An electronic pen

Abstract

The application relates to the technical field of electronic pens, in particular to an electronic pen. The electronic pen comprises a circuit board, the circuit board comprises a board body and a first component, the first component is connected with the board body; a protection structure, the protection structure comprises at least one of a shielding structure and an insulating structure, the shielding structure is grounded, and the insulating structure is a structure made of insulating material; the protection structure and the board body enclose a protection cavity, and the first component is located in the protection cavity. When the protection structure comprises the shielding structure, the grounded shielding structure can isolate the first component from an external electrostatic field, so that external static charges are only distributed on the outer surface of the shielding structure, and the internal electric field intensity of the shielding structure is zero. When the protection structure comprises the insulating structure, the insulating structure can physically isolate the direct conduction path of external static electricity to the first component, so as to realize electrostatic protection of the first component. By adopting the protection structure, damage of static electricity to the circuit board can be prevented, and the anti-static capability of the electronic pen is improved.

Description

Technical Field

[0001] This application relates to the field of electronic pen technology, and more particularly to an electronic pen. Background Technology

[0002] During the disassembly, assembly, and maintenance of electronic pens, the circuit board sometimes has to be exposed. For example, when removing the battery, the circuit board is exposed. Current electronic pens do not have independent protective structures for the circuit board, making it easily susceptible to electrostatic damage and failure when exposed. Utility Model Content

[0003] To address the aforementioned issues, this application provides an electronic pen.

[0004] This application embodiment provides an electronic pen, the electronic pen comprising: A circuit board, the circuit board including a board body and a first component, the first component being connected to the board body; The protective structure includes at least one of a shielding structure and an insulating structure, wherein the shielding structure is grounded and the insulating structure is made of insulating material; the protective structure and the plate form a protective cavity, and the first component is located inside the protective cavity.

[0005] Optionally, the insulating structure includes an insulating shell, the shielding structure includes a metal foil, the insulating shell and the plate form the protective cavity, and the metal foil covers the side of the insulating shell facing away from the first component and is grounded.

[0006] Optionally, the electronic pen includes structural components; The circuit board and the insulating shell are both disposed on the same side of the structural component and are fixedly connected to the structural component. The metal foil extends to the side of the structural component opposite to the insulating shell and is fixedly connected to the structural component.

[0007] Optionally, the circuit board includes a connection structure, wherein the insulating shell and a portion of the board body form the protective cavity, and the connection structure is located outside the protective cavity and is used for connection to the battery; and / or, The circuit board includes a wireless charging coil, which is disposed on the side of the structural component facing away from the insulating shell. The structural component has a through hole, through which the wire of the wireless charging coil passes and is connected to the board body. The through hole is located on the part of the structural component not covered by the metal foil.

[0008] Optionally, the shielding structure includes a shielding cover, which is fixedly connected to the plate and grounded, and the shielding cover covers the first component.

[0009] Optionally, the circuit board includes a second component and a transient voltage suppression diode, wherein the transient voltage suppression diode is connected in parallel with the second component and grounded.

[0010] Optionally, the insulating structure includes an adhesive layer that covers at least a portion of the first component.

[0011] Optionally, the gap between the inner wall of the shield and the outer surface of the first component is θ, where 0.5mm ≤ θ ≤ 1mm.

[0012] Optionally, the thickness of the adhesive layer is h, where 0.2 mm ≤ h ≤ 0.5 mm.

[0013] Optionally, the board body includes pads, the first component is connected to the pads, and the distance between the edge of the adhesive layer and the pads is d, where d ≥ 0.3 mm.

[0014] In some embodiments of this application, the electronic pen includes a circuit board and a protective structure. The circuit board includes a connected board body and a first component. The protective structure includes at least one of a shielding structure and an insulating structure, wherein the shielding structure is grounded, and the insulating structure is made of an insulating material. The protective structure and the board body form a protective cavity, and the first component is located within the protective cavity. When the protective structure includes a shielding structure, the grounded shielding structure can isolate the first component from the external electrostatic field, ensuring that external static charges are distributed only on the outer surface of the shielding structure and that the electric field strength inside the shielding structure is zero, thereby achieving electrostatic protection for the first component. When the protective structure includes an insulating structure, since the insulating structure is made of an insulating material, it can physically isolate the direct conductive path of external static electricity to the first component, thus achieving electrostatic protection for the first component. Using the above-mentioned protective structure can prevent electrostatic damage to the circuit board when it is exposed, which is beneficial for improving the anti-static capability of the electronic pen and also provides convenience for the disassembly, assembly, and maintenance of the electronic pen.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is an isometric view of the circuit board and protective structure described in Embodiment 1 of this application; Figure 2 yes Figure 1 A cross-sectional diagram; Figure 3This is an isometric view of the circuit board and protective structure described in Embodiment 2 of this application; Figure 4 yes Figure 3 A bottom view from the perspective of the wireless charging coil side; Figure 5 yes Figure 4 Sectional view along AA; Figure 6 This is a cross-sectional schematic diagram of the circuit board and protective structure described in Embodiment 3 of this application; Figure 7 This is a cross-sectional schematic diagram of the circuit board and protective structure described in Embodiment 4 of this application; Reference numerals: 1. Circuit board; 11. Board body; 12. First component; 13. Connection structure; 14. Wireless charging coil; 2. Protective structure; 21. Insulating structure; 211. Insulating shell; 212. Adhesive layer; 22. Shielding structure; 221. Metal foil; 222. Shielding cover; 3. Protective cavity; 4. Structural component; 41. Through hole. Detailed Implementation

[0017] The embodiments of this utility model will now be described in detail. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0018] An electronic pen, also known as a smart pen or digital pen, is an electronic device that enables writing, drawing, or interactive input through digital technology. It is widely used in touch-screen devices such as tablets, graphics tablets, and smartphones. Existing electronic pens include capacitive, electromagnetic, ultrasonic, and hybrid technology pens. Through technologies such as pressure sensitivity, low latency, and tilt recognition, electronic pens can completely replace traditional pen and paper in digital creation and input.

[0019] During the disassembly, assembly, and maintenance of electronic pens, the circuit board sometimes has to be exposed. For example, most current electronic pens have removable batteries. When removing the battery, the circuit board is exposed. At this time, static electricity from the external environment, such as static electricity carried by the operator, can easily act on the exposed circuit board, affecting or even damaging the components on it. This can easily lead to circuit board failure, thus affecting the performance and lifespan of the electronic pen. Exposed circuit boards also increase the requirements for anti-static conditions during disassembly, assembly, and maintenance, potentially causing difficulties.

[0020] To address the aforementioned issues, this application proposes an electronic pen.

[0021] Example 1 refer to Figure 1 Embodiment 1 of this application provides an electronic pen, which specifically includes a circuit board 1 and a protective structure 2.

[0022] refer to Figure 2 Circuit board 1 is the core control center of the electronic pen, undertaking key tasks such as signal acquisition, data processing, wireless communication, and power management. Typically, circuit board 1 includes a board body 11 and a first component 12. The board body 11 generally integrates circuit traces and has pads for connecting to the first component 12. The first component 12 can be a main controller, a custom IC (integrated circuit), resistors, inductors, capacitors, etc., and is usually fixedly connected and electrically conductive to the pads on the board body 11 by soldering.

[0023] refer to Figure 2 The protective structure 2 is used to provide ESD (Electro-Static Discharge) protection for the first component 12. In the first embodiment of this application, the protective structure 2 includes at least one of a shielding structure 22 and an insulating structure 21. In other words, the protective structure 2 can be composed of a shielding structure 22, an insulating structure 21, or a combination of both. The protective structure 2 and the plate 11 form a protective cavity 3, and the first component 12 is located inside the protective cavity 3. In the first embodiment of this application, the protective cavity 3 can be a fully enclosed cavity structure or an open cavity structure, depending on the first component 12 that needs protection. For example, when the first component 12 is a resistor or capacitor, the protective cavity 3 can be a fully enclosed cavity structure that completely surrounds the first component 12. When the first component 12 is a packaged processor, since the top of the processor has an anti-static structure, the protective structure 2 can cover the processor from the periphery and form an open protective cavity 3 with the plate 11. The protective structure 2 is connected to the top of the processor to achieve all-round electrostatic protection.

[0024] refer to Figure 2The shielding structure 22 is generally made of highly conductive metallic materials such as copper, aluminum, and their alloys. When the shielding structure 22 acts as a protective structure 2 covering the first component 12, it isolates the first component 12 from the external electrostatic field. At this time, the external static charge is only distributed on the outer surface of the shielding structure 22, and the electric field strength inside the shielding structure 22 is zero. Therefore, the shielding structure 22 can protect the first component 12 from damage caused by electrostatic discharge. At the same time, the shielding structure 22 is grounded, so that the static charge accumulated on the shielding structure 22 can be promptly conducted to the ground. This prevents the static charge from accumulating on the shielding structure 22, thereby preventing the shielding structure 22 from becoming a discharge source for electrostatic discharge. The shielding structure 22 can also absorb the electromagnetic wave radiation brought by high-frequency electrostatic discharge through the eddy current effect, so as to prevent the electrostatic discharge from causing electromagnetic interference to the first component 12.

[0025] refer to Figure 2 The insulating structure 21 is a structure made of insulating material, which can be rubber, plastic, silicone, etc., and will not be described in detail here. In Embodiment 1 of this application, in order to ensure insulation performance, the surface resistivity of the insulating structure 21 needs to be greater than or equal to 10. 14 Ω. When the insulating structure 21 serves as the protective structure 2 covering the first component 12, the insulating structure 21 can physically block the direct conductive path of static electricity to the first component 12, thereby preventing damage to the first component 12 caused by static discharge.

[0026] Since the protective structure 2 employs at least one of the insulating structure 21 and the shielding structure 22, it can prevent electrostatic discharge from damaging the circuit board 1 when the electronic pen's circuit board 1 is exposed. This improves the electronic pen's anti-static capability and prevents damage caused by electrostatic discharge when the circuit board 1 is exposed, thus ensuring the electronic pen's performance and lifespan. Simultaneously, in scenarios requiring the exposed circuit board 1, such as battery removal or installation, the protective structure 2 ensures that the circuit board 1 is not affected or damaged by external electrostatic discharge. This reduces the anti-static requirements for disassembly, assembly, and maintenance of the electronic pen, thus facilitating these processes.

[0027] Example 2: Embodiment 2 of this application is a further improvement upon Embodiment 1. (See reference...) Figure 3 Compared to Embodiment 1, the electronic pen provided in Embodiment 2 of this application also has a circuit board 1 and a protective structure 2. Embodiment 2 of this application mainly further defines the specific structure of the protective structure 2.

[0028] refer to Figure 4 The cut position shown and Figure 5In the second embodiment described in this application, optionally, the insulating structure 21 includes an insulating shell 211, and the shielding structure 22 includes a metal foil 221. The insulating shell 211 and the plate 11 form a protective cavity 3, and the metal foil 221 covers the side of the insulating shell 211 facing away from the first component 12 and is grounded. At this time, the insulating structure 21 covers the first component 12 to physically block the direct conductive path of static electricity to the first component 12, so as to prevent the first component 12 from being damaged by static discharge. The metal foil 221 covers the side of the insulating shell 211 facing away from the first component 12 to isolate the first component 12 from the external electrostatic field. At this time, the external static charge is only distributed on the outer surface of the metal foil 221, and the electric field strength inside the metal foil 221 is zero. At the same time, the metal foil 221 is grounded to conduct the static charge accumulated on the metal foil 221 to the ground in a timely manner. In other words, by adopting the above structure, the first component 12 can be shielded and protected by the metal foil 221, and the first component 12 can be insulated and protected by the insulating shell 211. At the same time, the grounding of the metal foil 221 enables the grounding and release of static charge. This can significantly improve the electrostatic protection effect of the protective structure 2 on the first component 12, and can more reliably avoid damage to the first component 12 caused by electrostatic discharge.

[0029] In the second embodiment described in this application, specifically, the insulating shell 211 is a shell structure made of insulating materials such as plastic, silicone, or rubber. Specifically, it can be polycarbonate or a terpolymer material composed of acrylonitrile, butadiene, and styrene. The specific shape of the insulating shell 211 can be determined according to actual needs. For example, the insulating shell 211 can be a cubic shell structure with an opening on one side to form a closed receiving cavity with the plate 11. The metal foil 221 is preferably copper foil and is covered on the side of the insulating shell 211 facing away from the first component 12 by means of adhesion or other methods. The metal foil 221 can be connected to conductive sheets or wire structures to ground through the conductive sheets, wires, or other structures.

[0030] refer to Figure 5 In the second embodiment of this application, optionally, the electronic pen includes a structural component 4. The structural component 4 serves as the mounting base for structures such as the circuit board 1 and the protective structure 2. In the second embodiment of this application, the specific shape of the structural component 4 can be set according to actual needs. For example, the structural component 4 can be a plate-like structure with grooves for mounting the circuit board 1. The circuit board 1 can be fixedly connected to the structural component 4 by means of bonding, fastener connection, etc. Similarly, the insulating shell 211 can be fixedly connected to the structural component 4 by means of bonding, non-metallic welding, etc.

[0031] refer to Figure 5The circuit board 1 and the insulating shell 211 are both located on the same side of the structural component 4. A metal foil 221 is attached to the surface of the insulating shell 211 facing away from the first component 12, and the end of the metal foil 221 extends to the side of the structural component 4 facing away from the insulating shell 211. The metal foil 221 and the structural component 4 can also be fixedly connected by adhesive or other means. This allows the metal foil 221 to seal the gap between the insulating shell 211 and the structural component 4, preventing static charge from entering the protective structure 2 through the gap between the structural component 4 and the insulating shell 211, thereby preventing the gap between the insulating shell 211 and the structural component 4 from affecting the protective effect of the protective structure 2. This further improves the comprehensive protection of the first component 12 by the protective structure 2, thereby improving the electrostatic protection effect of the protective structure 2 on the first component 12.

[0032] refer to Figure 5 In the second embodiment described in this application, optionally, the circuit board 1 includes a connection structure 13 for connecting to the battery. The connection structure 13 can be configured according to actual needs; for example, the connection structure 13 can be a spring contact that abuts against the battery. The insulating shell 211 and part of the board body 11 form a protective cavity 3, and the connection structure 13 is located outside the protective cavity 3. Since the battery connection structure 13 is located outside the protective structure 2, the protective structure 2 only protects the first component 12 on the circuit board 1. Therefore, when the battery is installed or removed, the protective structure 2 will not interfere with the installation or removal of the battery. This ensures the protection of the first component 12 while meeting the electronic pen's requirements for battery installation and removal.

[0033] refer to Figure 5 Some existing electronic pens have wireless charging capabilities, meaning that the electronic pen's circuit board 1 includes a wireless charging coil 14. The wireless charging coil 14 is located on the side of the structural component 4 facing away from the insulating shell 211, as shown in the reference diagram. Figure 4 The structural component 4 is provided with a through hole 41, through which the wires of the wireless charging coil 14 pass and connect to the board body 11 of the circuit board 1. Typically, two through holes 41 are provided to accommodate the two ends of the wires of the wireless charging coil 14 respectively. The through holes 41 are located on the portion of the structural component 4 not covered by the metal foil 221 to prevent the metal foil 221 from affecting the wireless charging coil 14. Since the wireless charging coil 14 is located outside the insulating shell 211, and the through holes 41 on the structural component 4 for the wires of the wireless charging coil 14 to pass through are located on the portion not covered by the metal foil 221, the protective structure 2 will not affect the normal operation of the wireless charging coil 14. This ensures protection for the first component 12 while meeting the wireless charging requirements of the electronic pen.

[0034] In the second embodiment of this application, for an electronic pen that is equipped with both a removable battery and a wireless charging coil 14, the wireless charging coil 14 and the connection structure 13 on the circuit board 1 can be configured using the aforementioned structures, which will not be described in detail here.

[0035] Example 3: Embodiment 3 of this application further improves upon Embodiment 1. Compared to Embodiment 1, the electronic pen provided in Embodiment 3 also has a circuit board 1 and a protective structure 2. Embodiment 3 mainly further defines the protective structure 2.

[0036] refer to Figure 6 In the third embodiment of this application, optionally, the shielding structure 22 includes a shielding cover 222. The shielding cover 222 is a cover structure made of conductive metals such as copper, aluminum, or their alloys. The shielding cover 222 can be fixedly connected to the plate 11 and grounded by welding or snap-fit ​​connection. Specifically, in the third embodiment of this application, the shielding cover 222 is welded to the exposed copper area of ​​the plate 11 where it is grounded, so as to achieve both fixed connection with the plate 11 and grounding.

[0037] refer to Figure 6 The shield 222 covers the first component 12, specifically including the body of the first component 12, the pins of the first component 12, and the corresponding pad area on the circuit board 1. In Embodiment 3 of this application, the first component can also be a main controller, a custom IC (integrated circuit), a resistor, an inductor, a capacitor, etc. The specific shape of the shield 222 can be set according to actual needs. For example, the shield 222 can be a cubic structure with an opening on one side to form a receiving cavity with the circuit board 1.

[0038] When the shield 222 covers the first component 12, it isolates the first component 12 from the external electrostatic field. At this time, the external static charge is only distributed on the outer surface of the shield 222, and the electric field strength inside the shield 222 is zero. Therefore, the shield 222 can protect the first component 12 from damage caused by electrostatic discharge. At the same time, the shield 222 is grounded, so that the static charge accumulated on the shield 222 can be promptly conducted to the ground. This prevents the static charge from accumulating on the shield 222, thereby preventing the shield 222 from becoming a discharge source for electrostatic discharge. The shield 222 can also absorb the electromagnetic wave radiation caused by high-frequency electrostatic discharge through the eddy current effect, so as to prevent the electrostatic discharge from causing electromagnetic interference to the first component 12.

[0039] In the third embodiment of this application, optionally, the circuit board 1 includes a second component and a transient voltage suppression diode, with the transient voltage suppression diode connected in parallel with the second component and grounded. Specifically, the input terminal of the transient voltage suppression diode is connected to the second component, and the output terminal is grounded. The second component can be a component that cannot be covered by the protective structure 2, such as an indicator light or a switch. When electrostatic discharge affects the second component, the transient voltage suppression diode connected in parallel with the second component can quickly reduce its own impedance to guide the current generated by electrostatic discharge to the ground. In the third embodiment of this application, the second component can also be a test node (such as a test structure) on the circuit board 1, or a connection node (such as a connector) on the circuit board 1, in which case the input terminal of the transient voltage suppression diode is connected to the node, and the output terminal is grounded.

[0040] In the third embodiment of this application, optionally, the gap between the inner wall of the shielding cover 222 and the outer surface of the first component 12 is θ, which is not less than 0.5 mm and not greater than 1 mm. Specifically, the gap θ between the inner wall of the shielding cover 222 and the outer surface of the first component 12 can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, etc. When the gap θ is less than 0.5 mm, if the shielding cover 222 deforms due to the electronic pen being dropped or collided, the shielding cover 222 is likely to conduct to the first component 12. This can easily cause the first component 12 to be grounded through the shielding cover 222, thereby affecting the normal operation of the first component 12. When the gap θ is greater than 1 mm, the space occupied by the shielding cover 222 increases. This can easily lead to wasted space on the circuit board 1 and make the space inside the electronic pen more congested, which is not conducive to the miniaturization design of the electronic pen.

[0041] Example 4: Embodiment 4 of this application further improves upon Embodiment 1. Compared to Embodiment 1, the electronic pen provided in Embodiment 4 also has a circuit board 1 and a protective structure 2. Embodiment 4 mainly further defines the protective structure 2.

[0042] refer to Figure 7 In Embodiment 4 of this application, optionally, the insulating structure 21 includes an adhesive layer 212. The adhesive layer 212 covers at least a portion of the first component 12 by dispensing. In other words, the adhesive layer 212 may cover only a portion of the first component 12, or it may cover the entire first component 12. For ease of understanding, different first components 12 are used as examples in Embodiment 4 of this application.

[0043] When the first component 12 is a resistor, capacitor, or other similar component, the adhesive layer 212 completely covers the first component 12, including the body and pins of the first component 12. At this time, the adhesive and the board 11 form a completely enclosed cavity, and the first component 12 can receive all-round electrostatic protection under the coverage of the adhesive.

[0044] When the first component 12 is a processor, since the top of the processor has an anti-static structure (e.g., an insulating coating), the adhesive layer 212 can cover the side of the first component 12 from its horizontal periphery. At this time, the adhesive layer 212 and the board 11 form an open protective cavity 3, and the adhesive layer 212 is in contact with the top of the processor to ensure that the processor has an all-round electrostatic protection effect.

[0045] In the fourth embodiment described in this application, specifically, the adhesive layer 212 can be composed of colloids such as epoxy resin, silicone, conformal adhesive, and UV-curable adhesive, and the surface resistivity of the adhesive layer 212 needs to be greater than or equal to 10. 14 Ω. When the adhesive layer 212 serves as a protective structure 2 covering the first component 12, it can physically block the direct conductive path of static electricity to the first component 12, thereby preventing damage to the first component 12 caused by static discharge.

[0046] In Embodiment 4 of this application, optionally, the thickness of the adhesive layer 212 is h, where 0.2mm ≤ h ≤ 0.5mm. Specifically, the thickness h of the adhesive can be 0.2mm, 0.3mm, 0.4mm, 0.5mm, etc. When the thickness of the adhesive layer 212 is less than 0.2mm, the adhesive layer 212 is too thin, resulting in poor insulation protection, and in severe cases, even a risk of breakdown. When the first component 12 is a processor, an excessively thin adhesive layer 212 can also cause gaps between the adhesive layer 212 and the top of the processor, thereby affecting the electrostatic protection effect of the first component 12. When the thickness of the adhesive layer 212 is greater than 0.5mm, the adhesive layer 212 will occupy more space on the circuit board 1. This is not conducive to the layout of the first component 12 on the circuit board 1, and may also bring interference risks to the assembly of the circuit board 1.

[0047] In the fourth embodiment of this application, optionally, the board body 11 has pads. The first component 12 is connected to the pads, and the distance between the edge of the adhesive layer 212 and the pad is d, and the distance d is not less than 0.3 mm. Specifically, the edge of the adhesive layer 212 is the part of the adhesive that is closest to the pad where it contacts the board body 11. The distance d between the edge of the adhesive layer 212 and the pad can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, etc. This provides a sufficient gap between the adhesive layer 212 and the pad to prevent the adhesive layer 212 from entering the pad, thereby preventing the adhesive from expanding and cracking the pad.

[0048] Specifically, when the first component 12 is a processor, the adhesive layer 212 covers the side of the first component 12 from its horizontal periphery. At this time, the adhesive layer 212 faces the protective cavity 3 formed by the board 11, and the pads on the board 11 that connect to the first component 12 are also within the protective cavity 3. The minimum distance from the side of the adhesive layer 212 facing the pad to the pad is the spacing d between the edge of the adhesive layer 212 and the pad.

[0049] Example 5: Embodiment 5 of this application further improves upon Embodiment 1. Compared to Embodiment 1, the electronic pen provided in Embodiment 5 also has a circuit board 1 and a protective structure 2. Embodiment 5 mainly further defines the protective structure 2.

[0050] In Embodiment 5 of this application, multiple first components 12 can be provided. Correspondingly, at least two protective structures 2 can also be provided. Specifically, two protective structures 2 can be provided, one of which covers a portion of the multiple first components 12, and the other protective structure 2 can cover the remaining first components 12. The two protective structures 2 can have the same structure or different structures. For example, both protective structures 2 can include the insulating shell 211 and metal foil 221 described in Embodiment 2 of this application, or both can include the shielding cover 222 described in Embodiment 3 of this application, or both can include the adhesive layer 212 described in Embodiment 4 of this application. Alternatively, one of the two protective structures 2 may include any one of the insulating shell 211 and metal foil 221 described in Embodiment 2 of this application, the shielding cover 222 described in Embodiment 3 of this application, and the adhesive layer 212 described in Embodiment 4 of this application. The other of the two protective structures 2 may include any one of the insulating shell 211 and metal foil 221 described in Embodiment 2 of this application, the shielding cover 222 described in Embodiment 3 of this application, and the adhesive layer 212 described in Embodiment 4 of this application. Three, four, five, or even more protective structures 2 may be provided. Multiple protective structures 2 may adopt the same structure or different structures. That is, when multiple protective structures 2 are provided, the multiple protective structures 2 may be any two or all of the following combinations: the insulating shell 211 and metal foil 221 described in Embodiment 2 of this application, the shielding cover 222 described in Embodiment 3 of this application, and the adhesive layer 212 described in Embodiment 4 of this application.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this application.

[0052] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or at least two of the features. In the description of this utility model, unless otherwise stated, "at least two" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0053] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "left", "right", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0054] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or at least two embodiments or examples.

[0056] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. An electronic pen, characterized in that, include: The circuit board (1) includes a board body (11) and a first component (12), wherein the first component (12) is connected to the board body (11); The protective structure (2) includes at least one of a shielding structure (22) and an insulating structure (21), wherein the shielding structure (22) is grounded and the insulating structure (21) is a structure made of insulating material; the protective structure (2) and the plate (11) form a protective cavity (3), and the first component (12) is located inside the protective cavity (3).

2. The electronic pen according to claim 1, characterized in that, The insulating structure (21) includes an insulating shell (211), and the shielding structure (22) includes a metal foil (221). The insulating shell (211) and the plate (11) form the protective cavity (3). The metal foil (221) covers the side of the insulating shell (211) facing away from the first component (12) and is grounded.

3. The electronic pen according to claim 2, characterized in that, The electronic pen includes a structural component (4); The circuit board (1) and the insulating shell (211) are both located on the same side of the structural member (4) and are fixedly connected to the structural member (4). The metal foil (221) extends to the side of the structural member (4) opposite to the insulating shell (211) and is fixedly connected to the structural member (4).

4. The electronic pen according to claim 3, characterized in that, The circuit board (1) includes a connection structure (13), the insulating shell (211) and a portion of the board body (11) forming the protective cavity (3), the connection structure (13) being located outside the protective cavity (3) and used for connection with a battery; and / or, The circuit board (1) includes a wireless charging coil (14), which is disposed on the side of the structural member (4) facing away from the insulating shell (211). The structural member (4) is provided with a through hole (41), through which the wire of the wireless charging coil (14) passes and is connected to the board body (11). The through hole (41) is located in the part of the structural member (4) not covered by the metal foil (221).

5. The electronic pen according to any one of claims 1-4, characterized in that, The shielding structure (22) includes a shielding cover (222), which is fixedly connected to the plate (11) and grounded, and the shielding cover (222) covers the first component (12).

6. The electronic pen according to any one of claims 1-4, characterized in that, The circuit board (1) includes a second component and a transient voltage suppression diode, wherein the transient voltage suppression diode is connected in parallel with the second component and grounded.

7. The electronic pen according to any one of claims 1-4, characterized in that, The insulating structure (21) includes an adhesive layer (212) that covers at least a portion of the first component (12).

8. The electronic pen according to claim 5, characterized in that, The gap between the inner wall of the shield (222) and the outer surface of the first component (12) is θ, 0.5mm≤θ≤1mm.

9. The electronic pen according to claim 7, characterized in that, The thickness of the adhesive layer (212) is h, where 0.2 mm ≤ h ≤ 0.5 mm.

10. The electronic pen according to claim 7, characterized in that, The board (11) includes a pad, the first component (12) is connected to the pad, and the distance between the edge of the adhesive layer (212) and the pad is d, where d ≥ 0.3 mm.

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