Split power unit structure

CN224874978UActive Publication Date: 2026-10-20SUZHOU WEICHUANG ELECTRICAL EQUIP TECH
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Patent Information

Application Number
CN202522081266.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-26
Publication Date
2026-10-20
Estimated Expiration
2035-09-26

AI Technical Summary

Technical Problem

由于大容量电解电容体积和重量巨大,导致整个功率单元箱体重量惊人,给运输、现场吊装及柜体内的搬移和定位带来了极大的困难和不便,对安装现场的起重设备提出了过高要求

Benefits of technology

[0024]本申请实施例提供的分体式功率单元结构,将功率单元设计为分体式结构,包含独立的整流逆变模块和电容模块,分别置于第一箱体和第二箱体中。电容模块通过连接铜排与整流逆变模块可拆卸电连接。整流逆变模块中,整流部件和逆变部件处于同一安装平面,第一叠层母排连接整流部件和逆变部件,第一薄膜电容组布置在两者之间并与第一叠层母排电连接。

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Abstract

The application relates to a split power unit structure, which comprises a rectifier-inverter module and a capacitor module arranged in two independent boxes. The capacitor module is detachably electrically connected with the rectifier-inverter module through a connecting copper bar. In the rectifier-inverter module, a rectification component and an inversion component are arranged in the same plane and connected through a first laminated busbar, and a first thin-film capacitor group connected with the busbar is arranged between the rectification component and the inversion component. The structure solves the problem of large volume and heaviness of a traditional integrated power unit, and significantly improves the convenience of transportation, installation and cabinet layout. Meanwhile, the split design supports independent testing and quick replacement of each module, greatly simplifies the manufacturing and testing process, and shortens the on-site maintenance time.
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Description

Technical Field

[0001] This application relates to the field of frequency converter technology, and in particular to a split power unit structure. Background Technology

[0002] With the continuous development of industrial technology, high-power frequency converters are increasingly widely used in rail transportation, power transmission, new energy power generation, and industrial drives. As the core component of the frequency converter, the power unit's performance, reliability, and power density directly determine the efficiency of the entire system.

[0003] Traditional power units typically employ a highly integrated, monolithic structure, compactly housing all power components such as capacitors, rectifiers, and inverters within a single enclosure. This structure reveals numerous drawbacks during actual manufacturing, testing, installation, and maintenance:

[0004] First, it is large and heavy. Due to the large size and weight of the large-capacity electrolytic capacitors, the entire power unit enclosure is incredibly heavy, which brings great difficulties and inconvenience to transportation, on-site hoisting, and moving and positioning within the cabinet, and places excessive demands on the lifting equipment at the installation site.

[0005] Secondly, independent module testing and maintenance are impossible. All components are coupled within a single enclosure, making it difficult to quickly locate the faulty module in case of a system malfunction. Replacing any component requires disassembling the entire massive power unit, a cumbersome process with significant downtime. Furthermore, during manufacturing, it's impossible to perform separate functional and performance tests on the rectifier / inverter or capacitor sections; only whole-machine testing is possible, resulting in a complex and high-risk testing process. Utility Model Content

[0006] The purpose of this application is to provide a split power unit structure to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this application provides the following technical solution:

[0008] A split power unit structure includes a rectifier-inverter module, a capacitor module, a first enclosure for housing the rectifier-inverter module, and a second enclosure for housing the capacitor module, wherein the first enclosure and the second enclosure are independent of each other.

[0009] The capacitor module and the rectifier-inverter module are connected to a detachable grounding connection via a copper busbar.

[0010] The rectifier-inverter module includes a rectifier component, an inverter component, a first stacked busbar, and a first thin-film capacitor bank;

[0011] The rectifier component and the inverter component are located on the same mounting plane;

[0012] The first end of the first stacked busbar is connected to the rectifier component, and the second end is connected to the inverter component;

[0013] The first thin-film capacitor bank is arranged between the rectifier and the inverter and is electrically connected to the first stacked busbar.

[0014] Furthermore, the capacitor module includes a second stacked busbar and a second thin-film capacitor group, one end of the second thin-film capacitor group being electrically connected to the second stacked busbar, and the other end being supported on the inner side wall of the second housing.

[0015] Furthermore, a limiting plate is provided between the second stacked busbar and the inner sidewall of the second housing, and the limiting plate has a plurality of first through holes, and each thin film capacitor in the second thin film capacitor group is respectively inserted into the corresponding first through hole.

[0016] Furthermore, the connecting copper busbar is located on the capacitor module, with one end connected to the second stacked busbar and the other end extending to the outside of the second housing for electrical connection with the corresponding connection terminal on the rectifier-inverter module.

[0017] Furthermore, the second thin-film capacitor assembly is fixed to the second housing by the first fixing plate.

[0018] Furthermore, the second housing has multiple first ventilation holes arranged along its height direction on its housing wall.

[0019] Furthermore, a second fixing plate is provided inside the first housing, and the second fixing plate is installed inside the first housing by a plurality of fasteners, and the rectifier-inverter module is disposed on the second fixing plate.

[0020] Furthermore, the second fixing plate is provided with a plurality of second through holes, and each thin film capacitor in the first thin film capacitor group is respectively inserted into the corresponding second through hole.

[0021] Furthermore, a heat sink is provided on the side of the second fixing plate facing away from the rectifier inverter module, and the air duct of the heat sink is connected to the second ventilation hole opened on the first housing.

[0022] Furthermore, both the first and second boxes are equipped with handling handles.

[0023] The technical solutions provided in this application have the following advantages compared with the prior art:

[0024] The split power unit structure provided in this application embodiment designs the power unit as a split structure, including independent rectifier-inverter modules and capacitor modules, which are respectively placed in a first housing and a second housing. The capacitor module is detachably electrically connected to the rectifier-inverter module via connecting copper busbars. In the rectifier-inverter module, the rectifier component and the inverter component are on the same mounting plane, a first stacked busbar connects the rectifier component and the inverter component, and a first thin-film capacitor bank is arranged between the two and electrically connected to the first stacked busbar.

[0025] This application has the following beneficial effects:

[0026] 1. It solves the problem of the traditional integrated structure being bulky and heavy, making it easier to transport, hoist, move and position, and reducing the requirements for lifting equipment at the installation site.

[0027] 2. Independent module testing and maintenance are possible. When a system malfunctions, the faulty module can be quickly located. Replacement of components does not require disassembling the entire power unit, simplifying operation and reducing downtime. During the manufacturing process, each module can be individually tested for functionality and performance, simplifying the testing process and reducing risk. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0031] Figure 1 This is a schematic diagram of a split power unit structure provided in an embodiment of this application.

[0032] Figure 2 This is a schematic diagram of the structure of the rectifier-inverter module provided in an embodiment of this application.

[0033] Figure 3 This is a schematic diagram of the capacitor module provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. First housing; 101. Second fixing plate; 102. Second ventilation hole; 200. Second housing; 201. First ventilation hole; 301. Handle;

[0036] 11. Rectifier component; 12. Inverter component; 13. First stacked busbar; 14. First thin-film capacitor bank; 15. Heat sink;

[0037] 21. Connecting copper busbar; 22. Second stacked busbar; 23. Second thin-film capacitor bank; 24. Limiting plate; 25. First fixing plate. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0040] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0041] Figures 1 to 3A split power unit structure provided in this application embodiment includes a rectifier-inverter module, a capacitor module, a first enclosure 100 for housing the rectifier-inverter module, and a second enclosure 200 for housing the capacitor module. The first enclosure 100 and the second enclosure 200 are independent of each other.

[0042] The capacitor module and the rectifier-inverter module are connected to a detachable grounding connection via a copper busbar 21.

[0043] The rectifier-inverter module includes a rectifier component 11, an inverter component 12, a first stacked busbar 13, and a first thin-film capacitor bank 14.

[0044] The rectifier component 11 and the inverter component 12 are located on the same mounting plane.

[0045] The first end of the first stacked busbar 13 is connected to the rectifier component 11, and its second end is connected to the inverter component 12.

[0046] The first thin-film capacitor bank 14 is arranged between the rectifier component 11 and the inverter component 12, and is electrically connected to the first stacked busbar 13.

[0047] In the above technical solution, the split power unit structure divides the power unit into two main functional parts: a rectifier-inverter module and a capacitor module, which are placed in separate first enclosure 100 and second enclosure 200, respectively. This split design breaks through the limitations of the traditional integrated structure, making each module relatively independent in space, providing a basis for subsequent independent operation and maintenance.

[0048] The capacitor module is detachably connected to the rectifier-inverter module via connecting copper busbar 21. During power transmission, the capacitor module functions as an energy storage and filter, while connecting copper busbar 21 serves as the transmission channel for electrical signals and energy, connecting the capacitor module and the rectifier-inverter module into a complete electrical circuit. When connection is required, a suitable connection method (such as bolt connection) is used to connect connecting copper busbar 21 to the corresponding interface of the rectifier-inverter module; when disassembly and maintenance are required, simply disconnect connecting copper busbar 21 from the rectifier-inverter module.

[0049] Understandably, due to the use of a split structure, the capacitor module and the rectifier-inverter module are placed in separate boxes. Compared with the traditional integrated structure, the overall volume and weight are distributed, making the volume and weight of each box relatively small, which facilitates handling and loading / unloading during transportation and reduces the requirements for transportation vehicles.

[0050] At the installation site, the modular structure offers greater flexibility. The first housing 100 and the second housing 200 can be installed separately according to the actual installation space and sequence, reducing installation difficulties caused by the large overall structure, improving installation efficiency, and lowering the requirements for lifting equipment at the installation site.

[0051] Meanwhile, when a power unit malfunctions, the split structure allows for rapid identification of the faulty module. Because the rectifier / inverter module and capacitor module are independent, the faulty module can be quickly identified by checking the operating status and parameters of each module, eliminating the need for a comprehensive inspection of the entire bulky integrated structure and significantly reducing fault diagnosis time.

[0052] Specifically, when replacing faulty components, only the problematic module needs to be operated on; the entire power unit does not need to be disassembled. For example, if the rectifier-inverter module malfunctions, only the module inside the first enclosure 100 needs to be operated accordingly; if the capacitor module malfunctions, only the connection between the connecting copper busbar 21 and the rectifier-inverter module needs to be disconnected, and the second enclosure 200 can be removed for repair or replacement. This independent maintenance method reduces downtime and improves equipment availability.

[0053] It should also be noted that the rectifier-inverter module and the capacitor module are arranged separately, avoiding the impact of capacitor heat generation on the heat dissipation of power semiconductor devices (such as IGBTs) in the rectifier-inverter module. In traditional integrated structures, the large amount of heat from the capacitors is concentrated in the enclosed space, resulting in excessively high system heat density and making heat dissipation design difficult. The separate structure allows each module to be designed for independent heat dissipation, employing appropriate heat dissipation methods based on the heat generation characteristics of each module, such as setting up a dedicated heat sink for the rectifier-inverter module. This effectively reduces the difficulty of heat dissipation design and improves the long-term operational reliability of the system.

[0054] Further, please refer to Figure 3 In this application, the capacitor module includes a second stacked busbar 22 and a second thin film capacitor group 23. One end of the second thin film capacitor group 23 is electrically connected to the second stacked busbar 22, and the other end is supported on the inner side wall of the second housing 200.

[0055] In the capacitor module, the second thin-film capacitor bank 23 is electrically connected to the second laminated busbar 22. As a highly efficient electrical connection component, the second laminated busbar 22 has the characteristics of low inductance and low impedance, which can provide a stable and low-loss electrical connection path for the second thin-film capacitor bank 23, allowing current to flow smoothly between the capacitor bank and the busbar.

[0056] The second thin-film capacitor bank 23 plays an important role in energy storage and filtering within the capacitor module. When an external power source charges the capacitor module, the second thin-film capacitor bank 23 stores electrical energy; when it needs to release energy, it can output the energy to other related circuits through the second stacked busbar 22. Simultaneously, it can filter the input voltage, smoothing voltage fluctuations and providing a relatively stable DC voltage for the subsequently connected rectifier and inverter modules.

[0057] In some embodiments of this application, a limiting plate 24 is provided between the second stacked busbar 22 and the inner sidewall of the second housing 200. The limiting plate 24 has a plurality of first through holes (not shown in the figure), and each thin film capacitor in the second thin film capacitor group 23 is respectively inserted into the corresponding first through hole.

[0058] Understandably, during use, the limiting plate 24 effectively restricts the position of the second film capacitor group 23, and fixes each film capacitor in the second film capacitor group 23 through the first through hole on it, making the internal structure of the capacitor module more compact and orderly. The capacitors will not interfere with each other due to vibration or collision, which improves the mechanical strength and stability of the entire capacitor module and enables it to better adapt to different working environments and transportation conditions.

[0059] It should be noted that the connecting copper busbar 21 of this application can be located in the rectifier-inverter module or in the capacitor module. In a preferred embodiment, the connecting copper busbar 21 is located in the capacitor module, with one end connected to the second stacked busbar 22 and the other end extending to the outside of the second housing 200 for electrical connection with the corresponding connection terminal on the rectifier-inverter module.

[0060] The connecting copper busbar 21, a key component for electrical transmission, is connected at one end to the second stacked busbar 22 in the capacitor module. It collects and transmits the stable DC power processed by the second thin-film capacitor bank 23 to the connecting copper busbar 21. The other end extends to the outside of the second housing 200, connecting to the corresponding terminal on the rectifier-inverter module. When the power unit operates, the DC power stored and filtered by the capacitor module is transmitted to the rectifier-inverter module via the connecting copper busbar 21. Upon receiving the stable DC power, the rectifier-inverter module converts it into AC power of the required frequency and voltage according to control commands, thus realizing the power unit's energy conversion function.

[0061] Since the connecting copper busbar 21 extends to the outside of the second enclosure 200, additional safety measures can be considered in the design, such as insulating sleeves and protective covers. These measures can prevent accidental electric shock caused by personnel touching the copper busbar, and also protect the copper busbar from external environmental corrosion and damage, further improving the safety of the power unit.

[0062] In some embodiments of this application, the second thin-film capacitor group 23 is fixed inside the second housing 200 by the first fixing plate 25.

[0063] The first fixing plate 25 is made of SMC material, which has high mechanical strength and rigidity, and can fix heavy components such as capacitors and busbars to prevent displacement or deformation during transportation, vibration or operation.

[0064] At the same time, SMC material is also an electrical insulating material that can securely fix conductors with different potentials (such as the positive and negative terminals of a capacitor, busbars) on the same board without the need for additional insulating pads or complex insulation designs, simplifying the assembly process.

[0065] In other embodiments, fixing plates made of other materials can also be used, as long as they have insulating properties and sufficient mechanical strength.

[0066] Please continue reading. Figure 1 The second box 200 has multiple first ventilation holes 201 arranged along its height direction on its box wall.

[0067] When the power unit is running, the second thin-film capacitor group 23 inside it generates heat, which raises the air temperature inside the second enclosure 200. Based on the natural convection principle that hot air rises and cold air sinks, the design of the first ventilation holes 201 arranged along the height of the enclosure wall provides a channel for airflow.

[0068] Relatively cool outside air enters the interior of the second housing 200 through the first ventilation hole 201 at the bottom or lower position, while hot air that expands and rises due to heat inside is discharged through the first ventilation hole 201 at the top or higher position, thus forming a continuous air circulation.

[0069] By creating good air circulation, the first ventilation hole 201 can dissipate the heat generated by the electronic components inside the second housing 200 in a timely manner, effectively reducing the operating temperature of the components.

[0070] In addition, a second fixing plate 101 is provided inside the first housing 100. The second fixing plate 101 is installed inside the first housing 100 by multiple fasteners, and the rectifier-inverter module is disposed on the second fixing plate 101.

[0071] With the secure connection of the second fixing plate 101 and fasteners, the rectifier inverter module is stably fixed inside the first housing 100, effectively preventing the module from shifting or loosening due to vibration, impact and other factors during transportation, installation and operation. This ensures the relative positional accuracy between the module and surrounding electrical components, guarantees the stability and reliability of the electrical connection, and reduces electrical faults such as poor contact and increased resistance caused by loose connections.

[0072] Meanwhile, the second fixing plate 101 has multiple second through holes (not shown in the figure), and each film capacitor in the first film capacitor group 14 is respectively inserted into the corresponding second through hole.

[0073] During operation, the power unit is inevitably subjected to various vibrations and shocks. The film capacitor is inserted through the second through-hole of the second fixing plate 101, forming an integral structure with the fixing plate and enhancing the capacitor's vibration resistance. Even in harsh working environments, the capacitor maintains a stable position and will not loosen or be damaged by vibration, improving the reliability and service life of the power unit.

[0074] Please see Figure 2 In some embodiments of this application, a heat sink 15 is provided on the side of the second fixing plate 101 facing away from the rectifier inverter module, and the air duct of the heat sink 15 is connected to the second ventilation hole 102 opened on the first housing 100.

[0075] During operation, the rectifier-inverter module generates a large amount of heat, which is first transferred to the second fixed plate 101, which is in close contact with it, through thermal conduction. Since the second fixed plate 101 is directly connected to the rectifier-inverter module and is usually made of a material with certain thermal conductivity (such as metal), it can quickly absorb and conduct the heat generated by the module.

[0076] The heat sink 15 is mounted on the side of the second mounting plate 101 facing away from the rectifier-inverter module. The heat absorbed by the second mounting plate 101 is further transferred to the heat sink 15 through heat conduction. The heat sink 15 is generally composed of multiple heat dissipation fins, which have a large surface area and can more effectively absorb and store heat.

[0077] When outside air enters the casing through the second ventilation hole 102 on the first casing 100, it flows along the direction of the airflow duct of the radiator 15. The design of the airflow duct guides the air to flow in an orderly manner inside the radiator 15, allowing the air to fully contact the heat dissipation fins.

[0078] As air flows over the heat dissipation fins, it exchanges heat with the fin surface. The air absorbs heat from the fins, its temperature rises, and its density decreases, creating an upward airflow that further promotes air movement. Simultaneously, cooler outside air continuously enters through the second vent 102, forming a continuous air convection that carries away heat from the radiator 15, achieving the purpose of heat dissipation.

[0079] Similarly, the second ventilation hole 102 is also arranged along the height direction of the first housing 100.

[0080] Furthermore, both the first box 100 and the second box 200 are equipped with handling handles 301.

[0081] When the split power unit needs to be moved, the force applied by the operator to the handling handle 301 is transmitted through the handle to the first housing 100 and the second housing 200. The handling handle 301 is usually made of a sturdy material, such as metal or high-strength plastic, which can withstand a certain amount of tension and pressure, ensuring that it will not break or deform during the handling process, thereby reliably transmitting the force to the housing and realizing the overall movement of the power unit.

[0082] Additionally, it should be noted that in some embodiments of this application, the first housing 100 and the second housing 200 are both made of sheet metal. Of course, housings made of other materials can also be used, and this is not limited here.

[0083] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0084] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0085] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0086] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0087] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0088] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0089] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0090] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A split-type power unit structure, characterized in that, It includes a rectifier-inverter module, a capacitor module, a first housing for housing the rectifier-inverter module, and a second housing for housing the capacitor module, wherein the first housing and the second housing are independent of each other; The capacitor module and the rectifier-inverter module are detachably grounded via a connecting copper busbar. The rectifier-inverter module includes a rectifier component, an inverter component, a first stacked busbar, and a first thin-film capacitor bank; The rectifier component and the inverter component are located on the same mounting plane; The first end of the first stacked busbar is connected to the rectifier component, and the second end is connected to the inverter component; The first thin-film capacitor bank is arranged between the rectifier and the inverter and is electrically connected to the first stacked busbar.

2. The split power unit structure according to claim 1, characterized in that, The capacitor module includes a second stacked busbar and a second thin-film capacitor group. One end of the second thin-film capacitor group is electrically connected to the second stacked busbar, and the other end is supported on the inner side wall of the second housing.

3. The split power unit structure according to claim 2, characterized in that, A limiting plate is provided between the second stacked busbar and the inner sidewall of the second housing. The limiting plate has multiple first through holes, and each thin film capacitor in the second thin film capacitor group is respectively inserted into the corresponding first through hole.

4. The split power unit structure according to claim 2, characterized in that, The connecting copper busbar is located on the capacitor module, with one end connected to the second stacked busbar and the other end extending to the outside of the second housing, for electrical connection with the corresponding connection terminal on the rectifier inverter module.

5. The split power unit structure according to claim 2, characterized in that, The second thin-film capacitor group is fixed to the second housing by the first fixing plate.

6. The split power unit structure according to claim 1, characterized in that, The second box has multiple first ventilation holes arranged along its height direction on its box wall.

7. The split power unit structure according to claim 1, characterized in that, The first housing is provided with a second fixing plate, which is installed in the first housing by a plurality of fasteners, and the rectifier-inverter module is disposed on the second fixing plate.

8. The split power unit structure according to claim 7, characterized in that, The second fixing plate has multiple second through holes, and each thin film capacitor in the first thin film capacitor group is respectively inserted into the corresponding second through hole.

9. The split power unit structure according to claim 7, characterized in that, The second fixing plate has a heat sink on the side facing away from the rectifier inverter module, and the air duct of the heat sink is connected to the second ventilation hole opened on the first housing.

10. The split power unit structure according to claim 1, characterized in that, Both the first and second boxes are equipped with handling handles.