A multi-layer composite circuit metal housing

Abstract

The utility model discloses a multilayer composite circuit metal shell, including circuit shell and shell top cover, the top of circuit shell is provided with shell top cover, the outer wall both sides of circuit shell all are provided with handle, the both sides of handle are provided with the vent hole, the vent hole is located at the outer wall both sides of circuit shell, the other two sides of circuit shell all are provided with circuit hole, the circuit shell is by layer structure composition. The utility model provides the basic strength through stainless steel middle layer body, bears the weight of internal circuit element and external pressure, prevents deformation, the high modulus of glass fiber reinforcing layer through glass fiber and the toughness of resin matrix, absorbs impact energy, protects internal circuit from collision damage, and glass fiber and alumina density are significantly lower than pure stainless steel, and the overall weight is lightened, is convenient for installation and carries, assembles fast through the plug -in column and the plug -in slot, reduces the weight of connecting piece, and further optimizes the light weight effect.

Description

Technical Field

[0001] This utility model relates to the field of circuit metal casing technology, specifically to a multi-layer composite circuit metal casing. Background Technology

[0002] The metal casing of a circuit is a key component in electronic devices used to protect internal circuit elements, ensure safe operation, and provide structural support. It is usually made of metal materials, which provide mechanical protection, electromagnetic shielding, heat dissipation, and grounding by utilizing the high strength, electrical conductivity, and thermal conductivity of the metal materials.

[0003] Existing metal casings for this type of circuit are mostly single-layer structures, lacking multi-layer composite structures. They typically rely on the thickness of a single material to enhance strength, but increasing the thickness significantly increases weight and cost, and deformation or breakage may still occur in extreme environments. The heat conduction path of a single-layer metal casing is singular, and heat is prone to accumulate locally, leading to overheating of the device. The shielding of electromagnetic waves by a single-layer metal casing mainly relies on the material itself, but it cannot be optimized for different frequency bands. Single-layer metal casings are prone to corrosion in humid or salt spray environments, requiring additional coating protection, but the coating may fail due to scratches. A single-layer casing cannot simultaneously achieve multiple functions such as heat dissipation, shielding, and lightweighting.

[0004] Therefore, it is necessary to invent a multi-layer composite circuit metal casing to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a multilayer composite circuit metal casing to solve the problems mentioned above.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-layer composite circuit metal casing, comprising a circuit casing, a top cover, a handle, a vent, circuit holes, and a layer structure. The top cover is provided on the top of the circuit casing, handles are provided on both sides of the outer wall of the circuit casing, vents are provided on both sides of the handles, the vents are located on both sides of the outer wall of the circuit casing, and circuit holes are provided on the other two sides of the circuit casing. The circuit casing is composed of a layer structure. Preferably, there are three circuit housings, each of which is vertically stacked.

[0007] Preferably, plug-in posts are installed at the four corners of the bottom surface of the top circuit housing, and plug-in slots matching the plug-in posts are opened at the four corners of the surface of the lower circuit housing.

[0008] Preferably, insert strips are fixedly installed on both sides and the middle of the bottom surface of the top cover, and matching insertion holes are opened on both sides of the top outer wall of the circuit housing.

[0009] Preferably, the wiring holes are provided in two sets on the outside of each wiring housing, with three holes forming a group. The wiring holes are located on both sides of the outer wall of the wiring housing and are installed on the same straight line.

[0010] Preferably, the layer structure includes a middle layer, a reinforcing layer, and a surface layer. The middle layer is located at the base layer of the circuit housing, the reinforcing layer is disposed outside the middle layer, and the surface layer is disposed on the outer surface of the reinforcing layer.

[0011] Preferably, the middle layer is made of stainless steel, the reinforcing layer is made of glass fiber reinforced plastic, and the surface layer is made of alumina.

[0012] The technical effects and advantages provided by this utility model in the above technical solution are as follows: The stainless steel middle layer provides basic strength, bearing the weight of internal circuit components and external pressure, preventing deformation. The glass fiber reinforcement layer absorbs impact energy through the high modulus of glass fiber and the toughness of the resin matrix, protecting the internal circuit from collision damage. Glass fiber and alumina have a significantly lower density than pure stainless steel, resulting in a lighter overall weight, facilitating installation and handling. Quick assembly via plug-in posts and slots reduces the weight of connectors, further optimizing the lightweight effect. The shell structure of this type of device enhances the overall corrosion and oxidation resistance of the device. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a side-view structural diagram of the present invention; Figure 3 This is a schematic diagram of the stacked installation structure of the circuit shell of this utility model; Figure 4 This is a schematic diagram of the top circuit housing structure of this utility model; Figure 5 This is a schematic diagram of the layer structure of this utility model.

[0014] Explanation of reference numerals in the attached figures: 1. Circuit housing; 101. Plug post; 102. Plug slot; 2. Top cover; 201. Insert strip; 202. Plug hole; 3. Handle; 4. Vent hole; 5. Circuit hole; 6. Layer structure; 601. Middle layer; 602. Reinforcing layer; 603. Top layer. Detailed Implementation

[0015] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0016] This utility model provides, for example Figure 1-5The diagram shows a multi-layer composite circuit metal casing, including a circuit casing 1, a top cover 2, a handle 3, and vent holes 4. There are three circuit casings 1, each stacked vertically. The bottom of the top circuit casing 1 is equipped with four corner plugs 101, and the bottom of the lower circuit casing 1 is provided with four corner plug slots 102 that match the plugs 101. The top cover 2 is provided on the top of the circuit casing 1. Insert strips 201 are fixedly installed on both sides and the middle of the bottom surface of the top cover 2. The top outer wall of the circuit casing 1 is provided with two matching plug holes 202. The outer wall of the circuit casing 1 is provided with two handles 3 on both sides. Vent holes 4 are provided on both sides of the outer wall of the circuit casing 1. The circuit housing 1 achieves vertical stacking of three housings through the matching design of the top plug post 101 and the lower plug slot 102. This structure is fixed by mechanical snap-fit, reducing the use of connectors while ensuring the stability of the stacked housing. The gap control between the plug post and the slot can avoid assembly deviation. The top cover 2 is connected to the top socket 202 of the circuit housing by the snap-fit ​​of the bottom insert strip 201, which can achieve quick disassembly and assembly. The interference fit between the insert strip and the socket can enhance the sealing performance, prevent dust or liquid from entering the interior, and facilitate disassembly for maintenance. The other two sides of the circuit housing 1 are provided with circuit holes 5. There are two sets of circuit holes 5 located on the outside of each circuit housing 1, and three are arranged in a group. The circuit holes 5 are located on both sides of the outer wall of the circuit housing 1 and are installed on the same straight line. The circuit housing 1 is composed of a layer structure 6, which includes a middle layer 601, a reinforcing layer 602 and a surface layer 603. The middle layer 601 is located at the base layer of the shell layer of the circuit housing 1. The reinforcing layer 602 is provided on the outside of the middle layer 601. The surface layer 603 is provided on the outer surface of the reinforcing layer 602. The middle layer 601 is made of stainless steel, the reinforcing layer 602 is made of glass fiber reinforced plastic, and the surface layer 603 is made of alumina. The middle layer 601 serves as the base layer, providing basic strength and rigidity, bearing the weight of internal circuit components and external pressure. Its thermal conductivity aids in heat dissipation and prevents localized overheating. The reinforcing layer 602 absorbs impact energy through the high modulus of glass fiber and the toughness of the resin matrix. In the event of a drop or collision, the reinforcing layer 602 disperses stress through plastic deformation, protecting the middle layer 601 and the internal circuitry. The anodized film on the outer layer 603 provides corrosion resistance and insulation, preventing leakage or short circuits. Its high hardness resists surface scratches and extends the service life of the outer casing.

[0017] Working principle of this utility model: Refer to the instruction manual appendix Figure 1-5When using this utility model, the circuit housing 1 firstly achieves vertical stacking of the three housings through the matching design of the top plug post 101 and the lower plug slot 102. This structure is fixed by mechanical snap-fit, reducing the use of connecting parts while ensuring the stability after stacking. The gap control between the plug post and the slot can avoid assembly deviation. The top cover 2 is connected to the top plug hole 202 of the circuit housing through the snap-fit ​​of the bottom plug strip 201, realizing quick disassembly and assembly. The interference fit between the plug strip and the plug hole can enhance the sealing performance, prevent dust or liquid from entering the interior, and facilitate disassembly during maintenance. The middle layer 601 serves as the base layer, providing basic strength and rigidity, bearing the weight of the internal circuit components and external pressure. Its thermal conductivity assists in heat dissipation and prevents local overheating. The reinforcing layer 602 is constructed through... The high modulus of fiberglass and the toughness of the resin matrix absorb impact energy. In the event of a drop or collision, the reinforcing layer 602 disperses stress through plastic deformation, protecting the middle layer 601 and internal circuitry. The anodized film on the surface layer 603 provides corrosion resistance and insulation, preventing leakage or short circuits. Its high hardness resists surface scratches and extends the service life of the outer casing. The vent hole 4 design, with symmetrically distributed vent holes on both sides of the outer wall, forms a convection channel, utilizing the principle of hot air rising to accelerate the dissipation of internal heat. The diameter and spacing of the vent holes 4 need to balance heat dissipation efficiency and dust prevention requirements to prevent large particles of impurities from entering. The wiring hole 5 layout, with three wiring holes 5 arranged in a straight line along both sides of the outer wall in each group, facilitates classified wiring. The straight arrangement reduces signal interference and also facilitates modular expansion.

[0018] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-layer composite circuit metal casing, comprising a circuit casing (1), a top cover (2), a handle (3), a vent (4), circuit holes (5), and a layer structure (6), characterized in that, The top of the circuit housing (1) is provided with a top cover (2), and handles (3) are provided on both sides of the outer wall of the circuit housing (1). Ventilation holes (4) are provided on both sides of the handles (3). The ventilation holes (4) are located on both sides of the outer wall of the circuit housing (1). Circuit holes (5) are provided on the other two sides of the circuit housing (1). The circuit housing (1) is composed of a layer structure (6).

2. The multilayer composite circuit metal casing according to claim 1, characterized in that: The circuit housing (1) is provided in three parts, and each circuit housing (1) is installed vertically stacked.

3. The multilayer composite circuit metal casing according to claim 2, characterized in that: The top-level circuit housing (1) has four corners of the bottom surface with plug-in posts (101), and the bottom-level circuit housing (1) has four corners of the surface with plug-in slots (102) that match the plug-in posts (101).

4. The multilayer composite circuit metal casing according to claim 1, characterized in that: Inserts (201) are fixedly installed on both sides and the middle of the bottom surface of the top cover (2), and matching insertion holes (202) are opened on both sides of the top outer wall of the circuit housing (1).

5. The multilayer composite circuit metal casing according to claim 1, characterized in that: The line holes (5) are provided in two sets on the outside of each line housing (1), and three are arranged in a group. The line holes (5) are located on both sides of the outer wall of the line housing (1) and are installed on the same straight line.

6. The multilayer composite circuit metal casing according to claim 1, characterized in that: The layer structure (6) includes a middle layer (601), a reinforcing layer (602) and a surface layer (603). The middle layer (601) is located at the base layer of the outer shell (1) of the circuit housing. The reinforcing layer (602) is provided on the outside of the middle layer (601), and the surface layer (603) is provided on the outer surface of the reinforcing layer (602).

7. The multilayer composite circuit metal casing according to claim 1, characterized in that: The middle layer (601) is made of stainless steel, the reinforcing layer (602) is made of glass fiber reinforced plastic, and the surface layer (603) is made of alumina.

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