New energy driving motor controller power module integrated structure

Abstract

The utility model discloses a new energy drive motor controller power module integrated structure, aims at providing a kind of not only facilitate actual production assembly, improve assembly efficiency;And the structure layout is reasonable, is favorable to simplify assembly process steps, and improve the heat dissipation effect of a kind of new energy drive motor controller power module integrated structure. It includes: capacitor, including capacitor shell and the capacitor core filled in capacitor shell, capacitor shell is equipped with support assembly, heat dissipation water tank and with the import and export of heat dissipation water tank intercommunication, support assembly includes several support fixed column;IGBT module is fixedly installed on capacitor shell by first screw, and IGBT module seals and seals the notch of heat dissipation water tank;Master control drive integrated board is fixedly installed each support fixed column of support assembly by second screw, and IGBT module is located between capacitor shell and master control drive integrated board.

Description

Technical Field

[0001] This utility model relates to the technical field of new energy vehicle drive motor control equipment, specifically to an integrated structure of a power module for a new energy drive motor controller. Background Technology

[0002] New energy drive motor controllers generally include power modules, capacitors, current sensors, main control boards, and drive boards. With the rapid development of new energy vehicles, the structure of drive motor controllers is constantly being updated, becoming smaller and more powerful. Simultaneously, cost control is driving the integration and modularization of the controller's internal components. However, current new energy drive motor controllers still suffer from unreasonable structural design, numerous assembly steps, and inconvenient assembly. For example, Chinese Patent Publication No. CN118632463A, entitled "Integrated Motor Controller and New Energy Vehicle," includes a housing and a power module. One side of the housing has a cavity containing filter components, high-voltage connectors, boost inductors, circuit boards, and copper busbar components. The power module is located within the cavity and has a heat sink for heat dissipation. It also includes multiple boost power devices and multiple rectifier power devices. This integrated motor controller has a complex structure and also suffers from numerous assembly steps and inconvenient assembly. Utility Model Content

[0003] The purpose of this utility model is to provide an integrated structure for a power module of a new energy drive motor controller that not only facilitates actual production assembly and improves assembly efficiency, but also has a reasonable structural layout, which helps to simplify assembly process steps and improve heat dissipation.

[0004] The technical solution of this utility model is: A power module integrated structure for a new energy drive motor controller includes: A capacitor includes a capacitor housing and a capacitor core encapsulated within the capacitor housing. The capacitor housing is provided with a support assembly, a heat dissipation tank, and an inlet and outlet connected to the heat dissipation tank. The support assembly includes several support and fixing columns. The IGBT module is fixedly mounted on the capacitor housing by the first screw, and the IGBT module seals and covers the opening of the heat sink. The main control and drive integrated board is fixedly mounted on the support columns of the support assembly using second screws, and the IGBT module is located between the capacitor housing and the main control and drive integrated board. This solution provides a new energy drive motor controller power module integrated structure where a support assembly is set within the capacitor housing; the IGBT module is fixedly mounted on the capacitor housing using first screws, sealing the opening of the heat dissipation water tank; the main control and drive integrated board is fixedly mounted on the support columns of the support assembly using second screws, and the IGBT module is located between the capacitor housing and the main control and drive integrated board. This allows for convenient integration of the capacitor, IGBT module, and main control and drive integrated board into a single unit, resulting in a simple structure, convenient installation, easy production assembly, improved production efficiency, and good structural compactness. Meanwhile, a heat dissipation trough and its inlet and outlet are integrated into the capacitor housing, and the opening of the heat dissipation trough is sealed by the IGBT module. In this way, not only is there no need to arrange additional heat dissipation modules (such as heat sinks), saving the process of additional manufacturing and assembly of heat dissipation modules, simplifying the assembly process and reducing manufacturing costs, but the structural layout is also reasonable. By directly sealing the opening of the heat dissipation trough through the IGBT module, the cooling water flowing through the heat dissipation trough can directly cool the capacitor and IGBT module, effectively improving the heat dissipation effect and ensuring the normal operation of the capacitor and IGBT module.

[0005] Preferably, the capacitor housing includes: The main housing has a potting cavity. A side inlet connected to the potting cavity is provided on one side of the main housing. A potting port connected to the potting cavity is provided on the side of the main housing facing the IGBT module. The capacitor core is inserted into the potting cavity through the side inlet. The side baffle is fixed to one side of the main housing by clips or bolts, and the side mounting inlet is sealed. The potting cavity is filled with potting compound, and the main housing, side baffle, and capacitor core are encapsulated together using the potting compound. In this design, the capacitor core is inserted into the potting cavity through the side mounting inlet, and then the side baffle is fixed to one side of the main housing by clips or bolts, and the side mounting inlet is sealed to prevent subsequent potting compound leakage. This facilitates the assembly of the capacitor core and capacitor housing, and also facilitates the filling of the potting cavity with potting compound through the potting port to encapsulate the main housing, side baffle, and capacitor core together, thus facilitating the actual manufacturing of the capacitor.

[0006] Preferably, the potting opening and the opening of the heat sink are located on the same side of the main housing. Since the IGBT module is installed on the capacitor housing side where the heat sink is located, the capacitor copper busbar of the capacitor core extends to the outside of the capacitor housing through the potting opening. This allows for a more reasonable positioning of the module copper busbar and the capacitor copper busbar, facilitating the production and installation of the module copper busbar and the capacitor copper busbar of the IGBT module and the capacitor core.

[0007] Preferably, the capacitor core includes a capacitor copper busbar extending from the potting opening to the outside of the capacitor housing. The IGBT module includes a module copper busbar positioned close to or against the capacitor copper busbar, and the module copper busbar and capacitor copper busbar are connected by welding and / or bolts. Because the module copper busbar is close to or against the capacitor copper busbar, this not only facilitates the production and installation of the IGBT module's module copper busbar and the capacitor core's capacitor copper busbar, allowing for easy connection via welding and / or bolts, but also effectively reduces the distance between the module copper busbar and the capacitor copper busbar, thus reducing stray inductance.

[0008] Preferably, the capacitor core has a row of support pillars for supporting the capacitor copper busbars. The capacitor copper busbars are close to or abut against the end faces of the support pillars, and are located between the support pillars and the module copper busbars. In this way, not only can the capacitor copper busbars be positioned by the end faces of the support pillars, ensuring accurate positioning of the capacitor copper busbars, but it also facilitates the locking of the module copper busbars and capacitor copper busbars to the support pillars with bolts.

[0009] Preferably, the capacitor core includes a capacitor copper busbar, and the IGBT module includes a module copper busbar. The module copper busbar is close to or adjacent to the capacitor copper busbar, and the module copper busbar and the capacitor copper busbar are connected by welding or bolts. Because the module copper busbar is close to or adjacent to the capacitor copper busbar, this not only facilitates the production and installation of the module copper busbar of the IGBT module and the capacitor copper busbar of the capacitor core, allowing them to be easily connected together by welding and / or bolts; but also effectively reduces the distance between the module copper busbar and the capacitor copper busbar, reducing the generation of stray inductance.

[0010] Preferably, the IGBT module includes several module pins, and the main control and driver integrated board has corresponding insertion holes for each module pin. The module pins are inserted into the corresponding insertion holes on the main control and driver integrated board and connected by soldering. The IGBT module communicates with the main control and driver integrated board through the module pins. This makes the communication structure between the main control and driver integrated board and the IGBT module simple and reliable.

[0011] Preferably, a sealing ring is provided between the capacitor housing and the IGBT module, and the sealing ring surrounds the outside of the opening of the heat sink. This ensures that the IGBT module can reliably seal the opening of the heat sink.

[0012] Preferably, the main control and drive integrated board is equipped with a current sensor for measuring phase line current, which is soldered to the main control and drive integrated board. Soldering the current sensor directly to the main control and drive integrated board reduces the number of adapter copper busbars, facilitating actual production assembly and improving assembly efficiency.

[0013] Preferably, there is a gap between the main control driver board and the IGBT module. This gap allows for heat dissipation from the IGBT module, while also reducing the impact of heat generated by the IGBT module during operation on the main control driver board.

[0014] The beneficial effects of this utility model are: The IGBT module is fixedly mounted on the capacitor housing with a first screw, sealing the opening of the cooling water tank. The main control and drive integrated board is fixedly mounted on the support columns of the support assembly with a second screw, and the IGBT module is located between the capacitor housing and the main control and drive integrated board. This allows for convenient integration of the capacitor, IGBT module, and main control and drive integrated board into a single unit, resulting in a simple structure, easy installation, convenient production assembly, improved production efficiency, and good structural compactness. Simultaneously, the cooling water tank and its inlet and outlet are integrated into the capacitor housing, and the opening of the cooling water tank is sealed by the IGBT module. This eliminates the need for additional cooling modules (such as heat sinks), saving the process of fabricating and assembling additional cooling modules, simplifying assembly steps, and reducing manufacturing costs. Furthermore, the rational structural layout, with the IGBT module directly sealing the opening of the cooling water tank, allows the cooling water flowing through the tank to directly cool the capacitor and IGBT module, effectively improving heat dissipation and ensuring the normal operation of the capacitor and IGBT module. Attached Figure Description

[0015] Figure 1 This is an exploded view of the integrated structure of a power module for a new energy drive motor controller according to this utility model.

[0016] Figure 2 This is a three-dimensional structural diagram of a capacitor in the integrated structure of a power module of a new energy drive motor controller according to this utility model.

[0017] Figure 3 This is a three-dimensional structural diagram of a power module integrated structure for a new energy drive motor controller according to this utility model, showing the assembly of a capacitor and an IGBT module.

[0018] Figure 4 This is a three-dimensional structural diagram of the integrated structure of the power module of a new energy drive motor controller according to this utility model.

[0019] In the picture: Capacitor 1, capacitor core 1.0, capacitor copper busbar 1.0.1, support column 1.0.2, capacitor housing 1.1, main housing 1.1.1, side baffle 1.1.2, potting opening 1.1.3, heat dissipation water tank 1.2, support and fixing column 1.3, module mounting plane 1.4; IGBT module 2, module copper busbar 2.1, module pins 2.2; Main control and driver integrated board 3, current sensor 3.1. Detailed Implementation

[0020] Specific Implementation Example 1, such as Figures 1-4 As shown, a new energy drive motor controller power module integrated structure includes a capacitor 1, an IGBT module 2, and a main control drive integrated board 3.

[0021] The capacitor 1 includes a capacitor housing 1.1 and a capacitor core 1.0 encapsulated within the capacitor housing 1.1. The capacitor housing 1.1 is provided with a support assembly, a heat dissipation tank 1.2, and an inlet and outlet communicating with the heat dissipation tank 1.2. The support assembly includes several support fixing posts 1.3. In this embodiment, each support fixing post 1.3 of the support assembly is integrally formed with the capacitor housing 1.1, and the heat dissipation tank 1.2 is formed on the surface of the capacitor housing 1.1.

[0022] The IGBT module 2 is fixedly mounted on the capacitor housing 1.1 by the first screw, and the IGBT module 2 seals and covers the opening of the heat dissipation water tank 1.2.

[0023] The main control drive integrated board 3 is fixedly mounted on each support fixing column 1.3 of the support assembly by the second screw, and the IGBT module 2 is located between the capacitor housing 1.1 and the main control drive integrated board 3.

[0024] In this embodiment, a power module integrated structure for a new energy drive motor controller includes a support assembly within the capacitor housing 1.1. An IGBT module 2 is fixedly mounted on the capacitor housing 1.1 using a first screw, sealing the opening of the heat dissipation water tank 1.2. A main control drive integrated board 3 is fixedly mounted on each support post 1.3 of the support assembly using a second screw, with the IGBT module 2 positioned between the capacitor housing 1.1 and the main control drive integrated board 3. This allows for convenient integration of the capacitor, IGBT module 2, and main control drive integrated board 3 into a single unit. The structure is simple, easy to install, facilitates production assembly, improves production efficiency, and exhibits good compactness. Meanwhile, a heat sink 1.2 and its inlet and outlet connected to it are integrated into the capacitor housing 1.1, and the opening of the heat sink 1.2 is sealed by the IGBT module 2. In this way, there is no need to arrange additional heat dissipation modules (such as heat sinks), saving the process of additional manufacturing and assembly of heat dissipation modules, simplifying the assembly process and reducing manufacturing costs. Moreover, the structural layout is reasonable. By directly sealing the opening of the heat sink 1.2 through the IGBT module 2, the cooling water flowing through the heat sink 1.2 can directly cool the capacitor and the IGBT module 2, effectively improving the heat dissipation effect and ensuring the normal operation of the capacitor and the IGBT module 2.

[0025] Specific embodiment two, such as Figures 1-4 As shown, a new energy drive motor controller power module integrated structure includes a capacitor 1, an IGBT module 2, and a main control drive integrated board 3.

[0026] The capacitor 1 includes a capacitor housing 1.1 and a capacitor core 1.0 encapsulated within the capacitor housing 1.1. The capacitor housing 1.1 is provided with a support assembly, a heat dissipation tank 1.2, and an inlet and outlet communicating with the heat dissipation tank 1.2. The support assembly includes several support fixing posts 1.3. In this embodiment, each support fixing post 1.3 of the support assembly and the capacitor housing 1.1 are integrally molded structures. For example, each support fixing post 1.3 of the support assembly and the capacitor housing 1.1 are integrally injection molded structures. The heat dissipation tank 1.2 is formed on the surface of the capacitor housing 1.1, and the heat dissipation tank 1.2 and the capacitor housing 1.1 are integrally injection molded structures.

[0027] The IGBT module 2 is fixedly mounted on the capacitor housing 1.1 by a first screw. For example, the IGBT module 2 is fixedly mounted on the surface of the capacitor housing 1.1 by 3-6 first screws. The IGBT module 2 seals the opening of the heat dissipation water tank 1.2.

[0028] The main control drive integrated board 3 is fixedly mounted on each support fixing post 1.3 of the support assembly using second screws. Each support fixing post 1.3 corresponds to a second screw, which passes through mounting holes on the main control drive integrated board 3 and is threaded onto the corresponding support fixing post 1.3. For example, there are 4-8 support fixing posts 1.3, and the main control drive integrated board 3 is fixedly mounted on each support fixing post 1.3 of the support assembly using 4-8 second screws. The IGBT module 2 is located between the capacitor housing 1.1 and the main control drive integrated board 3. The main drive integrated board includes both drive and control circuits, allowing the entire new energy drive motor controller power module integrated structure to be independently controlled and directly integrated with different products.

[0029] In this embodiment, the capacitor core 1.0 includes a capacitor copper busbar 1.0.1. The IGBT module 2 includes a module copper busbar 2.1. The module copper busbar 2.1 is close to or abuts against the capacitor copper busbar 1.0.1. Specifically, after the IGBT module 2 is fixedly mounted on the capacitor housing 1.1 by the first screw, the module copper busbar 2.1 is close to or abuts against the capacitor copper busbar 1.0.1. In this embodiment, after the IGBT module 2 is fixedly mounted on the capacitor housing 1.1 by the first screw, the module copper busbar 2.1 is abuts against the capacitor copper busbar 1.0.1. The module copper busbar 2.1 and the capacitor copper busbar 1.0.1 are connected by welding or bolts for conducting high-voltage electricity. Since the module copper busbar 2.1 is close to or adjacent to the capacitor copper busbar 1.0.1, this not only facilitates the production and installation of the module copper busbar 2.1 of the IGBT module 2 and the capacitor copper busbar 1.0.1 of the capacitor core 1.0, allowing the module copper busbar 2.1 and the capacitor copper busbar 1.0.1 to be easily connected together by welding and / or bolts; but also effectively reduces the distance between the module copper busbar 2.1 and the capacitor copper busbar 1.0.1, reducing the generation of stray inductance.

[0030] IGBT module 2 includes several module pins 2.2, and the main control driver integrated board 3 has corresponding insertion holes for each of the module pins 2.2. The module pins 2.2 are inserted into the corresponding insertion holes on the main control driver integrated board 3 and connected by soldering. IGBT module 2 communicates with the main control driver integrated board 3 through module pins 2.2. This makes the communication structure between the main control driver integrated board 3 and IGBT module 2 simple and reliable.

[0031] In actual assembly, IGBT module 2 is installed first. IGBT module 2 is fixed on capacitor housing 1.1 with the first screw, and the opening of the heat sink 1.2 is sealed by IGBT module 2.

[0032] Next, install the main control driver integrated board 3. Specifically, insert the module pins 2.2 into the corresponding insertion holes on the main control driver integrated board 3. Then, fix the main control driver integrated board 3 to each support fixing column 1.3 of the mounting support assembly with the second screw. Next, the module pin 2.2 is soldered onto the main control drive integrated board 3, so that the IGBT module 2 can communicate with the main control drive integrated board 3 through the module pin 2.2; the module copper busbar 2.1 and the capacitor copper busbar 1.0.1 are connected by welding or bolts to conduct high voltage electricity; thus completing the assembly of a new energy drive motor controller power module integrated structure.

[0033] In this embodiment, a power module integrated structure for a new energy drive motor controller includes a support assembly within the capacitor housing 1.1. An IGBT module 2 is fixedly mounted on the capacitor housing 1.1 using a first screw, sealing the opening of the heat dissipation water tank 1.2. A main control drive integrated board 3 is fixedly mounted on each support post 1.3 of the support assembly using a second screw, with the IGBT module 2 positioned between the capacitor housing 1.1 and the main control drive integrated board 3. This allows for convenient integration of the capacitor, IGBT module 2, and main control drive integrated board 3 into a single unit. The structure is simple, easy to install, facilitates production assembly, improves production efficiency, and exhibits good compactness. Meanwhile, a heat sink 1.2 and its inlet and outlet connected to it are integrated into the capacitor housing 1.1, and the opening of the heat sink 1.2 is sealed by the IGBT module 2. In this way, there is no need to arrange additional heat dissipation modules (such as heat sinks), saving the process of additional manufacturing and assembly of heat dissipation modules, simplifying the assembly process and reducing manufacturing costs. Moreover, the structural layout is reasonable. By directly sealing the opening of the heat sink 1.2 through the IGBT module 2, the cooling water flowing through the heat sink 1.2 can directly cool the capacitor and the IGBT module 2, effectively improving the heat dissipation effect and ensuring the normal operation of the capacitor and the IGBT module 2.

[0034] Furthermore, such as Figures 1-3 As shown, the capacitor housing 1.1 has a module mounting surface 1.4 on its surface, which surrounds the outside of the slot of the heat sink 1.2. The IGBT module 2 is fixedly mounted on the module mounting surface 1.4 of the capacitor housing 1.1 by a first screw.

[0035] A sealing ring is provided between the capacitor housing 1.1 and the IGBT module 2, and the sealing ring surrounds the outside of the slot of the heat sink 1.2. In this embodiment, the sealing ring is located between the IGBT module 2 and the module mounting plane 1.4. This ensures that the IGBT module 2 can reliably seal the slot of the heat sink 1.2. In this embodiment, the module mounting plane 1.4 of the capacitor housing 1.1 is also provided with an annular sealing groove, which surrounds the outside of the slot of the heat sink 1.2. The sealing ring is embedded in the annular sealing groove. This facilitates the installation of the sealing ring.

[0036] Furthermore, such as Figure 1 As shown, the main control and drive integrated board 3 is equipped with a current sensor 3.1 for measuring the phase line current, and the current sensor 3.1 is welded to the main control and drive integrated board 3. Welding the current sensor 3.1 directly to the main control and drive integrated board reduces one set of adapter copper busbars, which facilitates actual production assembly and improves assembly efficiency.

[0037] Furthermore, there is a gap between the main control driver integrated board 3 and the IGBT module 2. This gap allows for heat dissipation, which is achieved through the heat dissipation of the IGBT module 2; at the same time, it reduces the impact of the heat generated by the IGBT module 2 during operation on the main control driver integrated board 3.

[0038] Furthermore, such as Figures 1-2 As shown, the capacitor housing 1.1 includes a main housing 1.1.1 and a side baffle 1.1.2. The main housing 1.1.1 has a potting cavity. A side mounting inlet communicating with the potting cavity is provided on one side of the main housing 1.1.1. A potting port 1.1.3 communicating with the potting cavity is provided on the side of the main housing 1.1.1 facing the IGBT module 2. In this embodiment, a heat sink 1.2 is disposed on the surface of the main housing 1.1.1, and the opening of the heat sink 1.2 also faces the IGBT module 2. The capacitor core 1.0 is inserted into the potting cavity through the side mounting inlet. The side baffle 1.1.2 is fixed to one side of the main housing 1.1.1 by clips or bolts and seals the side mounting inlet. In this embodiment, the side baffle 1.1.2 is fixed to one side of the main housing 1.1.1 by clips. This facilitates the installation of the side baffle 1.1.2. The potting cavity is filled with potting compound, which encapsulates the main housing 1.1.1, side baffle 1.1.2, and capacitor core 1.0 into a single unit. In this embodiment, the capacitor core 1.0 is inserted into the potting cavity through a side mounting inlet. Then, the side baffle 1.1.2 is fixed to one side of the main housing 1.1.1 using clips or bolts, and the side mounting inlet is sealed to prevent subsequent potting compound leakage. This facilitates the assembly of the capacitor core 1.0 and the capacitor housing 1.1. It also facilitates the filling of the potting cavity with potting compound through the potting port 1.1.3, encapsulating the main housing 1.1.1, side baffle 1.1.2, and capacitor core 1.0 into a single unit, thereby facilitating the actual manufacturing of the capacitor.

[0039] Furthermore, such as Figures 1-2 As shown, the potting port 1.1.3 and the slot of the heat sink 1.2 are located on the same side of the main housing 1.1.1. The capacitor copper busbar 1.0.1 extends out of the potting port 1.1.3 to the outside of the capacitor housing 1.1. Since the IGBT module 2 is installed on the side of the capacitor housing 1.1 where the heat sink 1.2 is located, the capacitor copper busbar 1.0.1 of the capacitor core 1.0 extends out of the capacitor housing 1.1 through the potting port 1.1.3. This makes the positions of the module copper busbar 2.1 and the capacitor copper busbar 1.0.1 more reasonable, and facilitates the production and installation of the module copper busbar 2.1 of the IGBT module 2 and the capacitor copper busbar 1.0.1 of the capacitor core 1.0.

[0040] Furthermore, such as Figures 2-3As shown, the capacitor core 1.0 is provided with a row of support pillars 1.0.2 that support the capacitor copper busbar 1.0.1. The capacitor copper busbar 1.0.1 is close to or abuts against the end face of the support pillar 1.0.2. The capacitor copper busbar 1.0.1 is located between the support pillar 1.0.2 and the module copper busbar 2.1.

[0041] In one example, the support column 1.0.2 has end holes on its end face. The module copper busbar 2.1 and the capacitor copper busbar 1.0.1 are connected together by bolts or screws. The bolts or screws pass through the connection holes on the module copper busbar 2.1 and the capacitor copper busbar 1.0.1 and are threaded onto the end holes of the support column 1.0.2. This facilitates the connection of the module copper busbar 2.1 and the capacitor copper busbar 1.0.1 together by bolts or screws.

[0042] In another example, the capacitor copper busbar 1.0.1 is close to or abuts against the end face of the support column 1.0.2. After the IGBT module 2 is fixedly mounted on the capacitor housing 1.1 by the first screw, the module copper busbar 2.1 is pressed against the capacitor copper busbar 1.0.1, while the capacitor copper busbar 1.0.1 also abuts against the end face of the support column 1.0.2. Then, the module copper busbar 2.1 and the capacitor copper busbar 1.0.1 are connected together by welding.

[0043] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the present utility model. Any simple modifications, alterations, or equivalent transformations made to the above embodiments based on the technical essence of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. An integrated structure for a power module of a new energy drive motor controller, characterized in that, include: A capacitor includes a capacitor housing and a capacitor core encapsulated within the capacitor housing. The capacitor housing is provided with a support assembly, a heat dissipation tank, and an inlet and outlet connected to the heat dissipation tank. The support assembly includes several support and fixing columns. The IGBT module is fixedly mounted on the capacitor housing by the first screw, and the IGBT module seals and covers the opening of the heat sink. The main control drive integrated board is fixedly mounted on each support column of the support assembly by the second screw, and the IGBT module is located between the capacitor housing and the main control drive integrated board.

2. The integrated structure of a power module for a new energy drive motor controller according to claim 1, characterized in that, The capacitor housing includes: The main housing has a potting cavity. A side inlet connected to the potting cavity is provided on one side of the main housing. A potting port connected to the potting cavity is provided on the side of the main housing facing the IGBT module. The capacitor core is inserted into the potting cavity through the side inlet. The side baffle is fixed to one side of the main housing by clips or bolts and seals the side mounting inlet. The potting cavity is filled with potting compound, and the main housing, side baffle and capacitor core are potted together by the potting compound.

3. The integrated structure of a power module for a new energy drive motor controller according to claim 2, characterized in that, The filling port and the opening of the heat dissipation water tank are located on the same side of the main casing.

4. The integrated structure of a power module for a new energy drive motor controller according to claim 2 or 3, characterized in that, The capacitor core includes a capacitor copper busbar that extends from the potting port to the outside of the capacitor housing. The IGBT module includes a module copper busbar that is close to or adjacent to the capacitor copper busbar. The module copper busbar and the capacitor copper busbar are connected by welding and / or bolts.

5. The integrated structure of a power module for a new energy drive motor controller according to claim 4, characterized in that, The capacitor core is provided with a row of support pillars that support the capacitor copper busbar. The capacitor copper busbar is close to or abuts against the end face of the support pillar and is located between the support pillar and the module copper busbar.

6. The integrated structure of a power module for a new energy drive motor controller according to claim 1, characterized in that, The capacitor core includes a capacitor copper busbar, and the IGBT module includes a module copper busbar. The module copper busbar is close to or adjacent to the capacitor copper busbar, and the module copper busbar and the capacitor copper busbar are connected by welding or bolts.

7. The integrated structure of a power module for a new energy drive motor controller according to claim 1, 2, or 3, characterized in that, The IGBT module includes several module pins. The main control and driver integrated board has plug holes that correspond one-to-one with the module pins. The module pins are inserted into the corresponding plug holes on the main control and driver integrated board and connected by soldering. The IGBT module communicates with the main control and driver integrated board through the module pins.

8. The integrated structure of a power module for a new energy drive motor controller according to claim 1, 2, or 3, characterized in that, A sealing ring is provided between the capacitor housing and the IGBT module, and the sealing ring surrounds the outside of the opening of the heat dissipation water tank.

9. The integrated structure of a power module for a new energy drive motor controller according to claim 1, 2, or 3, characterized in that, The main control and drive integrated board is equipped with a current sensor for measuring phase line current, and the current sensor is welded to the main control and drive integrated board.

10. The integrated structure of a power module for a new energy drive motor controller according to claim 1, 2, or 3, characterized in that, There is a gap between the main control driver integrated board and the IGBT module.

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