A side-emitting flip-chip LED structure

Abstract

The utility model relates to LED packaging technical field especially, and more particularly to a side light emitting flip LED structure, including the shell, three reflective grooves are arranged in the shell, and two groups of conductive pads are arranged in three reflective grooves, and the flip chip is welded on two groups of conductive pads, the colloid for encapsulating the light emitting chip is filled in the shell, the reflective groove of both sides is prolonged depth to the side close to the both ends of shell, forms the enlarged reflective slope, the utility model discloses the reflective groove of left and right sides is prolonged depth to the side close to the outside, and the area of reflective slope is increased, so that the light of the light emitting chip located in both sides can be more reflected to the other side of shell, thereby effectively solve the problem of LED left and right brightness uneven when unilateral chip light emitting, significantly improve the overall brightness uniformity, especially suitable for RGB light emitting chip unilateral layout's side light emitting scene.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically to a side-emitting flip-chip LED structure. Background Technology

[0002] Side-emitting LEDs are widely used in display backlighting, automotive lighting, and indoor ambient lighting due to their advantages such as thinness and controllable light uniformity. In side-emitting LEDs, RGB light-emitting chips are often combined to achieve colored light output. However, existing side-emitting LEDs mostly use a side-by-side layout of RGB light-emitting chips. For example, when the leftmost red chip is lit, because it is located on the left side of the casing, the light, after being guided or reflected, easily causes the left side of the LED to be brighter and the right side darker. Similarly, when the blue chip is lit, a similar uneven brightness problem occurs, seriously affecting the overall luminous efficacy uniformity of the LED.

[0003] To address this issue, existing technologies have attempted to improve the situation by optimizing the dot matrix of the light guide plate and adding auxiliary reflective structures. However, such solutions may lead to structural complexity, increased costs, or limited improvement in uniformity, making it difficult to achieve efficient brightness uniformity control while maintaining a thin and lightweight design. Therefore, there is an urgent need for a side-emitting LED structure that is simple in structure, cost-controllable, and can effectively solve the problem of uneven brightness on one side. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a side-emitting flip-chip LED structure, which solves the technical problem that when the red and blue chips located on the left and right sides of a side-emitting LED are lit separately, the corresponding side is brighter and the other side is darker, resulting in uneven overall brightness.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a side-emitting flip-chip LED structure, including a housing, three reflective grooves are provided inside the housing, and two sets of conductive pads are provided in each of the three reflective grooves. Flip-chip LEDs are soldered on the two sets of conductive pads. The housing is filled with a colloid for encapsulating the LEDs. The reflective grooves on both sides extend outwards on the side near the two ends of the housing to form an enlarged reflective slope, so as to reflect more of the light emitted by the LEDs on both sides to the other side of the housing.

[0006] Preferably, the light-emitting chip includes a red light chip, a green light chip, and a blue light chip, and the red light chip, green light chip, and blue light chip are respectively built into three reflective grooves, with the green light chip located between the red light chip and the blue light chip.

[0007] Preferably, the bottom of the housing is provided with pins, which are electrically connected to conductive pads. The bottom of the housing is also provided with a protrusion of the same height as the pins to enhance the connection stability of the side-emitting flip-chip LED.

[0008] Preferably, one end of the housing is provided with a polarity marking notch for marking the polarity of the side-emitting flip-chip LED.

[0009] Preferably, the colloid is made of epoxy resin, and the outer surface of the colloid is arc-shaped.

[0010] Preferably, the inner wall of the reflective groove is provided with a mirror-reflective coating.

[0011] By employing the above technical solution, this utility model provides a side-emitting flip-chip LED structure, which has at least the following beneficial effects: 1. This utility model increases the area of ​​the reflective slope by extending the depth of the reflective grooves on the left and right sides closer to the outside, so that more light emitted by the light-emitting chips on both sides can be reflected to the other side of the shell. This effectively solves the problem of uneven brightness of the LED when a single chip emits light, and significantly improves the overall brightness uniformity. It is especially suitable for side-emitting scenarios with a single-sided layout of RGB light-emitting chips.

[0012] 2. By designing the three light-emitting chips as partitions, this utility model not only optimizes the uniformity of color light mixing, but also, in conjunction with the structural improvement of the reflective groove, achieves dual uniformity of color and brightness through the synergistic effect of light source layout and light reflection, thereby improving the display and lighting effects of the side-emitting LED.

[0013] 3. The raised pin design at the bottom of the housing of this utility model enhances the connection stability with external circuits, effectively avoids abnormal light emission caused by poor contact, and improves the reliability and service life of the product. It is especially suitable for application scenarios under conditions such as vibration and frequent plugging and unplugging.

[0014] 4. This utility model provides a mirror-reflective coating on the inner wall of the reflective groove, which ensures high reflection efficiency while having good corrosion resistance and stability, extending the service life of the reflective structure and ensuring long-term reliability of brightness uniformity. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application: Figure 1 This is a schematic diagram of the front structure of this utility model; Figure 2 This is a top view of the structure of this utility model.

[0016] Figure label: 1. Outer shell; 2. Reflective groove; 3. Conductive pad; 4. Light-emitting chip; 5. Colloid; 6. Pin; 7. Protrusion; 8. Polarity marking notch. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Due to the inherent technical flaws in existing side-emitting LEDs, when the red and blue chips located on the left and right sides are lit separately, the corresponding side is brighter than the other, resulting in uneven overall brightness. Please refer to [reference needed]. Figures 1-2 This embodiment provides a side-emitting flip-chip LED structure. By extending the depth of the reflective grooves 2 on the outer side of both sides, the area of ​​the reflective slope is increased, allowing more light emitted from the light-emitting chips 4 on both sides to be reflected to the other side of the housing 1. This effectively solves the problem of uneven brightness between the left and right sides of the LED when only one chip is emitting light, significantly improving the overall brightness uniformity. It is especially suitable for side-emitting scenarios with a single-sided layout of RGB light-emitting chips 4. The LED structure includes a housing 1, with three reflective grooves 2 inside the housing 1. Each of the three reflective grooves 2 has two sets of conductive pads 3, on which flip-chip light-emitting chips 4 are soldered. The housing 1 is filled with colloid 5 for encapsulating the light-emitting chips 4. The reflective grooves 2 on both sides are extended outward on the side near both ends of the housing 1 to form an enlarged reflective slope, so as to reflect more light emitted from the light-emitting chips 4 on both sides to the other side of the housing 1. By extending the depth of the reflective grooves 2 on both sides near both ends of the housing 1 to form an enlarged reflective slope, more light from the light-emitting chips 4 on both sides is reflected to the other side of the housing 1, effectively improving the overall brightness uniformity.

[0019] The existing side-emitting LEDs have an unreasonable layout of RGB light-emitting chips 4, which easily leads to uneven mixing of colored light and further aggravates the problem of uneven brightness. To address this issue, the light-emitting chip 4 includes a red light chip, a green light chip, and a blue light chip, and the red light chip, green light chip, and blue light chip are respectively built into three reflective grooves 2. The green light chip is located between the red light chip and the blue light chip. By building the red light chip, green light chip, and blue light chip into three reflective grooves 2 respectively, with the green light chip located in the middle, the spatial layout of RGB light is optimized, the uniformity of colored light mixing is improved, and the reflective structure achieves dual uniformity of color and brightness.

[0020] The existing side-emitting LED has insufficient pin 6 connection stability, which is prone to abnormal light emission due to poor contact, affecting product reliability and service life. To address this issue, pin 6 is provided at the bottom of the housing 1. Pin 6 is electrically connected to the conductive pad 3. A protrusion 7 of the same height as pin 6 is provided at the bottom of the housing 1 to enhance the connection stability of the side-emitting flip LED. The pin 6 at the bottom of the housing 1, together with the protrusion 7 of the same height, enhances the connection stability with external circuits, reduces the risk of poor contact, and improves the reliability and service life of the product under conditions such as vibration and frequent plugging and unplugging.

[0021] The polarity identification of existing side-emitting LEDs is difficult during assembly, which easily leads to wiring errors and reduces assembly efficiency. To address this issue, a polarity marking notch 8 is provided at one end of the housing 1 to mark the polarity of the side-emitting flip-chip LED. The polarity marking notch 8 provides clear polarity guidance during assembly, reduces the probability of assembly errors, and improves the ease of operation in production and application.

[0022] The mismatch between the refractive index of the colloid 5 material and the shell 1 of the side-emitting LED can easily cause light loss. In addition, the unreasonable shape design of the colloid 5 affects the light pattern and light emission efficiency. To address this issue, the material of the colloid 5 is epoxy resin, and the outer surface of the colloid 5 is arc-shaped. The epoxy resin material of the colloid 5 matches the refractive index of the shell 1, reducing interface light loss. The arc-shaped outer surface optimizes the light emission pattern, improves the light efficiency, and at the same time, the encapsulation protects the internal chip and enhances weather resistance.

[0023] The reflective coating on the inner wall of the side-emitting LED reflective groove 2 has low reflectivity and poor corrosion resistance, resulting in unstable brightness uniformity and short service life. To address this issue, a mirror reflective coating is provided on the inner wall of the reflective groove 2. The mirror reflective coating has high reflectivity, which can stably reflect light to ensure brightness uniformity, while also improving the corrosion resistance of the reflective structure and extending the product's service life.

[0024] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0025] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A side-emitting flip-chip LED structure, characterized in that, The device includes a housing (1), which has three reflective grooves (2) and two sets of conductive pads (3) in each of the three reflective grooves (2). The two sets of conductive pads (3) are soldered with flip-chip light-emitting chips (4). The housing (1) is filled with colloid (5) for encapsulating the light-emitting chips (4). The reflective grooves (2) on both sides extend outward from the side near the two ends of the housing (1) to form an enlarged reflective slope, so as to reflect more of the light emitted by the light-emitting chips (4) on both sides to the other side of the housing (1).

2. The side-emitting flip-chip LED structure according to claim 1, characterized in that: The light-emitting chip (4) includes a red light chip, a green light chip and a blue light chip, and the red light chip, green light chip and blue light chip are respectively built into three reflective grooves (2), with the green light chip located between the red light chip and the blue light chip.

3. The side-emitting flip-chip LED structure according to claim 1, characterized in that: The bottom of the housing (1) is provided with pins (6), which are electrically connected to conductive pads (3). The bottom of the housing (1) is provided with a protrusion (7) of the same height as the pins (6) to enhance the connection stability of the side-emitting flip LED.

4. The side-emitting flip-chip LED structure according to claim 1, characterized in that: One end of the housing (1) is provided with a polarity marking notch (8) for marking the polarity of the side-emitting flip LED.

5. The side-emitting flip-chip LED structure according to claim 1, characterized in that: The colloid (5) is made of epoxy resin, and the outer surface of the colloid (5) is arc-shaped.

6. The side-emitting flip-chip LED structure according to claim 1, characterized in that: The inner wall of the reflective groove (2) is provided with a mirror reflective coating.

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