A wireless transmission device

Abstract

The application provides a wireless transmission device, comprising a shell, a transmitting plate and an interface plate arranged in the shell, wherein the transmitting plate and the interface plate are arranged on opposite sides of the shell, a transceiving chip is integrated on the side of the transmitting plate away from the interface plate, a heat dissipation element is arranged between the transmitting plate and the interface plate to form a heat conduction path between the transmitting plate and the interface plate, so that the heat generated by the transceiving chip on the transmitting plate is conducted to the side of the interface plate through the heat dissipation element to realize step-by-step heat dissipation; a wave-transparent cover is arranged on the side of the shell away from the interface plate to stably cover the transmitting plate. Through the optimization of the structure and layout design, the transceiving chip for transmitting electromagnetic waves and the heat dissipation structure thereof are arranged on the two sides in the thickness direction of the transmitting plate, so that the overall miniaturization is ensured, good wireless transmission effect and stable heat dissipation of the related circuit board are realized, and the performance of the corresponding product and the user experience are effectively improved.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and further to a wireless transmission device. Background Technology

[0002] Wireless transmission, as a core component of the field of wireless communication, is a way of transmitting data using wireless technology. In recent years, with its in-depth development, it has not only changed people's lifestyles and social patterns, but also promoted the transformation of social productivity and greatly boosted social development.

[0003] In related technologies, circuit boards, as core components of wireless transmission equipment, directly affect the performance, reliability, and application scenarios of the corresponding devices due to their heat dissipation and wave transmission capabilities. Currently, due to the high cost and difficulty in multi-layering of high thermal conductivity materials, the corresponding circuit board processing technology is complex and the yield is low. The industry mostly uses substrates with relatively low thermal conductivity, such as FR-4 substrate with a thermal conductivity of 0.3 W / m·K, to produce circuit boards. However, due to the limited heat dissipation capacity, it cannot meet the heat dissipation requirements of high-power chips. Corresponding devices usually need to add forced heat dissipation solutions. For example, in the circuit boards of wireless transmission equipment, the components used to transmit electromagnetic waves have high power. Currently, the industry mostly uses metal thermal conductivity solutions for heat dissipation, which conflicts with increasing wave transmission. Using forced heat dissipation solutions, such as adding fans, increases the weight of the corresponding wireless transmission equipment, which goes against the trend of miniaturization and needs improvement. Utility Model Content

[0004] The purpose of this application is to provide a wireless transmission device that, by optimizing the circuit board layout and related structural design, achieves good wireless transmission performance and stable heat dissipation of the circuit board while ensuring its overall miniaturization, thereby improving the performance of the corresponding product and the user experience.

[0005] The technical solution provided in this application is as follows:

[0006] This application provides a wireless transmission device, including:

[0007] The transmitter board has a transceiver chip integrated on one side.

[0008] The housing and the interface board are both located inside the housing, and are located on opposite sides of the housing. The side of the transmitter board that integrates the transceiver chip is positioned away from the interface board.

[0009] A heat dissipation element is disposed between the transmitter board and the interface board, and forms a heat conduction path between the transmitter board and the interface board, so that the heat generated by the transceiver chip on the transmitter board is conducted to the interface board side through the heat dissipation element;

[0010] A wave-transparent cover is disposed on the housing and located on the side of the transmitter plate away from the interface plate, so as to stably cover the transmitter plate.

[0011] This application provides a wireless transmission device in which the transceiver chip and its heat conduction path are located on opposite sides of the thickness of the transmitter board, so that the propagation direction of the electromagnetic waves emitted by the transceiver chip is opposite to the direction of heat dissipation. On the one hand, the heat generated by the transceiver chip on the transmitter board is conducted through heat dissipation elements to the housing, interface board, and the housing on the side of the interface board away from the transmitter board, achieving heat dissipation in stages without the need for an additional forced heat dissipation structure, which is conducive to the miniaturization of the corresponding wireless transmission device. On the other hand, the propagation path of the electromagnetic waves emitted by the transceiver chip is smooth, and it is covered only by a shell made of wave-transparent material without any heat dissipation structure blocking it. Compared with the heat dissipation solutions in related technologies, this method achieves stable heat dissipation while effectively ensuring the wave transmittance and stability of the corresponding wireless transmission device structure, significantly improving the communication effect of the corresponding wireless transmission device, enhancing its signal quality, and thus ensuring the performance of the corresponding wireless communication product and improving the user experience.

[0012] In some embodiments, the housing includes a body and a base, which are detachably disposed;

[0013] The launching plate is located on the side of the main body opposite to the base;

[0014] The interface board is located between the body and the base.

[0015] The wireless transmission device provided in this application utilizes a detachable main body and a base to form a housing. On the one hand, this facilitates the production and assembly of the wireless transmission device; on the other hand, in practical applications, the base can be removed from the main body to quickly dissipate heat from the interface board, further improving the heat dissipation efficiency of the wireless transmission device.

[0016] In some embodiments, the body includes a support plate and multiple side plates, the multiple side plates surrounding the periphery of the support plate, and the body forming a first mounting groove and a second mounting groove on both sides of the support plate in the thickness direction.

[0017] The transmitter board is disposed in the first mounting slot, and the interface board is disposed in the second mounting slot.

[0018] In some embodiments, the wave-transparent cover is slidably embedded in the opening of the first mounting groove, and the connection between the wave-transparent cover and the body is a tight fit connection.

[0019] The wireless transmission device provided in this application consists of a main body formed by multiple side plates surrounding a support plate, and mounting positions for the transmitter plate and interface plate are naturally formed at both ends of the main body in the thickness direction. The main body structure is simple and easy to manufacture. Furthermore, the wave-transmitting cover can be detachably installed on the main body by using a sliding embedding method, which further reduces the manufacturing difficulty of the wireless transmission device, facilitates the efficient production and assembly of the wireless transmission device, and helps enterprises reduce costs and increase efficiency.

[0020] In some embodiments, the heat dissipation element includes a first copper-clad area, which is disposed on the side of the transmitter board away from the transceiver chip, and the transceiver chip is located within the heat dissipation surface formed by the first copper-clad area on the transmitter board.

[0021] The heat dissipation element further includes a first heat dissipation protrusion, which is formed on the side of the housing away from the interface board and at least partially abuts against the first copper-plated area, so that the heat generated by the transceiver chip on the transmitter board can be transferred to the housing in sequence through the first copper-plated area and the first heat dissipation protrusion.

[0022] In some implementations, the processing chip is integrated into the transmitter board and is located on the same side as the transceiver chip;

[0023] The emitter board has a third copper plating area on the side opposite to the processing chip, and the processing chip is located within the heat dissipation surface formed by the third copper plating area on the emitter board.

[0024] The heat dissipation element includes a second heat dissipation protrusion, which is formed on the side of the housing away from the interface board and at least partially abuts against the third copper-clad area, so that the heat generated by the processing chip on the transmitter board can be transferred to the housing in sequence through the third copper-clad area and the second heat dissipation protrusion.

[0025] This application provides a wireless transmission device that incorporates copper plating on the back of the chip-concentrated area on the transmitter board. Utilizing copper's high thermal conductivity, the heat dissipation efficiency of the transmitter board is improved. Simultaneously, a heat dissipation protrusion structure is provided on the housing to increase the heat dissipation area and optimize the heat conduction path. This enhances the ability to dissipate heat generated by the transceiver chips and processing chips on the transmitter board to the housing and surrounding environment without increasing the overall weight of the wireless transmission device. The heat dissipation element has a simple structure, is easy to install, and offers reliable and stable performance, further contributing to cost reduction and efficiency improvement for enterprises.

[0026] In some embodiments, a second copper-clad area and a fourth copper-clad area are respectively provided on both sides of the interface board in the thickness direction, and the second copper-clad area is provided corresponding to the support board;

[0027] The heat dissipation element includes a third heat dissipation boss, which is formed on the side of the support plate near the interface plate and at least partially abuts against the second copper-clad area.

[0028] The fourth heat dissipation protrusion is formed on the side of the base near the interface board and at least partially abuts against the fourth copper-clad area;

[0029] Heat dissipation fins are formed on the outer wall surface of the base.

[0030] This application provides a wireless transmission device in which, during operation, the interface board receives heat from the housing through a third heat dissipation boss and a second copper-plated area. The heat, along with its own generated heat, is then transferred to the base via the third copper-plated area and a fourth heat dissipation boss. This heat dissipation structure is simple and reliable, further promoting the miniaturization and lightweighting of the wireless transmission device. Simultaneously, due to the heat dissipation fins, airflow across the surface of the wireless transmission device further increases the heat dissipation rate of the housing and its internal heat-generating components.

[0031] In some embodiments, the first positioning post includes multiple posts, which are respectively disposed on the periphery of the body.

[0032] The second positioning post includes multiple posts, which are respectively disposed on the periphery of the base and correspond one-to-one with the first positioning post.

[0033] The interface board is detachably mounted between the first positioning post and the second positioning post.

[0034] In some embodiments, a Universal Serial Bus (USB) interface is also included, which is integrated on the interface board and located between the body and the base.

[0035] This application provides a wireless transmission device that uses bolts or other fasteners to sequentially pass through a first positioning post, an interface plate, and a second positioning post, or vice versa. This allows for the detachable and stable installation of the interface plate within the housing while simultaneously fastening the main body and base. The structure is ingenious and easy to assemble. Furthermore, the universal serial bus interface integrated on the interface plate only needs to be positioned between the main body and the base, eliminating the need for additional openings on other parts of the housing sidewall. This simplifies the structure and assembly process of the wireless transmission device, effectively ensuring its production efficiency and contributing to its lightweight design.

[0036] In some embodiments, the base has a flange at one end away from the body, and the flange is located on the side wall of the base.

[0037] This application provides a wireless transmission device, in which a flange is used to assemble the wireless transmission device with other devices, or to assemble the wireless transmission device with a forced heat dissipation component, so that it can be applied to different usage scenarios, or to facilitate the addition of a fan or other forced heat dissipation component to the wireless transmission device for forced heat dissipation; thereby effectively ensuring its ease of use and guaranteeing user experience.

[0038] Compared with the prior art, the wireless transmission device provided in this application has at least one of the following advantages:

[0039] 1. This application employs copper plating on the back of the chip concentration area on the transmitter board and on both sides of the interface board in the thickness direction. Heat dissipation protrusions are installed at the locations between the transmitter board and the interface board, and at the locations on the interface board away from the transmitter board. Combined with the design of heat dissipation fins on the outer wall of the shell, a complete and reliable heat conduction path is formed from the side of the transmitter board away from the transceiver chip to the outer wall of the shell, achieving effective heat dissipation in stages. Simultaneously, the propagation direction of the electromagnetic waves emitted by the transceiver chip is opposite to the heat conduction direction. The heat dissipation and wave-transparency schemes are relatively independent and conflict-free, ensuring stable heat dissipation of components on the circuit board of the wireless transmission device while achieving good wireless transmission performance. Moreover, the wave-transparency shell effectively extends the service life of the corresponding wireless transmission device. Furthermore, since no forced heat dissipation structure is required, the overall structure of this wireless transmission device is simple, easy to manufacture, assemble, and use, small and lightweight, with good overall performance, thus effectively ensuring a good user experience. Attached Figure Description

[0040] The preferred embodiments will now be described in a clear and easy-to-understand manner, with reference to the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this solution.

[0041] Figure 1 This is an exploded view illustrating the assembly method of the wireless transmission device, as shown in the embodiments of this application.

[0042] Figure 2 This is a side view that mainly illustrates the overall appearance of the wireless transmission device in the embodiments of this application;

[0043] Figure 3 This is a top view of the embodiment of the present application, which mainly illustrates the installation form of the wave-transparent cover on the wireless transmission device;

[0044] Figure 4 yes Figure 3 The sectional view along the AA direction is mainly used to show the layout of the heat dissipation components in the wireless transmission device.

[0045] Figure 5This is a plan view illustrating the layout of the heat dissipation components on the transmitter board, as shown in the embodiments of this application.

[0046] Figure 6 This is a plan view illustrating the layout of heat dissipation components on the interface board, which is the main feature of this application embodiment.

[0047] Explanation of reference numerals in the attached figures:

[0048] 1. Housing; 11. Body; 111. Support plate; 1111. First heat dissipation boss; 1112. Second heat dissipation boss; 1113. Third heat dissipation boss; 112. Side plate; 1121. First positioning post; 12. Base; 121. Second positioning post; 122. Fourth heat dissipation boss; 123. Heat dissipation fins; 124. Flange; 2. Transmitter board; 21. Transceiver chip; 22. First copper plating area; 23. Processing chip; 24. Third copper plating area; 3. Interface board; 31. Second copper plating area; 32. Universal serial bus interface; 33. Fourth copper plating area; 4. Wave-transparent cover. Detailed Implementation

[0049] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0050] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0051] In the telecommunications equipment manufacturing industry, circuit boards are core components of wireless transmission equipment. Their heat dissipation and wave transmission capabilities directly affect the performance, reliability, and application scenarios of the corresponding equipment, thus impacting user experience. Therefore, optimizing the structural design of wireless transmission equipment and improving the heat dissipation and wave transmission capabilities of its internal circuit boards has become an important research direction in related industries, and will have a profound impact on the industry's development.

[0052] In one embodiment, reference is made to the accompanying drawings. Figures 1 to 6This invention provides a wireless transmission device that is small and lightweight, achieving both good wireless transmission performance and stable heat dissipation of the circuit board, resulting in excellent overall performance and a superior user experience. It includes a housing 1 and a transmitter board 2 and an interface board 3 housed within the housing 1. The transmitter board 2 and interface board 3 are located on opposite sides of the housing 1. A transceiver chip 21 is integrated on the side of the transmitter board 2 facing away from the interface board 3. A heat dissipation element is provided between the transmitter board 2 and the interface board 3 to form a heat conduction path, allowing the heat generated by the transceiver chip 21 on the transmitter board 2 to be conducted to the interface board 3 side via the heat dissipation element, achieving tiered heat dissipation. A wave-transparent cover 4 is provided on the side of the housing 1 facing away from the interface board 3 to stably cover the transmitter board 2 and its transceiver chip 21.

[0053] In this way, the heat generated by the transceiver chip 21 on the transmitter board 2 is conducted to the housing 1, the interface board 3, and the side of the housing 1 opposite to the transmitter board 2 via the heat dissipation element, achieving effective heat dissipation in stages without the need for an additional forced heat dissipation structure. This not only ensures stable heat dissipation for the transmitter board 2 but also facilitates the miniaturization of the corresponding wireless transmission equipment. Furthermore, since the transceiver chip 21 used to transmit electromagnetic waves and its heat conduction path are located on opposite sides of the thickness of the transmitter board 2, the propagation path of the electromagnetic waves emitted by the transceiver chip 21 is unobstructed by any metal heat dissipation structure. This effectively improves the wave transmittance of the corresponding wireless transmission equipment structure, ensuring the stability and reliability of its communication effect and related performance. As a result, the wireless transmission equipment has excellent overall performance, is suitable for long-term continuous and stable operation, has strong applicability, and effectively guarantees the user experience.

[0054] In one embodiment, based on the above embodiments, referring to Figures 1 to 6 Specifically, in this embodiment, the housing 1 includes a body 11 and a base 12, which are detachably configured; specifically, refer to... Figures 1 to 3 The main body 11 includes a support plate 111 and a side plate 112. The side plate 112 includes multiple pieces, which are connected end to end to form the side wall of the shell 1, surrounding the support plate 111. A first mounting groove and a second mounting groove are formed on both sides of the support plate 111 in the thickness direction, that is, the support plate 111 is located in the middle position of the shell 1 along the installation direction. In the embodiments of this application, the main body 11 can be integrally formed by the support plate 111 and the side plate 112. Of course, the main body can also be made by subtractive forming of shafts, columns, etc. This application does not impose specific limitations on it.

[0055] Reference Figure 1 and Figure 4The transmitting plate 2 is disposed in the first mounting groove and stably installed in the housing 1 by the wave-transparent cover 4. In this embodiment, the wave-transparent cover 4 is generally a thin sheet structure. To improve its ease of assembly, the wave-transparent cover 4 is preferably embedded in the opening of the first mounting groove on the body 11 along its thickness direction, and its edge near the transmitting plate 2 abuts against the side wall of the first mounting groove and the edge of the transmitting plate 2. Of course, the connection between the wave-transparent cover 4 and the housing 1 is a tight-fit sliding connection. In addition, in the embodiments of this application, the wave-transparent cover 4 can also be detachably installed on the housing 1 by means of hinge, snap-fit, locking, etc. The interface plate 3 is disposed in the second mounting groove and is detachably disposed between the body 11 and the base 12. To ensure the wave transmittance, the thickness of the wave-transparent cover 4 is preferably 1 mm in this embodiment.

[0056] In this embodiment, refer to Figure 1 , Figures 4 to 6 The heat dissipation element includes a first copper-clad area 22 and a second copper-clad area 31. The first copper-clad area 22 is located on the side of the transmitter board 2 away from the transceiver chip 21 and is positioned corresponding to the area of ​​the transceiver chip 21, i.e., the transceiver chip 21 is located within the heat dissipation surface formed by the first copper-clad area 22 on the transmitter board 2. The second copper-clad area 31 is located on the side of the interface board 3 near the support plate 111 in the thickness direction. The heat dissipation element also includes a first heat dissipation boss 1111, which is formed on the side of the support plate 111 near the transmitter board 2 and is positioned corresponding to the first copper-clad area 22. In this embodiment, the first heat dissipation boss 1111 at least partially abuts against the first copper-clad area 22. During the operation of the corresponding wireless transmission device, the heat generated by the transceiver chip 21 on the transmitter board 2 is absorbed by the first copper-clad area 22 and conducted to the first heat dissipation boss 1111 to achieve diffusion and transfer to the body 11.

[0057] Reference Figure 1 , Figure 4 and Figure 5 As is well known, in addition to the transceiver chip 21, the transmitter board 2 usually integrates various processing chips 23. In this embodiment, the processing chip 23 and the transceiver chip 21 are integrated on the same side of the transmitter board 2, and the transmitter board 2 also has a third copper plating area 24 corresponding to the processing chip 23. The third copper plating area 24 is also located on the side of the transmitter board 2 away from the transceiver chip 21, that is, the processing chip 23 is located within the heat dissipation surface formed by the third copper plating area 24 on the transmitter board 2. In this embodiment, the first heat dissipation protrusion 1111 can be simultaneously provided corresponding to the third copper plating area 24. Of course, referring to Figure 1In the embodiments of this application, the heat dissipation element further includes a second heat dissipation protrusion 1112. The second heat dissipation protrusion 1112 is formed on the side of the support plate 111 near the transmitter plate 2 and is spaced apart from the first heat dissipation protrusion 1111. The second heat dissipation protrusion 1112 is disposed corresponding to the third copper-clad area 24. In this embodiment, the second heat dissipation protrusion 1112 at least partially abuts against the third copper-clad area 24 so that the heat generated by the processing chip 23 on the transmitter plate 2 is sequentially transferred and diffused to the body 11 through the third copper-clad area 24 and the second heat dissipation protrusion 1112, thereby further improving the heat dissipation capacity of the transmitter plate 2. In the embodiments of this application, the second heat dissipation protrusion 1112 and / or the first heat dissipation protrusion 1111 may also be configured as a collection of multiple small-volume heat dissipation protrusions, that is, the second heat dissipation protrusion 1112 and / or the first heat dissipation protrusion 1111 is composed of multiple spaced-apart small-volume heat dissipation protrusions to further enhance the heat transfer and heat dissipation effect of the body 11; of course, the configuration of the first heat dissipation protrusion 1111 and the second heat dissipation protrusion 1112 should not be regarded as a specific limitation on the scope of protection of this application.

[0058] Reference Figure 1 , Figure 4 and Figure 6 Similarly, in this embodiment, corresponding to the second copper-clad area 31, the heat dissipation element also includes a third heat dissipation protrusion 1113. The third heat dissipation protrusion 1113 is formed on the side of the support plate 111 away from the first heat dissipation protrusion 1111 and / or the second heat dissipation protrusion 1112, and is disposed corresponding to the second copper-clad area 31, that is, the third heat dissipation protrusion 1113 at least partially abuts against the second copper-clad area 31. During the operation of the wireless transmission device, some of the heat on the support plate 111 is conducted and diffused to the interface board 3 through the third heat dissipation protrusion 1113 and the second copper-clad area 31; thereby, a step-by-step heat dissipation channel is formed between the transmitter board 2 and the interface board 3; at the same time, since the first copper-clad area 22, the second copper-clad area 31, and the third copper-clad area 24 are all disposed on the side of the transmitter board 2 away from the transceiver chip 21, the copper-clad structure stably reflects and absorbs the electromagnetic interference signals generated by the electronic components in the circuit structure of the transmitter board 2 and the interface board 3, effectively shielding electromagnetic interference and further improving the signal quality of the wireless transmission device.

[0059] Furthermore, refer to Figures 1 to 3 In this embodiment, the cross-sections of the body 11 and the base 12 are generally rectangular. Of course, the body 11 and the base 12 can also be set to other suitable shapes. The shapes of the two should not be used as a specific limitation on the scope of protection of this application. This embodiment only uses the shell 1 as a generally rectangular columnar structure to illustrate the technical principle of this application.

[0060] Reference Figure 1 and Figure 4The body 11 has multiple first positioning posts 1121 around its periphery. Specifically, in this embodiment, the multiple first positioning posts 1121 are located at the four corners of the body 11, and each first positioning post 1121 is formed on the inner wall surface of the corresponding side plate 112. At the same time, the base 12 has multiple second positioning posts 121 on the inner wall surface of its side wall, and the second positioning posts 121 correspond one-to-one with the first positioning posts 1121. During assembly, the interface plate 3 is placed between the first positioning posts 1121 and the second positioning posts 121. With the help of fasteners such as bolts, the corresponding first positioning posts 1121, the interface plate 3 and the second positioning posts 121 are passed through in sequence, or the corresponding second positioning posts 121, the interface plate 3 and the first positioning posts 1121 are passed through in sequence. This achieves stable installation of the interface plate 3 in the housing 1 and detachable encapsulation of the housing 1. The structure is ingenious and the assembly is efficient and convenient.

[0061] In the embodiments of this application, a connection method such as a snap-fit, magnetic attraction, or sliding insertion can also be provided between the base 12 and the body 11 to achieve a detachable and stable connection between the two. This application will not elaborate on this, and the assembly method of the body 11 and the base 12 should not be regarded as a specific limitation on the scope of protection of this application.

[0062] Since interface board 3 integrates various interfaces such as the universal serial bus interface 32, refer to Figure 2 and Figure 6 In this embodiment, various interfaces such as the Universal Serial Bus Interface 32 are integrated on the side of the interface board 3. During production, after the interface board 3 is assembled between the body 11 and the base 12, the various interfaces such as the Universal Serial Bus Interface 32 are sandwiched between the body 11 and the base 12, which effectively simplifies the structure, production and assembly process of the wireless transmission device, improves its production efficiency, and further promotes its development towards lightweight design.

[0063] Furthermore, refer to Figure 1The base 12 is recessed inward on the side near the interface plate 3 and forms a cavity. In this embodiment, the heat dissipation element may also include a fourth heat dissipation protrusion 122 formed in the cavity. In this case, the interface plate 3 preferably has a fourth copper-plated area 33 on the side away from the second copper-plated area 31. After the interface plate 3 is assembled between the base 12 and the body 11, the fourth copper-plated area 33 on it at least partially abuts against the fourth heat dissipation protrusion 122. In addition, the outer wall surface of the base 12 is provided with heat dissipation fins 123. During the operation of the wireless transmission device, the first copper-clad area 22 and the third copper-clad area 24 absorb the heat generated by the transceiver chip 21, the processing chip 23 and other circuit structures on the transmitter board 2, and then diffuse it to the main body 11 and its surrounding environment through the corresponding first heat dissipation protrusion 1111 and the second heat dissipation protrusion 1112. Some of the heat of the main body 11 is conducted to the interface board 3 through the third heat dissipation protrusion 1113 and the second copper-clad area 31, and then, together with the heat generated by the interface board 3 itself, is conducted to the base 12 through the fourth copper-clad area 33 and the fourth heat dissipation protrusion 122. Due to the setting of the heat dissipation fins 123, when the air flows through the base 12, it accelerates the removal of heat from it, thereby improving the heat dissipation efficiency of the heat conduction path.

[0064] In this embodiment, refer to Figure 1 , Figure 2 and Figure 4 The heat dissipation fins 123 are preferably located on the side of the base 12 away from the interface plate 3, while the side wall of the base 12 is used to provide the flange 124. In this embodiment, the flange 124 is preferably located at the end of the base 12 away from the interface plate 3 to facilitate connection between the wireless transmission device and other devices, or to connect the wireless transmission device and the forced heat dissipation component to further enhance heat dissipation capabilities. Testing has shown that the heat dissipation method of the wireless transmission device can ensure that the transceiver chip 21 and the processing chip 23 can operate continuously for more than 2 hours.

[0065] The implementation principle of this application embodiment is as follows: During the operation of the wireless transmission device, the first copper-clad area 22 and the third copper-clad area 24 absorb the heat generated by the corresponding chip concentration areas such as the transceiver chip 21 and the processing chip 23 on the transmitter board 2 in a timely manner. Then, the heat is transferred to the body 11 through the first heat dissipation protrusion 1111 and the second heat dissipation protrusion 1112, respectively. Part of the heat of the body 11 is dissipated to the surrounding environment along the support plate 111, and part is conducted to the interface board 3 through the third heat dissipation protrusion 1113 and the second copper-clad area 31. Then, it is transferred to the heat dissipation fins 123 of the base 12 by the fourth copper-clad area 33 and the fourth heat dissipation protrusion 122, and is accelerated to dissipate to the surrounding environment by the heat dissipation fins 123, thereby achieving efficient heat dissipation. If the heat dissipation capacity is to be further enhanced, it can be achieved by externally connecting a heat dissipation enhancement component through the flange 124. In this way, the performance degradation of the transmitter board 2 and the interface board 3 caused by high temperature and the aging of electronic components are effectively avoided, and the overall development of the wireless transmission device towards miniaturization and lightweighting is promoted at the same time.

[0066] Furthermore, since the transceiver chip 21 and the heat dissipation element are located on opposite sides of the thickness direction of the transmitter board 2, and the transceiver chip 21 is covered only by the wave-transparent cover 4, the propagation path of the electromagnetic waves emitted by the transceiver chip 21 is smooth and there is no structural obstruction such as heat dissipation metal, resulting in high wave transmittance of the corresponding wireless transmission equipment structure. In addition, since the first copper-clad area 22, the second copper-clad area 31 and the third copper-clad area 24 can stably reflect and absorb the electromagnetic interference signals generated by the electronic components in the circuit structure of the transmitter board 2 and the interface board 3, the electromagnetic interference is effectively shielded, thereby effectively improving the communication effect of the corresponding wireless transmission equipment and further ensuring its signal quality.

[0067] In summary, the wireless transmission device described in this application has stable and reliable heat dissipation capabilities, excellent wireless transmission performance, long service life, small and lightweight overall size, and good comprehensive performance. Moreover, its overall structure is simple, making it convenient to produce and use, which helps enterprises reduce costs and increase efficiency, and provides a good user experience.

[0068] It should be noted that the above embodiments can be freely combined as needed. The above description is only a preferred embodiment of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the protection scope of this application.

Claims

1. A wireless transmission device, characterized in that, include: The transmitter board has a transceiver chip integrated on one side. The housing and the interface board are both located inside the housing, and are located on opposite sides of the housing. The side of the transmitter board that integrates the transceiver chip is positioned away from the interface board. A heat dissipation element is disposed between the transmitter board and the interface board, and forms a heat conduction path between the transmitter board and the interface board, so that the heat generated by the transceiver chip on the transmitter board is conducted to the interface board side through the heat dissipation element; A wave-transparent cover is disposed on the housing and located on the side of the transmitter plate away from the interface plate, so as to stably cover the transmitter plate.

2. The wireless transmission device according to claim 1, characterized in that, The housing includes a body and a base, which are detachably configured. The launching plate is located on the side of the main body opposite to the base; The interface board is located between the body and the base.

3. The wireless transmission device according to claim 2, characterized in that, The main body includes a support plate and multiple side plates. The multiple side plates surround the periphery of the support plate, and the main body forms a first mounting groove and a second mounting groove on both sides of the support plate in the thickness direction. The transmitter board is disposed in the first mounting slot, and the interface board is disposed in the second mounting slot.

4. A wireless transmission device according to claim 3, characterized in that, The wave-transparent cover is slidably embedded in the opening of the first mounting groove, and the connection between the wave-transparent cover and the body is a tight fit connection.

5. A wireless transmission device according to claim 1, characterized in that, The heat dissipation element includes a first copper-clad area, which is located on the side of the transmitter board away from the transceiver chip, and the transceiver chip is located within the heat dissipation surface formed by the first copper-clad area on the transmitter board. The heat dissipation element further includes a first heat dissipation protrusion, which is formed on the side of the housing away from the interface board and at least partially abuts against the first copper-plated area, so that the heat generated by the transceiver chip on the transmitter board can be transferred to the housing in sequence through the first copper-plated area and the first heat dissipation protrusion.

6. A wireless transmission device according to claim 1 or 5, characterized in that, The processing chip is integrated into the transmitter board and is located on the same side as the transceiver chip; The emitter board has a third copper plating area on the side opposite to the processing chip, and the processing chip is located within the heat dissipation surface formed by the third copper plating area on the emitter board. The heat dissipation element includes a second heat dissipation protrusion, which is formed on the side of the housing away from the interface board and at least partially abuts against the third copper-clad area, so that the heat generated by the processing chip on the transmitter board can be transferred to the housing in sequence through the third copper-clad area and the second heat dissipation protrusion.

7. A wireless transmission device according to claim 3, characterized in that, The interface board has a second copper-clad area and a fourth copper-clad area on both sides in the thickness direction, and the second copper-clad area is provided corresponding to the support board. The heat dissipation element includes a third heat dissipation boss, which is formed on the side of the support plate near the interface plate and at least partially abuts against the second copper-clad area. The fourth heat dissipation protrusion is formed on the side of the base near the interface board and at least partially abuts against the fourth copper-clad area; Heat dissipation fins are formed on the outer wall surface of the base.

8. A wireless transmission device according to claim 2, characterized in that, The first positioning post includes multiple posts, which are respectively disposed on the periphery of the body. The second positioning post includes multiple posts, which are respectively disposed on the periphery of the base and correspond one-to-one with the first positioning post. The interface board is detachably mounted between the first positioning post and the second positioning post.

9. A wireless transmission device according to claim 2 or 8, characterized in that, It also includes a Universal Serial Bus (USB) interface, which is integrated on the interface board and located between the body and the base.

10. A wireless transmission device according to claim 2, characterized in that, The base has a flange at one end away from the main body, and the flange is located on the side wall of the base.

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