Memory slot and motherboard

Abstract

The utility model discloses a kind of memory slot and mainboard, it is related to electronic connector technical field, wherein, memory slot includes slot base body, conductive spring and elastic support, slot base body has the insertion slot for memory stick insertion;Conductive spring includes installation section and contact section, one end of the installation section is fixed to the one side of the slot base body away from the insertion slot, the other end extends in the direction of away from the slot base body, the contact section is connected to the other end of the installation section, the one side of the contact section away from the slot base body is used for abutting with the gold finger;Elastic support is located between the conductive spring and the slot base body, and the elastic support is gradually expanded along the direction of approaching the slot base body.The technical scheme provided by the utility model can improve the electrical connection stability of memory slot and gold finger.

Description

Technical Field

[0001] This utility model relates to the field of electronic connector technology, and in particular to a memory slot and a motherboard. Background Technology

[0002] As memory technology iterates towards higher frequencies and higher bandwidths (e.g., the mainstream transmission rate of DDR5 memory has reached 6400Mbps), the contact performance between the memory slot and the motherboard's gold fingers has become a key bottleneck affecting data transmission stability. However, the current design of the spring contact structure for the electrical connection between the memory slot and the gold fingers is often not reasonable enough, making it easy for the spring contact structure and the gold fingers to have poor contact, thus affecting data transmission stability. Utility Model Content

[0003] The main purpose of this invention is to provide a memory slot and motherboard that improves the electrical connection stability of the memory slot and gold fingers.

[0004] To achieve the above objectives, the present invention provides a memory slot comprising: The slot base has a socket for inserting memory modules; A conductive spring includes a mounting section and a contact section. One end of the mounting section is fixed to the side of the slot base opposite to the insertion groove, and the other end extends obliquely away from the slot base. The contact section is connected to the other end of the mounting section, and the side of the contact section opposite to the slot base is used to abut against the gold finger. An elastic support is disposed between the conductive spring and the slot base, and the elastic support gradually expands in the direction close to the slot base.

[0005] In one embodiment, the conductive spring further includes a support section, one end of which is connected to the end of the mounting section away from the slot base, and the other end extends toward the slot base. The elastic support is connected at the junction of the support section and the mounting section.

[0006] In one embodiment, both the mounting section and the support section are configured as arcuate sections protruding away from the slot base.

[0007] In one embodiment, the mounting section and the supporting section are arranged in a U-shape or semi-circle.

[0008] In one embodiment, the mounting section, the contact section, and the support section are integrally formed.

[0009] In one embodiment, the contact segment extends obliquely away from the slot base; or, The contact segment is parallel to the plane of the slot base on the side opposite to the insertion slot.

[0010] In one embodiment, the contact segment is provided with a nickel plating layer and a gold plating layer stacked on the side away from the slot substrate, and the gold plating layer is provided on the side of the nickel plating layer away from the contact segment.

[0011] In one embodiment, the thickness of the contact segment is greater than or equal to 0.15 mm and less than or equal to 0.2 mm; The thickness of the nickel plating layer is greater than or equal to 3 μm and less than or equal to 5 μm; The thickness of the gold plating layer is greater than or equal to 0.8 μm and less than or equal to 1 μm.

[0012] In one embodiment, the elastic support member is configured as an elastic support cylinder, the thickness of which is greater than or equal to 0.1 mm and less than or equal to 0.12 mm; and / or, The slot base is provided with a limiting groove on the side opposite to the insertion slot, and the end of the elastic support member away from the conductive spring is inserted into the limiting groove.

[0013] This utility model also proposes a motherboard, including the memory slots described above.

[0014] The technical solution of this utility model involves setting a socket for inserting memory modules in the slot base. The conductive spring includes an mounting section and a contact section. One end of the mounting section is fixed to the side of the slot base away from the socket, thereby electrically connecting the conductive spring to the conductive structure in the slot base. The other end extends obliquely away from the slot base. The contact section is connected to the other end of the mounting section, thereby further leading the conductive spring to the side of the slot base away from the socket. At the same time, the contact section is spaced apart from the slot base. During installation, the side of the contact section away from the slot base is used to abut against the gold fingers, thereby achieving a stable electrical connection between the conductive spring and the gold fingers. At this time, the contact section and the gold fingers directly have abutting pressure, causing the conductive spring to undergo elastic deformation. The mounting section is mainly used to provide elastic potential energy for the conductive spring. Furthermore, an elastic support is provided between the conductive contact spring and the slot base. This elastic support further provides elastic support to the conductive contact spring. That is, when the memory slot is installed on the motherboard, the conductive contact spring initially contacts the motherboard's gold fingers. As pressure increases, the conductive contact spring is compressed, generating initial contact pressure. Simultaneously, the elastic support is compressed, creating secondary pressure and ensuring a tight fit between the motherboard's gold fingers and the memory slot contact piece, improving data transmission stability. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 A schematic diagram of an angle structure of a memory slot according to an embodiment of the present invention; Figure 2 for Figure 1 Another angle diagram of the memory slot structure; Figure 3 for Figure 1 A magnified view of a portion of the memory slot at the conductive spring contact; Figure 4 for Figure 1 Another angled structural diagram of the memory slot.

[0017] Explanation of icon numbers: 1. Memory slot; 11. Slot base; 111. Insertion slot; 12. Conductive spring; 121. Mounting section; 122. Contact section; 123. Support section; 13. Elastic support component; 131. Large end; 132. Small end.

[0018] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0020] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0022] This utility model proposes a memory slot 1 for installation on a motherboard, and the motherboard is provided with gold fingers for signal connection with the memory slot 1. The memory slot 1 can be used to insert memory modules, thereby realizing the signal connection between the memory modules and the motherboard. The memory slot 1 in this solution can achieve a stable connection with the motherboard gold fingers, and is suitable for mainstream specifications such as DDR4 and DDR5 memory modules. It can be widely used in consumer desktop motherboards, laptops, industrial control equipment and high-performance servers and other scenarios.

[0023] Please see Figures 1 to 4 In one embodiment of this utility model, the memory slot 1 includes: The slot base 11 has a connector slot 111 for inserting memory modules; The conductive spring 12 includes a mounting section 121 and a contact section 122. One end of the mounting section 121 is fixed to the side of the slot base 11 opposite to the insertion groove 111, and the other end extends obliquely away from the slot base 11. The contact section 122 is connected to the other end of the mounting section 121, and the side of the contact section 122 opposite to the slot base 11 is used to abut against the gold finger. An elastic support 13 is disposed between the conductive spring 12 and the slot base 11, and the elastic support 13 gradually expands in the direction close to the slot base 11.

[0024] As memory technology iterates towards higher frequencies and higher bandwidths (e.g., DDR5 memory's mainstream transmission rate has reached 6400Mbps), the contact performance between the memory slot 1 and the motherboard's gold fingers has become a key bottleneck affecting data transmission stability. Currently, the conductive springs in mainstream memory slots are typically single-elastic structures, usually with a flat or simple curved design, relying on their own elastic deformation to contact the gold fingers and provide pressure. After prolonged use, these conductive springs are prone to elastic fatigue and deformation, leading to a decrease in contact pressure with the gold fingers. This results in poor contact between the memory slot and the motherboard's gold fingers, affecting data transmission stability. Furthermore, the buffering effect of these conductive springs is limited; under severe vibration, excessive deformation of the contact piece may momentarily break the connection between the conductive spring and the gold fingers, causing computer crashes, blue screens, and other malfunctions.

[0025] Therefore, the conductive spring 12 in this solution includes a mounting section 121 and a contact section 122 connected together. One end of the mounting section 121 is fixed to the side of the slot base 11 away from the insertion slot 111, thereby electrically connecting the conductive spring 12 to the conductive structure inside the slot base 11, and leading the conductive spring 12 out to the side of the slot base 11 away from the insertion slot 111 (that is, the side of the slot base 11 opposite to the motherboard). The other end of the mounting section 121 extends obliquely away from the slot base 11, and the contact section 122 is connected to the mounting section 121. At the other end of 1, the conductive spring 12 is further led out to the side of the slot base 11 away from the insertion slot 111, while the contact segment 122 is spaced apart from the slot base 11. During installation, the side of the contact segment 122 away from the slot base 11 is used to abut against the gold fingers, thereby achieving a stable electrical connection between the conductive spring 12 and the gold fingers. At this time, the contact segment 122 and the gold fingers have direct abutment pressure, causing the conductive spring 12 to undergo elastic deformation. At this time, the mounting segment 121 is mainly used to provide elastic potential energy for the conductive spring 12. Furthermore, an elastic support member 13 is provided between the conductive spring 12 and the slot base 11, so that the elastic support member 13 can further provide elastic support for the conductive spring 12. That is, when the memory slot 1 is installed on the motherboard, when the conductive spring 12 contacts the gold fingers of the motherboard, it first contacts the contact segment 122. As the pressure increases, the conductive spring 12 is compressed, generating initial contact pressure. At the same time, the elastic support 13 is compressed, generating secondary pressure to ensure that the motherboard's gold fingers and the memory slot 1 contact piece are tightly fitted, improving data transmission stability.

[0026] Furthermore, the elastic support 13 gradually expands along the direction close to the slot base 11. That is, the elastic support 13 has a large end 131 and a small end 132 arranged opposite to each other. The elastic support 13 gradually expands from the small end 132 to the large end 131. The small end 132 is used to abut against the conductive spring 12, and the large end 131 is used to abut against the slot base 11. Compared with the elastic support 13 being an elastic element with a constant diameter, this structure is less prone to bending when the conductive spring 12 is subjected to vibration, thereby ensuring the contact piece and... There will be no misalignment or displacement between the gold fingers. Therefore, when the conductive spring 12 is subjected to vibration (such as high-frequency vibration with an amplitude ≤0.5mm), if the contact section 122 is slightly displaced relative to the gold fingers and undergoes a slight lateral movement, the elastic support 13 can release the stored elastic potential energy to compensate for the displacement and push the contact section 122 to maintain contact with the gold fingers. If the contact section 122 is slightly moved towards the slot base 11 due to compression, the elastic support 13 further absorbs the impact force, reducing the possibility of permanent deformation of the conductive spring 12 due to pressure overload.

[0027] Compared to the single elastic structure in existing technologies, this solution adopts a multi-level buffer design of "conductive spring 12 + elastic support 13", which significantly improves the contact pressure between the memory slot 1 and the motherboard gold fingers. Even if there is slight oxidation or dust on the surface of the motherboard gold fingers or the surface of the contact section 122, the increase in contact resistance can be controlled within 5mΩ, thereby ensuring good electrical connection, greatly enhancing vibration resistance, and ensuring the continuity of data transmission.

[0028] It should be noted that the fact that the other end of the mounting segment 121 extends obliquely away from the slot base 11 does not mean that the mounting segment 121 is an entirely oblique straight segment; it can also be an arc-shaped segment. That is, this design only defines the approximate extension direction of the mounting segment 121, and does not define its overall shape. The elastic support 13 can be fixed to the conductive spring 12, and only abuts against the slot base 11 without a direct connection, thus ensuring the stable installation of the elastic support 13. Of course, in other embodiments, the elastic support 13 can be fixed to the slot base 11 and only abuts against the conductive spring 12; or the elastic support can be fixed to both the slot base 11 and the conductive spring 12.

[0029] Furthermore, to further improve the contact stability between the conductive spring 12 and the gold finger, in one embodiment, the contact segment 122 extends obliquely away from the slot base 11, thereby further increasing the deformability of the conductive spring 12 and enhancing its elastic potential energy. The contact segment 122 can be configured as a straight segment, that is, a straight segment extending obliquely away from the slot base 11; alternatively, it can be configured as an arc-shaped segment. In another embodiment, the contact segment 122 is parallel to the plane of the slot base 11 on the side opposite to the insertion groove 111.

[0030] The slot base 11 is made of liquid crystal polymer to improve its overall performance. The slot base 11 can be integrally injection molded from liquid crystal polymer. It can be securely mounted to the motherboard using screws or bolts, ensuring stable installation.

[0031] In one embodiment, a limiting groove is provided on the side of the slot base 11 opposite to the insertion groove 111. The end of the elastic support member 13 away from the conductive spring piece 12 is inserted into the limiting groove, thereby reducing the possibility of the elastic support member 13 shifting off the slot base 11 during vibration, thus improving the stability of the slot base 11. Furthermore, the limiting groove is treated with a polytetrafluoroethylene coating, thereby improving the wear resistance of the limiting groove and reducing the frictional resistance when the elastic support member 13 deforms relative to the slot base 11.

[0032] Furthermore, in order to improve the support stability of the elastic support member 13, in one embodiment, referring to... Figure 3 and Figure 4 The elastic support 13 is configured as an elastic support cylinder, that is, the elastic support 13 is a cylindrical structure formed by the curling and wrapping of an elastic sheet, thereby improving the support effect of the elastic support 13 on the conductive spring 12. The elastic support cylinder is made of spring steel, specifically, it is formed by stamping 65Mn spring steel, ensuring sufficient elastic potential energy. The surface of the elastic support 13 is subjected to HRC42-45 quenching treatment, which effectively improves the insertion and removal fatigue life of the memory slot 1, reduces the probability of contact pressure attenuation between the conductive spring 12 and the gold fingers after insertion and removal, and reduces the replacement frequency of the memory slot 1. The surface of the elastic support 13 is also galvanized, thereby improving its corrosion resistance and extending its service life. The thickness of the elastic support cylinder is greater than or equal to 0.1mm and less than or equal to 0.12mm, thus ensuring both the structural strength and elastic potential energy of the elastic support cylinder. Specifically, the thickness of the elastic support cylinder can be 0.1mm, 0.11mm, and 0.12mm, etc.

[0033] See Figures 1 to 4In an embodiment of this utility model, the conductive spring 12 further includes a support section 123. One end of the support section 123 is connected to the end of the mounting section 121 away from the slot base 11, and the other end extends toward the slot base 11. An elastic support member 13 is connected at the connection between the support section 123 and the mounting section 121. That is, a part of the conductive spring 12 is used to fix it to the slot base 11 and lead it out to the side of the slot base 11 away from the insertion groove 111. The other part branches into two spaced segments. One segment, namely the contact segment 122, is used to abut against the gold finger, and the other segment, namely the support segment 123, is used to extend toward the slot base 11. Thus, when the conductive spring 12 abuts against the gold finger, it is further supported between the contact segment 122 and the slot base 11, thereby further increasing the contact pressure between the conductive spring 12 and the gold finger and improving the stability of data transmission. This allows the support section 123 and the elastic support member 13 to jointly support the contact section 122, further absorbing the impact force and reducing the possibility of permanent deformation of the conductive spring piece 12 due to pressure overload. Furthermore, the elastic support member 13 connects to the connection between the support section 123 and the mounting section 121, which on the one hand facilitates the absorption of the impact force of the conductive spring piece 12, and on the other hand, this location is a structurally weak point of the conductive spring piece 12, effectively reducing the possibility of deformation.

[0034] Furthermore, both the mounting section 121 and the support section 123 are configured as arc-shaped sections protruding away from the slot base 11. Specifically, this arc shape, compared to a straight section, can further enhance the elastic potential energy of the conductive spring 12, improve the structural strength of the conductive spring 12, and thus reduce the possibility of deformation of the conductive spring 12. Preferably, the mounting section 121 and the support section 123 are both arranged in a U-shape or semi-circle.

[0035] In the embodiments of this utility model, the mounting section 121, the contact section 122 and the support section 123 are integrally formed, that is, the missile piece is integrally formed, thereby improving the overall structural strength of the conductive spring piece 12, thereby ensuring the stable connection between the conductive spring piece 12 and the gold finger, and also facilitating the assembly of the memory slot 1.

[0036] In one embodiment, the conductive spring 12 is made of beryllium bronze. Beryllium bronze combines high strength with excellent conductivity, thereby improving the strength, hardness, and fatigue limit of the conductive spring 12. This ensures that the conductive spring 12 maintains stable contact pressure under long-term insertion / removal, vibration, or high-stress environments, resisting stress relaxation and thus avoiding contact failure due to plastic deformation. Furthermore, its good conductivity effectively transmits current and controls heat generation. In addition, beryllium bronze has excellent corrosion and wear resistance, ensuring that the contact resistance remains low and stable even after long-term use, improving the reliability of the connection between the memory slot 1 and the gold fingers.

[0037] Furthermore, the contact segment 122 has a nickel plating layer and a gold plating layer stacked on the side opposite to the slot base 11, with the gold plating layer located on the side of the nickel plating layer away from the contact segment 122. Specifically, the surface of the contact segment 122 that contacts the gold finger is gold-plated and then nickel-plated, which ensures good conductivity and reduces friction and wear, thereby improving the service life of the contact segment 122. Additionally, the support segment 123 undergoes annealing to reduce its overall hardness (approximately 15-20%), thereby enhancing the overall toughness and elasticity of the support segment 123.

[0038] Furthermore, the thickness of the contact segment 122 is greater than or equal to 0.15 mm and less than or equal to 0.2 mm; the thickness of the nickel plating layer is greater than or equal to 3 μm and less than or equal to 5 μm; and the thickness of the gold plating layer is greater than or equal to 0.8 μm and less than or equal to 1 μm, thus balancing the overall structural strength and elastic potential energy of the contact segment 122. It should be noted that the thickness of the contact segment 122 specified here refers to the thickness of the contact segment 122 before nickel and gold plating. Specifically, the thickness of the contact segment 122 can be 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, etc.; the thickness of the nickel plating layer can be 3 μm, 4 μm, 5 μm, etc.; and the thickness of the gold plating layer can be 0.8 μm, 0.9 μm, 1 μm, etc.

[0039] This utility model also proposes a motherboard, which includes a memory slot 1. The specific structure of the memory slot 1 is as described in the above embodiments. Since this motherboard adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0040] The above are merely exemplary embodiments of this utility model and are not intended to limit the scope of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the protection scope of this utility model.

Claims

1. A memory slot for mounting on a motherboard, the motherboard having gold fingers, characterized in that, The memory slots include: The slot base has a socket for inserting memory modules; A conductive spring includes a mounting section and a contact section. One end of the mounting section is fixed to the side of the slot base opposite to the insertion groove, and the other end extends obliquely away from the slot base. The contact section is connected to the other end of the mounting section, and the side of the contact section opposite to the slot base is used to abut against the gold finger. An elastic support is disposed between the conductive spring and the slot base, and the elastic support gradually expands in the direction close to the slot base.

2. The memory slot as described in claim 1, characterized in that, The conductive spring also includes a support section, one end of which is connected to the end of the mounting section away from the slot base, and the other end extends toward the slot base. The elastic support is connected at the junction of the support section and the mounting section.

3. The memory slot as described in claim 2, characterized in that, Both the mounting section and the support section are configured as arc-shaped sections protruding away from the slot base.

4. The memory slot as described in claim 3, characterized in that, The mounting section and the supporting section are arranged in a U-shape or semi-circle.

5. The memory slot as described in claim 2, characterized in that, The mounting section, the contact section, and the support section are integrally formed.

6. The memory slot as described in claim 1, characterized in that, The contact segment extends at an angle away from the slot base; or... The contact segment is parallel to the plane of the slot base on the side opposite to the insertion slot.

7. The memory slot as described in claim 1, characterized in that, The contact segment is provided with a nickel plating layer and a gold plating layer stacked on the side away from the slot base, and the gold plating layer is provided on the side of the nickel plating layer away from the contact segment.

8. The memory slot as described in claim 7, characterized in that, The thickness of the contact segment is greater than or equal to 0.15 mm and less than or equal to 0.2 mm; The thickness of the nickel plating layer is greater than or equal to 3 μm and less than or equal to 5 μm; The thickness of the gold plating layer is greater than or equal to 0.8 μm and less than or equal to 1 μm.

9. The memory slot as described in claim 1, characterized in that, The elastic support is configured as an elastic support cylinder, the thickness of which is greater than or equal to 0.1 mm and less than or equal to 0.12 mm; and / or, The slot base is provided with a limiting groove on the side opposite to the insertion slot, and the end of the elastic support member away from the conductive spring is inserted into the limiting groove.

10. A motherboard, characterized in that, Includes a memory slot as described in any one of claims 1 to 9.

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