A CCS integrated collection structure

Abstract

The utility model relates to battery technical field discloses a kind of collection structure of CCS integration, including the blistering support of hollow structure;The upper end middle part of blistering support is equipped with FCC, for collecting voltage signal and temperature signal, and the both sides of FCC are electrically connected with busbar, and the both sides of blistering support upper end are arranged with busbar;The upper end of FCC is equipped with from board, from board is located in blistering support, and electrically connected with FCC, to receive voltage signal and temperature signal;The lower end of blistering support is equipped with from board support, for fixing from board;From board support is equipped with at least four vertical from board column upwards, and from board is fixed on FCC by from board column;The lower end of FCC is equipped with temperature sensing support, and temperature sensing support is located between FCC and blistering support.The utility model can solve the problem of low space utilization, high cost and complex operation when voltage and temperature sensing collection in existing battery pack.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, specifically to a CCS integrated acquisition structure. Background Technology

[0002] In electric vehicles, energy storage systems, and other equipment, the battery pack is a core component, and its performance and cost directly affect the market competitiveness of the end product. Furthermore, signal transmission within the battery pack has a crucial impact on its overall performance and is a vital link in ensuring stable equipment operation.

[0003] Currently, the common approach for transmitting voltage and temperature signals to slave boards (such as BSM slave boards or AFE chips) within a battery pack is to use an FPC (Flexible Printed Circuit) + wiring harness connection. The slave board is typically mounted at the front or rear of the battery pack housing, and its connection to the FPC is achieved via wiring harnesses and connectors. This solution utilizes the FPC for flexible signal transmission and the wiring harnesses for electrical connections between components, thus meeting the signal transmission requirements within the battery pack.

[0004] However, as the industry continues to raise its requirements for battery pack performance, battery pack energy density, production cost, and production efficiency, the above-mentioned FPC+ harness adapter solution has the following problems: (1) Low space utilization: The wiring layout of the harness inside the battery pack is complex, occupying a lot of valuable space, resulting in low utilization of the internal space of the battery pack, which limits the improvement of battery pack energy density; (2) High cost: The material cost and processing cost of the harness are high, and it is necessary to rely on operators for assembly, which further increases the production cost; (3) Difficulty in automated production: The installation process of the harness requires operator operation, which is difficult to adapt to automated production lines, thus restricting production efficiency and consistency; (4) Heavy weight: The harness itself is heavy, which increases the overall weight of the battery pack. Utility Model Content

[0005] The present invention aims to provide a CCS integrated acquisition structure to solve the problems of low space utilization, high cost and complicated operation when collecting voltage and temperature data in existing battery packs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a CCS integrated acquisition structure, including a hollow blister bracket; an FCC is provided in the middle of the upper end of the blister bracket for acquiring voltage and temperature signals, and busbars are arranged on both sides of the upper end of the blister bracket, and the two sides of the FCC are electrically connected to the busbars; The upper end of the FCC is provided with a slave plate, which is located inside the blister pack and electrically connected to the FCC to receive voltage and temperature signals; the lower end of the blister pack is provided with a slave plate bracket for fixing the slave plate; the slave plate bracket is provided with at least four vertically upward slave plate posts, and the slave plate is fixed to the FCC through the slave plate posts; The lower end of the FCC is provided with a temperature-sensing bracket, and the temperature-sensing bracket is located between the FCC and the blister pack bracket.

[0007] The principle of this solution is as follows: The vacuum-formed bracket serves as the foundation of the overall architecture. Its unique hollow structure provides installation space and protection for the FCC, busbars, slave board, and temperature sensor bracket, optimizing the spatial layout. The FCC, located in the middle of the upper part of the vacuum-formed bracket, is the core data acquisition component, directly acquiring voltage and temperature signals. The busbars arranged on both sides of the upper part of the vacuum-formed bracket are electrically connected to both sides of the FCC, undertaking the functions of current convergence and transmission, ensuring efficient power transmission. The slave board at the upper end of the FCC is in contact with the FCC, used to receive the voltage and temperature signals acquired by the FCC, and then perform subsequent processing and analysis.

[0008] The advantages of this solution are: (1) Compared with the existing technology, which uses a wire harness to connect the slave board and FPC, this solution integrates the slave board directly into the FCC through the design of the FCC and slave board bracket, forming an integrated unit of "slave board-FCC". This breaks the traditional mode of "slave board independent installation + wire harness connection", realizes the multi-level connection of the signal transmission link from "FPC → wire harness → slave board", simplifies it to a single-level direct connection of "FCC → slave board", reduces intermediate conversion links, optimizes the signal transmission path, and improves the system integration.

[0009] (2) Compared with direct welding of the slave board, this solution effectively solves the problem of high welding failure rate. Direct welding, due to the lack of precise positioning and support structure, is prone to inaccurate welding positioning, weld point misalignment, and alignment deviation during the welding process. At the same time, the limited operating space of the battery pack also increases the difficulty of welding, which can easily lead to quality hazards such as cold welding, short circuit or insufficient structural strength.

[0010] This solution effectively optimizes the welding process by introducing a dedicated slave plate bracket. As a key auxiliary positioning and support component, this bracket precisely positions and reliably fixes the slave plate before welding, ensuring it is in the correct position and orientation, significantly reducing alignment issues and weld misalignment caused by manual operation or fixture errors. Although this solution adds an assembly step, it greatly improves welding accuracy and process stability, thereby effectively reducing the welding defect rate and increasing product consistency and production yield.

[0011] (3) In this design, the vacuum-formed bracket can isolate conductive components (such as busbars and FCCs) to prevent short circuits, and can provide installation positions for the slave board, temperature sensor bracket, busbar, and FCC, ensuring the overall structural stability. The hollow structure design of the vacuum-formed bracket enables a three-dimensional wiring layout, integrating the FCC, busbar, slave board, and temperature sensor bracket on the upper end of the vacuum-formed bracket in a planar arrangement, realizing the integrated design of "FCC + busbar + slave board + temperature sensor bracket". This design effectively reduces the use of wiring harnesses, simplifies electrical connections, ensures improved accuracy of voltage and temperature acquisition, and makes the overall structure more compact and space-efficient.

[0012] (4) This solution abandons the wiring harness and integrates the signal transmission and mechanical support functions into the structural design of the blister bracket, FCC and the plate bracket, which not only improves the space utilization inside the battery pack, but also achieves the goal of weight reduction and cost reduction.

[0013] Preferably, as an improvement, the FCC includes a laterally extending FFC body, and an FPC branch extending longitudinally from the FFC body and an obliquely extending temperature-sensing branch; one end of the FPC branch is connected to the FFC body, and the other end of the FPC branch is connected to the busbar; one end of the temperature-sensing branch is connected to the FFC body, and the other end of the temperature-sensing branch is connected to the temperature-sensing bracket.

[0014] Beneficial effects: The FCC structure integrates voltage and temperature acquisition into a single FCC component, replacing the complex connection method of "multiple wire harnesses + connectors" in the traditional method. This simplifies the electrical connection structure, reduces the failure rate, and improves system reliability. It also avoids the problem of messy wire harness layout in traditional systems, improving overall space utilization and assembly efficiency.

[0015] Preferably, as an improvement, the blister packer includes a manifold mounting groove, a slave plate mounting groove, and a temperature sensor mounting groove; the manifold mounting groove is located on both sides of the upper end of the blister packer and is used to install manifolds; the slave plate mounting groove is located in the middle of the upper end of the blister packer and is used to install slave plates; the temperature sensor mounting groove is located at both ends of the slave plate mounting groove and is used to install temperature sensor brackets.

[0016] Beneficial effects: Through reasonable layout, the vacuum forming bracket has dedicated positioning slots for precise installation of various components, which simplifies the assembly process, reduces errors caused by manual adjustment, improves the consistency and repeatability of mass production, provides conditions for the automated production of subsequent acquisition structures, and enhances the compactness and space utilization of the overall structure.

[0017] Preferably, as an improvement, the FFC body is bent into the mounting groove of the slave plate, the FFC body has a groove structure, the slave plate is fitted and fixed in the middle of the groove structure, and the slave plate is pressed downward by both sides of the groove structure.

[0018] Beneficial effects: The FFC main body is directly embedded into the mounting slot of the slave plate through a bending design, making full use of the three-dimensional space of the vacuum-formed bracket and avoiding the excessive installation area occupied by the traditional flat laying method. This makes the overall structure more compact and improves the utilization efficiency of the internal space of the battery pack. The groove structure ensures that the slave plate will not shift or loosen during use.

[0019] Preferably, as an improvement, the slave plate bracket is located at the lower end of the slave plate mounting slot.

[0020] Beneficial effects: The design of the slave plate bracket and slave plate mounting slot provides multi-point support for the slave plate, ensuring that the slave plate does not shift or tilt during installation.

[0021] Preferably, as an improvement, the manifold mounting groove is provided with at least two vertically upward manifold columns; the manifold is provided with positioning holes corresponding to the manifold columns, and the manifold is fixed in the manifold mounting groove by docking with the manifold columns through the positioning holes.

[0022] Beneficial effects: The docking method between the positioning hole and the manifold simplifies the installation steps, helps improve production efficiency, and provides a clear installation benchmark for the manifold, ensuring that its installation position is consistent each time, effectively improving assembly accuracy and consistency of mass production.

[0023] Preferably, as an improvement, the temperature sensing bracket is provided with aluminum bars at both ends, and the temperature sensing bracket is snapped into the temperature sensing mounting groove by the aluminum bars.

[0024] Beneficial effects: The snap-fit ​​structure between the aluminum bar and the temperature sensor mounting slot allows the temperature sensor bracket to be quickly and accurately positioned and fixed in the designated location.

[0025] Preferably, as an improvement, the temperature sensing bracket is provided with at least two vertically upward temperature sensing columns; the temperature sensing branch is provided with through holes corresponding to the temperature sensing columns, and the temperature sensing branch is fixed on the temperature sensing bracket by the connection between the through holes and the temperature sensing columns.

[0026] Beneficial effects: The fit between the temperature sensing post and the through hole ensures that the temperature sensing branch is installed accurately on the temperature sensing bracket, which helps the temperature sensor to stably fit the temperature measuring point and improves the accuracy and consistency of temperature acquisition; at the same time, the plug-in method of the through hole and the temperature sensing post enables the rapid installation of the temperature sensing branch, simplifies the assembly process, and improves production efficiency.

[0027] Preferably, as an improvement, the thickness of the blister support is 0.3mm-0.6mm, and the thickness of the plate support is 1.2mm-2.0mm.

[0028] Beneficial effects: The thickness design of the vacuum forming bracket effectively reduces the overall weight while ensuring basic structural support and insulation performance; the thickness design of the plate bracket provides higher mechanical strength and load-bearing capacity, ensuring stable support for the plate.

[0029] Preferably, as an improvement, it also includes a CCS cover, which is located above the blister packer.

[0030] Beneficial effects: CCS provides protection by forming a physical isolation layer, effectively preventing dust, impurities, moisture, etc. from entering, thus improving the protection level and safety of the internal circuitry of the acquisition structure.

[0031] The beneficial effects of this solution are: (1) This solution makes full use of the spatial structure of the vacuum forming bracket and makes a reasonable layout of it, making the overall structure more compact and neat, improving the integration, and at the same time, realizing "one-time positioning and synchronous installation", reducing the steps of separate wiring and connection, effectively improving assembly efficiency, which is conducive to realizing automated production and reducing costs; (2) This solution completely eliminates the redundant wiring harness connecting the two in the traditional solution by using a welding integrated design between the board and the FCC, thereby effectively improving the utilization rate of the internal space of the battery pack and reducing the cost and overall weight of the battery pack.

[0032] (3) This solution achieves the optimal configuration of structural function and material usage by setting the vacuum forming bracket and the plate bracket to different thicknesses. This design not only takes into account the requirements of lightweight, high strength and low cost, but also improves assembly accuracy, space utilization and system operation reliability. Attached Figure Description

[0033] Figure 1 A schematic diagram of a CCS integrated acquisition structure provided in this embodiment of the present invention. Figure 1 .

[0034] Figure 2 A schematic diagram of the FCC structure in a CCS integrated acquisition structure provided in this embodiment of the utility model. Figure 1 .

[0035] Figure 3 This is a schematic diagram of the vacuum forming bracket in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0036] Figure 4This is a schematic diagram of the busbar mounting slot in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0037] Figure 5 A schematic diagram of a CCS integrated acquisition structure provided in this embodiment of the present invention. Figure 2 .

[0038] Figure 6 This is a schematic diagram of the structure of the slave board support in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0039] Figure 7 A schematic diagram of the FCC structure in a CCS integrated acquisition structure provided in this embodiment of the utility model. Figure 2 .

[0040] Figure 8 This is a partial schematic diagram of the slave board (in installation) in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0041] Figure 9 This is a schematic diagram of the temperature sensing bracket in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0042] Figure 10 This is a partial schematic diagram of a temperature sensing bracket (in installation) in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0043] Figure 11 This is a schematic diagram of the CCS cover in a CCS integrated acquisition structure provided in an embodiment of the present invention.

[0044] The reference numerals in the accompanying drawings include: 1. Vacuum forming bracket; 11. Manifold mounting slot; 12. Slave plate mounting slot; 13. Temperature sensor mounting slot; 14. Manifold column; 15. FCC; 21. FFC main body; 22. FPC branch; 23. Temperature sensor branch; 24. Manifold; 5. Slave plate bracket; 6. Slave plate column; 7. CCS cover; 8. Temperature sensor column. Detailed Implementation

[0045] The following detailed description illustrates the specific implementation method: The implementation examples are basically as follows Figure 1 As shown: A CCS integrated acquisition structure includes a hollow blister bracket 1; an FCC2 is installed in the middle of the upper end of the blister bracket 1 for acquiring voltage and temperature signals; busbars 3 are arranged on both sides of the upper end of the blister bracket 1, and the two sides of the FCC2 are electrically connected to the busbars 3. The upper end of FCC2 is equipped with a slave plate 4, which is located inside the blister bracket 1 and is electrically connected to FCC2 to receive voltage and temperature signals; the lower end of the blister bracket 1 is equipped with a slave plate bracket 6 for fixing the slave plate 4; the slave plate bracket 6 is provided with at least four vertically upward slave plate posts 61, and the slave plate 4 is fixed to FCC2 by the slave plate posts 61. The lower end of FCC2 is provided with a temperature-sensing bracket 5, and the temperature-sensing bracket 5 is located between FCC2 and the blister bracket 1.

[0046] Specifically, such as Figure 2 As shown, the FCC2 (Flexible Circuit Assembly) includes a laterally extending FFC body 21, an FPC branch 22 extending longitudinally from the FFC body 21, and a diagonally extending temperature-sensing branch 23. One end of the FPC branch 22 is connected to the FFC body 21, and the other end is connected to the busbar 3; one end of the temperature-sensing branch 23 is connected to the FFC body 21, and the other end is connected to the temperature-sensing bracket 5. At least one FCC2 is installed in the upper middle part of the thermoforming bracket 1. The FPC branch 22 is used to collect voltage signals, and the temperature-sensing branch 23 is used to collect temperature signals. After the voltage and temperature signals are collected, they are transmitted to the slave board 4 to realize real-time monitoring and data feedback of the battery's operating status. In this embodiment, the FPC branch 22 and the temperature-sensing branch 23 are soldered to the FFC body 21.

[0047] like Figure 3 As shown, the vacuum forming bracket 1 is equipped with several manifold mounting slots 11, slave plate mounting slots 12 and temperature sensing mounting slots 13 to achieve precise installation and fixation of each component.

[0048] The manifold mounting slots 11 are located on both sides of the upper end of the blister bracket 1 and are used to install the manifold 3. For example... Figure 4 As shown, each manifold mounting slot 11 is provided with at least two vertically upward-pointing manifold columns 14; the busbar 3 is provided with positioning holes corresponding to the manifold columns 14, and the busbar 3 is securely fixed in the manifold mounting slot 11 by the docking of the positioning holes and the manifold columns 14. The manifold mounting slot 11 not only accurately positions the busbar 3, but also enhances the overall stability through the manifold columns 14.

[0049] like Figure 5 , Figure 6As shown, the mounting groove 12 is located at the upper center of the vacuum forming bracket 1 and is used to install the slave plate 4. A slave plate bracket 6 is installed on the back of the mounting groove 12, and at least four vertically upward slave plate posts 61 are provided within the slave plate bracket 6. The slave plate 4 is securely fixed within the mounting groove 12 by the slave plate posts 61 in the slave plate bracket 6. The mounting groove 12 serves a positioning and limiting function; the slave plate bracket 6 not only provides precise installation positioning, accurately positioning and reliably fixing the slave plate 4 before welding, but also effectively supports the slave plate 4, preventing it from moving or shifting during operation, thereby ensuring its installation stability. In this embodiment, the thickness of the slave plate bracket 6 is 1.2mm-2.0mm. Specifically, the thickness of the slave plate bracket 6 is 1.2mm. This thickness design provides higher mechanical strength and load-bearing capacity, ensuring stable support for the slave plate 4.

[0050] Temperature sensor mounting slots 13 are located at both ends of the plate mounting slots 12 and are used to mount temperature sensor brackets 5. Aluminum clamps are provided at both ends of the temperature sensor brackets 5, and the temperature sensor brackets 5 are fixedly connected to the temperature sensor mounting slots 13 by the aluminum clamps, ensuring the stability of the temperature sensor brackets 5 and their mounting slots 13, thereby ensuring accurate acquisition of temperature signals.

[0051] In this embodiment, the thickness of the vacuum forming bracket 1 is 0.3mm-0.6mm, integrating the FPC, FFC, and busbar 3; specifically, the thickness of the vacuum forming bracket 1 is 0.5mm, effectively reducing the overall weight while ensuring basic structural support and insulation performance. Adjacent slave boards 4 are connected by communication harnesses.

[0052] like Figure 7 , Figure 8 As shown, the FFC body 21 is welded to the upper middle part of the vacuum forming bracket 1 along its length. Near the slave plate mounting groove 12, the FFC body 21 is bent and connected to the slave plate mounting groove 12. Specifically, near the slave plate mounting groove 12, the left and right ends of the FFC body 21 are bent multiple times to form a groove structure. The middle part of this groove structure is used to directly fit and install the slave plate 4, achieving precise positioning and providing physical support; the two sides of the groove structure are used to press the slave plate 4 downwards, ensuring that the slave plate 4 is firmly installed on the FFC body 21, thereby ensuring that the slave plate 4 will not shift or loosen during use. In this embodiment, the slave plate 4 is welded and installed in the middle of the groove structure.

[0053] like Figure 9 , Figure 10 As shown, the temperature sensing bracket 5 is equipped with at least two vertically upward temperature sensing columns 8; the temperature sensing branch 23 is provided with through holes corresponding to the temperature sensing columns 8. Through the connection between the through holes and the temperature sensing columns 8, the temperature sensing branch 23 is thermally riveted to the temperature sensing bracket 5, thereby achieving a stable connection between the temperature sensing branch 23 and the temperature sensing bracket 5.

[0054] In this embodiment, the busbar 14, the plate post 61, and the temperature sensing post 8 are mainly fixed by hot riveting.

[0055] In addition, the acquisition structure also includes a CCS cover 7, which covers the blister bracket 1 and its installed electrical components (such as busbar 3, FCC2, slave board 4, temperature sensor bracket 5, etc.) to form a physical isolation layer, effectively preventing dust, impurities, moisture and other contaminants from entering, and improving the protection level and safety of the internal circuit system of the acquisition structure.

[0056] Specific implementation process: Installation: As needed, configure and install the corresponding busbar 3, slave plate 4, and temperature sensor bracket 5 on the blister bracket 1. After the data acquisition structure is assembled, securely install it on the battery module.

[0057] Operation: When the battery cell is working, the current is collected through the FFC body 21 to the bus 3. At the same time, the FPC branch 22 collects the voltage in real time, and the temperature sensing branch 23 monitors the temperature change in real time to achieve stable operation.

[0058] In existing technologies, directly welding the slave board 4 poses numerous risks. The welding operation is highly likely to cause irreversible damage to the precision electronic components on the slave board 4, affecting their performance and even leading to complete failure. Simultaneously, the quality of the solder joints is difficult to guarantee, easily resulting in incomplete connections or false soldering, which can lead to unstable signal transmission and, in severe cases, battery pack malfunctions. In mass production, these risks are further amplified. Therefore, to ensure product stability and yield, non-welding connection methods have been considered a more reliable option.

[0059] However, while the non-welded connection method using FPC + wiring harness adapters offers flexibility and facilitates later maintenance and component replacement, this flexibility comes with several drawbacks. To achieve this flexible, non-welded connection, additional connectors, wiring harnesses, and other accessories are required. This not only increases material costs but also significantly increases production assembly steps, reducing production efficiency. Furthermore, these additional structures occupy more space, contradicting the trend of continuously pursuing higher energy density in battery packs.

[0060] In summary, this solution abandons the traditional wire harness connection method used in existing technologies, which relies on a "Flexible Printed Circuit (FPC) + wire harness" adapter. It integrates signal transmission and mechanical support functions into the structural design of the vacuum forming bracket 1, FCC 2, and slave board bracket 6. Specifically, this solution integrates the slave board directly into the FCC, forming a unified "slave board-FCC" unit. This breaks away from the traditional "independent slave board installation + wire harness adapter" model, simplifying the multi-level signal transmission link from "FPC → wire harness → slave board" to a single-level direct connection of "FCC → slave board," reducing intermediate conversion steps, optimizing the signal transmission path, and improving system integration.

[0061] This design not only effectively reduces the overall weight of the battery pack, but also significantly reduces the risk of failure caused by aging or loosening of wiring harness connectors. At the same time, it reduces the complexity of the PACK structure, saves up to 90% of the wiring harness and the space occupied by the wiring harness, and significantly improves the scalability of the module. In addition, it helps to reduce the manufacturing cost of the PACK and facilitates the automated production of the PACK.

[0062] Furthermore, for the "welding of slave plate 4", this solution is achieved through the special structural design of slave plate bracket 6, temperature sensing mounting groove 13, and FFC body 21. This allows for stable and precise positioning of slave plate 4 and FCC2 during the welding process, ensuring the accuracy of the welding position and avoiding welding failures caused by positioning deviations.

[0063] This solution achieves a three-dimensional wiring layout through the hollow structure of the vacuum-formed bracket 1, the rational arrangement of FCC2 and the slave board bracket 6. Components such as FCC2, busbar 3, slave board 4, and temperature sensor bracket 5 are integrated and installed in the vacuum-formed bracket 1 in a planar arrangement, realizing an integrated and modular design of "FCC2 + busbar 3 + slave board 4 + temperature sensor bracket 5". This design effectively reduces the use of wiring harnesses, simplifies electrical connections, ensures improved accuracy of voltage and temperature acquisition, and makes the overall structure more compact and space-efficient.

[0064] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A CCS-integrated acquisition structure, characterized in that: The device includes a hollow thermoforming support; an FCC is provided at the upper center of the thermoforming support for collecting voltage and temperature signals, and busbars are arranged on both sides of the upper end of the thermoforming support, with the two sides of the FCC electrically connected to the busbars. The upper end of the FCC is provided with a slave plate, which is located inside the blister pack and electrically connected to the FCC to receive voltage and temperature signals; the lower end of the blister pack is provided with a slave plate bracket for fixing the slave plate; the slave plate bracket is provided with at least four vertically upward slave plate posts, and the slave plate is fixed to the FCC through the slave plate posts; The lower end of the FCC is provided with a temperature-sensing bracket, and the temperature-sensing bracket is located between the FCC and the blister pack bracket.

2. The CCS integrated acquisition structure according to claim 1, characterized in that: The FCC includes a horizontally extending FFC body, an FPC branch extending longitudinally from the FFC body, and a diagonally extending temperature-sensing branch; one end of the FPC branch is connected to the FFC body, and the other end of the FPC branch is connected to the busbar; one end of the temperature-sensing branch is connected to the FFC body, and the other end of the temperature-sensing branch is connected to the temperature-sensing bracket.

3. The CCS integrated acquisition structure according to claim 2, characterized in that: The vacuum forming bracket includes a manifold mounting slot, a slave plate mounting slot, and a temperature sensing mounting slot; the manifold mounting slot is located on both sides of the upper end of the vacuum forming bracket and is used to install manifolds; the slave plate mounting slot is located in the middle of the upper end of the vacuum forming bracket and is used to install slave plates; the temperature sensing mounting slot is located at both ends of the slave plate mounting slot and is used to install temperature sensing brackets.

4. The CCS integrated acquisition structure according to claim 3, characterized in that: The FFC body is bent multiple times into the mounting groove of the slave plate. The FFC body has a groove structure. The slave plate is fixed in the middle of the groove structure, and the slave plate is pressed down on both sides of the groove structure.

5. The CCS integrated acquisition structure according to claim 3, characterized in that: The slave plate bracket is located at the lower end of the slave plate mounting slot.

6. The CCS integrated acquisition structure according to claim 3, characterized in that: The manifold mounting groove is provided with at least two vertically upward manifold columns; the manifold is provided with positioning holes corresponding to the manifold columns, and the manifold is fixed in the manifold mounting groove by docking with the manifold columns through the positioning holes.

7. The CCS integrated acquisition structure according to claim 3, characterized in that: The temperature sensing bracket has aluminum bars at both ends, and the temperature sensing bracket is snapped into the temperature sensing mounting groove by the aluminum bars.

8. The CCS integrated acquisition structure according to claim 2, characterized in that: The temperature sensing bracket is provided with at least two vertically upward temperature sensing columns; the temperature sensing branch is provided with through holes corresponding to the temperature sensing columns, and the temperature sensing branch is fixed on the temperature sensing bracket by the connection between the through holes and the temperature sensing columns.

9. The CCS integrated acquisition structure according to claim 1, characterized in that: The thickness of the vacuum forming bracket is 0.3mm-0.6mm, and the thickness of the plate bracket is 1.2mm-2.0mm.

10. The CCS integrated acquisition structure according to claim 1, characterized in that: It also includes a CCS cover, which is located above the blister packer.

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