Middle frame and electronic device

CN224875219UActive Publication Date: 2026-10-20HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202521910628.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-04
Publication Date
2026-10-20
Estimated Expiration
2035-09-04

AI Technical Summary

Technical Problem

然而,第一搭接部设置在容置空间的侧壁上,为了保证容置空间的空间足够大,需减小边框的厚度,导致边框的强度不足,容易发生变形

Benefits of technology

[0027]本申请实施例提供的电子设备,包括上述任一实施例中的中框,因此二者能够解决相同的技术问题,并实现相同的技术效果。

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of electronic equipment, in particular to a middle frame and electronic equipment. The application aims to solve the problem of insufficient strength of the frame and easy deformation. The application provides a middle frame, which comprises a frame, a middle plate and a connecting piece. The frame surrounds a containing space, the middle plate is arranged in the containing space, and the middle plate divides the containing space into a first containing space and a second containing space arranged along the center line direction of the containing space. The connecting piece is located in the first containing space, one end of the connecting piece is connected with a first connecting surface, and the other end of the connecting piece is connected with a second connecting surface. The frame and the middle plate are connected through the connecting piece, so that the connection between the frame and the middle plate is transferred from the containing space to the outside of the containing space, the connecting piece does not affect the size of the containing space, the thickness of the frame is ensured, the strength of the frame is guaranteed, the frame is prevented from deforming, and the stability of the electronic equipment is improved.
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Description

Technical Field

[0001] This application relates to the field of electronic device technology, specifically to a mid-frame and an electronic device. Background Technology

[0002] Electronic devices (such as mobile phones and tablets) generally include a mid-frame, which comprises a border and a mid-plate. The border encloses an accommodating space, and the mid-plate is disposed within this space. A first overlapping portion is located on the side wall of the accommodating space, and a second overlapping portion is located on the edge of the mid-plate. The first overlapping portion covers the second overlapping portion and is welded to it to achieve the connection between the border and the mid-plate. However, since the first overlapping portion is located on the side wall of the accommodating space, to ensure a sufficiently large accommodating space, the thickness of the border needs to be reduced, resulting in insufficient strength of the border and making it prone to deformation. Utility Model Content

[0003] This application provides a mid-frame and an electronic device that can improve the strength of the frame and prevent the mid-frame from deforming.

[0004] In a first aspect, embodiments of this application provide a mid-frame, including a frame, a mid-plate, and a connector. The frame encloses an accommodating space, and the mid-plate is disposed within the accommodating space, dividing the accommodating space into a first accommodating space and a second accommodating space disposed along the centerline of the accommodating space. The connector is located within the first accommodating space, with a first connecting surface on the frame and a second connecting surface on the mid-plate, both the first and second connecting surfaces being perpendicular to the centerline of the accommodating space. One end of the connector is connected to the first connecting surface, and the other end of the connector is connected to the second connecting surface.

[0005] The frame and the middle plate are connected by connectors, which moves the connection between the frame and the middle plate from inside the accommodating space to outside the accommodating space. This avoids the connectors affecting the size of the accommodating space, thereby ensuring the thickness and strength of the frame, preventing frame deformation, and improving the stability of the electronic device.

[0006] Meanwhile, the connection between the frame and the middle plate via connectors reduces the contact area between them, preventing heat from internal components from being rapidly transferred to the frame through the middle plate, thus reducing the heat perceived by the user, lowering the heat transfer rate between the frame and the middle plate, and reducing the heat transferred to the frame, thereby improving the user experience of electronic devices.

[0007] In some embodiments that may include the above embodiments, the first connecting surface and the second connecting surface are spaced apart along the center line of the accommodating space. The connector includes a first plate, a second plate, and a third plate. The first plate is connected to the first connecting surface, the second plate is connected to the second connecting surface, and the third plate is disposed between the first plate and the second plate. The third plate is connected to both the first plate and the second plate, and the third plate is perpendicular to both the first plate and the second plate.

[0008] The first and second connecting surfaces are spaced apart along the centerline of the accommodating space, meaning that the first and second connecting surfaces have different heights in the thickness direction of the middle frame. The first plate is connected to the first connecting surface, and the second plate is connected to the second connecting surface. Due to the height difference between the first and second connecting surfaces, there is also a height difference between the first and second plates.

[0009] The third plate is perpendicular to both the first and second plates, and is connected to both. In other words, the extension direction of the third plate is parallel to the thickness direction of the middle frame. There is a bend between the first and third plates, and also between the second and third plates.

[0010] When the middle frame is subjected to force due to a drop or impact, the position of the frame and the middle plate may change. Since there are angles between the third plate and the first plate, and between the third plate and the second plate, the force on the frame and the middle plate will act on the connector, causing the angle of the angle to change. The connector can play a buffering role, absorbing the force on the frame and the middle plate, reducing the force on the frame and the middle plate, and ensuring the stability of the connection between the connector and the middle plate and the frame.

[0011] In some embodiments that may include the above embodiments, the connector includes a first plate and a second plate. One end of the first plate is connected to a first connecting surface, and the other end of the first plate is connected to one end of the second plate. The other end of the second plate is connected to a second connecting surface. The length direction of the first plate and the length direction of the second plate intersect in a plane parallel to the middle plate.

[0012] The length directions of the first and second plates intersect in a plane parallel to the middle plate. This means that the first and second plates are inclined relative to the centerline of the accommodating space, forming a bend between them. When the middle frame is subjected to impact, the relative positions of the frame and the middle plate change. Because the connector is connected to the frame and the middle plate, it is subjected to forces from these components and deforms. The force on the connector is concentrated at the bend. The first and second plates can open or close under stress, buffering the impact on the middle frame and ensuring the stability of the connection between the connector and the frame and the middle plate.

[0013] In some embodiments that may include the above-described embodiments, the connector includes a first plate, a second plate, a third plate, and a fourth plate. The first plate is connected to a first connecting surface, the second plate is connected to a second connecting surface, and the third and fourth plates are both disposed between the first and second plates. One end of the third plate is connected to the first plate, and the other end of the third plate is connected to one end of the fourth plate. The other end of the fourth plate is connected to the second plate. The length directions of the third and fourth plates intersect in a plane parallel to the middle plate.

[0014] The length directions of the third and fourth plates intersect in a plane parallel to the middle plate, meaning that the third and fourth plates are inclined relative to the centerline of the accommodating space. The third and fourth plates are positioned between the first and second plates, and there are angles between the first and third plates, between the third and fourth plates, and between the fourth and second plates.

[0015] When the mid-frame is subjected to impact, the relative positions of the frame and the mid-plate change. Since the connector is connected to the frame and the mid-plate, the connector will be subjected to the force of the frame and the mid-plate and will deform. The force on the connector is concentrated at the corner. The first and second plates can open or close when subjected to force to buffer the impact of the mid-frame and ensure the stability of the connection between the connector and the mid-plate and the frame.

[0016] In some embodiments that may include the above embodiments, the first plate is welded to the first connecting surface, and the second plate is welded to the second connecting surface.

[0017] Welding the first plate to the first connecting surface and the second plate to the second connecting surface ensures a tighter connection between the first plate and the first connecting surface, as well as between the second plate and the second connecting surface, thus improving the stability of the middle frame.

[0018] In some embodiments that may include the above embodiments, the connector is an elastic element.

[0019] The connector is an elastic component. When the middle frame is subjected to impact force and the relative position of the side frame and the middle plate changes, the elastic component is subjected to the force of the middle plate and the side frame, and will undergo elastic deformation to absorb impact energy, reduce the impact force on the side frame and the middle plate, and improve the stability of the side frame and the middle plate.

[0020] In some embodiments that may include the above embodiments, the middle frame further includes a filling portion that fills the space between the border and the middle plate, and the filling portion is connected to both the border and the middle plate.

[0021] There is a gap between the frame and the middle plate. The filler material fills the gap between the frame and the middle plate, which enhances the connection strength and sealing performance between them, improves the stability and reliability of the middle frame, reduces impact damage to the circuit board during drops or collisions, and provides cushioning for the middle frame. The filler material also prevents liquids and dust from entering the interior of the middle frame, protecting the circuit board from the influence of the external environment.

[0022] In some embodiments that may include the above embodiments, the middle frame further includes an antenna radiator disposed on the frame and electrically connected to the connector.

[0023] The antenna radiator is mounted on the frame and electrically connected to the connector. Since the connector is connected to both the frame and the middle plate, the antenna radiator can be connected to the middle plate. The circuit board on the middle plate has a reference ground, which can act as the ground plane for the antenna radiator, allowing it to form a loop. The antenna radiator can be connected to the ground on the circuit board via a grounding pin. Simultaneously, the antenna radiator can also be connected to the radio frequency (RF) circuit on the circuit board via a feed pin to receive signals from the RF circuit, thus enabling signal transmission and reception.

[0024] In some embodiments that may include the above embodiments, the frame includes an antenna radiator.

[0025] The bezel, including the antenna radiator, improves the space utilization of the mid-frame and saves storage space. Simultaneously, because the bezel is located on the outside of the electronic device, the antenna radiator is less likely to be blocked by other components on the device, resulting in a smoother radiation path for electromagnetic waves, optimized antenna radiation efficiency, and improved signal stability.

[0026] Secondly, embodiments of this application provide an electronic device, including a display panel, a cover plate, and the aforementioned mid-frame, wherein the display panel covers one side of the mid-frame and the cover plate covers the other side of the mid-frame.

[0027] The electronic device provided in this application includes the mid-frame in any of the above embodiments, so both can solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0028] Figure 1 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 1 ;

[0029] Figure 2 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 2 ;

[0030] Figure 3 Schematic diagram of the structure of the electronic device provided in the embodiments of this application Figure 3 ;

[0031] Figure 4 This is a schematic diagram of the structure of the middle frame in the related technology;

[0032] Figure 5 for Figure 4 Sectional view along axis AA;

[0033] Figure 6 This is a schematic diagram of the structure of the middle frame provided in an embodiment of this application;

[0034] Figure 7 for Figure 6 BB-direction sectional view;

[0035] Figure 8 A schematic diagram of the connection between the frame and the middle plate provided in the embodiments of this application via connectors. Figure 1 ;

[0036] Figure 9 A schematic diagram of the connection between the frame and the middle plate provided in the embodiments of this application via connectors. Figure 2 ;

[0037] Figure 10 This is a schematic diagram of the middle frame structure in the injection molding process provided in an embodiment of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 10: Electronic device; 11: Display panel; 12: Cover plate; 13: Battery; 20: Middle frame; 21: Frame; 211: First connecting surface; 212: Accommodating space; 22: Middle plate; 221: Second connecting surface; 23: Connector; 24: First overlapping part; 25: Second overlapping part; 26: Filling part; 31: First plate; 32: Second plate; 33: Third plate; 34: Fourth plate; 41: First welding part; 42: Second welding part; 51: First accommodating space; 52: Second accommodating space. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0042] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0043] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0044] Please refer to Figure 1 and Figure 2 This application provides an electronic device 10, including a display panel 11, a cover plate 12, and a mid-frame 20. This application does not limit the electronic device 10; for example, the electronic device 10 may include a mobile phone, tablet computer, laptop computer, smart home device, smart wearable device (e.g., smartwatch, smart bracelet, smart glasses, smart helmet), virtual reality (VR) electronic device, augmented reality (AR) electronic device, etc.

[0045] The length direction of electronic device 10 is the x-direction, the width direction is the y-direction, and the thickness direction is the z-direction. The length direction of the middle frame 20 is the same as the length direction of electronic device 10, the width direction of the middle frame 20 is the same as the width direction of electronic device 10, and the thickness direction of the middle frame 20 is the same as the thickness direction of electronic device 10. These details will not be repeated below.

[0046] The display panel 11 covers one side of the mid-frame 20, and the cover plate 12 covers the other side of the mid-frame 20. The space enclosed by the cover plate 12 and the mid-frame 20 can accommodate internal components such as batteries, circuit boards, and camera modules. The cover plate 12 can isolate external dust, foreign objects, etc., and reduce the direct damage to internal components from impact when the electronic device 10 is accidentally dropped or bumped.

[0047] This application does not limit the connection method between the cover plate 12 and the middle frame 20. For example, in some embodiments, the edge of the cover plate 12 is provided with elastic buckles, and the corresponding position of the middle frame 20 is provided with a slot. During assembly, pressing causes the buckles to engage with the slots, thus connecting the housing and the middle frame 20. In other embodiments, the middle frame 20 is provided with threaded holes, and the corresponding position of the cover plate 12 is provided with through holes. Bolts pass through the through holes and engage with the threaded holes, thus connecting the cover plate 12 and the middle frame 20. In still other embodiments, the cover plate 12 and the middle frame 20 can be bonded together with adhesives (e.g., epoxy glue, acrylic glue, etc.).

[0048] This application does not limit the display panel 11. For example, the display panel 11 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display panel, a micro light-emitting diode (MicroLED) display panel, or a quantum dot light-emitting diode (QLED) display panel, etc.

[0049] Please refer to Figure 3 The electronic device 10 provided in this application embodiment also includes a battery 13 and a circuit board, which are disposed between the middle frame 20 and the cover plate 12. Figure 2 Within the space enclosed (as shown), battery 13 provides power to the circuit board, which is equipped with a processor. The processor provides display data to the display screen to drive the display screen to display images.

[0050] For example, the processor described above may include one or more processing units, such as: an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU), etc. The different processing units may be independent devices or integrated into one or more processors.

[0051] In addition, the aforementioned electronic device 10 also includes a gyroscope sensor, a Hall sensor, an external memory interface, an internal memory, a universal serial bus (USB) interface, a charging management module, a power management module, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, and a sensor module, etc., which are electrically connected to the processor.

[0052] Continue to refer to Figure 3 The middle frame 20 provided in this embodiment includes a side frame 21 and a middle plate 22. The side frame 21 encloses an accommodating space 212. The side frame 21 is used to connect with the cover plate 12. Figure 2 (as shown) and display panel 11 ( Figure 1 The connection (shown) allows it to directly withstand impact forces, reducing the risk of damage to the display panel 11 or cover plate 12. The middle plate 22 is connected to the frame 21, with the middle frame 20 located inside the frame 21, and the middle plate 22 positioned within the accommodating space 212. The middle plate 22 is used to secure circuit boards, batteries, camera modules, etc., preventing internal components from shifting or being damaged when the electronic device 10 shakes or falls. The middle plate 22 improves the bending and compression resistance of the electronic device 10, preventing damage to internal components due to external deformation (e.g., circuit board breakage, display screen leakage).

[0053] This application does not limit the processing technology of the middle frame 20. For example, the middle frame 20 can be processed by forging, stamping, die casting, or computerized numerical control (CNC). The processing technologies of the frame 21 and the middle plate 22 can be the same or different.

[0054] For example, in some embodiments, both the frame 21 and the middle plate 22 can be manufactured using computer-controlled digital processing. In other embodiments, the frame 21 can be manufactured using computer-controlled digital processing, while the middle plate 22 can be manufactured using die casting.

[0055] It is understandable that in embodiments where the middle frame 20 is manufactured using a forging process, the middle frame 20 has higher strength. In embodiments where the middle frame 20 is manufactured using a stamping process, the manufacturing cost of the middle frame 20 is lower and the preparation time is shorter. In embodiments where the middle frame 20 is manufactured using a die-casting process, the middle frame 20 has higher strength and simpler manufacturing steps. In embodiments where the middle frame 20 is manufactured using computer-controlled digital processing, the middle frame 20 has higher precision. A suitable processing technology can be selected based on the actual production needs of the middle frame 20.

[0056] Please refer to Figure 4 and Figure 5 , Figure 5 for Figure 4 A cross-sectional view along line AA. In related technologies, the sidewall of the frame 21 has a first overlapping portion 24, and the edge of the middle plate 22 has a second overlapping portion 25. The first overlapping portion 24 covers the second overlapping portion 25, and the first overlapping portion 24 and the second overlapping portion 25 are welded to achieve the connection between the middle plate 22 and the frame 21. However, since the first overlapping portion 24 is located on the sidewall of the frame 21, in order to ensure that the accommodating space 212 is large enough, the thickness of the frame 21 needs to be reduced, resulting in insufficient strength of the frame 21, which is prone to deformation, causing the internal functions of the electronic device 10 to fail (e.g., antenna failure, black spots on the display screen, etc.), and reducing the stability of the electronic device 10.

[0057] Please refer to Figure 3 , Figure 6 and Figure 7 , Figure 3 The dashed line in the diagram represents the centerline of the accommodating space 212. The mid-frame 20 provided in this embodiment includes a side frame 21, a mid-plate 22, and a connector 23. The side frame 21 encloses the accommodating space 212, and the mid-plate 22 is disposed within the accommodating space 212. The mid-plate 22 divides the accommodating space 212 into a first accommodating space 51 and a second accommodating space 52 disposed along the centerline direction of the accommodating space 212. It can be understood that the center of the accommodating space 212 is the geometric center of the side frame, and the extension direction of the centerline of the accommodating space 212 is parallel to the thickness direction z of the mid-frame 20.

[0058] The connector 23 is located within the first accommodating space 51. A first connecting surface 211 is provided on the frame 21, and a second connecting surface 221 is provided on the middle plate 22. Both the first connecting surface 211 and the second connecting surface 221 are perpendicular to the center line of the accommodating space 212. One end of the connector 23 is connected to the first connecting surface 211, and the other end of the connector 23 is connected to the second connecting surface 221.

[0059] The location of the first accommodating space 51 is not limited in this embodiment. For example, the first accommodating space 51 may be located between the middle plate 22 and the display panel 11, and correspondingly, the second accommodating space 52 may be located between the middle plate 22 and the cover plate 12; the first accommodating space 51 may also be located between the middle plate 22 and the cover plate 12, and the second accommodating space 52 may be located between the middle plate 22 and the display panel 11. Figure 7 This is a cross-sectional view showing that the first accommodating space 51 is located between the middle plate 22 and the display panel 11, and the second accommodating space 52 is located between the middle plate 22 and the cover plate 12.

[0060] The frame 21 and the middle plate 22 are connected by the connector 23, so that the connection between the frame 21 and the middle plate 22 is moved from inside the accommodating space 212 to outside the accommodating space 212. This avoids the connector 23 affecting the size of the accommodating space 212, thereby ensuring the thickness of the frame 21, ensuring the strength of the frame 21, preventing the frame 21 from deforming, and improving the stability of the electronic device 10.

[0061] Meanwhile, the frame 21 and the middle plate 22 are connected by a connector 23, which can reduce the contact area between the frame 21 and the middle plate 22, and prevent the heat of the internal components from being quickly transferred to the frame 21 through the middle plate 22, so that the user can feel the heat significantly. This reduces the heat transfer rate between the frame 21 and the middle plate 22, reduces the heat transferred to the frame 21, and thus improves the user experience of the electronic device 10.

[0062] This application embodiment does not limit the number of connectors 23. For example, the number of connectors 23 can be one or more. It is understood that the more connectors 23 there are, the higher the connection strength between the frame 21 and the middle plate 22. This application embodiment also does not limit the thickness and width of the connectors 23. It is understood that the greater the thickness and width of the connectors 23, the higher the strength of the connectors 23.

[0063] However, the thickness of connector 23 is affected by the thickness of frame 21 and middle plate 22, and the width of connector 23 is affected by the edge shape of frame 21 and middle plate 22. The thickness and width of connector 23 can be adjusted according to the actual structure of middle frame 20 to select a suitable connector 23.

[0064] Please refer to Figure 7 In some embodiments, the first connecting surface 211 and the second connecting surface 221 are spaced apart along the centerline direction of the accommodating space 212. It can be understood that the centerline direction of the accommodating space 212 is also the thickness direction z of the middle frame 20. Figure 6 (As shown). The first connecting surface 211 and the second connecting surface 221 are spaced apart along the center line of the accommodating space 212. That is, the first connecting surface 211 and the second connecting surface 221 have different heights in the thickness direction z of the middle frame 20.

[0065] The different heights of the frame 21 and the middle plate 22 allow for a certain space between the middle plate 22 and the cover plate 12, enabling internal components such as circuit boards and batteries to be installed within the accommodating space 212 between the middle plate 22 and the cover plate 12. When the phone is dropped or impacted, the frame 21 is the main stress-bearing area, and the height difference between the frame 21 and the middle plate 22 can absorb some of the impact force, reducing the stress transmitted to the middle plate 22.

[0066] The connector 23 includes a first plate 31, a second plate 32 and a third plate 33. The first plate 31 is connected to the first connecting surface 211, the second plate 32 is connected to the second connecting surface 221, and the third plate 33 is disposed between the first plate 31 and the second plate 32. The third plate 33 is connected to both the first plate 31 and the second plate 32, and is perpendicular to both the first plate 31 and the second plate 32.

[0067] This application does not limit the connection between the first plate 31, the second plate 32, and the third plate 33. For example, in some embodiments, the first plate 31, the second plate 32, and the third plate 33 can be formed separately, and then connected by welding or bonding. In other embodiments, the first plate 31, the second plate 32, and the third plate 33 can be formed integrally.

[0068] The first plate 31 is connected to the first connecting surface 211, and the second plate 32 is connected to the second connecting surface 221. Due to the height difference between the first connecting surface 211 and the second connecting surface 221, there is also a height difference between the first plate 31 and the second plate 32. The third plate 33 is perpendicular to both the first plate 31 and the second plate 32, and is connected to both the first plate 31 and the second plate 32. That is, the extension direction of the third plate 33 is parallel to the thickness direction z of the middle frame 20. There is a bend between the first plate 31 and the third plate 33, and there is also a bend between the second plate 32 and the third plate 33.

[0069] When the middle frame 20 is subjected to force due to a drop or impact, the positions of the side frame 21 and the middle plate 22 may change. Since there are angles between the third plate 33 and the first plate 31, and between the third plate 33 and the second plate 32, the force on the side frame 21 and the middle plate 22 will act on the connector 23, causing the angle of the angle to change. The connector 23 can play a buffering role, absorbing the force on the side frame 21 and the middle plate 22, and reducing the force on the side frame 21 and the middle plate 22.

[0070] Please refer to Figure 8 In some embodiments, the connector 23 includes a first plate 31 and a second plate 32. One end of the first plate 31 is connected to the first connecting surface 211, and the other end of the first plate 31 is connected to one end of the second plate 32. The other end of the second plate 32 is connected to the second connecting surface 221. The length direction of the first plate 31 and the length direction of the second plate 32 intersect in a plane parallel to the middle plate 22.

[0071] This application does not limit the connection between the first plate 31 and the second plate 32. For example, in some embodiments, the first plate 31 and the second plate 32 can be formed separately, and then connected by welding or bonding. In other embodiments, the first plate 31 and the second plate 32 can be formed integrally.

[0072] The length directions of the first plate 31 and the second plate 32 intersect in a plane parallel to the middle plate 22. That is, the first plate 31 and the second plate 32 are inclined relative to the center line of the accommodating space 212, and there is a bend between the first plate 31 and the second plate 32.

[0073] This application does not limit the angle of the bend. For example, the angle of the bend can be greater than or equal to 30° and less than or equal to 160°. Optionally, the angle of the bend can be 30°, 60°, 90°, 120°, or 150°.

[0074] Since the first connecting surface 211 and the second connecting surface 221 are parallel, one end of the first plate 31 is connected to the first connecting surface 211, the other end of the first plate 31 is connected to the second plate 32, and the other end of the second plate 32 is connected to the second connecting surface 221. An angle is formed between the first plate 31 and the second plate 32, and the connector 23 is in the shape of a "V".

[0075] When the middle frame 20 is subjected to impact, the relative positions of the side frame 21 and the middle plate 22 change. Since the connector 23 is connected to the side frame 21 and the middle plate 22, the connector 23 will be subjected to the force of the side frame 21 and the middle plate 22 and will deform. The force on the connector 23 is concentrated at the corner. The first plate 31 and the second plate 32 can open or close when subjected to force to buffer the impact force of the middle frame 20 and ensure the stability of the connection between the connector 23 and the middle plate 22 and the side frame 21.

[0076] Please refer to Figure 9 In some embodiments, the connector 23 includes a first plate 31, a second plate 32, a third plate 33, and a fourth plate 34. The first plate 31 is connected to the first connecting surface 211, the second plate 32 is connected to the second connecting surface 221, and the third plate 33 and the fourth plate 34 are both disposed between the first plate 31 and the second plate 32. One end of the third plate 33 is connected to the first plate 31, and the other end of the third plate 33 is connected to one end of the fourth plate 34. The other end of the fourth plate 34 is connected to the second plate 32. The length direction of the third plate 33 and the length direction of the fourth plate 34 intersect in a plane parallel to the middle plate 22.

[0077] This application does not limit the connection between the first plate 31, the second plate 32, the third plate 33, and the fourth plate 34. For example, in some embodiments, the first plate 31, the second plate 32, the third plate 33, and the fourth plate 34 can be formed separately, and then the first plate 31 and the second plate 32 can be connected by welding or bonding. In other embodiments, the first plate 31, the second plate 32, the third plate 33, and the fourth plate 34 can be integrally formed.

[0078] The length directions of the third plate 33 and the fourth plate 34 intersect in a plane parallel to the middle plate 22. That is, the third plate 33 and the fourth plate 34 are inclined relative to the centerline of the accommodating space 212. The third plate 33 and the fourth plate 34 are disposed between the first plate 31 and the second plate 32. There are angles between the first plate 31 and the third plate 33, between the third plate 33 and the fourth plate 34, and between the fourth plate 34 and the second plate 32.

[0079] This application does not limit the angle of the bend. For example, the angle of the bend can be greater than or equal to 30° and less than or equal to 160°. Optionally, the angle of the bend can be 30°, 60°, 90°, 120°, or 150°.

[0080] Since there are bends between the first plate 31 and the third plate 33, the third plate 33 and the fourth plate 34, and the fourth plate 34 and the second plate 32, and one end of the first plate 31 is connected to the first connecting surface 211, and one end of the second plate 32 is connected to the second connecting surface 221, the connector 23 is in the shape of a "W".

[0081] When the middle frame 20 is subjected to impact, the relative positions of the side frame 21 and the middle plate 22 change. Since the connector 23 is connected to the side frame 21 and the middle plate 22, the connector 23 will be subjected to the force of the side frame 21 and the middle plate 22 and will deform. The force on the connector 23 is concentrated at the corner. The first plate 31 and the second plate 32 can open or close when subjected to force to buffer the impact force of the middle frame 20 and ensure the stability of the connection between the connector 23 and the middle plate 22 and the side frame 21.

[0082] The embodiments of this application do not limit the connection method between the first plate 31 and the first connecting surface 211, and between the second plate 32 and the second connecting surface 221. For example, in some embodiments, the first plate 31 and the first connecting surface 211, and the second plate 32 and the second connecting surface 221 are bonded together by adhesive.

[0083] In other embodiments, the first plate 31 is welded to the first connecting surface 211, and the second plate 32 is welded to the second connecting surface 221.

[0084] The first plate 31 is welded to the first connecting surface 211, and the second plate 32 is welded to the second connecting surface 221. This ensures a tighter connection between the first plate 31 and the first connecting surface 211, and between the second plate 32 and the second connecting surface 221, thereby improving the stability of the middle frame 20.

[0085] In the above embodiments, the connector 23 is an elastic element. This application does not limit the type of elastic element; for example, the connector 23 can be a sheet spring, a spring, etc.

[0086] The connector 23 is an elastic element. When the middle frame 20 is subjected to an impact force and the relative positions of the side frame 21 and the middle plate 22 change, the elastic element is subjected to the force of the middle plate 22 and the side frame 21, and will undergo elastic deformation to absorb the impact energy, reduce the impact force on the side frame 21 and the middle plate 22, and improve the stability of the side frame 21 and the middle plate 22.

[0087] Continue to refer to Figure 7 In the above embodiment, the middle frame 20 further includes a filling portion 26, which fills the space between the side frame 21 and the middle plate 22, and the filling portion 26 is connected to both the side frame 21 and the middle plate 22.

[0088] The filler portion 26 can be injection molded. This application embodiment does not limit the material of the filler portion 26. For example, the material of the filler portion 26 can include plastic; specifically, the material of the filler portion 26 can be polycarbonate (PC), polyurethane (PU), etc.

[0089] A gap exists between the frame 21 and the middle plate 22. The filler portion 26 fills the gap between the frame 21 and the middle plate 22, which can enhance the connection strength between the frame 21 and the middle plate 22, as well as the sealing performance between the frame 21 and the middle plate 22. This improves the stability and reliability of the middle frame 20, reduces impact damage to the circuit board during drops or collisions, and provides cushioning for the middle frame 20. The filler portion 26 can also prevent liquids and dust from entering the interior of the middle frame 20, protecting the circuit board from the influence of the external environment.

[0090] During injection molding, the plastic temperature is high, which will cause strong impact and compression on the frame 21 and the middle plate 22. The frame 21 and the middle plate 22 are only connected by the connector 23. The frame 21 and the middle plate 22 have low strength and are prone to deformation, bending or breakage.

[0091] Please refer to Figure 10A first welding portion 41 is provided on the side of the frame 21 near the connector 23, and a second welding portion 42 is provided on the side of the middle plate 22 near the connector 23. The first welding portion 41 and the second welding portion 42 are welded together. This application embodiment does not limit the number of the first welding portion 41 and the second welding portion 42. For example, the number of the first welding portion 41 and the second welding portion 42 can be one or multiple. In embodiments where the number of the first welding portion 41 and the second welding portion 42 is multiple, the multiple first welding portions 41 are arranged circumferentially around the frame 21, and the multiple second welding portions 42 are arranged circumferentially around the middle plate 22.

[0092] The embodiments of this application do not limit the specific structure of the first welding part 41 and the second welding part 42. For example, in some embodiments, the first welding part 41 is provided with a through hole, and the second welding part 42 is provided with a protrusion on the side facing the through hole. The protrusion is inserted into the through hole and welded to the through hole. In other embodiments, the second welding part 42 is provided with a through hole, and the first welding part 41 is provided with a protrusion on the side near the through hole. The protrusion is inserted into the through hole and welded to the through hole.

[0093] After injection molding is completed and the filling part 26 is fixed, the middle frame 20 can be further processed to remove the first welded part 41 and the second welded part 42. Optionally, the processing technology can be computer-controlled.

[0094] In the above embodiment, the middle frame 20 also includes an antenna radiator, which is disposed on the frame 21 and electrically connected to the connector 23.

[0095] This application does not limit the antenna radiator. For example, in some embodiments, the antenna radiator may include a radiator formed on the frame 21. Optionally, the antenna radiator may include an LDS antenna formed by laser direct forming (LDS) process. Three-dimensional metal circuits can be engraved on the frame 21 to form an LDS antenna.

[0096] In other embodiments, the antenna radiator also includes a patch antenna, which is directly attached to the frame 21.

[0097] The antenna radiator is disposed on the frame 21 and electrically connected to the connector 23. Since the connector 23 is connected to the frame 21 and the middle plate 22 respectively, the antenna radiator can be connected to the middle plate 22. The circuit board on the middle plate 22 is provided with a reference ground, which can serve as the grounding layer of the antenna radiator, so that the antenna radiator can form a loop.

[0098] The antenna radiator can be connected to ground on the circuit board via a grounding pin. Simultaneously, the antenna radiator can also be connected to the radio frequency (RF) circuitry on the circuit board via a feed pin to receive signals from the RF circuitry, thus enabling signal transmission and reception.

[0099] In the above embodiment, the frame 21 includes an antenna radiator.

[0100] The frame 21, the middle plate 22, and the connector 23 are all made of metal to facilitate conductivity between the middle plate 22 and the frame 21. The frame 21 is cut into multiple independent metal segments, which are separated by filler parts 26 to form breaks. These breaks prevent the frame 21 from forming a complete closed conductor, thus avoiding complete shielding of electromagnetic waves. Each independent metal segment becomes a local conductor, and the electromagnetic field around the metal segment can radiate outward (or receive electromagnetic waves) through the breaks.

[0101] One end of the metal segment can be connected to the RF chip on the circuit board via connector 23, and the other end of the metal segment can be connected to the ground terminal of the circuit board via connector 23, thereby forming a complete signal loop.

[0102] The frame 21 includes the antenna radiator, which can improve the space utilization of the middle frame 20 and save storage space 212. Figure 3 (As shown). Meanwhile, the frame 21 is located on the electronic device 10 ( Figure 3 On the outside (as shown), the antenna radiator is less likely to be blocked by other components on the electronic device 10, the radiation path of electromagnetic waves is smoother, the radiation efficiency of the antenna is optimized, and the stability of the signal is improved.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A middle frame, characterized in that, include: The border, which encloses the accommodating space; A middle plate is disposed within the accommodating space, and the middle plate divides the accommodating space into a first accommodating space and a second accommodating space disposed along the centerline direction of the accommodating space; A connector is located within the first accommodating space. A first connecting surface is provided on the frame, and a second connecting surface is provided on the middle plate. Both the first and second connecting surfaces are perpendicular to the center line of the accommodating space. One end of the connector is connected to the first connecting surface, and the other end of the connector is connected to the second connecting surface.

2. The middle frame according to claim 1, characterized in that, The first connecting surface and the second connecting surface are spaced apart along the center line direction of the accommodating space; The connector includes a first plate, a second plate, and a third plate. The first plate is connected to the first connecting surface, the second plate is connected to the second connecting surface, and the third plate is disposed between the first plate and the second plate. The third plate is connected to both the first plate and the second plate, and is perpendicular to both the first plate and the second plate.

3. The middle frame according to claim 1, characterized in that, The connector includes a first plate and a second plate. One end of the first plate is connected to the first connecting surface, and the other end of the first plate is connected to one end of the second plate. The other end of the second plate is connected to the second connecting surface. The length direction of the first plate and the length direction of the second plate intersect in a plane parallel to the middle plate.

4. The middle frame according to claim 1, characterized in that, The connector includes a first plate, a second plate, a third plate, and a fourth plate. The first plate is connected to the first connecting surface, the second plate is connected to the second connecting surface, and the third plate and the fourth plate are both disposed between the first plate and the second plate. One end of the third plate is connected to the first plate, the other end of the third plate is connected to one end of the fourth plate, and the other end of the fourth plate is connected to the second plate. The length direction of the third plate intersects the length direction of the fourth plate in a plane parallel to the middle plate.

5. The middle frame according to any one of claims 2-4, characterized in that, The first plate is welded to the first connecting surface, and the second plate is welded to the second connecting surface.

6. The middle frame according to any one of claims 1-5, characterized in that, The connecting element is an elastic element.

7. The middle frame according to any one of claims 1-5, characterized in that, The middle frame also includes a filling portion, which fills the space between the border and the middle plate, and the filling portion is connected to both the border and the middle plate.

8. The middle frame according to any one of claims 1-6, characterized in that, The middle frame also includes an antenna radiator, which is disposed on the frame and electrically connected to the connector.

9. The middle frame according to claim 8, characterized in that, The frame includes the antenna radiator.

10. An electronic device, characterized in that, include: The display panel, the cover plate, and the middle frame according to any one of claims 1-9, wherein the display panel covers one side of the middle frame and the cover plate covers the other side of the middle frame.