Thick film processing system

Abstract

The application discloses a thick film processing system, which comprises a control module, a thick film processing module, a thickness measuring module and an image module. The thick film processing module is electrically connected with the control module and is configured to form a thick film layer on a substrate under the control of the control module. The thickness measuring module is electrically connected with the control module and is configured to output thickness acquisition information to the control module according to the thickness of the thick film layer. The image module is electrically connected with the control module and is configured to acquire image information of the thick film layer and transmit the image information to the control module, so that the control module determines the thickness of the thick film layer and adjusts the processing parameters of the thick film processing module based on the thickness acquisition information and the image information. In this way, the thickness of the thick film layer can be acquired in real time during the processing, so that the processing process can be optimized in time and the work efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of thick film processing technology, and in particular to a thick film processing system. Background Technology

[0002] Thick film processing equipment is a device that uses printing technology to print electronic pastes of various properties onto a substrate to form a thick film layer. Currently, the method for measuring the thickness of thick film layers is as follows: after the thick film processing equipment has finished processing, the thickness is measured using a film thickness tester after the paste has cured.

[0003] However, this method separates the processing and measurement processes, resulting in lower work efficiency. Utility Model Content

[0004] This application provides a thick film processing system that can acquire the thickness of the thick film layer in real time during the processing, so as to optimize the processing process and improve work efficiency.

[0005] In a first aspect, embodiments of this application provide a thick film processing system, comprising: a control module; a thick film processing module electrically connected to the control module and configured to form a thick film layer on a substrate under the control of the control module; a thickness measurement module electrically connected to the control module and configured to output thickness acquisition information to the control module based on the thickness of the thick film layer; and an image module electrically connected to the control module and configured to acquire image information of the thick film layer and transmit it to the control module, so that the control module determines the thickness of the thick film layer and adjusts the processing parameters of the thick film processing module based on the thickness acquisition information and the image information.

[0006] In one or more embodiments, the thick film processing system further includes: an encoder module electrically connected to the control module, configured to transmit multiple positional information of the substrate to which the thick film layer is to be formed to the control module, so that the control module controls the operation of the thick film processing module according to the positional information to form a thick film layer on the substrate.

[0007] In one or more embodiments, the thick film processing system further includes: a temperature sensor disposed on the thick film processing module and electrically connected to the control module, configured to output a temperature detection signal to the control module based on the temperature of the environment in which the thick film processing module is located, so that the control module determines the temperature of the environment in which the thick film processing module is located based on the temperature detection signal.

[0008] In one or more embodiments, the thick film processing system further includes: a humidity sensor disposed on the thick film processing module and electrically connected to the control module, configured to output a humidity detection signal to the control module based on the humidity of the environment in which the thick film processing module is located, so that the control module determines the humidity of the environment in which the thick film processing module is located based on the humidity detection signal.

[0009] In one or more embodiments, the control module includes: a programmable logic controller (PLC) electrically connected to the thick film processing module, the thickness measurement module, and the image module, configured to control the thick film processing module and receive the thick film acquisition signal and the image information; and a computer electrically connected to the PLC, configured to send the processing parameters to the PLC so that the PLC controls the thick film processing module according to the processing parameters, and to receive and display the thick film acquisition signal and the image information.

[0010] In one or more embodiments, the thickness measurement module includes a laser thickness gauge.

[0011] In one or more embodiments, the image module includes a line scan camera.

[0012] In one or more embodiments, the thick film processing module includes a printer, a sprayer, and a coating machine.

[0013] In one or more embodiments, the printing press includes a printing fixture on which the substrate is disposed.

[0014] The beneficial effects of this application are as follows: The thick film processing system of this application includes a control module, a thick film processing module, a thickness measurement module, and an image module. The thick film processing module is electrically connected to the control module, and is controlled by the control module to form a thick film layer on the substrate. The thickness measurement module is also electrically connected to the control module, and outputs thickness acquisition information to the control module based on the thickness of the thick film layer. The image module is electrically connected to the control module, acquires image information of the thick film layer, and transmits it to the control module, enabling the control module to determine the thickness of the thick film layer and adjust the processing parameters of the thick film processing module based on the thickness acquisition information and the image information. Through the above process, during the processing of the thick film processing module, the control module can determine the thickness of the thick film layer in real time based on the thickness acquisition information and the image information, and adjust the processing parameters of the thick film processing module in a timely manner, thus optimizing the processing process and improving work efficiency. Attached Figure Description

[0015] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are not intended to limit the embodiments, and elements having the same reference numerals in the drawings are designated as similar elements.

[0016] Figure 1 This is a schematic diagram of the composition of the thick film processing system provided in the embodiments of this application. Figure 1 ; Figure 2 This is a schematic diagram of the composition of the thick film processing system provided in the embodiments of this application. Figure 2 ; Figure 3 This is a schematic diagram of the composition of the thick film processing system provided in the embodiments of this application. Figure 3 ; Figure 4 This is a schematic diagram of the thick film processing system provided in the embodiments of this application. Figure 1 ; Figure 5 This is a schematic diagram of the thick film processing system provided in the embodiments of this application. Figure 2 ; Figure 6 This is a schematic diagram of the composition of the thick film processing system provided in the embodiments of this application. Figure 4 . Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0018] It should be noted that when an element is described as "connected" to another element, it can be directly connected to the other element, or there can be one or more intermediate elements between them.

[0019] Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0020] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the composition of the thick film processing system provided in the embodiments of this application. Figure 1 As shown, the thick film processing system 100 includes a control module 10, a thick film processing module 20, a thickness measurement module 30, and an image module 40.

[0021] The control module 10 can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a microcontroller, an ARM (Acorn RISC Machine) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination of these components. Furthermore, the control module 10 can also be any conventional processor, controller, microcontroller, or state machine. The control module 10 can also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors combined with a DSP, and / or any other such configuration.

[0022] The thick film processing module 20 is electrically connected to the control module 10. The thick film processing module 20 is configured to form a thick film layer on a substrate under the control of the control module 10. Specifically, the thick film processing module 20 mainly utilizes screen printing technology to precisely deposit electronic pastes with specific electrical properties (such as conductivity, resistance, and insulation) onto the surface of rigid substrates such as ceramics, glass, or metal-coated ceramics according to a preset circuit pattern. The substrate, also often referred to as a base plate or substrate, is the underlying material that serves as the foundation for supporting other materials or structures. The substrate is the physical support platform for the entire structure, and subsequent processes (such as printing, coating, deposition, and welding) are all performed on the substrate.

[0023] The thickness measurement module 30 is electrically connected to the control module 10. The thickness measurement module 30 is configured to output thickness acquisition information to the control module 10 based on the thickness of the thick film layer. The thickness measurement module 30 measures the actual thickness of the thick film layer and sends the acquired thickness data as thickness acquisition information to the control module 10. Subsequently, the control module 10 can determine the thickness of the thick film layer based on the thickness acquisition information.

[0024] In some embodiments, the thickness measurement module 30 includes a laser thickness gauge. A laser thickness gauge is a precision instrument that uses laser technology to measure the thickness of an object non-contactly. The laser thickness gauge can convert the physical thickness of a thick film layer into a precise electrical signal.

[0025] Image module 40 is electrically connected to control module 10. Image module 40 is configured to acquire image information of the thick film layer and transmit it to control module 10, so that control module 10 can determine the thickness of the thick film layer and adjust the processing parameters of thick film processing module 20 (e.g., speed, pressure, distance, etc.) based on the thickness acquisition information and image information. Image module 40 takes pictures or scans the thick film to acquire its image information and transmits the image information to control module 10. Control module 10 can use image processing algorithms to analyze the image information, including image filtering, edge detection, feature extraction, etc., to identify the thickness of the thick film layer. In some embodiments, the features of the printed pattern and possible defects can also be identified. For example, the boundary of the printed pattern can be accurately determined by the edge detection algorithm, thereby calculating the size and shape parameters of the pattern. The analysis results are compared with preset standards to determine whether the printing quality is qualified. If the detection results are found to exceed the allowable tolerance range or have defects, for example, for high-precision thick film circuit printing, the tolerance of line width may need to be controlled within ±5μm. The system checks the printed graphic for completeness, checking for defects such as missing edges, broken corners, burrs, blockages during printing, or other deformations caused by other reasons. The system automatically issues an alarm and feeds relevant information back to the operator or equipment control system. Operators can then adjust printing parameters or perform equipment maintenance based on the feedback to correct printing defects.

[0026] In some embodiments, the image module 40 includes a line scan camera. A line scan camera is suitable for applications requiring high resolution and continuous image acquisition. Unlike area scan cameras, a line scan camera captures only one dimension of image information at a time, i.e., one row of pixels, constructing a two-dimensional image through the relative motion of the object or the camera. This characteristic makes line scan cameras suitable for high-speed, high-precision continuous surface inspection tasks.

[0027] In related technologies, the thickness of thick films is measured by using a film thickness tester after the slurry has cured following processing on the thick film processing equipment. This method separates the processing and measurement processes, resulting in low work efficiency and potentially poor accuracy in the thickness of the thick film due to the inability to adjust the processing in real time.

[0028] In the embodiments of this application, by setting a thickness measurement module 30 and an image module 40, the control module 10 can accurately determine the thickness of the thick film layer in real time based on the thickness acquisition information and image information during the processing of the thick film processing module 20, and adjust the processing parameters of the thick film processing module 20 in a timely manner, that is, optimize the processing process in a timely manner, improve work efficiency, and improve the accuracy of the thickness of the thick film layer by adjusting the processing parameters of the thick film processing module 20 in real time.

[0029] In some embodiments, such as Figure 2 As shown, the control module 10 includes a programmable logic controller 11 and a computer 12.

[0030] The programmable logic controller (PLC) 11 is electrically connected to the thick film processing module 20, the thickness measurement module 30, and the image module 40. The PLC 11 is configured to control the thick film processing module 20 and receive thick film acquisition signals and image information. The PLC 11 is a digital computing electronic system designed specifically for industrial environments to control various machines and production processes. The PLC 11 includes a central processing unit (CPU), memory, input / output (I / O) modules, a power supply module, a programming device, and a communication interface.

[0031] Computer 12 is electrically connected to programmable logic controller 11. Computer 12 is configured to send processing parameters to programmable logic controller 11, so that programmable logic controller 11 controls thick film processing module 20 according to the processing parameters, and receives and displays thick film acquisition signals and image information. Computer 12 is an electronic device capable of automatically and quickly performing numerical calculations and logical operations, and capable of storing and processing information. Computer 12 includes an arithmetic logic unit, a control unit, a memory, input devices, and output devices.

[0032] In some embodiments, the computer 12 further uploads the data it obtains to systems such as production management systems (MES) to achieve historical data recording and analysis.

[0033] In some embodiments, such as Figure 3 As shown, the thick film processing module 20 includes a printing machine 21, a spraying machine 22, and a coating machine 23.

[0034] The printing press 21 is used to precisely transfer prepared electronic pastes (such as silver paste, resistive paste, and dielectric paste) onto a ceramic substrate through a screen template to form circuit patterns (such as conductors, pads, and resistors). Please refer to [the relevant documentation / reference]. Figure 4 and Figure 5 , Figure 4 and Figure 5Two different structures of a thick film processing system are shown. The printing machine 21 includes a printing fixture 211, which refers to the various jigs, fixtures, and auxiliary devices used during the printing process to fix the substrate, ensure positioning accuracy, and guarantee printing consistency. The substrate 200 is mounted on the printing fixture 211. The measuring axis of the detection device 80 is perpendicular to the surface of the substrate 200. The detection device 80 includes a thickness measuring module 30 and an image module 40. The spraying machine 22 is used to form thick films by spraying, especially suitable for workpieces with complex shapes, large curvatures, or requiring localized thickening. The spraying machine 22 includes types such as plasma spraying, cold spraying, or electrostatic spraying. The coating machine 23 is used to form large-area, uniform thick films, or to provide a base layer for subsequent processing (such as photolithography or laser processing). The coating machine 23 includes types such as blade coating, slot extrusion coating, and roller coating.

[0035] In some embodiments, such as Figure 6 As shown, the thick film processing system 100 also includes an encoder module 50.

[0036] The encoder module 50 is electrically connected to the control module 10. The encoder module 50 is configured to transmit multiple positional information of the substrate to be formed into a thick film layer to the control module 10, so that the control module 10 controls the operation of the thick film processing module 20 according to the positional information to form a thick film layer on the substrate. The encoder module 50 can convert mechanical displacement (rotational or linear motion) into electrical signals to measure and feedback position, speed, direction, and acceleration in real time and with high accuracy.

[0037] Please continue to refer to Figure 6 In some embodiments, the thick film processing system 100 also includes a temperature sensor 60.

[0038] Temperature sensor 60 is disposed in thick film processing module 20 and electrically connected to control module 10. Temperature sensor 60 is configured to output a temperature detection signal to control module 10 based on the temperature of the environment in which thick film processing module 20 is located, so that control module 10 can determine the temperature of the environment in which thick film processing module 20 is located based on the temperature detection signal. Temperature sensor 60 can sense the temperature of the environment or object and convert it into a measurable electrical signal (such as voltage, current, resistance, or digital signal). Therefore, temperature sensor 60 can measure temperature accurately in real time, providing feedback to control module 10 to achieve precise temperature control, monitoring, and alarm functions.

[0039] Please continue to refer to Figure 6 In some embodiments, the thick film processing system 100 also includes a humidity sensor 60.

[0040] The humidity sensor 60 is located in the thick film processing module and electrically connected to the control module 10. The humidity sensor 60 is configured to output a humidity detection signal to the control module 10 based on the humidity of the environment in which the thick film processing module 20 is located, so that the control module 10 can determine the humidity of the environment in which the thick film processing module 20 is located based on the humidity detection signal. The humidity sensor 60 measures the water vapor content in the air, converting the physical quantity of humidity into a measurable electrical signal (such as voltage, current, resistance, or digital signal). By integrating the humidity sensor 60 into the thick film processing system 100 and linking it with the control module 10, automatic adjustment and alarm functions for environmental parameters are achieved.

[0041] It should be noted that, as Figures 2-3 , Figure 6 The hardware structure of the thick film processing system 100 shown is merely an example, and the thick film processing system 100 may have more or fewer components than those shown in the figure, may combine two or more components, or may have different component configurations. The various components shown in the figure may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits. For example, in some embodiments, the thick film processing system 100 also includes an ADC (Analog-to-Digital Converter) module, which converts continuous analog signals from sensors (such as the thickness measurement module 30 and the image module 40) into discrete digital signals that the control module 10 can understand and process.

[0042] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

[0043] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thick film processing system, characterized in that, include: Control module; A thick film processing module, electrically connected to the control module, is configured to form a thick film layer on a substrate under the control of the control module. The thickness measurement module is electrically connected to the control module and is configured to output thickness acquisition information to the control module based on the thickness of the thick film layer. An image module, electrically connected to the control module, is configured to acquire image information of the thick film layer and transmit it to the control module, so that the control module can determine the thickness of the thick film layer and adjust the processing parameters of the thick film processing module based on the thickness acquisition information and the image information.

2. The thick film processing system according to claim 1, characterized in that, The thick film processing system also includes: An encoder module, electrically connected to the control module, is configured to transmit multiple positional information of the substrate to which the thick film layer is to be formed to the control module, so that the control module controls the operation of the thick film processing module according to the positional information to form a thick film layer on the substrate.

3. The thick film processing system according to claim 1, characterized in that, The thick film processing system also includes: A temperature sensor is located in the thick film processing module and electrically connected to the control module. It is configured to output a temperature detection signal to the control module based on the temperature of the environment in which the thick film processing module is located, so that the control module can determine the temperature of the environment in which the thick film processing module is located based on the temperature detection signal.

4. The thick film processing system according to claim 1, characterized in that, The thick film processing system also includes: A humidity sensor is disposed in the thick film processing module and electrically connected to the control module. It is configured to output a humidity detection signal to the control module based on the humidity of the environment in which the thick film processing module is located, so that the control module can determine the humidity of the environment in which the thick film processing module is located based on the humidity detection signal.

5. The thick film processing system according to any one of claims 1-4, characterized in that, The control module includes: A programmable logic controller, electrically connected to the thick film processing module, the thickness measurement module and the image module, is configured to control the thick film processing module and receive the thickness acquisition information and the image information; A computer, electrically connected to the programmable logic controller (PLC), is configured to send the processing parameters to the PLC so that the PLC controls the thick film processing module according to the processing parameters, and to receive and display the thickness acquisition information and the image information.

6. The thick film processing system according to any one of claims 1-4, characterized in that, The thickness measurement module includes a laser thickness gauge.

7. The thick film processing system according to any one of claims 1-4, characterized in that, The image module includes a line scan camera.

8. The thick film processing system according to any one of claims 1-4, characterized in that, The thick film processing module includes a printing machine, a spraying machine, and a coating machine.

9. The thick film processing system according to claim 8, characterized in that, The printing press includes a printing fixture, and the substrate is disposed on the printing fixture.

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