Fluid circuit controller for space applications and its cabinet

Abstract

The utility model provides a kind of space fluid circuit controller and its chassis, belong to spacecraft thermal control technical field.The chassis adopts layered structure, each layer structure is integrally processed, including: a plurality of sequentially laminated settings square frame structure and first cover plate and second cover plate;The edge of adjacent square frame structure is mutually docked;The first cover plate and second cover plate are connected on the outermost square frame structure respectively, and are enclosed as box with square frame structure;A plurality of the heat conduction surface of square frame structure is set on the same side and contacts with mounting platform;Each of the square frame structure is provided with a plurality of lightening groove.The chassis of the utility model, each square frame structure can be used to install corresponding PCB board, and according to the electronic components of PCB board to set heat dissipation structure specifically, so it has good heat dissipation effect, and the lightening groove can reduce the structural weight of the chassis.

Claims

1. A chassis for a fluid loop controller for space applications, characterized in that, The chassis adopts a layered structure, with each layer being manufactured as a single piece, including: Multiple stacked rectangular structures, a first cover plate, and a second cover plate; The edges of adjacent rectangular structures are joined together; the first cover plate and the second cover plate are respectively connected to the outermost rectangular structure and together with the rectangular structure form a box; Multiple of the aforementioned box structures have heat-conducting surfaces that contact the mounting platform on the same side; Each of the aforementioned box structures is provided with several weight-reducing grooves.

2. The chassis of the space fluid loop controller according to claim 1, characterized in that, The heat-conducting surface has outwardly protruding mounting ears at both ends, and the mounting ears have mounting holes.

3. The chassis of the space fluid loop controller according to claim 1, characterized in that, The distance between the sidewall of the weight-reducing groove and the edge of the frame structure is greater than 1 mm, and the distance between the sidewalls of adjacent weight-reducing grooves is greater than 1 mm.

4. The chassis of the space fluid loop controller according to claim 3, characterized in that, The weight-reduction groove is a square groove set on the outer surface of the frame structure.

5. The chassis of the space fluid loop controller according to claim 1, characterized in that, The interior of the rectangular structure is provided with bosses for contacting components, and thermally conductive insulating pads are provided on the bosses.

6. The chassis of the space fluid loop controller according to claim 1, characterized in that, The frame structure is made of magnesium-aluminum alloy MB15 with a thermal conductivity ≥117 W / mK.

7. The chassis of the space fluid loop controller according to claim 1, characterized in that, The first cover plate, the plurality of said rectangular structures, and the second cover plate are fixedly connected at each of the four corners by a screw.

8. The chassis of the space fluid loop controller according to claim 1, characterized in that, The surface of the chassis is treated with a yellow conductive oxidation process.

9. The chassis of the space fluid loop controller according to claim 1, characterized in that, The minimum thickness on the side where the heat-conducting surface is located is not less than 3mm, and thermal grease is applied to the bottom of the heat-conducting surface.

10. A fluid loop controller for space applications, comprising multiple PCBs and a chassis for mounting the PCBs, characterized in that, The plurality of PCBs include at least a filter board assembly, a power board assembly, a main control board assembly, a thermal control board assembly, and a radiation board control assembly. The chassis is any one of the chassis described in claims 1 to 9. Each PCB is installed in a corresponding frame structure of the chassis. The components of each layer are connected for power supply and communication through board-to-board connectors.

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