly below the inductor housing 100 to efficiently dissipate heat from the inductor body 200 inside the inductor housing 100. Of course, if the heat sink 300 serves as a heat dissipation device for power components in a converter, the flow channel 320 inside can be arranged over a larger area to dissipate heat from power semiconductor devices.

[0050] Reference Figure 1 and Figure 3 The accommodating chamber 101 formed by the inductor housing 100 has a rectangular shape when viewed from above. Its width is approximately matched with the width of the inductor body 200, and its length can accommodate multiple inductor bodies 200 arranged sequentially. The inductor body 200 includes an iron core 210, a coil 220, and a support 230.

[0051] Specifically, the iron core 210 includes a shaft core 212 and several side cores 211 arranged around the coil 220. The shaft core 212 is located at the center of the iron core 210, and its two ends extend out of the two ends of the coil 220. Each shaft core 212 is provided with four side cores 211. Two side cores 211 are attached to the outer peripheral surfaces of the left and right sides of the shaft core 212 in the front-back direction, and the other two side cores 211 are connected to the outer ends of the two side cores 211 in the left-right direction, forming a closed rectangular magnetic circuit structure. When multiple inductor bodies 200 are arranged sequentially in the front-back direction in the converter, two adjacent inductor bodies 200 share a side core 211 located between them, so as to reduce material usage, optimize spatial layout and enhance the overall magnetic circuit continuity. The core material 210 is a high-permeability soft magnetic alloy, preferably a silicon steel sheet laminated structure, an amorphous alloy strip wound structure, or a powder metallurgy iron-silicon-aluminum magnetic powder core. Its operating frequency range covers 10kHz to 200kHz, and its saturation magnetic flux density is not less than 1.2T, so as to adapt to the high-frequency and high-current operating conditions in the converter.

[0052] Coil 220 is a multi-layer flat winding made of copper wire, with the winding axis parallel to the first direction. The wire cross-section is rectangular or trapezoidal, and the number of turns is set between 10 and 50 turns according to the inductance requirement. The surface of the wire is coated with polyesterimide or polyamideimide insulating varnish with a heat resistance rating of 180℃ or higher to ensure stable electrical insulation performance at high temperatures. After winding, coil 220 has a rounded rectangular cross-section, and its four corners are rounded transition structures. The rounded part is the bending part 221 of coil 220, which is used to realize the turning of the wire from one layer to another to avoid stress concentration. The inner and outer diameters of coil 220 match the magnetic circuit profile of iron core 210, so that coil 220 is tightly wrapped around the core 212 and side core 211 of iron core 210.

[0053] The bracket 230 is an injection-molded engineering plastic part, located at both ends of the coil 220. It serves to fix the axial position of the coil 220, provide mechanical support, and achieve electrical insulation between the conductor of the coil 220 and the iron core 210 and the inductor housing 100. The main body of the bracket 230 has a ring-shaped structure, with one side surface abutting the end of the coil 220. A large through hole is provided in the middle along the front-back direction for the end of the shaft 212 in the iron core 210 to pass through. Two lugs are also provided on the top of the bracket 230, extending outwards relative to the inductor housing 100 along the front-back direction. The two ends of the coil 220 can be placed and fixed on these lugs for easy connection to external circuits. The material of the bracket 230 is selected with a temperature resistance ≥180℃ and a volume resistivity not less than 10 Ω·cm. 14 High-performance insulating engineering plastics with a dielectric strength greater than 20 kV / mm and an Ω·cm, preferably polyamide-imide (PAI), liquid crystal polymer (LCP), or modified polyphenylene sulfide (PPS).

[0054] A thermally conductive medium is filled between the heat dissipation surface 310 and the inductor body 200. In one embodiment, the thermally conductive medium includes potting compound, which is injected into the space within the accommodating chamber 101 excluding the inductor body 200. As a fluid material, the potting compound can fully fill the irregular gaps on the surface of the inductor body 200 and all empty spaces within the accommodating chamber 101 during the injection process, forming a dense filler without voids after curing. In this way, the potting compound can form a large-area, gapless wetting contact between the inductor body 200 and the heat dissipation surface 310, maximizing the effective contact area for heat conduction. Simultaneously, the potting compound also possesses excellent electrical insulation properties and mechanical fixing effects, ensuring the electrical safety of the system and suppressing vibrations generated during inductor operation while achieving efficient heat conduction.

[0055] Furthermore, the heat-conducting medium may also include a top heat-conducting block 400. The top heat-conducting block 400 has a contact portion whose shape is adapted to at least a portion of the top of the inductor body 200, and is correspondingly disposed on the top of the inductor body 200 through the contact portion; the top heat-conducting block 400 has a heat-conducting portion extending toward the inductor housing 100, and the heat-conducting portion contacts the inner wall of the inductor housing 100. Specifically, this integrated heat-dissipating inductor structure includes a plurality of top heat-conducting blocks 400, each top heat-conducting block 400 corresponding to one inductor body 200, used to assist in conducting heat from the top region of the coil 220 to the inductor housing 100. The top heat-conducting block 400 has a cross-shaped structure, including a contact portion extending in the left-right direction and two heat-conducting portions extending forward and backward respectively. The lower surface of the contact portion of the top heat-conducting block 400 is configured to conform to the outer contour of the top of the coil 220 in the inductor body 200, thereby maximizing contact with the upper surface of the coil 220. The ends of the two heat-conducting portions of the top heat-conducting block 400 are in direct contact with the upper region of the side wall 110 of the inductor housing 100, forming a heat conduction path. This allows the heat generated at the top of the coil 220 to be effectively transferred to the inductor housing 100 through the top heat-conducting block 400 and its heat-conducting arms, and then conducted to the heat conductor. This improves the heat conduction efficiency at the top of the inductor body 200 and enhances the temperature uniformity at different locations of the inductor body 200.

[0056] Furthermore, in other embodiments, the heat-conducting medium may also include a bottom heat-conducting block. The bottom heat-conducting block is disposed between the bottom of the inductor body 200 and the heat dissipation surface 310, and is in contact with both. The bottom heat-conducting block has a similar structure and is made of the same material as the top heat-conducting block 400. For each inductor body 200, two bottom heat-conducting blocks are respectively disposed at the two rounded corner positions on the bottom of the outer periphery of the coil 220 of that inductor body 200. These two bottom heat-conducting blocks have arc-shaped heat-conducting surfaces adapted to the rounded corner shape of the outer periphery of the coil 220, forming a conformal fit with the outer periphery of the coil 220; simultaneously, the bottom surfaces of these two bottom heat-conducting blocks are in close contact with the heat dissipation surface 310 to transfer heat to the heat sink 300.

[0057] Both the bottom and top heat-conducting blocks 400 are made of thermally conductive ceramic material. Preferably, they are ceramic matrix composites with high thermal conductivity and electrical insulation, such as aluminum nitride (AlN), beryllium oxide (BeO), or silicon carbide (SiC) based ceramics, with a thermal conductivity of not less than 120 W / (m·K) and a volume resistivity greater than 10 Ω·m. 12 Ω·cm, to ensure efficient heat conduction under high temperature and high voltage conditions, and to reliably block leakage current between coil 220 and the outer casing; in some embodiments, the bottom heat conduction block and the top heat conduction block 400 may also be made of metal-based composite material (such as aluminum silicon carbide SiC / Al), but an insulating coating needs to be added to the contact surface with coil 220 to maintain electrical isolation function.

[0058] After the bottom heat-conducting block is placed between the bottom of the inductor body 200 and the heat dissipation surface 310, it can simultaneously contact both and form an efficient heat conduction path. Compared with completely filling with potting compound, using a solid bottom heat-conducting block can transfer heat from the inductor body 200 to the heat sink 300 more quickly and efficiently. By setting the top heat-conducting block 400 and making it contact the top of the inductor body 200 and the inner wall of the inductor housing 100, a new heat conduction path is constructed. The heat from the top is collected by the top heat-conducting block 400 and then laterally conducted through its heat-conducting part to the side wall 110 of the inductor housing 100, and finally transferred to the heat sink 300 through the connection between the side wall 110 and the heat sink 300. This improves the heat dissipation problem of the inductor body 200, making the overall temperature distribution of the inductor body 200 more uniform.

[0059] In the inductor mounting structure provided in this embodiment, the inductor housing 100 is enclosed by side walls 110 and sits directly on the heat dissipation surface 310 of the heat sink 300. The heat dissipation surface 310 of the heat sink 300 directly forms the bottom surface of the receiving chamber 101, or at least the main part of the bottom surface. In this way, the inductor housing 100 and the heat sink 300, originally independent components, cooperate to form a unified receiving chamber 101 with its bottom directly facing the heat dissipation core. When the inductor body 200 is placed in this receiving chamber 101, the thermally conductive medium used for fixing, such as potting compound, can be directly filled between the inductor body 200 and the heat dissipation surface 310 of the heat sink 300, achieving direct thermal contact between the two. Through this structure, the path of heat conduction from the inductor body 200 to the heat sink 300 is changed. The new heat conduction path no longer needs to pass through the bottom wall of the inductor housing 100, nor does it require additional thermal interface materials to overcome the contact thermal resistance between the housing and the heat sink 300. Heat can be directly transferred from the inductor body 200 through a single thermally conductive layer to the heat dissipation surface 310 of the heat sink 300. This effectively improves the overall heat dissipation capacity of the inductor assembly, enhancing its operational stability and lifespan.

[0060] The foregoing description of the specifications and embodiments is intended to explain the scope of protection of this utility model, but does not constitute a limitation on the scope of protection of this utility model. Modifications, equivalent substitutions, or other improvements to the embodiments of this utility model or a portion thereof that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of this utility model or the foregoing embodiments, should all be included within the scope of protection of this utility model.

Claims

1. An inductor mounting structure, characterized in that, include: A radiator (300) having a heat dissipation surface (310); and The inductor housing (100) is circumferentially enclosed by sidewalls (110) and sits on the heat dissipation surface (310) to cooperate with the heat sink (300) to form a housing chamber (101) suitable for housing the inductor body (200); The bottom surface of the accommodating chamber (101) is at least partially the heat dissipation surface (310).

2. The inductor mounting structure as described in claim 1, characterized in that, The bottom of the inductor housing (100) is completely open so that the bottom surface of the receiving chamber (101) is entirely formed by the heat dissipation surface (310).

3. The inductor mounting structure as described in claim 1, characterized in that, The inductor housing (100) is welded to the heat sink (300).

4. The inductor mounting structure as described in claim 1, characterized in that, The radiator (300) is a liquid-cooled radiator (300), which has a flow channel (320) for supplying liquid cooling fluid through at least the portion of the bottom surface of the accommodating chamber (101) in the heat dissipation surface (310).

5. An integrated heat dissipation inductor structure, characterized in that, Includes the inductor mounting structure as described in any one of claims 1-4; And, also includes: An inductor body (200) is housed in the accommodating chamber (101) and its position corresponds to the portion of the bottom surface of the accommodating chamber (101) formed by the heat dissipation surface (310). and A thermally conductive medium is filled between the heat dissipation surface (310) and the inductor body (200).

6. The integrated heat dissipation inductor structure as described in claim 5, characterized in that, The thermally conductive medium includes potting compound, which is poured into the space of the accommodating chamber (101) excluding the inductor body (200).

7. The integrated heat dissipation inductor structure as described in claim 5, characterized in that, The thermally conductive medium includes a bottom thermally conductive block, which is disposed between the bottom of the inductor body (200) and the heat dissipation surface (310) and is in contact with both.

8. The integrated heat dissipation inductor structure as described in claim 7, characterized in that, The heat-conducting medium includes a top heat-conducting block (400), which has a contact portion that is adapted to at least a portion of the top of the inductor body (200) and is disposed on the top of the inductor body (200) through the contact portion; the top heat-conducting block (400) has a heat-conducting portion extending toward the inductor housing (100) and the heat-conducting portion is in contact with the inner wall of the inductor housing (100).

9. The integrated heat dissipation inductor structure as described in claim 8, characterized in that, The bottom and top heat-conducting blocks (400) are made of thermally conductive ceramic material.

10. A converter including power components, characterized in that, It also includes an integrated thermal inductor structure as described in any one of claims 5-9, wherein at least a portion of the power components are cooled by the heat sink (300).

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