A dual capacity capacitor

Abstract

The utility model discloses a double capacity capacitor, it includes child parent capacity core and metal shell, child parent capacity core is encapsulated in metal shell through epoxy resin filling layer, child parent capacity core includes a core shaft, at least two thin film capacitors that are coiled by gold plating film and the insulating film isolation layer that is arranged between two adjacent thin film capacitors, thin film capacitor and insulating film isolation layer all are set in the core shaft outside, the end surface of thin film capacitor is equipped with the gold spraying layer, insulating film isolation layer at least one section is stretched out the end surface of thin film capacitor, and the gold spraying layer of corresponding thin film capacitor on this end surface is cut off, the both ends of core shaft protrude from the end surface of the thin film capacitor closest to its outside, and the end surface of core shaft is higher or level with the gold spraying layer. The utility model discloses the end of core shaft protrude from the end surface of thin film capacitor, and is higher or level with the gold spraying layer, avoids the gold spraying layer to fall into the inner chamber of core shaft, and the length of core shaft increases, increases the creeping distance of the both ends of thin film capacitor, is more safe.

Description

Technical Field

[0001] This utility model relates to a capacitor, and more particularly to a dual-capacity capacitor. Background Technology

[0002] Chinese Patent Publication No. CN204045394U, published on December 24, 2014, discloses a mother-daughter capacitor for a twin-tub washing machine. It includes a casing, capacitors, a cross-shaped clamp, and potting compound. The casing and capacitor are filled with potting compound. The capacitor is fixed inside the casing by the cross-shaped clamp. The capacitor consists of a spindle, a first capacitor core, a separator, and a second capacitor core. The second capacitor core is wound around the outer periphery of the spindle, and a certain number of separators surround the second capacitor core. The first capacitor core is wound around the outer periphery of the separators. In this structure, the end of the spindle is flush with the end face of the capacitor core. Because the spindle is a hollow structure, the gold plating layer of the capacitor core can easily penetrate into the inner wall of the spindle, shortening the creepage distance at both ends of the capacitor core, affecting product quality and increasing the scrap rate. Furthermore, the casing of the cover structure is made of aluminum. Before the potting compound dries, it has a certain buoyancy, causing the capacitor to float and tilt. The gold plating surface of the capacitor can easily approach or contact the casing, posing a safety hazard. Utility Model Content

[0003] The purpose of this invention is to provide a dual-capacity capacitor that is simple in structure, reasonable in design, safe and reliable.

[0004] The purpose of this utility model is achieved as follows: A dual-capacitance capacitor includes a master capacitor core and a metal casing. The master capacitor core is encapsulated in the metal casing by an epoxy resin potting layer. The master capacitor core includes a core shaft, at least two thin-film capacitors wound with gold-plated film, and an insulating film isolation layer disposed between two adjacent thin-film capacitors. The thin-film capacitors and the insulating film isolation layer are both sleeved on the core shaft. The end face of the thin-film capacitor is provided with a gold-plated layer. At least one section of the insulating film isolation layer extends beyond the end face of the thin-film capacitor and separates the gold-plated layer of the corresponding thin-film capacitor on that end face. Both ends of the core shaft protrude beyond the end face of the thin-film capacitor closest to its outermost end. The end face of the core shaft is higher than or level with the gold-plated layer.

[0005] The objective of this utility model can also be achieved by the following technical measures: As a more specific embodiment, the metal casing includes a lower shell and a top cover. The lower shell has a cavity for placing the capacitor cores. The top cover is located on top of the lower shell, and the edge of the top cover is rolled and fastened to the top edge of the lower shell. An insulating seat is provided on the top cover, and an output electrode is provided on the insulating seat, with the output electrode extending out of the top cover. A lead wire is welded between the gold-plated surface of the capacitor core and the inner end of the output electrode, and at least one lead wire is in a taut state.

[0006] As a further solution, the upper end of the insulating base extends out of the top cover and is provided with a sleeve corresponding to the root of the lead-out electrode. An epoxy resin fixing layer is provided on the inner side of the sleeve to further fix the lead-out electrode and ensure the sealing of the lead-out electrode connection.

[0007] As a further embodiment, an insulating sleeve is also attached to the inner wall of the lower shell, and the epoxy resin potting layer fills the insulating sleeve and covers the female and male capacitor cores; or, an insulating sleeve is also provided outside the female and male capacitor cores, the insulating sleeve separates the side walls and bottom walls of the female and male capacitor cores from the inner wall of the lower shell, the epoxy resin potting layer fills the space between the outer wall of the insulating sleeve and the inner wall of the lower shell and inside the insulating sleeve, and the epoxy resin potting layer also covers the female and male capacitor cores.

[0008] As a further embodiment, the lower end of the insulating base is located at the bottom of the top cover, and the lower end of the insulating base is also provided with a support foot, which is inserted into the epoxy resin potting layer and abuts against the core of the mother and daughter capacitors.

[0009] As a further embodiment, the top edge of the lower shell is provided with an outward rolled edge, the top cover is provided with a recessed platform corresponding to the cavity opening of the lower shell, the recessed platform is inserted into the cavity opening, and the edge of the top cover is provided with a downward rolled edge, the downward rolled edge covering the outward rolled edge.

[0010] As a further embodiment, the thin-film capacitor includes two capacitors, namely a first thin-film capacitor and a second thin-film capacitor. The gold-plated film of the first thin-film capacitor is wound around the core shaft, and an insulating film is wound around the outer periphery of the first thin-film capacitor. The wound insulating film forms the insulating film isolation layer. The gold-plated film of the second thin-film capacitor is wound around the insulating film isolation layer. The upper ends of the first thin-film capacitor and the second thin-film capacitor are respectively provided with a first gold spray layer and a second gold spray layer.

[0011] As a further embodiment, the lower ends of the first and second thin-film capacitors are covered by a common gold sputtering layer. The lead-out electrodes are provided in three forms: a first lead-out electrode, a second lead-out electrode, and a common lead-out electrode. The first lead-out electrode, the second lead-out electrode, and the common lead-out electrode are electrically connected to the first gold sputtering layer, the second gold sputtering layer, and the common gold sputtering layer, respectively.

[0012] As a further embodiment, the first lead electrode includes three conductive tabs, the second lead electrode includes two conductive tabs, and the common lead electrode includes four conductive tabs. Since the number of conductive tabs for each lead electrode is different, different lead electrodes can be better distinguished.

[0013] As a further embodiment, the lower ends of the first and second thin-film capacitors are respectively provided with a third gold sputtering layer and a fourth gold sputtering layer, which are separated by the lower end of an insulating film isolation layer; the lead-out electrode consists of four lead-out wires, which are electrically connected to the first, second, third, and fourth gold sputtering layers respectively.

[0014] The beneficial effects of this utility model are as follows: (1) The end of the spindle of this utility model protrudes out of the end face of the film capacitor and is higher than or level with the gold spray layer, which avoids the gold spray layer falling into the inner cavity of the spindle. In addition, the increased length of the spindle increases the creepage distance at both ends of the film capacitor, making it safer.

[0015] (2) The bottom of the top cover of this utility model is provided with a support foot, which touches the core of the capacitor and the daughter capacitor to prevent the core of the capacitor and the daughter capacitor from floating or tilting before the epoxy resin potting layer is cured.

[0016] (3) The core of the mother and daughter capacitors of this utility model can be internally connected in series and a common lead electrode can be led out, so that two thin film capacitors can be connected in parallel or in series. Attached Figure Description

[0017] Figure 1 This is an exploded structural diagram of the first embodiment of the present invention.

[0018] Figure 2 This is a cross-sectional structural diagram of the first embodiment of the present invention.

[0019] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle.

[0020] Figure 4 for Figure 2 Enlarged structural diagram at point B.

[0021] Figure 5 This is a schematic diagram of the core structure of the mother and daughter capacitors in the first embodiment of this utility model.

[0022] Figure 6 This is an exploded structural diagram of the second embodiment of the present invention.

[0023] Figure 7 This is a cross-sectional structural diagram of the second embodiment of the present invention. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments: Example 1, see Figures 1-5As shown, a dual-capacitance capacitor includes a master capacitor core 3 and a metal casing. The master capacitor core 3 is encapsulated in the metal casing by an epoxy resin potting layer 6. The master capacitor core 3 includes a core shaft 31, at least two thin-film capacitors wound with gold-plated film, and an insulating film isolation layer 34 disposed between two adjacent thin-film capacitors. The thin-film capacitors and the insulating film isolation layer 34 are both sleeved on the core shaft 31. The end face of the thin-film capacitor is provided with a gold-plated layer. At least one section of the insulating film isolation layer 34 extends out of the end face of the thin-film capacitor and separates the gold-plated layer of the corresponding thin-film capacitor on the end face. The two ends of the core shaft 31 protrude out of the end face of the thin-film capacitor closest to its outermost end face, and the end face of the core shaft 31 is higher than or level with the gold-plated layer.

[0025] The metal casing includes a lower shell 1 and a top cover 4. The lower shell 1 has a cavity for placing the capacitor core 3. The top cover 4 is located on the top of the lower shell 1, and the edge of the top cover 4 is rolled and fastened to the top edge of the lower shell 1. The top cover 4 is provided with an insulating seat 51, and the insulating seat 51 is provided with a lead electrode 5, which extends out of the top cover 4. A lead wire is welded between the gold-plated surface of the capacitor core 3 and the inner end of the lead electrode 5, and at least one lead wire is in a taut state.

[0026] The upper end of the insulating base 51 extends out of the top cover 4 and a sleeve 511 is provided at the root of the lead-out electrode 5. An epoxy resin fixing layer 512 is provided on the inner side of the sleeve 511.

[0027] An insulating sleeve 2 is provided outside the core capacitor 3. The insulating sleeve 2 separates the side wall and bottom wall of the core capacitor 3 from the inner wall of the lower shell 1. An epoxy resin potting layer 6 is filled between the outer wall of the insulating sleeve 2 and the inner wall of the lower shell 1 and inside the insulating sleeve 2. The epoxy resin potting layer 6 also covers the core capacitor 3.

[0028] As a further embodiment, the lower end of the insulating base 51 is located at the bottom of the top cover 4, and the lower end of the insulating base 51 is also provided with a support foot 55, which is inserted into the epoxy resin potting layer 6 and abuts against the core of the capacitor.

[0029] The top edge of the lower shell 1 is provided with an outward rolled edge 11, and the top cover 4 is provided with a recessed platform corresponding to the cavity opening of the lower shell 1. The recessed platform is inserted into the cavity opening, and the edge of the top cover 4 is provided with a downward rolled edge 41, which covers the outward rolled edge 11.

[0030] The thin-film capacitor includes two capacitors, namely a first thin-film capacitor 32 and a second thin-film capacitor 33. The gold-plated film of the first thin-film capacitor 32 is wound around the core 31, and an insulating film is wound around the outer periphery of the first thin-film capacitor 32. The wound insulating film forms the insulating film isolation layer 34. The gold-plated film of the second thin-film capacitor 33 is wound around the insulating film isolation layer 34. The upper ends of the first thin-film capacitor 32 and the second thin-film capacitor 33 are respectively provided with a first gold spray layer 321 and a second gold spray layer 331.

[0031] The lower ends of the first thin-film capacitor 32 and the second thin-film capacitor 33 are covered by a common gold sputtering layer 35. There are three lead-out electrodes 5, namely the first lead-out electrode 52, the second lead-out electrode 53 and the common lead-out electrode 54. The first lead-out electrode 52, the second lead-out electrode 53 and the common lead-out electrode 54 are electrically connected to the first gold sputtering layer 321, the second gold sputtering layer 331 and the common gold sputtering layer 35, respectively.

[0032] The first lead electrode 52 includes three conductive tabs, the second lead electrode 53 includes two conductive tabs, and the common lead electrode 54 includes four conductive tabs.

[0033] Example 2 differs from Example 1 in that: see [link to example]. Figure 6 and Figure 7 As shown, the lower ends of the first thin-film capacitor 32 and the second thin-film capacitor 33 are respectively provided with a third gold sputtering layer 322 and a fourth gold sputtering layer 332, which are separated by the lower end of the insulating film isolation layer 34; the lead electrode 5 consists of four lead wires, which are electrically connected to the first gold sputtering layer 321, the second gold sputtering layer 331, the third gold sputtering layer 322 and the fourth gold sputtering layer 332 respectively.

[0034] The above describes the preferred embodiments of this utility model, illustrating and describing its basic principles, main features, and advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made without departing from the spirit and scope of this utility model, and all such changes and modifications fall within the scope of protection of this utility model as defined by the appended claims and their equivalents.

Claims

1. A dual-capacitance capacitor, comprising a master capacitor core (3) and a metal casing, wherein the master capacitor core (3) is encapsulated within the metal casing by an epoxy resin potting layer (6), the master capacitor core (3) comprising a core shaft (31), at least two thin-film capacitors wound with gold-plated film, and an insulating film isolation layer (34) disposed between two adjacent thin-film capacitors, wherein the thin-film capacitors and the insulating film isolation layer (34) are both sleeved outside the core shaft (31), the end face of the thin-film capacitors is provided with a gold-plated layer, and at least one section of the insulating film isolation layer (34) extends beyond the end face of the thin-film capacitors and separates the gold-plated layer of the corresponding thin-film capacitors on the end face, characterized in that: The two ends of the mandrel (31) protrude beyond the end face of the thin film capacitor closest to its outer side, and the end face of the mandrel (31) is higher than or level with the gold spray layer.

2. The dual-capacitance capacitor according to claim 1, characterized in that: The metal casing includes a lower shell (1) and a top cover (4). The lower shell (1) has a cavity for placing the capacitor core (3). The top cover (4) is located on the top of the lower shell (1). The edge of the top cover (4) is rolled and fastened to the top edge of the lower shell (1). An insulating seat (51) is provided on the top cover (4). An output electrode (5) is provided on the insulating seat (51). The output electrode (5) extends out of the top cover (4). A lead wire is welded between the gold-plated surface of the capacitor core (3) and the inner end of the output electrode (5). At least one lead wire is in a taut state.

3. The dual-capacitance capacitor according to claim 2, characterized in that: The upper end of the insulating base (51) extends out of the top cover (4) and a sleeve (511) is provided at the root of the lead-out electrode (5). An epoxy resin fixing layer (512) is provided inside the sleeve (511).

4. The dual-capacitance capacitor according to claim 2, characterized in that: An insulating sleeve (2) is attached to the inner wall of the lower shell (1). The epoxy resin potting layer (6) is filled in the insulating sleeve (2) and covers the female capacitor core (3). Alternatively, an insulating sleeve (2) is provided outside the female capacitor core (3). The insulating sleeve (2) separates the side wall and bottom wall of the female capacitor core (3) from the inner wall of the lower shell (1). The epoxy resin potting layer (6) is filled between the outer wall of the insulating sleeve (2) and the inner wall of the lower shell (1) and inside the insulating sleeve (2). The epoxy resin potting layer (6) also covers the female capacitor core (3).

5. The dual-capacitance capacitor according to claim 4, characterized in that: The lower end of the insulating base (51) is located at the bottom of the top cover (4). The lower end of the insulating base (51) is also provided with a support foot (55). The support foot (55) is inserted into the epoxy resin potting layer (6) and abuts against the core of the mother and daughter capacitors (3).

6. The dual-capacitance capacitor according to claim 2, characterized in that: The top edge of the lower shell (1) is provided with an outward rolled edge (11), and the top cover (4) is provided with a recessed platform corresponding to the cavity opening of the lower shell (1). The recessed platform is inserted into the cavity opening, and the edge of the top cover (4) is provided with a downward rolled edge (41). The downward rolled edge (41) covers the outward rolled edge (11).

7. The dual-capacitance capacitor according to claim 2, characterized in that: The thin-film capacitor includes two capacitors, namely a first thin-film capacitor (32) and a second thin-film capacitor (33). The gold-plated film of the first thin-film capacitor (32) is wound around the core (31), and an insulating film is wound around the outer periphery of the first thin-film capacitor (32). The wound insulating film forms the insulating film isolation layer (34). The gold-plated film of the second thin-film capacitor (33) is wound around the insulating film isolation layer (34). The upper ends of the first thin-film capacitor (32) and the second thin-film capacitor (33) are respectively provided with a first gold spray layer (321) and a second gold spray layer (331).

8. The dual-capacitance capacitor according to claim 7, characterized in that: The lower ends of the first thin film capacitor (32) and the second thin film capacitor (33) are covered by a common gold sputtering layer (35). There are three lead-out electrodes (5): a first lead-out electrode (52), a second lead-out electrode (53), and a common lead-out electrode (54). The first lead-out electrode (52), the second lead-out electrode (53), and the common lead-out electrode (54) are electrically connected to the first gold sputtering layer (321), the second gold sputtering layer (331), and the common gold sputtering layer (35), respectively.

9. The dual-capacitance capacitor according to claim 8, characterized in that: The first lead electrode (52) includes three conductive tabs, the second lead electrode (53) includes two conductive tabs, and the common lead electrode (54) includes four conductive tabs.

10. The dual-capacitance capacitor according to claim 7, characterized in that: The lower ends of the first thin film capacitor (32) and the second thin film capacitor (33) are respectively provided with a third gold sputtering layer (322) and a fourth gold sputtering layer (332), and the third gold sputtering layer (322) and the fourth gold sputtering layer (332) are separated by the lower end of the insulating film isolation layer (34); the lead electrode (5) consists of four lead wires, which are electrically connected to the first gold sputtering layer (321), the second gold sputtering layer (331), the third gold sputtering layer (322) and the fourth gold sputtering layer (332) respectively.

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