Deep-drawing VC uniform-temperature fin liquid cooling plate
Patent Information
- Application Number
- CN202521294793.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-24
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-06-24
AI Technical Summary
冷端散热的方式一般是在均温板冷板表面布置散热翅片,翅片占用的尺寸空间需要比较大,且随着电子散热需求的日益增长,风冷散热翅片方式已难以满足要求
[0011]本实用新型所提供的深冲压VC均温翅片液冷板,以冲压板形式作为均温板上板,加大均温板热扩散面积,增加均温板及液冷板的承压能力,在冲压成型的凸起之间布置交错齿翅片,进一步增大均温板的热扩散面积,强化液冷散热能力。
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Figure CN224875276U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of liquid cooling plate technology, specifically a deep-drawn VC heat-equalizing finned liquid cooling plate. Background Technology
[0002] In the field of electronic heat dissipation, the surface of a vapor chamber is in contact with the heat source, and the vapor chamber is filled with a working medium. The working medium near the heat source absorbs heat and evaporates, while the gaseous working medium flows to the cold end away from the heat source, releases heat, and condenses into a liquid medium, thus achieving the purpose of cooling the heat source. Cold-end heat dissipation typically involves arranging heat dissipation fins on the surface of the vapor chamber's cold end. These fins require a relatively large space, and with the increasing demand for electronic heat dissipation, air-cooled heat dissipation fins are no longer sufficient. Utility Model Content
[0003] The purpose of this invention is to provide a deep-drawn VC uniform temperature finned liquid cooling plate to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a deep-drawn VC heat exchanger finned liquid cooling plate, characterized in that: it includes a substrate, and the lower end of the substrate is sequentially provided with a liquid cooling plate upper plate, a heat exchanger upper plate, and a heat exchanger lower plate; the end face of the substrate is provided with a refrigerant inlet and a refrigerant outlet; the end face of the liquid cooling plate upper plate is provided with a through hole communicating with the refrigerant inlet and the refrigerant outlet; and the end face of the heat exchanger upper plate is stamped with multiple protrusions and interlaced toothed fins.
[0005] In a further optimized version, the substrate is provided with at least four snap fasteners symmetrically at both ends.
[0006] In a further optimized configuration, the plurality of protrusions are arranged laterally, and the plurality of staggered toothed fins are respectively arranged between the plurality of protrusions.
[0007] In a further optimized configuration, the temperature distribution plate has a coolant inlet and a coolant outlet in the middle of its upper section.
[0008] In a further optimized configuration, the upper plate of the heat exchanger plate and the upper plate of the liquid cooling plate are brazed to form an integral structure.
[0009] In a further optimized configuration, the heat exchange plate and the liquid cooling plate of the integrated structure are embedded in the bottom of the substrate.
[0010] Beneficial effects
[0011] The deep-drawn VC heat spreader finned liquid cooling plate provided by this utility model uses a stamped plate as the upper plate of the heat spreader, which increases the heat diffusion area of the heat spreader and the pressure bearing capacity of the heat spreader and the liquid cooling plate. The staggered toothed fins are arranged between the stamped protrusions to further increase the heat diffusion area of the heat spreader and enhance the liquid cooling heat dissipation capacity. Attached Figure Description
[0012] Figure 1 This is an exploded view of the overall structure of this utility model;
[0013] Figure 2 This is a schematic diagram of the liquid cooling plate and the heat exchange plate structure of this utility model;
[0014] Figure 3 This is a schematic diagram of the plate structure of the temperature equalization plate of this utility model;
[0015] Figure 4 This is a schematic diagram of the raised portion of the heat exchange plate of this utility model;
[0016] Figure 5 This is a top view of the uniform temperature plate structure of this utility model. Detailed Implementation
[0017] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.
[0018] Example
[0019] like Figure 1-5 As shown, a deep-drawn VC heat exchanger finned liquid cooling plate includes a substrate 1. The lower end of the substrate 1 is provided with a liquid cooling upper plate 7, a heat exchanger upper plate 8, and a heat exchanger lower plate 10. The middle of the end face of the substrate 1 is provided with a refrigerant inlet 5 and a refrigerant outlet 6. The end face of the liquid cooling upper plate 7 is provided with a through hole that communicates with the refrigerant inlet 5 and the refrigerant outlet 6. The end face of the heat exchanger upper plate 8 is stamped with a plurality of protrusions 9 and staggered toothed fins 11.
[0020] In this embodiment, at least four clips 2 are symmetrically provided at both ends of the substrate 1 to fix the overall liquid cooling plate.
[0021] Multiple protrusions 9 are arranged horizontally, and multiple staggered toothed fins 11 are respectively arranged between multiple protrusions 9.
[0022] The heat exchange plate 8 has a coolant inlet 13 and a coolant outlet 14 in the middle.
[0023] The heat spreader plate 8 and the liquid cooling plate plate 7 are brazed to form an integral structure.
[0024] The integrated heat exchange plate 8 and the liquid cooling plate 7 are embedded at the bottom of the substrate 1.
[0025] The vapor chamber plate has several stamped protrusions, with staggered toothed fins arranged between them. A liquid cooling channel is formed between the vapor chamber plate and the liquid cooling plate. Coolant flows from the inlet into the staggered toothed fins on both sides, then flows back into the staggered toothed fins through the loops on both sides of the liquid cooling channel, and finally flows out from the coolant outlet, thereby carrying away the heat generated by the heat source. The vapor chamber plate and the liquid cooling plate are brazed together and embedded in the bottom of the substrate. The liquid inlet and outlet protrude from the through holes in the substrate.
[0026] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A deep-drawn VC heat exchanger finned liquid cooling plate, characterized in that: The substrate (1) includes a liquid cooling upper plate (7), a heat spreader upper plate (8), and a heat spreader lower plate (10) sequentially arranged at its lower end. A refrigerant inlet (5) and a refrigerant outlet (6) are provided in the middle of the end face of the substrate (1). A through hole communicating with the refrigerant inlet (5) and refrigerant outlet (6) is provided on the end face of the liquid cooling upper plate (7). Multiple protrusions (9) and interlaced toothed fins (11) are stamped on the end face of the heat spreader upper plate (8). At least four buckles (2) are symmetrically provided at both ends. Multiple protrusions (9) are arranged horizontally, and multiple staggered toothed fins (11) are respectively arranged between multiple protrusions (9). A coolant inlet (13) and a coolant outlet (14) are provided in the middle of the upper plate of the heat exchanger (8). The upper plate of the heat exchanger (8) and the upper plate of the liquid cooling plate (7) are brazed to form an integral structure. The upper plate of the heat exchanger (8) and the upper plate of the liquid cooling plate (7) of the integral structure are embedded in the bottom of the substrate (1).