LED package with double-layered encapsulation structure

Abstract

The utility model discloses a LED packaging piece of double -layered glue encapsulation structure relates to LED packaging piece technical field, including the shell, and the shell inside is provided with the encapsulation mechanism, the encapsulation mechanism includes copper column, a plurality of lugs, chip, first glue seal layer and second glue seal layer, and copper column fixed mounting is in the bottom of shell inner wall, the utility model provides technical scheme in, adopt double -layered glue encapsulation design, and the first glue seal layer plays the basic sealed protection and fixed role to chip, and the second glue seal layer covers in the first glue seal layer top and is connected with copper column outer wall, and copper column outer wall top is provided with the lug, and the heat of chip work generates part through copper column direct conduction heat dissipation, and another part is passed to first glue seal layer and second glue seal layer, can fast heat conduction to copper column, and the contact area of second glue seal layer and copper column is increased to the lug simultaneously, and the heat dissipation efficiency has been improved significantly, and the problem that the luminous efficiency is reduced and the life is shortened because of the heat accumulation of chip is avoided effectively.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED packaging component with a double-layer adhesive encapsulation structure. Background Technology

[0002] LED packaging is a key technology in the manufacturing of semiconductor light-emitting diodes (LEDs) that protects the chip and enables efficient light emission. It is mainly used in lighting, display and other fields. Its core functions include mechanical protection, heat dissipation optimization, luminous efficiency improvement and power management. It requires the use of transparent and heat-resistant materials and special processes. White LEDs are achieved by encapsulating a mixture of blue light-emitting chips and phosphors. In current LED packaging technology, traditional packaging structures mostly adopt a single-layer encapsulation design. In the long-term use of a single-layer encapsulation layer, it is difficult to simultaneously achieve good light transmittance, mechanical protection performance and heat dissipation effect. As a result, when the LED packaged component is in high-power operation, the heat generated by the chip cannot be dissipated quickly, and heat accumulation is likely to occur, which in turn affects the luminous efficiency and lifespan of the chip. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an LED package with a double-layer adhesive encapsulation structure, so as to solve the problem that the prior art is prone to heat accumulation, which in turn affects the luminous efficiency and service life of the chip.

[0004] In view of this, the present invention provides an LED package with a double-layer adhesive encapsulation structure, including a housing, wherein an encapsulation mechanism is disposed inside the housing; The packaging mechanism includes a copper pillar, a plurality of bumps, a chip, a first encapsulation layer and a second encapsulation layer. The copper pillar is fixedly installed on the bottom of the inner wall of the outer shell. The plurality of bumps are integrally formed on the top of the outer wall of the copper pillar. The chip is disposed on the top of the copper pillar. The first encapsulation layer is disposed on the top of the chip and the copper pillar. The second encapsulation layer is disposed on the top of the first encapsulation layer.

[0005] Optionally, the bottom of the second sealant layer extends to the outer wall of the copper pillar, and the bottom of the second sealant layer is fixedly installed on the outer wall of the copper pillar.

[0006] Optionally, a phosphor layer is disposed on the top of the chip, and the phosphor layer is located between the top of the chip and the first encapsulating layer.

[0007] Optionally, a fixing adhesive layer is fixedly installed on the inner wall of the housing, and a lens is fixedly installed on the inner wall of the housing, with the bottom of the lens fixedly installed on the top of the fixing adhesive layer.

[0008] Optionally, a number of pins are fixedly mounted on the outer wall of the housing.

[0009] Optionally, a plurality of gold wires are fixedly mounted on the connection end of the chip, and the other end of the gold wires passes through the fixing adhesive layer and is connected to the corresponding pin.

[0010] Optionally, the top of the copper pillar is provided with a mounting groove, and the chip is fixedly mounted on the wall of the mounting groove.

[0011] As can be seen from the above technical solutions, the embodiments of this utility model have the following advantages: 1. This utility model discloses an LED package with a double-layer adhesive encapsulation structure. The double-layer adhesive encapsulation design provides basic sealing protection and fixation for the chip. The second adhesive encapsulation layer covers the top of the first adhesive encapsulation layer and connects to the outer wall of the copper pillar. The top of the outer wall of the copper pillar is provided with a protrusion. During use, part of the heat generated by the chip is directly conducted and dissipated through the copper pillar, and the other part is transferred to the first and second adhesive encapsulation layers. This allows for rapid heat conduction to the copper pillar. At the same time, the protrusion increases the contact area between the second adhesive encapsulation layer and the copper pillar, significantly improving heat dissipation efficiency and effectively preventing the chip from experiencing a decrease in luminous efficiency and a shortened lifespan due to heat accumulation.

[0012] 2. The present invention provides an LED package with a double-layer adhesive encapsulation structure, wherein the second adhesive layer can provide secondary protection for the first adhesive layer and the chip, thereby enhancing the mechanical strength and anti-aging performance of the package.

[0013] These features and advantages of the present invention will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is a diagram of the copper column of this utility model.

[0015] Explanation of reference numerals in the attached diagram: 1. Housing; 2. Pin; 3. Copper pillar; 4. Bump; 5. Chip; 6. Gold wire; 7. First encapsulation layer; 8. Second encapsulation layer; 9. Lens; 10. Fixing adhesive layer; 11. Phosphor layer. Detailed Implementation

[0016] The technical solutions of the present utility model will be explained and described below with reference to the accompanying drawings. However, the following embodiments are only preferred embodiments of the present utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments in the implementation methods without creative effort are all within the protection scope of the present utility model.

[0017] The following describes in detail, with reference to the accompanying drawings, an LED package with a double-layer adhesive encapsulation structure according to an embodiment of the present invention. Example

[0018] For easier understanding, please refer to Figures 1 to 3 This utility model provides an embodiment of an LED package with a double-layer adhesive encapsulation structure, including a shell 1, and an encapsulation mechanism disposed inside the shell 1; the encapsulation mechanism includes a copper pillar 3, a plurality of bumps 4, a chip 5, a first adhesive layer 7 and a second adhesive layer 8, the copper pillar 3 is fixedly installed on the bottom of the inner wall of the shell 1, the plurality of bumps 4 are integrally formed on the top of the outer wall of the copper pillar 3, the chip 5 is disposed on the top of the copper pillar 3, the first adhesive layer 7 is disposed on the top of the chip 5 and the copper pillar 3, and the second adhesive layer 8 is disposed on the top of the first adhesive layer 7.

[0019] It should be noted that a double-layer encapsulation design is adopted. The first encapsulation layer 7 provides basic sealing protection and fixation for the chip 5. The second encapsulation layer 8 covers the top of the first encapsulation layer 7 and connects to the outer wall of the copper pillar 3. The top of the outer wall of the copper pillar 3 is provided with a bump 4. During use, part of the heat generated by the chip 5 is directly conducted and dissipated through the copper pillar 3, and the other part is transferred to the first encapsulation layer 7 and the second encapsulation layer 8. This can quickly conduct heat to the copper pillar 3. At the same time, the bump 4 increases the contact area between the second encapsulation layer 8 and the copper pillar 3, which significantly improves the heat dissipation efficiency and effectively avoids the problem of decreased luminous efficiency and shortened lifespan of the chip due to heat accumulation.

[0020] In this example, the outer shell 1 serves as the external protective structure of the entire package. Its function is to provide mounting support and mechanical protection for the internal components, prevent external dust, moisture and other impurities from entering the package, avoid damage to the internal components from physical collisions, and ensure the overall structural stability of the package. The material used is ABS engineering plastic.

[0021] In this example, the copper pillar 3 is fixed to the bottom of the inner wall of the outer casing 1 by adhesive bonding. The copper pillar 3 has excellent thermal conductivity and can quickly conduct the heat generated by the chip 5 when it is working, dissipate the heat to the external environment, and reduce the working temperature of the chip 5. Its material is high-purity copper, which has a high thermal conductivity and excellent heat dissipation effect.

[0022] In this example, the first encapsulating layer 7 can be made of high-transmittance silicone, and the second encapsulating layer 8 is made of transparent thermally conductive material, specifically transparent thermally conductive silicone. It not only has good light transmittance to ensure that light can be emitted normally, but also has excellent thermal conductivity, which can quickly absorb the heat transferred from the chip 5 to the first encapsulating layer 7 and conduct the heat to the copper pillar 3, further improving the heat dissipation efficiency of the package. At the same time, the second encapsulating layer 8 can also provide secondary protection for the first encapsulating layer 7 and the chip 5, enhancing the mechanical strength and anti-aging performance of the package.

[0023] In some embodiments, such as Figure 2 , Figure 3 As shown, the bottom of the second adhesive layer 8 extends to the outer wall of the copper pillar 3, and the bottom of the second adhesive layer 8 is fixedly installed on the outer wall of the copper pillar 3. An installation groove is opened at the top of the copper pillar 3, and the chip 5 is fixedly installed on the groove wall.

[0024] It should be noted that the design of bump 4 can effectively increase the contact area between the second encapsulation layer 8 and the copper pillar 3, improve the heat conduction efficiency from the second encapsulation layer 8 to the copper pillar 3, and thus improve the heat dissipation performance of the entire package. At the same time, bump 4 can also enhance the connection between the second encapsulation layer 8 and the copper pillar 3, and prevent the second encapsulation layer 8 from falling off due to factors such as temperature changes.

[0025] In this example, chip 5 is the core light-emitting component of the LED package, which can convert electrical energy into light energy to achieve the light-emitting function. An LED chip can be selected.

[0026] In some embodiments, such as Figure 2 As shown, a phosphor layer 11 is provided on the top of the chip 5. The phosphor layer 11 is located between the top of the chip 5 and the first encapsulation layer 7. A fixing adhesive layer 10 is fixedly installed on the inner wall of the outer shell 1. A lens 9 is fixedly installed on the inner wall of the outer shell 1. The bottom of the lens 9 is fixedly installed on the top of the fixing adhesive layer 10.

[0027] It should be noted that the phosphor layer 11 uses YAG phosphor material. When the chip 5 emits blue light, the blue light passes through the phosphor layer 11, and the phosphor is excited to produce yellow light. The yellow light mixes with the unabsorbed blue light to form white light, thus achieving the light emission effect of white LED. The phosphor layer 11 has a uniform thickness, which ensures the consistency and stability of the emitted color.

[0028] In this example, the phosphor layer 11 is coated using a screen printing process, which can precisely control the thickness and uniformity of the phosphor layer 11, ensuring the stable luminescence performance of the package.

[0029] In this example, lens 9 is made of high-transmittance PMMA material, which has excellent light transmittance and optical focusing performance. It can focus and refract the light emitted by chip 5, improve the utilization rate and light output efficiency of light, make the light more concentrated, and enhance the lighting effect of LED package. The surface of lens 9 is optically polished to reduce the reflection and scattering loss of light. Example

[0030] In some embodiments, such as Figure 2 As shown, a number of pins 2 are fixedly installed on the outer wall of the outer casing 1, and a number of gold wires 6 are fixedly installed on the connection end of the chip 5. The other end of the gold wires 6 passes through the fixing adhesive layer 10 and is connected to the corresponding pin 2.

[0031] It should be noted that pin 2 is made of oxygen-free copper with a tin-plated surface, which has good conductivity and oxidation resistance. Its function is to realize the electrical connection between chip 5 and external circuit, and to transfer the power of external power supply to chip 5 to provide power support for the operation of chip 5. The number of pins 2 matches the number of electrodes of chip 5 to ensure the accuracy of circuit connection.

[0032] In this example, the gold wire 6 is made of 99.99% pure gold, which has excellent conductivity and flexibility, enabling a reliable electrical connection between chip 5 and pin 2. Its diameter is 25μm, which ensures both conductivity and good fatigue resistance, allowing it to adapt to temperature changes and slight vibrations during use, thus avoiding open circuits.

[0033] In this example, epoxy resin can be used to fix the adhesive layer 10.

[0034] Working principle: When the LED package is working, the external power supply inputs electrical energy through pin 2. The electrical energy is transmitted to chip 5 through gold wire 6. Chip 5 converts electrical energy into light energy. If it is a white LED package, the blue light emitted by chip 5 passes through phosphor layer 11, exciting the phosphor to produce yellow light. The yellow light and blue light mix to form white light. The light passes through the first encapsulation layer 7 and the second encapsulation layer 8 in sequence, and is emitted after being focused and refracted by lens 9 to realize the lighting function.

[0035] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An LED package with a double-layer adhesive encapsulation structure, characterized in that: Includes a housing (1), and the housing (1) is provided with an encapsulation mechanism inside; The encapsulation mechanism includes a copper pillar (3), several bumps (4), a chip (5), a first encapsulation layer (7) and a second encapsulation layer (8). The copper pillar (3) is fixedly installed on the bottom of the inner wall of the outer shell (1). Several bumps (4) are integrally formed on the top of the outer wall of the copper pillar (3). The chip (5) is disposed on the top of the copper pillar (3). The first encapsulation layer (7) is disposed on the top of the chip (5) and the copper pillar (3). The second encapsulation layer (8) is disposed on the top of the first encapsulation layer (7).

2. The LED package with a double-layer adhesive encapsulation structure according to claim 1, characterized in that: The bottom of the second sealant layer (8) extends to the outer wall of the copper column (3), and the bottom of the second sealant layer (8) is fixedly installed on the outer wall of the copper column (3).

3. The LED package with a double-layer adhesive encapsulation structure according to claim 1, characterized in that: A phosphor layer (11) is provided on the top of the chip (5), and the phosphor layer (11) is located between the top of the chip (5) and the first encapsulation layer (7).

4. The LED package with a double-layer adhesive encapsulation structure according to claim 1, characterized in that: A fixing adhesive layer (10) is fixedly installed on the inner wall of the outer shell (1), and a lens (9) is fixedly installed on the inner wall of the outer shell (1). The bottom of the lens (9) is fixedly installed on the top of the fixing adhesive layer (10).

5. The LED package with a double-layer adhesive encapsulation structure according to claim 4, characterized in that: The outer wall of the outer casing (1) is fixedly mounted with several pins (2).

6. The LED package with a double-layer adhesive encapsulation structure according to claim 5, characterized in that: The chip (5) has several gold wires (6) fixedly installed at its connection end. The other end of the gold wires (6) passes through the fixing adhesive layer (10) and is connected to the corresponding pin (2).

7. The LED package with a double-layer adhesive encapsulation structure according to claim 1, characterized in that: The copper pillar (3) has an installation groove at its top, and the chip (5) is fixedly installed on the wall of the installation groove.

Images