FDC-biscuit straight welding connection structure
CN224874429UActive Publication Date: 2026-10-20AMPHENOL (NINGDE) ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202522090472.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-28
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-09-28
AI Technical Summary
Technical Problem
对于单独提供镍片,材料成本较高
Benefits of technology
[0014]采用模切一体成型的FDC本体并配合激光焊工艺,可实现与巴片的直接焊接,避免了采用较为复杂的蚀刻工艺,且无需通过镍片进行桥接,大大简化了生产难度、并节省了工艺和材料成本。
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Figure CN224874429U_ABST
Abstract
The utility model relates to a kind of FDC-plate direct welding connection structure, comprising: the FDC body that is formed by die cutting process processing, including circuit layer, the upper insulating layer that is covered and connected on the upper surface of the circuit layer and the lower insulating layer that is covered and connected on the lower surface of the circuit layer, the side of the circuit layer is formed with the connecting portion extending outward;Plate, with the connecting portion is directly welded by laser welding mode;Wherein, one of the upper insulating layer and the lower insulating layer is provided with the welding window for partially exposing the connecting portion for the plate welding, another of the upper insulating layer and the lower insulating layer is provided with the heat dissipation window for partially exposing the connecting portion for welding heat dissipation.The utility model is formed by die cutting integrated FDC body and cooperates laser welding process, can realize direct welding with plate, avoids using more complex etching process, and does not need to be bridged by nickel sheet, greatly simplifies production difficulty, and saves process and material cost.
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