A missile-borne phase change material heat storage and dissipation module

Abstract

The utility model relates to a missile-borne phase change material heat storage and heat dissipation module, including first casing, second casing and phase change material, second casing is arranged below first casing, the upper surface of second casing is equipped with the heat storage groove of a plurality of upper opening intercommunication arrangement, the upper surface of second casing and the lower surface shape of first casing adaptation fit and fixed connection, and the heat storage groove is sealed and sealed to form continuous and closed heat storage cavity, phase change material adopts solid -liquid phase change material and keeps solid state at normal temperature, the first casing is equipped with the perfusion mouth that is connected to heat storage cavity, and phase change material is injected into heat storage cavity through perfusion mouth after heating, and perfusion mouth is blocked after perfusion. Through forming the closed heat storage cavity between first casing and second casing, and encapsulating solid -liquid phase change material in the cavity, passive heat storage type heat dissipation of missile-borne electronic equipment is realized, thereby effectively inhibiting the internal local temperature rising speed in the short time high power consumption stage of the projectile body, and keeping the component in the safe temperature zone runs.

Description

Technical Field

[0001] This utility model relates to the field of heat storage and heat dissipation technology for missile-borne equipment, specifically to a heat storage and heat dissipation module for missile-borne phase change material. Background Technology

[0002] The development trend of missile-borne electronic equipment is towards smaller size, higher computing speed, and greater power. The internal structure of the missile body is highly compact. When the equipment is powered on, the heat generated by the components accumulates in a very short time. Since the missile body is a completely sealed cavity, the temperature rises rapidly, and the heat dissipation path is limited. Natural heat dissipation methods are almost insufficient, easily causing localized overheating, which affects system stability and the lifespan of electronic components. Therefore, the problem of missile-borne heat dissipation has gradually become a bottleneck in technological development.

[0003] Air-cooled systems require continuous airflow and spatial channels, but the interior of a missile is a closed environment where air convection cannot be formed, making traditional air cooling unsuitable. While water-cooled systems offer high heat exchange efficiency and are not limited by convection, their complex liquid-cooling structure occupies a large volume, is costly, and significantly impacts the missile's weight, making them unsuitable for the compact onboard environment. Furthermore, the missile experiences severe vibrations, impacts, and high overloads, making the liquid-cooled pipes and joints prone to fatigue leaks or bursts under thermal cycling and mechanical stress, posing a risk of coolant leakage.

[0004] Therefore, it is necessary to study a heat storage and heat dissipation module for missile-borne phase change material. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a heat storage and heat dissipation module for missile-borne phase change material, which can effectively solve the problem that the temperature rises rapidly in the missile-borne environment and that traditional air cooling and water cooling are not suitable for the missile-borne environment.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A missile-borne phase change material heat storage and heat dissipation module includes a first shell, a second shell, and a phase change material; The upper surface of the second shell has several interconnected heat storage tanks with upper openings. The second housing is arranged below the first housing, and the upper surface of the second housing is adapted to fit and fixedly connected with the lower surface of the first housing to seal the heat storage tank to form a continuous and closed heat storage cavity. The first housing has an injection port that connects to the heat storage chamber. After the phase change material is heated, it is injected into the heat storage chamber through the injection port, and the injection port is sealed after injection.

[0007] Furthermore, the thermal storage tank includes a central tank, a main tank, and annular side tanks; The central groove is located in the middle of the upper surface of the first housing; The main channel is connected to the central channel and extends in all directions; The annular side grooves are connected to the main groove and arranged around the main groove and the central groove.

[0008] Furthermore, the central groove is a circular groove and there are two sets of them symmetrically distributed on the left and right sides, and the diameter of the main groove is larger than the diameter of the annular side groove.

[0009] Furthermore, heat-conducting wires are fixed in the central groove and the main groove, and the heat-conducting wires extend along the length direction of the main groove.

[0010] Furthermore, the heat storage tank is provided with several bottom grooves, which are arranged at intervals along the length of the heat storage tank.

[0011] Furthermore, both the first and second housings are made of aluminum alloy or magnesium alloy.

[0012] Furthermore, the phase change material is paraffin.

[0013] Furthermore, the upper surface of the first housing has a motherboard mounting slot with an upper opening in the middle, the lower surface of the first housing has a downward convex structure adapted to the motherboard mounting slot, and the upper surface of the second housing has a corresponding downward concave structure.

[0014] The beneficial effects of the above technical solution are: This invention achieves passive heat storage and heat dissipation for missile-borne electronic equipment by forming a closed heat storage cavity between the first and second shells and encapsulating a solid-liquid phase change material within the cavity. The first shell is in direct contact with the heat-generating element and can quickly transfer heat in the early stages of heating. After the heat is conducted through the first shell to the second shell below, it is absorbed by the phase change material through a heat storage groove on its upper surface. After absorbing heat, the phase change material undergoes a solid-liquid transition, utilizing latent heat to store heat and achieve temperature self-regulation. This effectively suppresses the rate of increase in internal local temperature during the short-term high-power phase of the missile and keeps the components operating within a safe temperature range. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 for Figure 1 Top view; Figure 3 for Figure 1 A split diagram; Figure 4 This is a top view of the second shell. Figure 5 This is a side sectional view of the thermal storage tank; Figure 6 for Figure 5 Top view; Figure 7 This is a simulation diagram of the heating curve for Example 1; Figure 8 This is a schematic diagram of the temperature distribution in Example 1.

[0016] Reference numerals: 1. First shell; 2. Second shell; 3. Heat storage tank; 4. Inlet; 5. Heat conduction wire; 6. Main board mounting slot; 301. Center slot; 302. Main channel slot; 303. Circumferential side slot; 304. Bottom slot. Detailed Implementation

[0017] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: This embodiment aims to provide a heat storage and heat dissipation module for missile-borne phase change material, which is mainly used for heat storage and heat dissipation in the internal environment of missiles, addressing the problem that the temperature rises rapidly in the missile environment and that traditional air cooling and water cooling are not suitable for the missile environment.

[0018] Example 1: A missile-borne phase change material heat storage and heat dissipation module, such as... Figure 1-3 ( Figure 3 The heat storage tank 3 is not shown in the diagram. The module includes a first housing 1, a second housing 2, and a phase change material. A motherboard mounting slot 6 with an upper opening is provided in the middle of the upper surface of the first housing 1 for mounting the control motherboard of the projectile. The first housing 1 is used to make thermal contact with the heating element and diffuse and conduct heat to the second housing 2. In other embodiments, the lower surface of the second housing 2 can also be provided with a motherboard mounting slot 6, so that the motherboard can be mounted on both sides of the module.

[0019] The second housing 2 is arranged below the first housing 1, and the upper surface of the second housing 2 has several interconnected heat storage tanks 3 with upper openings. The heat storage tanks 3 can be, for example, Figure 4 The arrangement can also be uniform in a linear or mesh-like manner. The end of the heat storage tank 3 is not connected to the outside world and is mainly used to contain phase change materials.

[0020] The upper surface of the second shell 2 is fitted and welded to the lower surface of the first shell 1 to form a continuous and closed heat storage chamber. The first shell 1 and the second shell 2 are both made of lightweight, high thermal conductivity metal. In this embodiment, they are made of 6063 aluminum alloy. In other embodiments, magnesium alloy or other composite materials can also be used to reduce the weight of the shell while ensuring thermal conductivity, thereby achieving a lightweight module.

[0021] The first housing 1 and the second housing 2 are welded together by vacuum brazing, resulting in a seamless encapsulation that avoids the risk of leakage during product use.

[0022] Phase change materials are solid-liquid phase change materials that remain solid at room temperature. Phase change materials are substances that change their form with temperature and can provide latent heat. They do not require external energy to drive them and can absorb a large amount of latent heat during solid-liquid transitions, storing the heat generated when the motherboard is working, reducing the transient temperature rise of electronic devices, and thus achieving the purpose of temperature control. This plays the role of "heat storage-type heat dissipation" and is particularly suitable for passive temperature control systems in missile environments without a continuous cold source.

[0023] Common phase change materials are mainly inorganic hydrated salts and organic materials. Inorganic hydrated salts are mostly low-to-medium temperature phase change materials, possessing advantages such as wide availability, low price, small phase change volume change, and large latent heat of phase change. However, they generally suffer from supercooling and phase separation, resulting in incomplete release of stored heat and unstable energy storage performance. Furthermore, most inorganic hydrated salts are corrosive to metals. Since the first shell 1 and the second shell in this embodiment are both made of high thermal conductivity metals, inorganic hydrated salts are not suitable for this embodiment.

[0024] In this embodiment, an organic phase change material is used, specifically paraffin wax. The phase change material in this embodiment has a phase change temperature of 80±3℃, a latent heat of phase change ≥220KJ / Kg, good compatibility with heat container materials and thermal conductivity, and is non-toxic or otherwise harmful. Furthermore, organic phase change materials are stable, do not exhibit supercooling or phase separation, have a reversible phase change process, and are corrosion-resistant, making them very suitable as the energy storage material for this embodiment.

[0025] In this embodiment, the phase change material itself is an organic, non-conductive product that is solid at room temperature. If the casing leaks, the phase change material will not leak out. Even if the phase change material leaks after being heated and liquefied, the liquid that flows out is non-conductive and will not cause a short circuit.

[0026] The first housing 1 has an injection port 4 that connects downwards to the heat storage chamber. After the phase change material is heated into a liquid, it is injected into the heat storage chamber through the injection port. After injection, the injection port 4 is sealed by welding. To facilitate the injection of the heat storage chamber, multiple injection ports 4 can be set at different locations.

[0027] In this embodiment, the total heat dissipation of the motherboard is 30W, and the maximum temperature is required to be no more than 125℃ according to technical requirements. Therefore, the heat dissipation module must meet the 125℃ temperature resistance requirement. In this embodiment, the filling volume is calculated based on the density at 125℃. The internal pressure of the phase change material after being filled at 125℃ is only 7.16 × 10⁻⁶. -9 The yield strength of 6063 aluminum alloy after heat treatment is 90 MPa. During filling, the material is filled with the density corresponding to 125 ℃ to maintain a good negative pressure inside the heat storage cavity, preventing it from bulging or cracking due to heat.

[0028] To ensure that the wall thickness of the first shell 1 is as uniform as possible, such as Figure 1 and Figure 3 The lower surface of the first housing 1 has a convex structure adapted to the motherboard mounting slot 6, and the upper surface of the second housing 2 has a corresponding concave structure. On the one hand, this helps to maintain the uniformity of the wall thickness of the first housing 1, ensuring uniform heat conduction; on the other hand, it increases the contact area between the first housing 1 and the second housing 2, which is beneficial for welding and fixing. In addition, the heat storage tank 3 is continuously arranged along the concave structure on the upper surface of the second housing 2, that is, the heat storage tank 3 is also provided on the side wall of the concave structure, which increases the total length of the heat storage tank 3 and improves the heat storage capacity.

[0029] like Figure 7 According to the simulation results, the equipment can maintain operation for more than 3 hours at an ambient temperature of 30 ℃, and the temperature will not exceed 110 ℃.

[0030] Example 2 is basically the same as Example 1, such as... Figure 8 In the control motherboard of the projectile, the main chip is the main heat-generating unit. The module temperature gradually decreases away from the chip, resulting in heat accumulation in the middle. To address this, this embodiment improves the structure of the heat storage tank to further transfer the heat from the center to the surrounding area.

[0031] In this embodiment, as Figure 4 The heat storage tank 3 includes a central tank 301, a main tank 302, and annular side tanks 303. The central tank 301 is located in the middle of the upper surface of the first shell. The central tank 301 is a circular tank and there are two sets of them symmetrically distributed on the left and right. The central tank 301 can store more phase change material and absorb more heat to alleviate the problem of heat accumulation in the middle.

[0032] The main channel 302 is connected to the central channel 301 and extends to all sides. The side channel 303 is connected to the main channel 302 and is arranged around the main channel 302 and the central channel 301.

[0033] The diameter of the main channel 302 is larger than the diameter of the annular channel 303. A heat-conducting wire 5 is welded and fixed in both the central channel 301 and the main channel 302, extending along the length of the main channel 302. The heat-conducting wire 5 can be made of copper wire, which has better thermal conductivity than paraffin wax. This allows the heat absorbed by the central channel 301 to be transferred through the main channel 302 to the surrounding annular channel 303, promoting uniform heating of the phase change material and alleviating the problem of heat accumulation in the central area.

[0034] Example 3 is basically the same as Example 1, except that the heat storage tank 3 has been improved to enhance the heat exchange capacity between the shell and the phase change material. For example... Figure 5 and Figure 6In this embodiment, the heat storage tank 3 is provided with a plurality of bottom grooves 304. The bottom grooves 304 are arranged at intervals along the length of the heat storage tank 3, which can increase the contact area between the phase change material and the lower shell, thereby promoting the heat exchange capacity between the shell and the phase change material.

Claims

1. A missile-borne phase change material heat storage and dissipation module, characterized in that: It includes a first shell (1), a second shell (2), and a phase change material; The upper surface of the second shell (2) is provided with several interconnected heat storage tanks (3) with upper openings. The second housing (2) is arranged below the first housing (1), and the upper surface of the second housing (2) is fitted and fixedly connected to the lower surface of the first housing (1) to seal the heat storage tank (3) to form a continuous and closed heat storage cavity. The first housing (1) has an injection port (4) that connects to the heat storage chamber. After the phase change material is heated, it is injected into the heat storage chamber through the injection port (4). The injection port (4) is sealed after injection.

2. The airborne phase change material heat storage and heat dissipation module according to claim 1, characterized in that: The thermal storage tank (3) includes a central tank (301), a main tank (302), and annular side tanks (303); The central groove (301) is located in the middle of the upper surface of the first housing (1); The main channel (302) is connected to the central channel (301) and extends in all directions; The annular side groove (303) is connected to the main groove (302) and arranged around the main groove (302) and the central groove (301).

3. The airborne phase change material heat storage and heat dissipation module according to claim 2, characterized in that: The central groove (301) is a circular groove and there are two sets of them symmetrically distributed on the left and right sides. The diameter of the main groove (302) is larger than the diameter of the annular side groove (303).

4. The airborne phase change material heat storage and heat dissipation module according to claim 3, characterized in that: A heat-conducting wire (5) is fixed in the central groove (301) and the main groove (302), and the heat-conducting wire (5) extends along the length direction of the main groove (302).

5. A missile-borne phase change material heat storage and dissipation module according to any one of claims 1-4, characterized in that: The heat storage tank (3) has several bottom grooves (304) arranged at intervals along the length of the heat storage tank (3).

6. A missile-borne phase change material heat storage and dissipation module according to any one of claims 1-4, characterized in that: The first housing (1) and the second housing (2) are both made of aluminum alloy or magnesium alloy.

7. The airborne phase change material heat storage and heat dissipation module according to claim 6, characterized in that: The phase change material is paraffin.

8. A missile-borne phase change material heat storage and dissipation module according to any one of claims 1-4, characterized in that: The first housing (1) has a motherboard mounting groove (6) with an upper opening in the middle of its upper surface. The lower surface of the first housing (1) has a convex structure that is adapted to the motherboard mounting groove (6). The upper surface of the second housing (2) has a corresponding concave structure.

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