frequency converter

Abstract

The utility model discloses a frequency converter, the frequency converter includes the case main body of being equipped with the heat dissipation air duct, is integrated with the condenser module on the drive board, and the radiator of installing rectifier module is included to the heat dissipation component, and the radiator is fixedly connected with the drive board, and the heat dissipation component and condenser module all are located in the heat dissipation air duct, and condenser module is arranged at the downstream of radiator. Cooling airflow first enters the radiator area under the action of fan, takes away the high heat of rectifier module, and then flows through condenser module and carries out secondary cooling. The scheme improves the heat dissipation efficiency of key power device, avoids local overheating, simultaneously utilizes airflow sequential cooling different elements, improves the utilization efficiency of cooling air, enhances system reliability and energy efficiency performance.

Description

Technical Field

[0001] This utility model relates to the field of power electronic equipment, specifically to a frequency converter. Background Technology

[0002] In existing technologies, frequency converters typically employ forced air cooling for heat dissipation. This involves drawing external air into the chassis via an internal fan, allowing it to flow through the power components to carry away the heat generated during operation, and then expelling the hot air. However, this cooling method has significant drawbacks in practical applications. Because the air intake path directly connects to the electrical component area inside the chassis, dust, metal particles, oil mist, and moisture carried by the external air are carried into the equipment and gradually accumulate on the surfaces of critical functional components such as circuit boards, driver chips, relays, and terminal blocks. This dust accumulation is particularly severe in highly polluted environments such as industrial sites, mines, textile mills, and metallurgical plants, where air pollutant concentrations are high. Accumulated dust not only reduces the heat dissipation efficiency of components, leading to increased localized temperature rise, but also causes leakage, creepage, and even short circuits due to its hygroscopic properties. Furthermore, it accelerates the oxidation and corrosion of metal pins, severely impacting electrical insulation performance and signal transmission stability. Under long-term operation, the combined effect of these factors can easily cause control board failure, capacitor drying and bursting, and drive malfunctions, significantly shortening the overall lifespan of the frequency converter. Utility Model Content

[0003] The present invention provides a frequency converter that aims to solve the technical problem of reduced service life of existing frequency converters due to dust accumulation on internal functional components caused by heat dissipation.

[0004] In a first aspect, this utility model provides a frequency converter, comprising: a chassis body, wherein a heat dissipation duct is provided inside the chassis body; a drive board, wherein a capacitor module is provided on the drive board; a heat dissipation assembly, wherein the heat dissipation assembly includes a heat sink, wherein a rectifier module is installed on the heat sink, and the heat sink is fixedly connected to the drive board; the heat dissipation assembly and the capacitor module are disposed within the heat dissipation duct, and the capacitor module is located downstream of the heat dissipation assembly.

[0005] In the frequency converter provided by this utility model, the heat dissipation component further includes a duct partition, which is connected to the radiator and the chassis body. The radiator, the duct partition, and the chassis body are connected to form the heat dissipation duct.

[0006] In the frequency converter provided by this utility model, the circuit also includes a base plate, the rectifier module is disposed on the base plate, and the base plate is connected to the drive board.

[0007] In the frequency converter provided by this utility model, the main body of the chassis includes a main housing and a side plate. The side plate covers the main housing, and the drive plate is installed on the inner side of the main housing facing the side plate.

[0008] In the frequency converter provided by this utility model, the main housing is provided with an air inlet and an air outlet, the air inlet and the air outlet are respectively connected to the two ends of the heat dissipation duct, the heat dissipation assembly also includes a fan, the fan is arranged near the air inlet, the duct partition is arranged near the air outlet, and the heat dissipation plate is arranged between the fan and the duct partition.

[0009] In the frequency converter provided by this utility model, the capacitor module is located close to the air outlet.

[0010] The frequency converter provided by this utility model also includes a control board assembly, which is mounted on the side plate and electrically connected to the drive board.

[0011] The frequency converter provided by this utility model also includes an output connection component, one part of which is disposed inside the main body of the chassis and electrically connected to the drive board, and the other part extends to the outside of the main body of the chassis to form a parallel connection part, wherein the parallel connection part is used to directly electrically connect to an adjacent frequency converter.

[0012] In the frequency converter provided by this utility model, the output connection assembly includes two conductive copper busbars disposed above the main housing. The two conductive copper busbars are electrically connected to the drive board respectively, and the two conductive copper busbars extend to the outside of the main body of the chassis to form a parallel connection part.

[0013] The frequency converter provided by this utility model also includes a debugging port, which is located on the top of the main housing and is electrically connected to the control board assembly.

[0014] Compared with the prior art, the beneficial effects of this utility model are: In this invention, the frequency converter includes a chassis body with a heat dissipation duct, a capacitor module integrated on the drive board, and a heat dissipation assembly including a heat sink for mounting the rectifier module. The heat sink is fixedly connected to the drive board. Both the heat dissipation assembly and the capacitor module are located within the heat dissipation duct, with the capacitor module positioned downstream of the heat sink. Cooling airflow, driven by a fan, first enters the heat sink area, carrying away the high heat generated by the rectifier module, and then flows through the capacitor module for secondary cooling. This solution improves the heat dissipation efficiency of key power devices, avoids localized overheating, and utilizes sequential airflow to cool different components, improving the utilization efficiency of cooling air and enhancing system reliability and energy efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is an exploded view of the frequency converter according to an embodiment of the present invention; Figure 2 This is a first disassembled view of the frequency converter according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the side plate of the frequency converter according to an embodiment of the present utility model; Figure 4 This is a complete assembly diagram of the frequency converter according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the drive board of the frequency converter and the components mounted on it according to an embodiment of the present utility model; Figure 6 This is a schematic diagram of the control board and side plate of the frequency converter according to an embodiment of the present invention. Figure label explanation: 10. Chassis body; 11. Main shell; 111. Air inlet; 112. Air outlet; 12. Side panel; 13. Top panel; 14. Heat dissipation duct; 15. Functional component mounting cavity; 21. Main functional area; 22. Capacitor module; 23. Driver board; 24. Base plate; 25. Rectifier module; 26. Main power terminal; 27. Lightning protection board; 271. Braking terminal; 30. Output connection assembly; 31. Conductive copper busbar; 32. Parallel connection part; 41. Fan; 42. Heat sink; 43. Air duct baffle; 50. Control panel assembly; 61. Debugging port; 62. Flip cover; 63. Tilting part; 64. Top cover assembly. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0019] This utility model addresses the technical problem that existing frequency converters cannot meet the application requirements of multi-drive products, and proposes a frequency converter, referring to... Figures 1 to 6 The inverter includes: a chassis body 10, with a heat dissipation duct 14 inside the chassis body 10; a drive board 23, with a capacitor module 22 on the drive board 23; a heat dissipation assembly, which includes a heat sink, with a rectifier module 25 mounted on the heat sink, and the heat sink is fixedly connected to the drive board 23; the heat dissipation assembly and the capacitor module 22 are disposed inside the heat dissipation duct 14, and the capacitor module 22 is located downstream of the heat dissipation assembly.

[0020] The inverter includes a chassis body 10. Inside the chassis body 10, a directional cooling air duct 14 is formed by structural partitions to guide cooling airflow from the air inlet 111 to the air outlet 112, achieving forced air cooling of high-heat components. A drive board 23, a multi-layer printed circuit board, is located inside the chassis body 10 and is fixedly mounted on the inner wall of the main housing 11. This drive board 23 serves as the core platform for the power circuit and integrates a capacitor module 22. The capacitor module 22 consists of multiple electrolytic capacitors or film capacitors, forming a DC bus filter circuit to smooth voltage fluctuations and provide instantaneous energy support. A heat dissipation assembly is located inside the chassis body 10 and includes a heat sink. This heat sink is a metal heat dissipation substrate 24 or a finned aluminum profile structure with good thermal conductivity. A rectifier module 25 is mounted on the rectifier module, which serves as the core power device for AC-to-DC conversion. It is fixed to the heat sink surface by screws or thermal adhesive to achieve efficient heat conduction. The heat sink is mechanically fixed to the drive plate 23 via studs, clips, or metal brackets, forming a stable structural linkage. This not only enhances the assembly rigidity of the internal components but also facilitates modular pre-assembly and overall assembly. Both the heat sink and capacitor module 22 are located within the heat dissipation duct 14. Driven by the fan 41, the cooling airflow flows sequentially over the heat sink surface and the capacitor module 22 area. The heat sink, located upstream of the heat dissipation duct 14, is directly impacted by the low-temperature airflow, quickly removing the concentrated heat generated by the rectifier module 25 during operation. The capacitor module 22 is located downstream of the heat sink, in the subsequent area of ​​the airflow path. Although in a slightly warmer airflow environment, its relatively small heat generation and the remaining cooling capacity of the airflow are sufficient to meet its heat dissipation needs. This co-current layout fully utilizes the temperature gradient of the airflow, achieving differentiated cooling for components with different thermal characteristics. Priority is given to cooling the high-heat-density rectifier module 25, while preventing the capacitor module 22 from being directly impacted by the high-speed airflow, thus avoiding vibration or dust accumulation and extending the lifespan of the electrolytic capacitors. Furthermore, the arrangement of the capacitor module 22 on the drive board 23 avoids physical interference with the heat sink. Electrical safety clearance is ensured through reasonable spatial planning, and local airflow distribution can be optimized by locally raising the module or adding a guide shroud, improving heat exchange uniformity. The entire cooling duct 14 is isolated from the functional component housing 15 by the duct partition 43, preventing dust-laden airflow from entering the control circuit area and ensuring system reliability. The inverter includes a chassis body 10, inside which a directional cooling duct 14 is formed by structural partitions. This duct guides cooling airflow from the air inlet 111 to the air outlet 112, achieving forced air cooling of high-heat-generating components.A drive board 23, a multi-layer printed circuit board, is installed inside the main chassis 10. This drive board 23 is fixedly mounted on the inner wall of the main housing 11, serving as the core platform for the power circuit. A capacitor module 22 is integrated on it, consisting of multiple electrolytic or film capacitors, forming a DC bus filter circuit to smooth voltage fluctuations and provide instantaneous energy support. A heat dissipation assembly, located inside the main chassis 10, includes a heat sink. This heat sink is a metal heat dissipation substrate 24 or a finned aluminum profile structure with good thermal conductivity. A rectifier module 25 is mounted on it, serving as the core power device for AC-to-DC conversion. It is fixed to the heat sink surface by screws or thermal adhesive, achieving efficient heat conduction. The heat sink is mechanically connected to the drive board 23 via studs, clips, or metal brackets, forming a stable structural linkage. This not only enhances the assembly rigidity of the internal components but also facilitates modular pre-assembly and overall assembly. Both the heat dissipation components and the capacitor module 22 are located within the heat dissipation duct 14. Driven by the fan 41, the cooling airflow flows sequentially over the heat sink surface and the capacitor module 22 area. The heat sink, located upstream of the heat dissipation duct 14, is directly impacted by the low-temperature airflow, quickly removing the concentrated heat generated by the rectifier module 25 during operation. The capacitor module 22 is located downstream of the heat sink, in the subsequent region of the airflow path. Although in a slightly warmer airflow environment, its relatively small heat generation and the remaining cooling capacity of the airflow are sufficient to meet its heat dissipation needs. This co-current flow layout fully utilizes the temperature gradient of the airflow, achieving differentiated cooling for components with different thermal characteristics. Priority is given to cooling the high-heat-density rectifier module 25, while preventing the capacitor module 22 from being directly impacted by the high-speed airflow, thus avoiding vibration or dust accumulation and extending the lifespan of the electrolytic capacitors. Furthermore, the arrangement of the capacitor module 22 on the drive board 23 avoids physical interference with the heat sink. Reasonable spatial planning ensures electrical safety distances, and local airflow distribution can be optimized by locally raising the module or adding a flow guide, improving heat transfer uniformity. The entire heat dissipation duct 14 is isolated from the functional component mounting cavity 15 by the duct partition 43 to prevent dust-laden airflow from entering the control circuit area and ensure the reliability of system operation.

[0021] In one embodiment, reference is made to Figures 1 to 6 The heat dissipation assembly also includes an air duct baffle 43, which is connected to the heat sink and the chassis body 10. The heat sink, the air duct baffle 43 and the chassis body 10 are connected to form a heat dissipation air duct 14.

[0022] The heat dissipation assembly also includes an air duct baffle 43, which serves as the boundary structure of the heat dissipation air duct 14. This baffle is located inside the chassis body 10, with one end connected to the side edge or end of the heat sink and the other end fixedly connected to the inner wall structure of the chassis body 10, such as the back, bottom, or side wall of the main housing 11 at a predetermined installation position. Reliable connection is achieved through screw fastening, snap-fit ​​engagement, or welding. The air duct baffle 43 is made of insulating and heat-resistant materials, such as flame-retardant engineering plastics or metal plates coated with an insulating layer, possessing certain mechanical strength and high-temperature resistance, and maintaining structural stability during long-term operation. Its main function is to work with the heat sink and chassis body 10 to form a closed or semi-closed heat dissipation air duct 14, confining the cooling airflow within a specific path under the drive of the fan 41, preventing airflow from diffusing into the control circuit area or other sensitive electronic components on the drive board 23. Specifically, the radiator serves as one side of the heat-conducting wall of the air duct, and the air duct baffle 43 connects to it along the extension direction of the heat dissipation air duct 14. The two are tightly fitted together by sealing gaskets, thermally conductive adhesive, or an integrated molding structure to prevent airflow leakage from the joints. The air inlet grille and air outlet grille of the chassis body 10 are located at both ends of the heat dissipation air duct 14, respectively. After entering from the inlet side, external air first flows over the surface of the radiator, carrying away the heat conducted to the radiator by the rectifier module 25, and then continues to flow forward to cool the capacitor module 22 located downstream, and finally is discharged from the outlet side. The air duct baffle 43 effectively isolates the heat dissipation airflow from other functional areas inside the chassis, especially preventing dust and moisture from entering the dense control circuit area with the airflow, thus improving the system's anti-contamination capability and long-term operational reliability. In terms of structural layout, the air duct baffle 43 can be designed as an L-shaped, U-shaped, or multi-segment splicing structure to adapt to different internal space layout requirements, and reinforcing ribs can be set on its surface to improve its resistance to deformation. In addition, flow guides or flow straightening ribs can be integrated on the air duct baffle 43 to optimize airflow pattern, reduce eddies and dead zones, and improve heat exchange efficiency.

[0023] In one embodiment, reference is made to Figures 1 to 6 The inverter also includes a base plate 24, a rectifier module 25 is disposed on the base plate 24, and the base plate 24 is connected to the drive board 23.

[0024] The power board assembly also includes a substrate 24 and a driver board 23, which serves as the core support carrier for the power circuit. The driver board 23 is located inside the main chassis 10 and fixedly mounted on the inner wall of the left side of the main housing 11, preferably parallel to the side plate 12, to fully utilize the lateral space and improve structural stability. The driver board 23 is a multilayer printed circuit board, integrating a main functional area 21 and a capacitor module 22. The functional area houses a driver chip, optocoupler isolation circuit, protection detection unit, and signal processing module, used to achieve precise control of the rectification and inversion processes. The capacitor module 22 is located in a local area of ​​the driver board 23, typically near the DC bus input. Multiple cylindrical electrolytic capacitors or multilayer bus capacitors are soldered onto it, forming a DC support filter circuit to smooth bus voltage fluctuations and provide instantaneous energy response. The substrate 24 is located in the functional component mounting cavity 15, perpendicularly inserted into the driver board 23, and its surface has a copper-clad layer and an insulating dielectric layer for electrical wiring. The rectifier module 25 is modularly mounted on the substrate 24 and fixed to the heat sink 42 by screws or clips. It is electrically connected to the driver board 23 via conductive copper busbars 31 or PCB traces. The substrate 24 and driver board 23 are soldered together using gold-fingered contacts, and electrical signals and power can be transmitted via ribbon cables, terminals, or connectors. This connection structure not only achieves a stable mechanical assembly but also ensures reliable transmission of low-inductance main circuit connections and control signals. By placing the rectifier module 25 on an independent substrate 24 and connecting it to the driver board 23, modular production and maintenance are facilitated, heat is concentrated and transferred to the heat sink 42, and the layout of the capacitor module 22 and rectifier module 25 is rationally partitioned, optimizing electromagnetic compatibility and thermal distribution.

[0025] In one embodiment, reference is made to Figures 1 to 6 The chassis body 10 includes a main shell 11 and a side plate 12. The side plate 12 covers the main shell 11, and the drive plate 23 is installed on the inner side of the main shell 11 facing the side plate 12.

[0026] The main body 10 of the chassis is composed of a main shell 11 and a side plate 12. The main shell 11 is the main structural frame of the frequency converter, made of aluminum alloy or cold-rolled steel sheet through die casting or sheet metal bending, possessing good mechanical strength, heat dissipation performance, and electromagnetic shielding capability. The side plate 12 serves as a removable side cover, which is screwed or snap-fitted to one side of the main shell 11 to form a closed internal space. The inner side of the main shell 11 facing the side plate 12 has multiple mounting holes or guide rail grooves for fixing and supporting internal functional components. The drive board 23 is mounted on this inner side, specifically by screws passing through mounting holes on the drive board 23 and fastening it to threaded holes or rivets on the main shell 11, ensuring a secure installation and good electrical grounding performance. A certain distance is maintained between the mounting surface of the drive board 23 and the side plate 12 to accommodate the arrangement of the control board assembly 50 or other auxiliary circuits, and also to facilitate the direct removal of the drive board 23 after disassembling the side plate 12, enabling modular maintenance. The detachable design of the side panel 12 allows for the inspection, replacement, or upgrade of the drive board 23 without disassembling the entire unit, greatly improving the maintainability of the equipment. Furthermore, a sealing strip or conductive gasket is provided between the main housing 11 and the side panel 12 to enhance the dustproof, moisture-proof, and electromagnetic compatibility performance of the chassis. This structural layout makes full use of the space on the side wall of the chassis, using the drive board 23 as the mounting reference for the core circuitry. This not only improves the utilization of internal space but also provides a stable mechanical and electrical foundation for the integration of the rectifier module 25, capacitor module 22, and other functional units, facilitating the miniaturization and high integration design of the frequency converter.

[0027] In one embodiment, reference is made to Figures 1 to 6 The main housing 11 is provided with an air inlet 111 and an air outlet 112. The air inlet 111 and the air outlet 112 are respectively connected to the two ends of the heat dissipation duct 14. The heat dissipation assembly also includes a fan 41. The fan 41 is disposed near the air inlet 111. The air duct partition 43 is disposed near the air outlet 112. The heat dissipation plate 42 is disposed between the fan 41 and the air duct partition 43.

[0028] The main housing 11 is provided with an air inlet 111 and an air outlet 112, which are respectively located at the front and rear ends of the chassis body 10, specifically at the lower front and lower back of the main housing 11. The two are arranged opposite each other along the front-rear direction of the chassis, connecting the two ends of the heat dissipation air duct 14 to form a directional airflow path from the front to the rear. The air inlet 111 is an independent, removable grille plate, which is installed on the front of the main housing 11 from the outside by screws or clips. It has multiple ventilation holes, which can effectively guide the outside air in and prevent larger particles of foreign objects from directly entering the interior. When the air inlet 111 plate is removed, a mounting cavity designed specifically for the fan 41 can be exposed. This mounting cavity is enclosed by the internal structure of the main housing 11 and its shape matches the outline of the fan 41 to accommodate and position the fan 41. Fan 41, as part of the heat dissipation assembly, is installed in the mounting cavity, adjacent to air inlet 111. It is preferably an axial or centrifugal DC fan, connected to the control circuit via wires, and its speed can be adjusted according to the inverter load. Air duct baffle 43 is located on the air outlet side of the heat dissipation air duct 14, near air outlet 112. Its rear end connects to the back of the main housing 11, and its front end connects to the heat sink 42. The drive plate 23 and side plate 12 are connected to its left and right sides respectively, forming a complete air duct boundary. Heat sink 42 is located between fan 41 and air duct baffle 43, serving a dual function of heat conduction and insulation. One side is attached to heat-generating elements such as the rectifier module 25, while the other side's multiple arrayed grids are exposed in the heat dissipation air duct 14, receiving direct cooling from the airflow. The entire heat dissipation duct 14 is effectively sealed and isolated from the functional component housing cavity 15 by the combined action of the heat sink 42 and the duct partition 43, ensuring that the cooling airflow only flows through the capacitor module 22 and the surface of the heat sink 42, and does not enter the main functional area 21 or other sensitive circuit areas on the drive board 23. This structure not only achieves efficient directional heat dissipation, but also improves the maintainability and replacement convenience of the fan 41 through the detachable air inlet 111 design, facilitating on-site cleaning or fault replacement, and further enhancing the inverter's adaptability and long-term operational reliability in industrial environments.

[0029] In one embodiment, reference is made to Figures 1 to 6The capacitor module 22 is positioned near the air outlet 112. The capacitor module 22 is mounted on the drive plate 23 and is arranged near the air outlet 112, specifically at the end of the air outlet side of the heat dissipation duct 14. Since the cooling airflow in the heat dissipation duct 14 enters through the air inlet 111, is driven by the fan 41, flows sequentially over the surface of the heat sink 42 and the capacitor module 22, and finally exits from the air outlet 112, although the air outlet side is at the end of the airflow path, the capacitor module 22 still receives effective convective cooling due to continuous airflow. Positioning the capacitor module 22 in this location allows for full utilization of the airflow throughout the duct, enabling secondary cooling of the capacitor module 22 after it absorbs heat from the heat sink 42, thus improving the overall heat dissipation efficiency of the duct. On the other hand, since power capacitors such as electrolytic capacitors are sensitive to temperature during long-term operation, their lifespan decreases exponentially with the increase of ambient temperature. Placing them in the airflow outlet area helps to remove their own heat and the heat conducted to the surrounding area in a timely manner, avoiding local heat accumulation that could lead to performance degradation or premature failure.

[0030] Furthermore, the placement of the capacitor module 22 near the air outlet 112 shortens the thermal resistance path between it and the air duct outlet, reducing the heat retention time in the structure. In specific implementations, multiple cylindrical capacitors within the capacitor module 22 are arranged in a linear or staggered array along the airflow direction to reduce wind resistance and enhance turbulent heat transfer. Simultaneously, the bottom of the capacitors is thermally connected to the drive board 23 via PCB copper foil or a metal bracket, further aiding heat conduction. The air duct baffle 43 extends to the vicinity of the air outlet 112 in this area, forming a closed boundary together with the heat sink 42, ensuring that airflow must pass over the surface of the capacitor module 22 before being discharged, preventing short-circuiting or bypassing of the airflow.

[0031] In one embodiment, reference is made to Figures 1 to 6 The frequency converter also includes a control board assembly 50, which is mounted on the side plate 12 and is electrically connected to the drive board 23.

[0032] The inverter also includes a control board assembly 50, which serves as the core control unit for signal acquisition, logic operations, communication interaction, and fault protection. The control board assembly 50 integrates a microprocessor, communication interface circuitry, analog input and output modules, digital input and output channels, and a power management unit. The control board assembly 50 is directly mounted inside the side panel 12, specifically fixed to the mounting holes or guide rail grooves on the side panel 12 using screws or clips, forming an independent and detachable modular structure. This installation method allows the control board assembly 50 to be removed entirely by simply removing the side panel 12 without disassembling other parts of the main chassis 10, greatly improving the ease of operation during on-site maintenance, program upgrades, or troubleshooting. The control board assembly 50 and the drive board 23 are electrically connected via a ribbon cable or flexible circuit board. The connection point is equipped with a matching quick-release ribbon cable socket to ensure a secure connection and easy disassembly; typically, a horn-shaped socket is used. The ribbon cable runs through the reserved wiring channel or space between the drive board 23 and the control board. This structural design achieves physical separation between the control function and the power system, taking into account both the reliability of electrical connections and the convenience of maintenance. It is an important technical feature for improving the intelligence level and serviceability of frequency converters.

[0033] In one embodiment, reference is made to Figures 1 to 6 The inverter also includes an output connection assembly 30, one part of which is located inside the main chassis 10 and electrically connected to the drive board 23, and the other part extends outward from the main chassis 10 to form a parallel connection portion 32, wherein the parallel connection portion 32 is used for direct electrical connection with an adjacent inverter. Further, the output connection assembly 30 includes two conductive copper busbars 31, disposed above the main housing 11, each of which is electrically connected to the drive board 23, and extends outward from the main chassis 10 to form the parallel connection portion 32.

[0034] The inverter also includes an output connection assembly 30 for extracting power from the internal DC bus and facilitating parallel operation between multiple devices. The output connection assembly 30 includes two conductive copper busbars 31, corresponding to the positive and negative terminals of the DC busbar respectively, located in the upper region of the main housing 11 and extending along the length of the chassis. One end of each of these two conductive copper busbars 31 is securely connected to the DC output terminals on the drive board 23 via bolts or crimp terminals, ensuring low-impedance, high-reliability power transmission. The other end extends horizontally outward from the top or upper side of the chassis body 10, protruding beyond the main housing 11, forming a parallel connection section 32 for direct docking with other inverters. The exposed copper busbar portion of this parallel connection section 32 has sufficient mechanical rigidity and conductive cross-section. Its ends can be equipped with guide chamfers or positioning structures to facilitate quick plug-in connection with the corresponding input interfaces of adjacent inverters when multiple units are installed in parallel, thereby completing both physical and electrical connections to the DC busbar. When multiple inverters of the same or compatible models are installed side-by-side in a book-like structure on standard DIN rails or in a cabinet, the parallel connection parts 32 of each unit can be connected in series or in a star configuration to achieve a common DC bus operation mode, supporting energy sharing, regenerative braking energy reuse, and system capacity expansion. During the installation of the two conductive copper busbars 31, insulating supports are provided between them and the main body 10 of the chassis to prevent short circuits with the metal casing. Sealing plates or insulating sleeves are installed in their exit areas to ensure both electrical isolation and dust and water resistance. The copper busbars are installed above the main casing 11, away from the control circuits and heat dissipation ducts 14 in the internal functional component housing 15, avoiding electromagnetic interference from high-current wiring to sensitive signals, and facilitating a neat top-out wiring method. This structural design not only simplifies the wiring process for multi-machine systems on-site and reduces the risk of installation errors, but also improves the modularity and scalability of the equipment, making it particularly suitable for applications requiring rapid deployment and flexible configuration, such as industrial automation, new energy storage, and drive system integration.

[0035] In one embodiment, reference is made to Figures 1 to 6 The frequency converter also includes a debugging port 61, which is located on the top of the main housing 11 and is electrically connected to the control board assembly 50.

[0036] The inverter also includes a debugging port 61, serving as a human-machine interface for setting equipment parameters, monitoring operating status, diagnosing faults, and updating programs. The debugging port 61 is located on the top of the main housing 11, specifically in the rear area of ​​the upper cover assembly 64. The installation position of the debugging port 61 avoids the main power circuit and high-vibration areas, effectively reducing the impact of electromagnetic interference on signal transmission. Simultaneously, a flip cover 62 is provided around the port. This flip cover 62 is a waterproof and dustproof protective cover hinged to the back of the main housing 11, closing the opening when not in use and improving the overall protection level of the unit. Furthermore, for easy opening, the flip cover 62 has a raised portion 63 on the side near the upper cover assembly 64, with its edge curved upwards, allowing for direct manual operation to open the flip cover 62.

[0037] In one embodiment, reference is made to Figures 1 to 6 The main body 10 of the chassis also includes a top plate 13, which is located on top of the main housing 11 and covers the joint between the main housing 11 and the side plate 12. The top plate 13 is fixedly connected to the main housing 11 and the side plate 12 by screws or snap-fit ​​structures, enhancing the structural strength and electromagnetic shielding integrity of the entire unit. The top plate 13 is made of metal, possessing good conductivity and mechanical rigidity. Its upper surface is a mounting surface with pre-drilled holes for supporting and fixing the top cover assembly 64. The top cover assembly 64 is detachably connected to the top plate 13 via a snap-fit ​​structure. Installation is simple; just align and press it into place. Disassembly is easy; it can be opened by hand without tools, greatly improving the convenience of on-site maintenance and functional expansion. Multiple convenient holes are provided on the top plate 13, precisely aligning with various external connection terminals, signal interfaces, communication module slots, or debugging interfaces located on the drive board 23 or control board. For example, debugging port 61, analog input terminals, digital output terminals, communication interface modules, or remote I / O expansion slots are all exposed to the outside through these convenient holes, allowing users to directly perform cable connection, module insertion / removal, or parameter setting operations from the top without opening the entire casing. The layout of the convenient holes is optimized according to the internal circuit functional zones, with insulating barriers or spacing between high-voltage and low-voltage interfaces to prevent cross-interference. Some holes are also equipped with removable sealing plates to close the openings when not in use to meet protection level requirements. This structural design is suitable for industrial environments requiring frequent debugging, multiple signal access, or modular upgrades, effectively improving the human-machine interface and system integration efficiency of the frequency converter.

[0038] In one embodiment, reference is made to Figures 1 to 6The front panel of the main housing 11 has a main terminal port and a brake terminal 271 port, both of which are openings penetrating the wall of the main housing 11 to lead internal electrical connections to the outside of the chassis, enabling wiring access for external power supplies, motor loads, and other functional units. The main terminal port is located in the lower middle part of the front of the main housing 11, aligned with the main power terminal 26 on the drive board 23. The main power terminal 26 serves as the main circuit input / output interface of the frequency converter. The terminal is directly soldered to the edge pad of the drive board 23 and extends outward through the main terminal port, forming a wiring area exposed on the outer side of the front, facilitating the connection of external large-section cables using bolts or terminal crimping. The soldered connection between the main power terminal 26 and the drive board 23 not only achieves electrical conduction but also provides a certain degree of mechanical support. If necessary, an insulating bracket can be used for secondary fixation to prevent the solder joint from breaking due to cable pulling. The brake terminal 271 port is located near the main terminal port, specifically below, aligned with the brake terminal 271 seat on the surge protector 27. The surge protector 27 is installed parallel to the drive board 23 above or to the side. It is electrically isolated from the drive board 23 and mechanically fixed via insulating isolation posts. It houses the braking unit drive circuit and braking terminal 271 sockets for connecting external braking resistors. The braking terminal 271 sockets are connected to the braking IGBT module on the drive board 23 via wires or copper busbars, and are led outwards aligned with the braking terminal 271 port, allowing the braking resistor cable to be directly connected from the front of the chassis. This layout centralizes braking-related interfaces on the front operating side, conforming to on-site wiring habits and avoiding additional cable trays. The isolation posts are made of high-strength engineering plastic, possessing excellent insulation performance and arc resistance, ensuring a safe distance between the high-voltage circuit and the control circuit. Insulating barriers or anti-creep grooves are provided around the main terminal port and the braking terminal 271 port to prevent surface discharge between terminals at different potentials. The overall structure achieves a front-mounted and centralized arrangement of the main circuit interfaces, improving the safety and convenience of wiring operations, while maintaining a high degree of integration and compact space for the internal power board assembly. This is a key design that balances electrical performance, maintenance efficiency, and structural safety.

[0039] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A frequency converter, characterized in that, include: The chassis body has a heat dissipation duct inside; A driver board, wherein a capacitor module is provided on the driver board; A heat dissipation assembly, comprising a heat sink, a rectifier module mounted on the heat sink, and the heat sink being fixedly connected to the drive board; The heat dissipation component and the capacitor module are disposed within the heat dissipation duct, and the capacitor module is located downstream of the heat dissipation component.

2. The frequency converter according to claim 1, characterized in that, The heat dissipation assembly also includes an air duct baffle, which is connected to the radiator and the chassis body. The radiator, the air duct baffle, and the chassis body are connected to form the heat dissipation air duct.

3. The frequency converter according to claim 2, characterized in that, It also includes a substrate, the rectifier module is disposed on the substrate, and the substrate is connected to the drive board.

4. The frequency converter according to claim 3, characterized in that, The chassis body includes a main shell and a side panel, the side panel covers the main shell, and the drive plate is mounted on the inner side of the main shell facing the side panel.

5. The frequency converter according to claim 4, characterized in that, The main housing is provided with an air inlet and an air outlet, which are respectively connected to the two ends of the heat dissipation duct. The heat dissipation assembly also includes a fan, which is located near the air inlet. The duct partition is located near the air outlet, and the heat dissipation plate is located between the fan and the duct partition.

6. The frequency converter according to claim 5, characterized in that, The capacitor module is positioned close to the air outlet.

7. The frequency converter according to claim 4, characterized in that, It also includes a control board assembly, which is mounted on the side plate and electrically connected to the drive board.

8. The frequency converter according to claim 7, characterized in that, It also includes an output connection component, one part of which is located inside the main body of the chassis and electrically connected to the drive board, and the other part extends to the outside of the main body of the chassis to form a parallel connection part, wherein the parallel connection part is used for direct electrical connection with an adjacent frequency converter.

9. The frequency converter according to claim 8, characterized in that, The output connection assembly includes two conductive copper busbars disposed above the main housing. The two conductive copper busbars are electrically connected to the drive board respectively, and the two conductive copper busbars extend to the outside of the chassis body to form a parallel connection part.

10. The frequency converter according to claim 7, characterized in that, It also includes a debugging port, which is located on the top of the main housing and is electrically connected to the control board assembly.

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