An integrated dual color device structure

Abstract

The utility model belongs to LED encapsulation device technical field relates to an integrated double -colored device structure, including support and first bowl cup and second bowl cup of independent distribution on the support, the bottom of support corresponding first bowl cup and second bowl cup all is equipped with two copper base pad, first wafer and second wafer are equipped in first bowl cup and second bowl cup respectively, and first bowl cup and second bowl cup are filled respectively with the transparent encapsulation colloid and fluorescent encapsulation colloid for the first wafer and second wafer of wrapping. The utility model can be compatible with flash lamp and infrared product, save the space and cost of development design, guarantee the use effect of product not to be influenced simultaneously, have better practicality, better compatibility, more optimal effect and so on advantage.

Description

Technical Field

[0001] This utility model belongs to the field of LED packaging device technology, specifically relating to an integrated dual-color device structure. Background Technology

[0002] Currently, in the consumer electronics sector of mobile phone applications, the optical device design of these products uses a single Flash LED and an infrared (850 / 940nm) LED in combination. The infrared LED is used for supplementary lighting or remote control transmission. Existing market designs all use multiple LEDs in combination, which results in problems such as large product design space occupation, high cost, and insufficient product combination flexibility. Utility Model Content

[0003] The purpose of this utility model is to address the defects and shortcomings of the existing technology by designing an integrated dual-color device structure that can save product design space, reduce product cost, and make product combinations more flexible.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: an integrated dual-color device structure, including a support, and a first cup and a second cup independently distributed on the support. The support is provided with two copper-based pads at the bottom of the first cup and the second cup respectively. The first cup and the second cup are respectively provided with a first chip and a second chip, and the first cup and the second cup are respectively filled with a transparent encapsulating colloid and a fluorescent encapsulating colloid for wrapping the first chip and the second chip.

[0005] Preferably, the first chip is an infrared chip or a red light chip.

[0006] Preferably, the first chip is mounted inside the first bowl, and is fixed to a copper-based pad inside the first bowl by conductive silver paste, and is connected to another copper-based pad by gold wire.

[0007] Preferably, the transparent encapsulating colloid is made of epoxy resin or silicone.

[0008] Preferably, the second chip is a blue light chip, which is fixed inside the second bowl in an inverted manner.

[0009] Preferably, the positive and negative electrodes of the second wafer are respectively connected to two copper-based pads inside the second cup via die bond adhesive.

[0010] Preferably, the die bond adhesive is selected from solder paste or conductive adhesive.

[0011] After adopting the above technical solution, the integrated dual-color device structure provided by this utility model has the following beneficial effects:

[0012] The structural design of this utility model can simultaneously encapsulate red light and Flash LED. By changing the wavelength of the red light, the color temperature of the flash lamp can be changed, thus making it compatible with flash lamps and infrared products in the field of mobile phone applications. This can save development and design space and costs, while ensuring that the product's performance is not affected. It has the advantages of better practicality, better compatibility, and better performance. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of an integrated dual-color device according to the present invention.

[0014] Among them: 1. Support 2. First cup 3. Second cup 4. Copper-based pad 5. First wafer 6. Second wafer 7. Transparent encapsulating colloid 8. Fluorescent encapsulating colloid 9. Conductive silver paste 10. Gold wire 11. Die-attach adhesive Detailed Implementation

[0015] The present invention will now be described in further clear and complete detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0016] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0017] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0018] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0019] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0020] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0021] This utility model discloses an integrated dual-color device structure, such as Figure 1 As shown, it includes a support 1, and a first bowl 2 and a second bowl 3 independently distributed on the support 1. The support 1 is provided with two copper-based pads 4 at the bottom of the first bowl 2 and the second bowl 3 respectively.

[0022] The first bowl 2 contains a first chip 5, which is an infrared chip (850 / 940nm) or a red light chip (615-650nm). The first chip 5 is mounted inside the first bowl 2. Specifically, the first chip 5 is fixed to a copper-based pad 4 inside the first bowl 2 by conductive silver paste 9 and is connected to another copper-based pad 4 by a gold wire 10. The first bowl 2 is also filled with a transparent encapsulating colloid 7 for wrapping the first chip 5. The transparent encapsulating colloid 7 is made of epoxy resin or silicone.

[0023] The second cup 3 contains a second chip 6, which is a blue light chip. It is fixed in the second cup 3 by flip-chip. Specifically, the positive and negative electrodes of the second chip 6 are respectively connected to two copper-based pads 4 in the second cup 3 by die bond 11. The die bond 11 is selected as solder paste or conductive adhesive. The second cup 3 is also filled with phosphor encapsulant 8 for wrapping the second chip 6.

[0024] Thus, this invention can combine Flash LED and infrared LED to form an integrated dual-color device, meaning that a single product has both the function of a single flash lamp and the function of infrared emission or supplementary lighting, thereby further saving product design space and reducing product cost. At the same time, red light and Flash LED can be packaged together, and the color temperature of the flash lamp can be changed by changing the wavelength of the red light, realizing specially tuned functional applications.

[0025] In summary, the integrated dual-color device structure provided by this utility model can be compatible with flash lamps and infrared products, saving development and design space and costs, while ensuring that the product's performance is not affected. It has advantages such as better practicality, better compatibility, and better performance, and has great market value, making it worthy of widespread promotion and application.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An integrated dual-color device structure, characterized in that: The device includes a support (1) and a first cup (2) and a second cup (3) independently distributed on the support (1). The support (1) has two copper-based pads (4) at the bottom of the first cup (2) and the second cup (3). The first cup (2) and the second cup (3) are respectively provided with a first wafer (5) and a second wafer (6). The first cup (2) and the second cup (3) are respectively filled with a transparent encapsulating colloid (7) and a fluorescent encapsulating colloid (8) for wrapping the first wafer (5) and the second wafer (6).

2. The integrated dual-color device structure according to claim 1, characterized in that: The first chip (5) is an infrared chip or a red light chip.

3. The integrated dual-color device structure according to claim 1, characterized in that: The first chip (5) is mounted inside the first bowl (2), and is fixed to a copper-based pad (4) inside the first bowl (2) by conductive silver paste (9), and is connected to another copper-based pad (4) by gold wire (10).

4. The integrated dual-color device structure according to claim 1, characterized in that: The transparent encapsulating colloid (7) is made of epoxy resin or silicone.

5. The integrated dual-color device structure according to claim 1, characterized in that: The second chip (6) is a blue light chip, which is fixed inside the second bowl (3) in an inverted manner.

6. The integrated dual-color device structure according to claim 5, characterized in that: The positive and negative electrodes of the second wafer (6) are respectively connected to two copper-based pads (4) in the second bowl (3) via die bond adhesive (11).

7. The integrated dual-color device structure according to claim 6, characterized in that: The die bond adhesive (11) is selected from solder paste or conductive adhesive.

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