Novel heat dissipation sealed waterproof integrated PCBA integrated Bluetooth speaker

Abstract

The utility model discloses a novel heat dissipation sealing waterproof integrated PCBA integrated type bluetooth audio amplifier, include: bluetooth audio amplifier casing, install a plurality of loudspeaker main body on the bluetooth audio amplifier casing, and the both sides of bluetooth audio amplifier casing are installed with diaphragm, the inside installation of bluetooth audio amplifier casing has power, integrated mainboard, integrated mainboard installs on bluetooth audio amplifier casing, and is away from power and loudspeaker main body setting, integrated mainboard is connected with loudspeaker main body and power, and then control loudspeaker main body work, and supply power through power supply. The utility model discloses through the setting of integrated mainboard avoided the need of isolation sealing and heat superposition effect between traditional type multiple mainboards, reduced the risk of heat gathering, thereby effectively reduced the possibility of equipment overheating, improved the stability and life of system.

Description

Technical Field

[0001] This utility model relates to a Bluetooth speaker, specifically a novel integrated Bluetooth speaker with a heat dissipation, sealing, and waterproof integrated PCBA. Background Technology

[0002] In existing Bluetooth speaker designs, multiple independent motherboards are typically used to implement different functions. While this design can meet the need for multiple functions, it also has some obvious shortcomings:

[0003] Traditional speakers typically require multiple PCBA boards to achieve simultaneous sealing, waterproofing, heat dissipation, and lighting effects. However, this new product achieves these effects simultaneously with a single integrated PCBA motherboard.

[0004] The unstable connection and input / output of multiple motherboards during operation affects the quality and lifespan of components and the stability of the speaker.

[0005] The design of multiple independent motherboards takes up more internal space, reduces the available space for other functional modules, and makes the speaker design more complex and its size correspondingly larger. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a novel integrated Bluetooth speaker with integrated heat dissipation, sealing and waterproofing PCBA, so as to solve the problems existing in the background art.

[0007] This utility model's integrated Bluetooth speaker with heat dissipation, sealing, and waterproofing is achieved through the following technical solutions:

[0008] A Bluetooth speaker housing, on which multiple speaker bodies are mounted, and diaphragms are mounted on both sides of the Bluetooth speaker housing; a power supply is installed inside the Bluetooth speaker housing;

[0009] An integrated motherboard is mounted on the Bluetooth speaker housing and is located away from the power supply and speaker body. The integrated motherboard is connected to the speaker body and the power supply, thereby controlling the operation of the speaker body and supplying power through the power supply.

[0010] As a preferred technical solution, the Bluetooth speaker housing includes a front shell and a rear shell;

[0011] The front cover has multiple speaker mounting positions, and the speaker body is mounted on the speaker mounting positions; the rear cover has a motherboard mounting position, and the integrated motherboard is mounted on the motherboard mounting position of the rear cover.

[0012] As a preferred technical solution, a C-shaped mesh is installed on the front shell of the Bluetooth speaker housing, and the mesh is positioned to avoid the button panel; the sound outlet holes on the mesh correspond to the positions of the speaker body.

[0013] As a preferred technical solution, the integrated motherboard is provided with a button body for control, and the integrated motherboard is covered with a button board, and the button board corresponds to the button body of the integrated motherboard.

[0014] As a preferred technical solution, the integrated motherboard also has a charging interface installed, and the button panel has a slot for the charging interface to pass through.

[0015] As a preferred technical solution, a waterproof gasket is provided between the motherboard mounting position and the button board of the rear shell; a waterproof gasket is also provided between the speaker mounting position and the speaker body of the front shell.

[0016] As a preferred technical solution, decorative covers are installed at both ends of the Bluetooth speaker shell, and LED beads are also set on the integrated motherboard, with the LED beads corresponding to the decorative covers.

[0017] As a preferred technical solution, a C-shaped mesh shell is wrapped around the mesh fabric, and the mesh shell is also positioned to avoid the keypad.

[0018] As a preferred technical solution, traditional speakers require multiple PCBAs to be interconnected, isolated, sealed, waterproof, heat dissipated, and illuminated; while this integrated motherboard integrates the PCB board into a single PCBA to achieve the sealing, heat dissipation, lighting, and waterproofing effects.

[0019] The beneficial effects of this utility model are:

[0020] This invention avoids the heat accumulation effect between multiple motherboards by integrating the motherboard, reducing the risk of heat buildup and thus effectively reducing the possibility of overheating, improving system stability and lifespan.

[0021] This invention makes the Bluetooth speaker body lighter and improves the utilization efficiency of internal space by integrating the motherboard.

[0022] Traditional speakers typically require multiple PCBA boards to achieve simultaneous sealing, waterproofing, heat dissipation, and lighting effects. However, this new product achieves the same sealing, waterproofing, heat dissipation, and lighting effects with a single integrated PCBA motherboard. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0026] Figure 3 This is a schematic diagram of the exploded structure of this utility model.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Speaker body; 2. Diaphragm; 3. Power supply; 4. Integrated motherboard; 5. Front shell; 6. Rear shell; 7. Speaker mounting position; 8. Motherboard mounting position; 9. Mesh fabric; 10. Button board; 11. Charging interface; 12. Waterproof gasket; 13. Decorative cover; 14. Mesh shell; 15. Cover. Detailed Implementation

[0029] All features disclosed in this specification, or steps in all methods or processes disclosed herein, may be combined in any way, except for mutually exclusive features and / or steps.

[0030] like Figures 1-3 As shown, this utility model discloses a novel integrated Bluetooth speaker with a heat dissipation, sealing, and waterproof integrated PCBA, comprising:

[0031] A Bluetooth speaker housing, on which multiple speaker bodies 1 are mounted, and diaphragms 2 are mounted on both sides of the Bluetooth speaker housing; a power supply 3 is installed inside the Bluetooth speaker housing;

[0032] An integrated motherboard 4 is mounted on the Bluetooth speaker housing and positioned away from the power supply 3 and the speaker body 1. The integrated motherboard 4 is connected to the speaker body 1 and the power supply 3, thereby controlling the operation of the speaker body 1 and supplying power through the power supply 3.

[0033] The Bluetooth speaker housing includes a front shell 5 and a rear shell 6.

[0034] The front cover 5 is provided with multiple speaker mounting positions 7, and the speaker body 1 is mounted on the speaker mounting position 7; the rear cover 6 is provided with a motherboard mounting position 8, and the integrated motherboard 4 is mounted on the motherboard mounting position 8 of the rear cover 6.

[0035] The front shell 5 of the Bluetooth speaker housing is equipped with a C-shaped mesh 9, which avoids the button panel 10; the sound outlet holes on the mesh 9 correspond to the positions of the speaker body 1.

[0036] For ease of control, in this embodiment, the integrated motherboard 4 is provided with a button body for control, and the integrated motherboard 4 is covered with a button plate 10, and the button plate 10 corresponds to the button body of the integrated motherboard 4.

[0037] In order to enable charging functionality, in this embodiment, the integrated motherboard 4 is also equipped with a charging interface 11, and the button panel 10 is provided with a slot for the charging interface 11 to pass through; a cover 15 is provided on the slot.

[0038] To enhance its sealing performance, in this embodiment, a waterproof gasket 12 is provided between the motherboard mounting position 8 of the rear shell 6 and the button board 10; a waterproof gasket 12 is also provided between the speaker mounting position 7 of the front shell 5 and the speaker body 1.

[0039] In order to serve both decorative and diaphragm support purposes, decorative covers 13 are installed at both ends of the Bluetooth speaker housing in this embodiment. LED beads 15 are also provided on the integrated motherboard 4, and the LED beads 15 correspond to the decorative covers 13. The light emitted by the LED beads 15 passes through the decorative covers 13, thereby giving it a lighting effect.

[0040] To enhance its aesthetics, in this embodiment, a C-shaped mesh shell 14 is wrapped around the mesh fabric 9, and the mesh shell 14 is also positioned to avoid the button panel 10.

[0041] Traditional speakers require multiple interconnected PCBAs for isolation, sealing, waterproofing, heat dissipation, and lighting; however, this invention integrates the PCB board into a single PCBA via a mainboard 4, achieving the same sealing, heat dissipation, lighting, and waterproofing effects.

[0042] This invention avoids the heat accumulation effect between multiple motherboards by integrating the motherboard, reducing the risk of heat buildup and thus effectively reducing the possibility of device overheating, improving system stability and lifespan. The integrated motherboard also makes the Bluetooth speaker body lighter and improves the utilization efficiency of internal space.

[0043] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A novel integrated Bluetooth speaker with heat dissipation, sealing, and waterproofing, comprising a PCBA, characterized in that... include: A Bluetooth speaker housing, on which multiple speaker bodies (1) are mounted, and diaphragms (2) are mounted on both sides of the Bluetooth speaker housing; a power supply (3) is installed inside the Bluetooth speaker housing; An integrated motherboard (4) is mounted on the Bluetooth speaker housing and positioned away from the power supply (3) and the speaker body (1). The integrated motherboard (4) is connected to the speaker body (1) and the power supply (3) to control the operation of the speaker body (1) and to be powered by the power supply (3). The Bluetooth speaker housing includes a front shell (5) and a rear shell (6); The front shell (5) is provided with multiple speaker mounting positions (7), and the speaker body (1) is mounted on the speaker mounting position (7); the rear shell (6) is provided with a motherboard mounting position (8), and the integrated motherboard (4) is mounted on the motherboard mounting position (8) of the rear shell (6); A C-shaped mesh (9) is installed on the front shell (5) of the Bluetooth speaker housing, and the mesh (9) is positioned to avoid the button panel (10); the sound outlet mesh on the mesh (9) corresponds to the position of the speaker body (1); The integrated motherboard (4) is provided with a button body for control, and a button board (10) is provided on the integrated motherboard (4), and the button board (10) corresponds to the button body of the integrated motherboard (4). The integrated motherboard (4) is also equipped with a charging interface (11), and the button board (10) is provided with a slot for the charging interface (11) to pass through. A waterproof gasket (12) is provided between the motherboard mounting position (8) of the rear shell (6) and the button board (10); a waterproof gasket (12) is also provided between the speaker mounting position (7) of the front shell (5) and the speaker body (1).

2. The novel integrated Bluetooth speaker with heat dissipation, sealing, and waterproofing as described in claim 1, characterized in that: The Bluetooth speaker housing has decorative covers (13) installed at both ends; the integrated motherboard (4) is also provided with LED beads (16), and the LED beads (16) correspond to the decorative covers (13).

3. The novel integrated Bluetooth speaker with heat dissipation, sealing, and waterproofing as described in claim 1, characterized in that: The mesh fabric (9) is wrapped with a C-shaped mesh shell (14), and the mesh shell (14) is also arranged to avoid the button panel (10).

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