A cushioned LED device structure

Abstract

The utility model belongs to LED device technical field relates to a kind of cushioning type LED device structure, including cushioning base plate and the fixed crystal base plate being arranged above cushioning base plate, the side of the fixed crystal base plate away from cushioning base plate is spaced apart with several LED wafer, the LED wafer and fixed crystal base plate are connected, the side of the fixed crystal base plate equipped with LED wafer is also equipped with the encapsulation colloid for the wrapping of LED wafer periphery.The utility model can completely avoid the problem that lamp pearl size and substrate size are not consistent, and can reduce process manufacturing link, and production cost is more saved, and its finished product can be consistent with original design product, and light efficiency has no any change, and customer end use also does not need to be designed to modify and can be used instead, and it also has the advantages of better compatibility, better effect and the like.

Description

Technical Field

[0001] This utility model belongs to the field of LED device technology, and specifically relates to a raised LED device structure. Background Technology

[0002] Currently available LED devices with raised mounting are all manufactured using a process of adding a substrate to the LED chip. This involves attaching the individual LED chip, which is then taped to the substrate using surface mount technology (SMT). The substrate is then cut into individual LED chips. The process flow is: die bonding, wire bonding, molding or dispensing, chip separation, testing, taping, placement, cutting, chip separation, and taping again. This process involves many steps, and the biggest problem is that, to ensure placement accuracy, the size of the substrate must be larger than the size of the individual LED chip. Therefore, it is impossible to achieve a size structure where the LED chip and the substrate are the same. Utility Model Content

[0003] The purpose of this invention is to solve the problems of inconsistent LED bead size and substrate size, complex process and high cost in the prior art. It designs a raised LED device structure that can be consistent with the original design product, with no change in light effect, and with a simpler process and lower manufacturing cost.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a raised LED device structure, including a raised substrate and a die-bonding substrate disposed above the raised substrate. A plurality of LED chips are distributed at intervals on the side of the die-bonding substrate away from the raised substrate. The LED chips are electrically connected to the die-bonding substrate. The side of the die-bonding substrate with LED chips is also provided with an encapsulating colloid for wrapping the outer periphery of the LED chips.

[0005] Preferably, the material of the raised substrate is any one of BT / FR4 / CEM-3 / ceramic.

[0006] Preferably, the raised substrate and the die-bonding substrate are designed to have the same dimensions except for thickness.

[0007] Preferably, the die-bonded substrate and the raised substrate are electrically connected through a solder paste layer.

[0008] Preferably, a die bond adhesive is provided between the LED chip and the die bond substrate, and the die bond adhesive is selected from silver paste, insulating glue or solder paste.

[0009] Preferably, when the LED chip is mounted on the die bond substrate, a conductive line is also provided between the LED chip and the die bond substrate.

[0010] Preferably, the encapsulating colloid is epoxy resin or silicone.

[0011] After adopting the above technical solution, the raised LED device structure provided by this utility model has the following beneficial effects:

[0012] The structural design of this utility model can completely avoid the problem of inconsistent LED chip size and substrate size, and can reduce the number of manufacturing processes, thus saving production costs. The finished product can be consistent with the original design product with no change in light effect. Customers can use it directly without design modifications. It also has the advantages of better compatibility and better effect. Attached Figure Description

[0013] Figure 1 This is a side view of a single LED product in a raised LED device structure according to this utility model;

[0014] Figure 2 This is a top view of the structure of a raised LED device according to the present invention.

[0015] The components are: 1. Elevated substrate; 2. Die-bonding substrate; 3. LED chip; 4. Encapsulating colloid; 5. Solder paste layer; 6. Die-bonding adhesive; 7. Conductive wire. Detailed Implementation

[0016] The present invention will now be described in further clear and complete detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0017] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0018] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0019] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0020] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0021] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0022] This utility model provides a raised LED device structure, such as Figure 1-2 As shown, it includes a raised substrate 1 and a die bond substrate 2 disposed above the raised substrate 1. The raised substrate 1 is designed as a whole substrate with the same dimensions (i.e., planar dimensions) as the die bond substrate 2 except for the thickness. The raised substrate 1 is made of any one of BT / FR4 / CEM-3 / ceramic. In specific connection, the die bond substrate 2 and the raised substrate 1 are connected by a solder paste layer 5.

[0023] The die-bonding substrate 2 has a plurality of LED chips 3 spaced apart on the side away from the raised substrate 1. The LED chips 3 are electrically connected to the die-bonding substrate 2. The side of the die-bonding substrate 2 with LED chips 3 is also provided with an encapsulating colloid 4 for wrapping the outer periphery of the LED chips 3. Specifically, a die-bonding adhesive 6 is also provided between the LED chips 3 and the die-bonding substrate 2. The die-bonding adhesive 6 is made of silver paste, insulating glue or solder paste, that is, the LED chips 3 can be mounted upright or flip-mounted on the die-bonding substrate 2. When the LED chips 3 are mounted upright on the die-bonding substrate 2, a conductive line 7 is also provided between the LED chips 3 and the die-bonding substrate 2. Furthermore, the encapsulating colloid 4 is made of epoxy glue or silicone.

[0024] The packaging process of this utility model for a raised LED device structure includes the following steps:

[0025] S1. Die bonding: The LED chip is fixed onto the pads of the die bonding substrate by die bonding and then baked and cured.

[0026] S2, Sealing: The die-bonding substrate with the LED chip bonded is sealed and cured;

[0027] S3, Printing: Print the solder paste layer onto the pads of the entire raised substrate;

[0028] S4. Full-piece bonding: The encapsulated die bond substrate is bonded to the raised substrate with printed solder paste using an alignment fixture, and then reflow soldering is performed for curing.

[0029] S5. Cutting: The entire PCB product is cut into individual LED units using a cutting process;

[0030] S6. Sorting / Tape Making: Test, sort, and package the products.

[0031] In summary, the raised LED device structure provided by this utility model can completely avoid the problem of inconsistent LED bead size and substrate size, and can reduce the number of manufacturing processes, thus saving manufacturing costs. The finished product can be consistent with the original design product with no change in luminous efficacy. Customers can use it directly without design modifications. It also has the advantages of better compatibility and better performance.

[0032] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A raised LED device structure, characterized in that: The device includes a raised substrate (1) and a die-bonding substrate (2) disposed above the raised substrate (1). A plurality of LED chips (3) are distributed at intervals on the side of the die-bonding substrate (2) away from the raised substrate (1). The LED chips (3) are electrically connected to the die-bonding substrate (2). The side of the die-bonding substrate (2) where the LED chips (3) are disposed is also provided with an encapsulating colloid (4) for wrapping the outer periphery of the LED chips (3).

2. The raised LED device structure according to claim 1, characterized in that: The material of the raised substrate (1) can be any one of BT / FR4 / CEM-3 / ceramic.

3. The raised LED device structure according to claim 1, characterized in that: The raised substrate (1) and the die-bonding substrate (2) are designed to be identical in all dimensions except for thickness.

4. The raised LED device structure according to claim 1, characterized in that: The die-bonded substrate (2) and the raised substrate (1) are connected by a solder paste layer (5).

5. The raised LED device structure according to claim 1, characterized in that: A die bond adhesive (6) is also provided between the LED chip (3) and the die bond substrate (2), and the die bond adhesive (6) is selected from silver paste, insulating glue or solder paste.

6. The raised LED device structure according to claim 1, characterized in that: When the LED chip (3) is mounted on the die bond substrate (2), a conductive line (7) is also provided between the LED chip (3) and the die bond substrate (2).

7. The raised LED device structure according to claim 1, characterized in that: The encapsulating colloid (4) is selected from epoxy resin or silicone.

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