A package structure of a display product

Abstract

The utility model belongs to display screen technical field relates to a kind of packaging structure of display screen product, including substrate, multiple LED luminous body distributed on substrate and the packaging colloid for wrapping LED luminous body top and periphery, the LED luminous body includes wafer and the electrode for being connected with substrate and being arranged at wafer bottom, the wafer periphery has the retaining wall cooperation with its side wall, and wafer can form its top single side light extraction under the action of retaining wall.The utility model solves the process problem of traditional lamp pearl patch and COB, can make the light-emitting spacing of small size display screen smaller, pixel is denser, color consistency is better, while it can be compatible SMT patching process or die bonding and crystal piercing operation process, wafer light-emitting point side after packaging has no light leakage problem, therefore, the utility model has the advantages of high production efficiency, good use effect, low input cost and the like.

Description

Technical Field

[0001] This utility model belongs to the field of display screen technology, and specifically relates to a packaging structure for display screen products. Background Technology

[0002] Currently, there are two manufacturing methods for display products on the market: one is to use RGB or white LED beads for module mounting, and the other is to manufacture them using COB (Chip-on-Board) technology.

[0003] The first design method uses SMD LED chips for module mounting. The sizes of these chips include 2121, 1515, 1010, 0606, and 0505. The chips are available in RGB three colors or pure white, with the smallest size currently being 0505. All chips are mounted using SMT. The spacing between individual chips (distance between the light-emitting center points) is 0.6-0.7mm. Considering the precision limitations of the mounting equipment, smaller spacing cannot be achieved, and the overall pixel density of the board cannot be increased.

[0004] The second design method is to manufacture it using the COB process, through a standard chip structure or a Mini flip chip method. This method can make the light-emitting pixels of the whole board denser and the spacing smaller. However, the biggest problem with this method is that the color of the light emitted cannot be consistent, because after the encapsulation is completed, it becomes a whole and cannot be sorted, and the cost of rework is greater. Utility Model Content

[0005] The purpose of this invention is to solve the process problems of traditional LED chip mounting and COB manufacturing, and to design a packaging structure for display products.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a packaging structure for a display product, including a substrate and a plurality of LED light emitters distributed on the substrate. The LED light emitters include a chip and an electrode disposed at the bottom of the chip for connection with the substrate. The outer periphery of the chip has a baffle that cooperates with its sidewall, and the chip can form a single-sided light emission from its top under the action of the baffle.

[0007] Preferably, the substrate also has an encapsulating colloid covering the top and outer periphery of the LED light emitter.

[0008] Preferably, the encapsulating colloid is a transparent epoxy or silicone.

[0009] Preferably, the distance between the light-emitting center points of adjacent LED light-emitting elements is 0.1-0.3 mm.

[0010] Preferably, the chip is a flip-chip RGB chip or a white light chip, and the chip size is 0.2*0.2mm, 0.15*0.15mm or 0.1*0.1mm.

[0011] Preferably, the electrode material is gold or gold-tin.

[0012] Preferably, a solder paste layer is also present between the wafer and the substrate.

[0013] After adopting the above technical solution, the packaging structure of the display product provided by this utility model has the following beneficial effects:

[0014] This invention solves the process problems of traditional LED chip mounting and COB manufacturing, enabling smaller light-emitting spacing, denser pixels, and better color consistency in small-sized displays. It is also compatible with SMT (Surface Mount Technology) processes, die bonding, and die bonding / splitting processes. After packaging, there is no light leakage from the sides of the chip's light-emitting points, making product repair convenient and cost-effective. Therefore, this invention solves both the light emission consistency problem in COB display packaging and the side light leakage problem in traditional LED chips and chips. Furthermore, it increases manufacturing speed through die bonding or die bonding operations, resulting in faster efficiency and lower costs. Attached Figure Description

[0015] Figure 1 This is a top view of the packaging structure of a display product according to the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of the LED light-emitting element in this utility model;

[0017] Figure 3 This is a cross-sectional view of the LED light-emitting element in this utility model.

[0018] The components are: substrate 1, LED light source 2, chip 3, electrode 4, barrier 5, and encapsulating colloid 6. Detailed Implementation

[0019] The present invention will now be described in further clear and complete detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0021] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0022] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0023] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0024] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0025] This utility model discloses a packaging structure for a display product, such as... Figure 1-3 As shown, it includes a substrate 1 and a plurality of LED light emitters 2 distributed on the substrate 1. The substrate 1 also has an encapsulating colloid 6 covering the top and outer periphery of the LED light emitters 2. The encapsulating colloid 6 is made of transparent epoxy or silicone.

[0026] The LED light emitter 2 includes a chip 3 and an electrode 4 disposed at the bottom of the chip 3 for connection with the substrate 1. The chip 3 has a baffle 5 on its outer periphery that cooperates with its sidewall, and the chip 3 can form a single-sided light emission from its top under the action of the baffle 5. Specifically, the chip 3 is a flip-chip RGB chip or a white light chip, so it can be tested and sorted first to classify chips with the same type of light emission specifications together for subsequent operations. The size of the chip 3 can be selected as 0.2*0.2mm, 0.15*0.15mm or 0.1*0.1mm, etc. After the module is packaged, the distance between the light emission center points of adjacent LED light emitters 2 is 0.1-0.3mm, the pixels are denser, the color consistency of the whole screen is better and more delicate. The electrode 4 is made of gold or gold-tin, and there is also a solder paste layer between the chip 3 and the substrate 1.

[0027] In the manufacturing process of the packaging structure of the display product of this utility model, the chip 3 is fixed to the surface of the substrate 1 printed with solder paste by a die bonding or die bonding device. Then, the solder paste is completely cured by reflow soldering, and the chip 3 is firmly soldered to the surface of the substrate 1. After that, the encapsulating colloid 6 is applied around the chip 3 and on its surface to prevent moisture and protect the chip 3. Since the chip 3 has good consistency after screening, the color light emission consistency is also better. On the other hand, since the chip itself is single-sided light emission with no light exposure around the edges, there is no problem of light crosstalk between individual chips. After the entire module is packaged, other subsequent design processes can be carried out.

[0028] This utility model provides a packaging structure for display products that solves the process problems of traditional LED chip mounting and COB manufacturing. It can make the light-emitting spacing of small-sized displays smaller, the pixels denser, and the color consistency better. At the same time, it is compatible with SMT mounting process or die bonding and die bonding processes. After packaging, there is no problem of light leakage on the side of the chip light-emitting point.

[0029] In summary, the packaging structure of the display product provided by this utility model further improves the light efficiency and light emission consistency of the entire module product, thereby forming a brand-new design product. It can reduce investment costs while improving production efficiency and usage effect, and has great market value, making it worthy of widespread promotion and application.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A packaging structure for a display product, characterized in that: The device includes a substrate (1) and a plurality of LED light emitters (2) distributed on the substrate (1). The LED light emitter (2) includes a chip (3) and an electrode (4) disposed at the bottom of the chip (3) for connection with the substrate (1). The chip (3) has a baffle (5) on its outer periphery that cooperates with its sidewall, and the chip (3) can form a single-sided light emission from its top under the action of the baffle (5).

2. The packaging structure of a display product according to claim 1, characterized in that: The substrate (1) also has an encapsulating colloid (6) that wraps around the top and outer periphery of the LED light emitter (2).

3. The packaging structure of a display product according to claim 2, characterized in that: The encapsulating colloid (6) is made of transparent epoxy or silicone.

4. The packaging structure of a display product according to claim 1, characterized in that: The distance between the light-emitting center points of adjacent LED light-emitting bodies (2) is 0.1-0.3 mm.

5. The packaging structure of a display product according to claim 1, characterized in that: The chip (3) is a flip-chip RGB chip or a white light chip, and the size of the chip (3) is 0.2*0.2mm, 0.15*0.15mm or 0.1*0.1mm.

6. The packaging structure of a display product according to claim 1, characterized in that: The electrode (4) is made of gold or gold-tin.

7. The packaging structure of a display product according to claim 1, characterized in that: A solder paste layer is also present between the wafer (3) and the substrate (1).

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