Lead frame and 3mm colloidal encapsulation direct insertion LED lamp bead
Patent Information
- Application Number
- CN202522517374.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-26
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-11-26
AI Technical Summary
此类产品目前所用的引线框架(见图1至图3)存在以下问题：一、需封装进胶体内的引线框架头部的总宽度A为(2.7±0.1)mm，若封装胶体直径为3mm，则引线框架头部3的外缘距离胶体外表面的距离仅有0.15mm(不算公差及生产过程中的偏差)，在客户端使用过程中，极易出现胶体破裂以及高温焊接过程中胶体软化引线框架移动导致的断线死灯
[0012]本实用新型的有益效果在于：通过将引线框架头部总宽度缩减至1.65-1.85mm，使封装后胶体边缘与引线框架的距离显著增大，有效避免了因距离过近导致的胶体破裂及高温焊接过程中胶体软化引发的引线框架移位断线死灯问题，大幅提升了3mm胶体封装直插LED灯珠的可靠性；同时将中间平台厚度减小至0.4-0.6mm，大幅降低了中间平台的面积，使电镀时镀层分布更均匀，从根本上解决了中间平台因镀层偏薄而出现的打线带起镀层、粘附不牢以及焊线瓷嘴磨损等问题，从而无需采用传统的加金球或加银胶等加固工艺，既降低了物料成本和工艺复杂度，又提高了生产效率；外侧平台与中间平台之间0.2-0.3mm的合理间距设置，配合中间平台厚度的优化，使得焊线线弧更加平缓顺畅，利于生产良率；综上，本技术方案在确保3mm胶体封装直插LED灯珠满足智能家居、通信领域高可靠性要求的同时，实现了生产成本的降低和制造效率的提升，延长了产品的使用寿命。
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Figure CN224875336U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of through-hole LED lamp bead technology, and in particular to a lead frame and a 3mm colloid-encapsulated through-hole LED lamp bead. Background Technology
[0002] With the continuous development of smart homes and communications, innovative products with high reliability are constantly emerging, driving the continuous innovation and improvement of peripheral supporting products. The reliability requirements for plug-in components are becoming increasingly stringent, especially for LED chips with a 3mm diameter colloid and three leads (2.54mm spacing between adjacent leads). The lead frame currently used in these products (see...) Figures 1 to 3 The following problems exist: First, the total width A of the lead frame head that needs to be encapsulated in the colloid is (2.7±0.1)mm. If the diameter of the encapsulating colloid is 3mm, then the distance between the outer edge of the lead frame head 3 and the outer surface of the colloid is only 0.15mm (not counting tolerances and deviations in the production process). During customer use, the colloid is very likely to crack and the lead frame may move due to the softening of the colloid during high-temperature soldering, resulting in broken wires and dead LEDs. 2. The size of the intermediate platform 21 at the end of the intermediate pin 2 is too large. Generally, the width B of the intermediate platform is (0.8±0.05) mm and the thickness C is (1.2±0.05) mm. During the electroplating process, because the area of the outer platform 11 at the end of the outer pin 1 is small, the plating layer on it will be relatively thick, so it can be processed normally for secondary soldering. However, the area of the intermediate platform 21 is large, and the plating layer on it is relatively thin. The wire bonding is easy to pull up the plating layer, and it is not firmly adhered. The thin plating layer will also increase the hardness of the bonding area, which will easily cause wear of the bonding ceramic tip and cause damage during secondary soldering. Therefore, in the existing technology, the intermediate platform 21 is forced to be reinforced by adding gold ball process or silver paste process during secondary soldering to ensure product quality. This directly leads to increased cost and slowed efficiency. Utility Model Content
[0003] The technical problem solved by this utility model is to provide a lead frame that helps reduce the production cost of LED beads, and a 3mm colloid-encapsulated through-hole LED bead with high reliability.
[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a lead frame, including two outer pins and an intermediate pin located between the two outer pins. The head of the lead frame includes an intermediate platform formed by the end of the intermediate pin and an outer platform formed by the end of the outer pins. The intermediate platform and the two outer platforms are arranged in a row. The total width of the head of the lead frame is 1.65-1.85mm, the distance between the outer platform and the intermediate platform is 0.2-0.3mm, and the thickness of the intermediate platform is 0.4-0.6mm.
[0005] In one embodiment, the width of the intermediate platform is 0.4-0.5 mm.
[0006] In one embodiment, the width of the intermediate platform is equal to the width of the outer platform.
[0007] In one embodiment, the thickness of the intermediate platform is equal to the thickness of the outer platform.
[0008] In one embodiment, the welding surface of the intermediate platform is 0.12-0.18 mm higher than the welding surface of the outer platform.
[0009] In one embodiment, the spacing between the middle pin and the outer pin is 2.54 ± 0.05 mm.
[0010] In one embodiment, the thickness of the outer pin is 0.35-0.55 mm.
[0011] To solve the above-mentioned technical problems, the second technical solution adopted by this utility model is: a 3mm colloid-encapsulated through-hole LED lamp bead, including an LED chip, a colloid and the aforementioned lead frame, wherein the LED chip is soldered to the head of the lead frame, and the colloid covers the head of the lead frame and the LED chip.
[0012] The beneficial effects of this invention are as follows: By reducing the total width of the lead frame head to 1.65-1.85mm, the distance between the edge of the encapsulated colloid and the lead frame is significantly increased, effectively avoiding colloid cracking due to excessive distance and lead frame displacement, wire breakage, and LED failure caused by colloid softening during high-temperature soldering. This greatly improves the reliability of 3mm colloid-encapsulated through-hole LED chips. Simultaneously, reducing the thickness of the intermediate platform to 0.4-0.6mm significantly reduces the area of the intermediate platform, resulting in a more uniform plating distribution during electroplating. This fundamentally solves the problem of wire lifting caused by a thin plating layer on the intermediate platform. This solution addresses issues such as poor plating and adhesion, as well as wear on the bonding tip, eliminating the need for traditional reinforcement processes like adding gold balls or silver paste. This reduces material costs and process complexity while improving production efficiency. The optimal 0.2-0.3mm spacing between the outer and middle platforms, combined with optimized middle platform thickness, results in smoother and more even bonding arcs, improving production yield. In summary, this technical solution ensures that 3mm encapsulated through-hole LED beads meet the high reliability requirements of smart homes and communications, while simultaneously reducing production costs, increasing manufacturing efficiency, and extending product lifespan. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0014] Figure 1 A front view of a lead frame in the prior art;
[0015] Figure 2 for Figure 1 Enlarged view at point F;
[0016] Figure 3 A top view of the lead frame head in a prior art lead frame;
[0017] Figure 4 This is a front view of the lead frame according to Embodiment 1 of this utility model;
[0018] Figure 5 for Figure 4 Enlarged view of point G in the middle;
[0019] Figure 6 This is a top view of the head of the lead frame in Embodiment 1 of this utility model;
[0020] Figure 7 This is a front view of a 3mm colloidal encapsulated through-hole LED bead according to Embodiment 1 of this utility model.
[0021] Explanation of icon numbers:
[0022] 1. Outer pin; 11. Outer platform;
[0023] 2. Intermediate pin; 21. Intermediate platform;
[0024] 3. Lead frame head;
[0025] 4. Colloids;
[0026] A. Total width of the lead frame head;
[0027] B. Width of the intermediate platform;
[0028] C. The thickness of the intermediate platform;
[0029] D. The distance between the outer platform and the middle platform;
[0030] E. The height difference between the welding surfaces of the intermediate platform and the outer platform. Detailed Implementation
[0031] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0033] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.
[0034] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0035] Furthermore, if the meaning of "and / or" in the entire text is to include three parallel solutions, taking "and A / or B" as an example, it includes solution A, solution B, and a solution that simultaneously satisfies both A and B. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0037] Example 1
[0038] Please refer to Figures 4 to 7One embodiment of this utility model is as follows: a lead frame includes two outer pins 1 and an intermediate pin 2 located between the two outer pins 1. The lead frame head 3 includes an intermediate platform 21 formed by the end of the intermediate pin 2 and an outer platform 11 formed by the end of the outer pins 1. The intermediate platform 21 and the two outer platforms 11 are arranged in a row. The total width A of the lead frame head is 1.65-1.85mm, the distance D between the outer platform and the intermediate platform is 0.2-0.3mm, and the thickness C of the intermediate platform is 0.4-0.6mm.
[0039] Preferably, the width B of the intermediate platform is 0.4-0.5mm. By further limiting the width of the intermediate platform 21 to 0.4-0.5mm, combined with its thickness design of 0.4-0.6mm, the welding area of the intermediate platform 21 is reduced by more than 50% compared with the prior art. The current density distribution during electroplating is more uniform, and the consistency of the plating thickness is significantly improved. This fundamentally solves the problem of thin plating caused by excessively large platform area and easy plating removal by wire bonding. The adhesion of the weld wire is enhanced, the breakage rate of the second weld is greatly reduced, and the reinforcement process of adding gold balls or silver paste is avoided, further reducing material costs and process complexity.
[0040] In one or more embodiments, the width of the intermediate platform 21 is equal to the width of the outer platform 11. The design that the width of the intermediate platform 21 is equal to the width of the outer platform 11 enables the three welding platforms to achieve uniform width dimensions, which is beneficial for the standardized design and processing of stamping dies, and reduces the cost and difficulty of die manufacturing. During the electroplating process, the current density distribution of the three platforms tends to be consistent, the coating thickness uniformity is better, and the quality stability between product batches is significantly improved. At the same time, the uniform width dimensions facilitate the standardized setting of wire bonding process parameters and improve production efficiency.
[0041] In one or more embodiments, the thickness of the intermediate platform 21 is equal to the thickness of the outer platform 11, and the width of the intermediate platform 21 is equal to the thickness of the outer platform 11. This matching design achieves the optimal configuration of the dimensions of the lead frame head 3 in all dimensions. While ensuring the mechanical strength of each platform, it makes the head structure more compact and symmetrical, and the stress distribution more uniform. It avoids the problem of local stress concentration caused by excessive size differences, and improves the overall structural stability of the lead frame. At the same time, this size matching relationship facilitates quality inspection and control during the processing, which is conducive to improving the yield.
[0042] In one embodiment, the welding surface of the intermediate platform 21 is higher than the welding surface of the outer platform 11, and the height difference E between the welding surfaces of the intermediate platform and the outer platform is 0.12-0.18 mm. This overcomes the defect in the prior art where the low intermediate platform 21 leads to uneven arc transitions, allowing the welding wire to form a smoother arc transition as it extends from the intermediate platform 21 to the outer platform 11. This effectively reduces stress concentration in the welding wire, significantly improves the reliability of the solder joint, and results in better consistency of the LED chip's light emission angle and more stable optical performance.
[0043] The spacing between the middle pin 2 and the outer pin 1 is 2.54 ± 0.05 mm, and the thickness of the outer pin 1 is 0.35-0.55 mm. This lead frame fully complies with the industry-standard 2.54 mm pin pitch, ensuring perfect compatibility with existing PCB board holes and insertion equipment. Customers can directly replace and use it without changing the circuit board design, improving the product's versatility and market adaptability, reducing customer switching costs, and facilitating large-scale promotion and application.
[0044] This embodiment also provides a 3mm encapsulated through-hole LED bead, which includes an LED chip, an encapsulated material 4, and the aforementioned lead frame. The LED chip is soldered to the head 3 of the lead frame, and the encapsulated material 4 covers the head 3 of the lead frame and the LED chip. The width of the short axis of the encapsulated material 4 is 3mm.
[0045] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A lead frame, characterized in that, The lead frame includes two outer pins and an intermediate pin located between the two outer pins. The lead frame head includes an intermediate platform formed by the end of the intermediate pin and an outer platform formed by the end of the outer pins. The intermediate platform is arranged in a row with the two outer platforms. The total width of the lead frame head is 1.65-1.85 mm. The spacing between the outer platforms and the intermediate platform is 0.2-0.3 mm. The thickness of the intermediate platform is 0.4-0.6 mm.
2. The lead frame according to claim 1, characterized in that, The width of the intermediate platform is 0.4-0.5 mm.
3. The lead frame according to claim 1, characterized in that, The width of the intermediate platform is equal to the width of the outer platform.
4. The lead frame according to claim 1, characterized in that, The thickness of the intermediate platform is equal to the thickness of the outer platform.
5. The lead frame according to claim 1, characterized in that, The welding surface of the intermediate platform is 0.12-0.18 mm higher than the welding surface of the outer platform.
6. The lead frame according to claim 1, characterized in that, The distance between the middle pin and the outer pin is 2.54±0.05mm.
7. The lead frame according to claim 1, characterized in that, The thickness of the outer pin is 0.35-0.55mm. 8.3mm gel-encapsulated through-hole LED beads, characterized in that, The device includes an LED chip, a colloid, and a lead frame as described in any one of claims 1-7, wherein the LED chip is soldered to the head of the lead frame, and the colloid covers the head of the lead frame and the LED chip.