Circuit board heat dissipation structure

Abstract

The utility model relates to circuit board technical field discloses a circuit board heat radiation structure, include: casing, circuit board sets up in the inner bottom wall of casing, heating element sets up in the upper surface of circuit board, every heating element is equipped with through -hole on the circuit board, heat conduction piece is set up in the inner bottom wall of casing with every heating element one -to -one, is located between the inner bottom wall of casing and circuit board, is used for with the heat that heating element radiated is conducted to the outside of casing from through -hole, the upper surface of heat conduction piece is sequentially stacked with heat conduction insulating layer and heat conduction gel layer, and heat conduction gel layer fills in the gap formed between heating element and heat conduction piece.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and specifically to a circuit board heat dissipation structure. Background Technology

[0002] With the rapid development of electronic technology, electronic products are becoming increasingly integrated. Typically, PCB boards are used in electronic products to house the wires, transistors, resistors, capacitors, inductors, integrated chips, and power devices required for integrated circuits. Because PCB boards integrate a variety of components, they are subject to heat generation issues, thus requiring heat dissipation measures.

[0003] In related technologies, silicone sheets are usually attached to the surface of components to conduct heat for heat dissipation. However, since silicone sheets are usually regular planar shapes and have a certain thickness, they are difficult to attach smoothly to irregularly shaped components, resulting in poor heat conduction. Utility Model Content

[0004] In view of this, the present invention provides a circuit board heat dissipation structure to solve the problem that the existing method of heat dissipation by attaching silicone sheets to the surface of components has poor thermal conductivity.

[0005] This utility model provides a circuit board heat dissipation structure, including: case; A circuit board is disposed on the inner bottom wall of the housing; A heating element is disposed on the upper surface of the circuit board; a through hole is provided on the circuit board for each heating element; A heat-conducting component is disposed on the inner bottom wall of the housing in a one-to-one correspondence with each of the heating elements, located between the inner bottom wall of the housing and the heating elements, for conducting the heat emitted by the heating elements to the outside of the housing through the through hole; a thermally conductive insulating layer and a thermally conductive gel layer are stacked sequentially on the upper surface of the heat-conducting component, and the thermally conductive gel layer fills the gap formed between the heating elements and the heat-conducting component.

[0006] In one optional embodiment, the heat-conducting component includes a first boss and a second boss, and the heating component includes a first heating component and a second heating component; the positions of the first boss and the first heating component are respectively configured to correspond one-to-one, and the positions of the second boss and the second heating component are respectively configured to correspond one-to-one.

[0007] In one optional embodiment, the first boss includes a first sub-boss and a second sub-boss; the first sub-boss is disposed on the inner bottom wall of the housing, and at least one second sub-boss is provided on the upper surface of the first sub-boss, and the upper surface of the second sub-boss is provided with the thermally conductive insulating layer and the thermally conductive gel layer, and the second sub-boss is adapted to be embedded in the through hole.

[0008] In one alternative embodiment, the first boss and the second boss are integrally formed with the housing.

[0009] In one alternative implementation, the first heating element is an inductor or a transformer; And / or, the second heating element is a MOS transistor, a surface mount device, or a busbar.

[0010] The technical solution of this utility model has at least the following advantages: 1. In this utility model, the heat of the heating element is conducted to the shell for heat dissipation through the through holes on the circuit board and the heat-conducting component. The thermal resistance is small, the heat conduction efficiency is high, and the heat dissipation effect is improved.

[0011] 2. In this utility model, the heat-conducting component contacts the heating component through a thermally conductive insulating layer and a thermally conductive gel layer. The thermally conductive gel layer fills the gap formed between the heating component and the heat-conducting component, ensuring a tight fit between the thermally conductive gel and the exposed portion of the heating component at the through-hole. This avoids gaps, increases the heat transfer area, reduces thermal resistance, increases thermal conductivity, increases breakdown voltage, and improves shock resistance, ensuring stable overall operation, extending service life, and enhancing heat dissipation. When maintenance is required, only the thermally conductive insulating layer needs to be peeled off, and the thermally conductive gel layer can be removed along with it, leaving no residue and improving maintenance efficiency.

[0012] 3. In this utility model, because the bottom of the heating element is exposed by through holes on the circuit board, the circuit board can contact the heat-conducting element without being upside down when installed in the housing. Compared with the upside-down method, the overall size can be reduced, front wiring and maintenance can be facilitated, installation efficiency can be improved, and it will not cause short circuits and generate electric arcs on the front, thereby causing thermal runaway and explosion of the battery. Attached Figure Description

[0013] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the first internal structure of the shell according to an embodiment of the present utility model; Figure 2 This is a schematic diagram of the second internal structure of the shell according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of a circuit board heat dissipation structure according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of the circuit board structure from a first perspective according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the circuit board structure from a second perspective according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the bottom structure of the shell according to an embodiment of the present invention.

[0015] Explanation of reference numerals in the attached figures: 1. Housing; 2. Circuit board; 3. Heating element; 4. Through hole; 5. Thermal conductive element; 6. Thermal conductive gel layer; 7. Heat dissipation element. Detailed Implementation

[0016] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0017] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] The following is combined Figures 1 to 6 The following describes embodiments of the present invention.

[0021] According to an embodiment of the present invention, a heat dissipation structure for a circuit board 2 is provided, comprising: a housing 1; a circuit board 2 disposed on the inner bottom wall of the housing 1; a heating element 3 disposed on the upper surface of the circuit board 2; a through hole 4 provided on the circuit board 2 corresponding to each heating element 3; a heat-conducting element 5 disposed on the inner bottom wall of the housing 1 corresponding to each heating element 3, located between the inner bottom wall of the housing 1 and the heating element 3, for conducting the heat emitted by the heating element 3 to the outside of the housing 1 through the through hole 4; a thermally conductive insulating layer and a thermally conductive gel layer 6 are sequentially stacked on the upper surface of the heat-conducting element 5, the thermally conductive gel layer 6 filling the gap formed between the heating element 3 and the heat-conducting element 5.

[0022] It should be noted that no specific limit is made to the through hole 4. The number, size and shape of the through hole 4 corresponding to each heating element 3 are selected according to actual needs. The position of the heat-conducting element 5 corresponds to the position of the through hole 4. The gap formed between the heating element 3 and the heat-conducting element 5 includes the through hole 4 and the gap between the thermal insulation layer and the circuit board 2.

[0023] In this embodiment, through holes 4 are provided on the circuit board 2 corresponding to the positions of each heating element 3, so that the heating element 3 is at least partially exposed in the through holes 4. A heat-conducting element 5 is provided on the inner bottom wall of the housing 1 corresponding to the position of each heating element 3, and the position of the heat-conducting element 5 corresponds to the position of the through hole 4 of the heating element 3. At the same time, a thermally conductive insulating layer is provided on the surface of the heat-conducting element 5, and a thermally conductive gel layer 6 is filled in the gap formed between the heating element 3 and the heat-conducting element 5 on the thermally conductive insulating layer. This allows the heat-conducting element 5 to contact the heating element 3 through the thermally conductive insulating layer and the thermally conductive gel layer 6. In particular, for heating elements 3 with irregular surfaces, the thermally conductive gel layer tightly adheres to the exposed part of the heating element 3 at the through hole 4, avoiding gaps and increasing the heat transfer area. During operation, the heat generated by the heating element 3 is conducted through the through hole 4, sequentially through the thermally conductive gel layer 6 and the thermally conductive insulating layer to the heat-conducting element 5, and then from the heat-conducting element 5 to the housing. The body 1 dissipates heat externally, has low thermal resistance, high thermal conductivity, high breakdown voltage, and good shock resistance, ensuring stable overall operation, improving service life and heat dissipation. When maintenance is required, only the thermally conductive insulation layer needs to be peeled off, and the thermally conductive gel layer 6 can also be removed together, leaving no residue and improving maintenance efficiency. In addition, because the circuit board 2 has through holes 4 to expose the bottom of the heat-generating component 3, the circuit board 2 can contact the heat-generating component 5 without being upside down when installed in the housing 1. Compared with the upside-down method, the overall size can be reduced, making it easier to wire and maintain from the front, improving installation efficiency, and preventing short circuits and arcing on the front, which could cause thermal runaway and explosion of the battery. For example, in a fully sealed scenario, one side of the circuit board 2 is the inverter and the other side is the battery. If the circuit board 2 is upside down, the pins of the components are on the front, which can easily cause arcing on the front and lead to thermal runaway and explosion of the battery.

[0024] In one embodiment, such as Figure 1 As shown, the heat-conducting component 5 includes a first boss and a second boss, and the heating component 3 includes a first heating component 3 and a second heating component 3; the positions of the first boss and the first heating component 3 are set in a one-to-one correspondence, and the positions of the second boss and the second heating component 3 are set in a one-to-one correspondence.

[0025] In this embodiment, the heat-conducting component 5 includes a first boss and a second boss, and the heat-generating component 3 includes a first heat-generating component 3 and a second heat-generating component 3. The shape and size of the first boss and the second boss can be adaptively adjusted according to the shape and size of the first heat-generating component 3 and the second heat-generating component 3 to meet the requirements. The first boss and the second boss respectively dissipate heat from the first heat-generating component 3 and the second heat-generating component 3, thereby improving the heat dissipation effect.

[0026] In one embodiment, the first boss and the second boss are integrally formed with the housing 1.

[0027] In this embodiment, the first boss and the second boss are integrally formed with the shell 1, which improves the structural strength and overall heat dissipation effect.

[0028] In one embodiment, the first boss includes a first sub-boss and a second sub-boss; the first sub-boss is disposed on the inner bottom wall of the housing 1, and at least one second sub-boss is provided on the upper surface of the first sub-boss. The upper surface of the second sub-boss is provided with a thermally conductive insulating layer and a thermally conductive gel layer 6, and the second sub-boss is adapted to be embedded in the through hole 4.

[0029] In this embodiment, the first boss is composed of a first sub-boob and a second sub-boob forming a stepped structure. During installation, the second sub-boob can be embedded in the through hole 4, and the second sub-boob contacts the first heating element 3 through the thermally conductive insulating layer and the thermally conductive gel layer 6 to conduct heat. The second sub-boob can both limit the circuit board 2 and dissipate heat from the first heating element 3, thus improving the heat dissipation effect. In addition, one or more second sub-boobs can be provided, and one or more through holes 4 corresponding to the first heating element 3 can be provided accordingly. The specific configuration can be set according to actual needs. When multiple second sub-boobs are provided, they can be spaced out to improve the heat dissipation effect.

[0030] In one embodiment, such as Figure 3 and Figure 4 As shown, the first heating element 3 is an inductor or a transformer.

[0031] In this embodiment, the first heating element 3 is an inductor or a transformer. The inductor and the transformer are respectively provided with a first boss. In particular, when the first heating element 3 is an inductor, the thermal conductive gel can fill the gaps of the enameled wire by filling it with thermal conductive gel. The heat transfer area is large, which can effectively conduct the heat on the surface of the enameled wire and can work reliably and stably.

[0032] In one embodiment, such as Figure 3 and Figure 4 As shown, the second heating element 3 is a MOS transistor, a surface mount device, or a busbar.

[0033] In this embodiment, a second protrusion is provided for each of the MOS transistor, the surface mount device, and the busbar. The second protrusion, together with the thermally conductive insulating layer and the thermally conductive gel layer 6, dissipates heat from the MOS transistor, the surface mount device, or the busbar, thereby improving the heat dissipation effect.

[0034] In one embodiment, the thermally conductive insulating layer is a thermally conductive silicone sheet.

[0035] In this embodiment, the thermally conductive insulating layer is made of thermally conductive silicone sheet, which has good thermal conductivity and insulation performance, high breakdown voltage resistance, and good shock resistance.

[0036] In one embodiment, the heat-conducting element 5 is made of aluminum.

[0037] In this embodiment, the heat-conducting component 5 is made of aluminum, which is lightweight and has good thermal conductivity.

[0038] Specifically, the shell 1 is made of aluminum, which is lightweight and has good thermal conductivity.

[0039] In one embodiment, such as Figure 6 As shown, the bottom of the housing 1 is provided with a heat sink 7 corresponding to the circuit board 2.

[0040] In this embodiment, the bottom of the housing 1 is provided with a heat sink 7 corresponding to the circuit board 2, so as to conduct the heat transferred by the heat conductor 5 to the heat sink 7, thereby further improving the heat dissipation effect.

[0041] In one embodiment, such as Figure 6 As shown, heat sink 7 is a heat sink fin.

[0042] In this embodiment, heat exchange is performed on the outside through heat dissipation fins, and the heat conducted by the heat conductor 5 is transferred out, thereby improving the heat dissipation effect.

[0043] In one embodiment, such as Figure 3 As shown, circuit board 2 is connected to housing 1 by studs.

[0044] In this embodiment, the circuit board 2 is connected to the housing 1 by studs, which facilitates installation and disassembly, and maintains a certain distance between the circuit board 2 and the inner bottom wall of the housing 1 to facilitate the installation of the heat-conducting component 5.

[0045] The specific working principle of the heat dissipation structure of the circuit board 2 provided in this embodiment is as follows: the heat generated by the first heating element is conducted sequentially through the thermally conductive gel layer 6, the thermally conductive silicone sheet, the second sub-protrusion, and the first sub-protrusion to the heat dissipation fins on the outside of the housing 1 for heat dissipation; the heat generated by the second heating element is conducted sequentially through the thermally conductive gel layer 6, the thermally conductive silicone layer, and the second protrusion to the heat dissipation fins on the outside of the housing 1 for heat dissipation.

[0046] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A heat dissipation structure for a circuit board, characterized in that, include: Shell (1); Circuit board (2) is disposed on the inner bottom wall of the housing (1); A heating element (3) is disposed on the upper surface of the circuit board (2); a through hole (4) is provided on the circuit board (2) for each heating element (3); A heat-conducting element (5) is disposed on the inner bottom wall of the housing (1) in a one-to-one correspondence with each of the heating elements (3), located between the inner bottom wall of the housing (1) and the heating elements (3), for conducting the heat emitted by the heating elements (3) to the outside of the housing (1) through the through hole (4); a heat-conducting insulating layer and a heat-conducting gel layer (6) are stacked sequentially on the upper surface of the heat-conducting element (5), and the heat-conducting gel layer (6) fills the gap formed between the heating elements (3) and the heat-conducting element (5).

2. The circuit board heat dissipation structure according to claim 1, characterized in that, The heat-conducting component (5) includes a first boss and a second boss, and the heating component (3) includes a first heating component (3) and a second heating component (3); the position of the first boss corresponds to the position of the first heating component (3), and the position of the second boss corresponds to the position of the second heating component (3).

3. The circuit board heat dissipation structure according to claim 2, characterized in that, The first boss includes a first sub-boss and a second sub-boss; the first sub-boss is disposed on the inner bottom wall of the housing (1), and at least one second sub-boss is provided on the upper surface of the first sub-boss. The upper surface of the second sub-boss is provided with the thermally conductive insulating layer and the thermally conductive gel layer (6). The second sub-boss is adapted to be embedded in the through hole (4).

4. The circuit board heat dissipation structure according to claim 2, characterized in that, The first boss and the second boss are integrally formed with the housing (1).

5. The circuit board heat dissipation structure according to claim 2, characterized in that, The first heating element (3) is an inductor or a transformer; And / or, the second heating element (3) is a MOS transistor, a surface mount device, or a busbar.

6. The circuit board heat dissipation structure according to claim 1, characterized in that, The thermally conductive insulating layer is a thermally conductive silicone sheet.

7. The circuit board heat dissipation structure according to claim 1, characterized in that, The heat-conducting component (5) is made of aluminum.

8. The circuit board heat dissipation structure according to any one of claims 1 to 7, characterized in that, The bottom of the housing (1) is provided with a heat sink (7) corresponding to the circuit board (2).

9. The circuit board heat dissipation structure according to claim 8, characterized in that, The heat sink (7) is a heat sink fin.

10. The circuit board heat dissipation structure according to claim 1, characterized in that, The circuit board (2) is connected to the housing (1) by studs.

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