Semiconductor wafer dust removal equipment with three-dimensional detection module

Abstract

The application discloses a semiconductor wafer dust removal equipment with a three-dimensional detection module, which comprises a machine base, a first movement mechanism, a second movement mechanism and a third movement mechanism arranged on the machine base, a bearing platform arranged on the first movement mechanism, a dust removal assembly arranged on the second movement mechanism and a detection assembly arranged on the third movement mechanism, wherein the detection assembly comprises a two-dimensional detection module and a three-dimensional detection module arranged adjacently. A control assembly controls the relative movement of the three movement mechanisms, so that the detection assembly detects the dust on the surface of the wafer and controls the dust removal assembly to remove the dust. The bearing, detection and dust removal functions are decoupled through the three independent movement mechanisms, the structure is compact, the detection precision is high, and the dust removal efficiency is good.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a semiconductor wafer dust removal device with a three-dimensional inspection module. Background Technology

[0002] During semiconductor manufacturing, dust particles and other contaminants inevitably adhere to the surface of wafers. If these dust particles are not removed in time, they will directly affect the yield of subsequent processes such as photolithography, etching, and deposition, as well as chip performance. Therefore, the industry has developed various wafer dust removal devices.

[0003] Existing wafer dust removal equipment typically uses two-dimensional (2D) vision inspection systems to identify the location of dust on the wafer surface, and then uses cleaning carriers such as adhesive sticks for targeted dust removal. However, 2D images only reflect planar information and cannot distinguish between "removable dust particles" and "irreversible physical defects" (such as scratches, dents, etc.). This limitation leads to two types of problems: on the one hand, the equipment attempts to remove dust from all abnormal points, wasting time and potentially causing secondary contamination; on the other hand, some defects are misjudged as dust and not recorded, affecting yield management.

[0004] While 3D detection technology exists in other areas of image recognition and analysis, it is mostly used as a standalone detection device, not integrated with dust removal functionality. In schemes employing 2D detection, the detection and dust removal modules typically share the same motion platform, with detection and dust removal performed sequentially through the platform's movement. This "sequential execution on the same platform" integration method has the following drawbacks: the shared motion path between the detection and dust removal modules prevents parallel operation, limiting production efficiency; the installation positions of the detection and dust removal modules are limited by the movement range of the same motion platform, resulting in poor layout flexibility for each module; and the frequent movement of the detection module following the dust removal module makes it prone to decreased detection accuracy due to vibration and impact, requiring frequent calibration.

[0005] Furthermore, the existing equipment's motion mechanism layout is not compact enough, and the arrangement of various functional modules on the machine base lacks systematic spatial optimization, resulting in a large equipment footprint, long motion paths, and slow operation cycles. In particular, for the stick-stick dust removal mode, the stick-stick consumable supply module (stick storage and adhesive supply) is usually set separately from the dust removal execution module, increasing the stick retrieval path length and stick replacement time, further reducing dust removal efficiency.

[0006] To address the aforementioned issues, there is a need for a semiconductor wafer dust removal device with a more rational and compact structural layout. This device should not only fully leverage the advantages of 3D inspection to accurately distinguish between dust and defects, but also shorten the movement paths between modules and improve dust removal efficiency through an optimized motion mechanism layout, while ensuring the stability and accuracy of the inspection modules. Utility Model Content

[0007] This application provides a semiconductor wafer dust removal device with a three-dimensional detection module to solve the technical problems of insufficient detection accuracy, chaotic equipment layout and low dust removal efficiency of existing equipment.

[0008] A semiconductor wafer dust removal device with a three-dimensional detection module includes a device frame assembly, a motion assembly, a support platform, a dust removal assembly, a detection assembly, and a control assembly. The device frame assembly is provided with a machine base. The motion assembly includes a first motion mechanism, a second motion mechanism, and a third motion mechanism, which are spaced apart on the machine base. The support platform is mounted on the first motion mechanism and is used to support the semiconductor wafer. The dust removal assembly is mounted on the second motion mechanism. The detection assembly is mounted on the third motion mechanism. The control assembly is connected to the... The motion component, the dust removal component, and the detection component are electrically connected. Through relative movement of the first motion mechanism, the second motion mechanism, and the third motion mechanism, the detection component is controlled to detect dust on the semiconductor wafer, and the dust removal component is controlled to remove dust from the semiconductor wafer. The detection component includes a two-dimensional detection module and a three-dimensional detection module. The two-dimensional detection module is used to acquire two-dimensional images of the semiconductor wafer surface. The three-dimensional detection module is used to acquire three-dimensional topographic data of the semiconductor wafer surface. The two-dimensional detection module and the three-dimensional detection module are disposed adjacent to each other on the third motion mechanism.

[0009] Furthermore, the first motion mechanism includes a first linear guide rail, a first sliding member, and a first driving member. The first linear guide rail extends along a first direction in the horizontal plane. The first sliding member is movably connected to the first linear guide rail. The two ends of the first driving member are respectively connected to the first sliding member and the machine base, controlling the first sliding member to move relative to the first linear guide rail along the first direction. The bearing platform is disposed on the first sliding member.

[0010] Furthermore, the first motion mechanism also includes a second linear guide rail, a second sliding member, and a second driving member. The second linear guide rail extends along a second direction in the horizontal plane and is disposed on the first sliding member. The second sliding member is movably connected to the second linear guide rail, and the bearing platform is disposed on the second sliding member. The two ends of the second driving member are respectively connected to the first sliding member and the bearing platform, controlling the second sliding member to move relative to the second linear guide rail along the second direction, the second direction being perpendicular to the first direction.

[0011] Furthermore, the dust removal component adopts an adhesive rod dust removal mode, including an adhesive module, an adhesive rod module, and a dust removal module; the second motion mechanism includes a third linear guide rail, a third drive component, and a first mounting bracket. The third linear guide rail extends along the second direction in the horizontal plane and is preset at a first height relative to the machine base; wherein, the dust removal module includes a third sliding component, which is movably connected to the third linear guide rail; the two ends of the third drive component are respectively connected to the third linear guide rail and the third sliding component, controlling the dust removal module to move relative to the third linear guide rail along the second direction; the first mounting bracket is mounted on the machine base and is spaced apart from the extension space of the first linear guide rail and the second linear guide rail in the horizontal plane; the adhesive module and the adhesive rod module are mounted on the first mounting bracket and cooperate with the dust removal module to provide adhesive rods and adhesive.

[0012] Furthermore, the dust removal module is provided with a first lifting member, which is arranged vertically and movably connected to the third sliding member to control the dust removal module to move vertically; the sticking rod module is provided with a first translation member, which is arranged horizontally along the first direction and movably connected to the first mounting bracket to control the sticking rod module to move along the first direction.

[0013] Furthermore, the positions of the adhesive module and the adhesive stick module are respectively preset at a second height and a third height relative to the machine base, and the second height and the third height are smaller than the first height.

[0014] Furthermore, the projection of the first mounting bracket onto the horizontal plane is located at one end of the extension line of the third linear guide rail.

[0015] Furthermore, the third motion mechanism includes a second mounting frame, which extends along the second direction in the horizontal plane. The two-dimensional detection module and the three-dimensional detection module are mounted on the second mounting frame. The two-dimensional detection module includes a second lifting component, and the three-dimensional detection module includes a third lifting component. The second lifting component and the third lifting component respectively control the two-dimensional detection module and the three-dimensional detection module to move in the vertical direction.

[0016] Furthermore, the third motion mechanism also includes a fourth linear guide rail, which extends along the second direction in the horizontal plane; the two-dimensional detection module includes a third slider and a fourth driving member, and the three-dimensional detection module includes a fourth slider and a fifth driving member, with the third slider and the fourth slider being movably disposed at intervals along the fourth linear guide rail; the fourth driving member is connected to the fourth linear guide rail and the third slider, controlling the two-dimensional detection module to move along the second direction; the fifth driving member is connected to the fourth linear guide rail and the fourth slider, controlling the three-dimensional detection module to move along the second direction.

[0017] Furthermore, both the second motion mechanism and the third motion mechanism are configured as gantry structures, arranged parallel to each other to form a workspace. The first motion mechanism and the supporting platform are located within the projection area of ​​the workspace on the horizontal plane. The dust removal component is installed in the direction of the second motion mechanism toward the third motion mechanism, and the two-dimensional detection module and the three-dimensional detection module are installed in the direction of the third motion mechanism toward the second motion mechanism.

[0018] Compared with existing technologies, the semiconductor wafer dust removal equipment with a three-dimensional detection module provided in this application has the following advantages:

[0019] Improved detection accuracy. This application, by setting up a three-dimensional detection module and utilizing the height information of 3D topographic data, has for the first time achieved accurate differentiation between dust and defects in semiconductor dust removal equipment. This solves the fundamental problem of 2D detection's inability to identify types, and avoids ineffective dust removal due to misjudging defects as dust or yield loss due to missed defects.

[0020] Production efficiency is improved. This application sets the carrier platform, dust removal components, and inspection components on three independent motion mechanisms, allowing inspection and dust removal to operate in partial parallel, thus shortening the cycle time for a single dust removal operation. The carrier platform only needs to feed the wafer into the workspace; inspection and dust removal move independently without waiting for the other to complete its action. The two-dimensional and three-dimensional inspection modules are fixedly installed with fixed relative positions, eliminating the need for frequent focusing and calibration, further shortening the inspection cycle.

[0021] High space utilization and compact structure. This application utilizes a layered and zoned arrangement of the first, second, and third motion mechanisms on the machine base. The first motion mechanism, located at the bottom, achieves XY plane motion. The third linear guide rail of the second motion mechanism is mounted at a first height, and the adhesive module and adhesive rod module are mounted on a first mounting bracket below the third linear guide rail (at the second and third heights). The third motion mechanism is arranged parallel to the second motion mechanism to form a workspace. This achieves a three-dimensional layout, significantly reducing the overall machine footprint. In particular, the space reuse design of "dust removal above the crossbeam and consumable supply below the crossbeam" greatly reduces the projected area of ​​the second motion mechanism on the horizontal plane.

[0022] High detection stability. The two-dimensional and three-dimensional detection modules of this application are fixedly mounted on the second mounting bracket of the third motion mechanism, remaining stationary in the X and Y directions, and only requiring lifting and focusing motion in the Z direction. Compared with the scheme of mounting the detection module on the motion platform, this reduces vibration and impact caused by motion, resulting in better long-term stability of the detection module, eliminating the need for frequent calibration, and improving detection accuracy and repeatability.

[0023] The consumable supply is highly efficient and highly automated. The dust removal module of this application moves along the second direction to the glue picking and stick picking stations respectively. The stick picking chamber can store multiple sticks and deliver them one by one, realizing the automatic supply and replacement of sticks and reducing manual intervention. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0025] Figure 1 This is a three-dimensional structural diagram of a semiconductor wafer dust removal device with a three-dimensional detection module in an embodiment of this application.

[0026] Figure 2 This is a perspective view of the three-dimensional structure of a semiconductor wafer dust removal device with a three-dimensional detection module in an embodiment of this application.

[0027] Figure 3 This is a three-dimensional structural diagram of the internal structure of the equipment frame component.

[0028] Figure 4 This is a three-dimensional exploded view of the internal structure of the equipment frame components.

[0029] Figure 5 for Figure 4The diagram shows an exploded view of the three-dimensional structure of the first motion mechanism and the supporting platform.

[0030] Figure 6 for Figure 4 The diagram shows the exploded three-dimensional structure of the second motion mechanism and the dust removal mechanism.

[0031] Figure 7 for Figure 4 The diagram shows the exploded three-dimensional structure of the third motion mechanism and the detection mechanism. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0033] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0034] Furthermore, the use of terms such as "first," "second," etc., in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least three, such as three, four, etc., unless otherwise explicitly specified.

[0035] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this application.

[0037] Please also refer to Figure 1 , Figure 2 and Figure 3 This utility model provides a semiconductor wafer dust removal device with a three-dimensional detection module for removing dust from the surface of a semiconductor wafer 10. It includes a device frame assembly 1, a motion assembly 2, a support platform 3, a dust removal assembly 4, a detection assembly 5, and a control assembly 6.

[0038] The equipment frame assembly 1 includes a base 11 and a frame structure mounted on top of the base 11. The base 11 is made of marble or cast iron, possessing excellent rigidity and vibration damping performance, with a flatness better than 0.01 mm / m, providing a precise installation reference for each moving mechanism. The base 11 divides the equipment frame assembly 1 into upper and lower spaces: the space above the base 11 is used to house core functional components such as the support platform 3, moving components 2, dust removal components 4, and detection components 5; the space below the base 11 is used to store auxiliary equipment such as power modules, control circuits, and pump structures corresponding to each drive component. This separated layout of the upper and lower spaces ensures that the core working area is unaffected by electrical and piping interference, while also facilitating maintenance and heat dissipation, resulting in a more compact overall structure.

[0039] The equipment frame assembly 1 is surrounded by a sealed housing 12, which has an openable operating door 13 and a transparent observation window 14. The operating door 13 is used for inspection, maintenance, and wafer handling; the transparent observation window 14 allows operators to observe the internal working status of the equipment in real time. The sealed housing 12, together with a clean air positive pressure maintenance system, creates an absolutely dust-free working environment inside the equipment, meeting the cleanliness requirements of semiconductor manufacturing.

[0040] The motion assembly 2 includes a first motion mechanism 21, a second motion mechanism 22, and a third motion mechanism 23, which are independently and spaced apart on the machine base 11. A support platform 3 is mounted on the first motion mechanism 21 and is used to support the semiconductor wafer 10. A dust removal assembly 4 is mounted on the second motion mechanism 22. A detection assembly 5 is mounted on the third motion mechanism 23. A control assembly 6 is electrically connected to the motion assembly 2, the dust removal assembly 4, and the detection assembly 5, respectively. Through the relative movement of the first motion mechanism 21, the second motion mechanism 22, and the third motion mechanism 23, the control assembly 6 controls the detection assembly 5 to detect dust on the semiconductor wafer 10 and controls the dust removal assembly 4 to remove dust from the semiconductor wafer 10. This structural layout, with the three motion mechanisms independently configured and each performing a different function, decouples the movement of the support platform 3, the detection assembly 5, and the dust removal assembly 4, avoiding the structural complexity and cumulative positioning errors caused by integrating all motion functions onto the same platform. The carrier platform 3 only needs to carry the wafer 10 for planar motion, without carrying the detection and dust removal modules. It has low motion inertia and high positioning accuracy. The detection component 5 and the dust removal component 4 move independently without interfering with each other. The most suitable motion mode and driving element can be selected according to their respective working characteristics.

[0041] Please also refer to Figure 3 , Figure 4 and Figure 5 The first motion mechanism 21 is used to realize the movement of the support platform 3 in the X and Y directions in the horizontal plane. The first motion mechanism 21 includes a first linear guide 211, a first slider 212, a first drive member 213, a second linear guide 214, a second slider 215, and a second drive member 216.

[0042] The first linear guide rail 211 extends along a first direction (Y direction in this embodiment) in the horizontal plane and is fixedly installed on the machine base 11. The first linear guide rail 211 consists of two parallel precision linear guide rails, respectively located on both sides of the machine base 11 along the X direction, and has high rigidity and high guiding accuracy, with a straightness better than 0.005 mm / m. The first sliding member 212 is movably connected to the first linear guide rail 211 and can slide freely along the Y direction on the first linear guide rail 211. The first driving member 213 is connected at both ends to the first sliding member 212 and the machine base 11, respectively, and controls the first sliding member 212 to move relative to the first linear guide rail 211 along the Y direction. The first driving member 213 adopts a linear motor or a servo motor in conjunction with a precision ball screw mechanism. The linear motor solution can achieve direct drive, with high transmission efficiency, no backlash, and large acceleration; the servo motor combined with the ball screw solution can achieve large thrust transmission, high positioning accuracy, and good self-locking performance. Both solutions can achieve sub-micron level positioning accuracy.

[0043] The second linear guide rail 214 extends along a second direction (X direction in this embodiment) in the horizontal plane and is disposed on the first sliding member 212. The support platform 3 includes a second sliding member 215, which is movably connected to the second linear guide rail 214. The two ends of the second driving member 216 are respectively connected to the first sliding member 212 and the support platform 3, controlling the second sliding member 215 to move relative to the second linear guide rail 214 along the X direction. The second direction is perpendicular to the first direction. The first linear guide rail 211 and the second linear guide rail 214 are stacked in the vertical direction, that is, the first linear guide rail 211 is located on the machine base 11, and the second linear guide rail 214 is located on the first sliding member 212, and the two are arranged in layers in the Z direction. This double-layer stacked structure minimizes the height of the entire XY motion platform, saves vertical space, and has a compact structure.

[0044] In another embodiment, the first motion mechanism 21 may consist only of a first linear guide 211 and a first slider 212, with the support platform 3 moving only along the first direction (Y direction), without the second linear guide 214 and the second drive member 216. In this embodiment, the dust removal module of the second motion mechanism 22 moves along the second direction (X direction) and the detection component of the third motion mechanism 23 moves along the second direction to cooperate in completing the coverage of various positions on the wafer surface. This simplified solution has a simpler structure and lower cost, making it suitable for applications where high detection speed is not required.

[0045] In another embodiment, the first motion mechanism 21 can also employ an air-floating motion platform or a magnetic levitation motion platform. The air-floating motion platform achieves contactless motion through the air-floating gap between the air-floating guide rail and the slider, resulting in minimal friction and high precision; the magnetic levitation motion platform achieves non-contact levitation through magnetic force, resulting in no mechanical contact, no wear, and high speed. Both alternatives can achieve higher motion speeds and precision, making them suitable for more advanced applications.

[0046] The support platform 3 is equipped with vacuum adsorption holes 31, which are connected to a vacuum generator via vacuum pipelines, for adsorbing and fixing the semiconductor wafer 10 onto the surface of the support platform 3. The support platform 3 is made of aluminum alloy or carbon fiber material, with a lightweight design to reduce motion inertia and improve motion speed and acceleration capabilities. The surface of the support platform 3 is also equipped with positioning marks (not shown) for coordinate calibration during system initialization.

[0047] Please also refer to Figure 3 , Figure 4 and Figure 6The second motion mechanism 22 is used to install and drive the dust removal assembly 4. The dust removal assembly 4 adopts an adhesive rod dust removal mode, which is used to remove dust from the surface of the semiconductor wafer 10 using an adhesive material. The dust removal assembly 4 includes a dust removal module 41, an adhesive rod module 42, and an adhesive module 43. The second motion mechanism 22 includes a third linear guide 221, a third slider 222, a third drive component 223, a first mounting bracket 224, a first lifting component 225, and a first translation component 226.

[0048] The third linear guide 221 extends along a second direction (X direction) in the horizontal plane and is mounted above the machine base 11 via the first column 227, with a preset first height H1 relative to the machine base 11. The third linear guide 221 is a high-rigidity precision linear guide with a straightness better than 0.005 mm / m. The dust removal module 41 includes a third sliding member 222, which is movably connected to the third linear guide 221. The third drive member 223 is connected at both ends to the third linear guide 221 and the third sliding member 222, respectively, to control the movement of the dust removal module 41 relative to the third linear guide 221 along the X direction. The third drive member 223 uses a linear motor or servo motor in conjunction with a lead screw mechanism.

[0049] The dust removal module 41 is equipped with a first lifting component 225, which is arranged vertically (Z-direction) and movably connected to a third sliding component 222, controlling the dust removal module 41 to move up and down in the Z-direction. The first lifting component 225 can be any one of a screw lifting mechanism (including a servo motor, a screw, and a screw nut), a cylinder lifting mechanism (including a cylinder and a piston rod), or a voice coil motor lifting mechanism. The screw lifting mechanism has high positioning accuracy and good self-locking performance, making it suitable for dust removal operations that require precise positioning and position maintenance; the cylinder lifting mechanism has high speed and sensitive response, making it suitable for rapid lifting actions; the voice coil motor lifting mechanism can achieve stepless speed regulation and smooth lifting without impact, making it suitable for impact-sensitive wafer surfaces. In this embodiment, the first lifting component 225 preferably uses a servo motor in conjunction with a precision screw mechanism, with a Z-direction resolution better than 0.1μm and a stroke of 50mm to 150mm. Closed-loop control via a force sensor enables precise adjustment of the contact force.

[0050] The first mounting bracket 224 is mounted on the machine base 11, spaced apart from the extensions of the first linear guide rail 211 and the second linear guide rail 214 in the horizontal plane. The adhesive module 43 and the adhesive rod module 42 are mounted on the first mounting bracket 224, cooperating with the dust removal module 41 to provide adhesive rods and adhesive. The projection of the first mounting bracket 224 on the horizontal plane is located at one end of the extension line of the third linear guide rail 221, without occupying the vertical space below the third linear guide rail 221. The adhesive module 43 and the adhesive rod module 42 are respectively preset with a second height H2 and a third height H3 relative to the machine base 11, where the second height H2 and the third height H3 are smaller than the first height H1. In other words, the adhesive module 43 and the adhesive rod module 42 are located below the third linear guide rail 221, arranged in layers in the vertical direction, resulting in a more compact overall structure. This space-reuse layout, where dust removal is performed above the beam and consumables are supplied beside it below the beam, significantly reduces the projected area of ​​the second motion mechanism 22 on the horizontal plane.

[0051] The third linear guide rail 221 is mounted above the machine base 11 via the first column 227. In another embodiment, the second motion mechanism 22 adopts an "L"-shaped support structure, that is, only one first column 227 is set at one end of the third linear guide rail 221, and the other end is suspended, so that the first mounting bracket 224 can be set below the suspended end. The adhesive module 43 and the adhesive stick module 42 are located in the area below the suspended end, making full use of the space below the third linear guide rail 221 and making the overall structure more compact. Compared with the traditional gantry structure, one end of the "L"-shaped support structure is spaced apart from the machine base 11, forming an open space, providing an installation position for the adhesive stick module 42 and the adhesive module 43, and also making it easier for operators to observe and place the adhesive sticks.

[0052] In this embodiment, the second motion mechanism 22 adopts a gantry structure, that is, the two ends of the third linear guide rail 221 are respectively mounted on the machine base 11 through two first columns 227. The gantry structure has higher rigidity and stability, and is suitable for scenarios requiring high-speed, high-acceleration and deceleration motion.

[0053] The sticking rod module 42 is equipped with a first translation member 226, which is arranged along a first direction (Y direction) in the horizontal plane and is movably connected to the first mounting bracket 224 to control the movement of the sticking rod module 42 along the Y direction. The first translation member 226 can be a servo motor in conjunction with a lead screw mechanism or a linear motor to move the sticks to be used in the sticking rod module 42 from the storage position to the stick retrieval position for the dust removal module 41 to retrieve. The sticking rod module 42 includes a sticking rod bin 421, in which multiple sticks are arranged along the vertical and / or horizontal direction. The sticking rod bin 421 has an opening facing the front of the equipment for easy replacement of sticks.

[0054] The adhesive module 43 includes at least one adhesive tank 431 containing an adsorption solution (such as a silicone gel solution or a viscous liquid) for the adhesive stick to dip into before dust removal.

[0055] Driven by the first lifting component 225, the dust removal module 41 descends along the Z-direction to the stick-picking station, picks up the adhesive stick provided by the stick-stick holder 42, then rises and moves along the X-direction above the adhesive tank 431 of the adhesive module 43. Driven by the first lifting component 225, it descends along the Z-direction to obtain adhesive. After a predetermined time, it rises again and moves along the X-direction above the wafer 10 to be dusted, then descends again to perform the dust removal action. After dust removal, the dust removal module 41 discards the used adhesive stick into the waste collection box or stick-stick bin 421, and then picks up a new adhesive stick to repeat the above process. This series of actions is automatically controlled by the control component 6, realizing the automatic supply and replacement of dust removal consumables, reducing manual intervention, and improving dust removal efficiency. The dust removal module 41 moves along the X-direction on the third linear guide 221, and the stick-stick module 42 moves along the Y-direction on the first mounting bracket 224. The projections of their paths on the horizontal plane intersect at the stick-picking station. This method of picking up rods by means of intersecting paths occupies less space and has a shorter movement path compared to moving in the same or opposite directions, resulting in higher rod picking efficiency.

[0056] Please also refer to Figure 3 , Figure 4 and Figure 7 The detection component 5 includes a two-dimensional detection module 51 and a three-dimensional detection module 52. The two-dimensional detection module 51 is used to acquire 2D images of the surface of the semiconductor wafer 10, and includes a 2D camera 511 and an illumination source (not shown). The 2D camera 511 uses a high-resolution area array industrial camera with a pixel count of no less than 20 million, and with a telecentric optical lens, its optical resolution is better than 1μm. The illumination source uses any one of coaxial illumination, ring illumination, or dome illumination, with adjustable color temperature and brightness, and can be switched according to the material characteristics of the wafer surface.

[0057] In another embodiment, the 2D camera 511 can also employ a line scan camera in conjunction with the stepping motion of the support platform 3 to achieve panoramic scanning. Line scan cameras offer higher scanning speed and resolution, making them suitable for rapid inspection of large-area wafers. The illumination source can also employ a multi-angle, multi-spectral illumination scheme, combining light sources of different angles and wavelengths to enhance the imaging contrast of dust and defects of different materials.

[0058] The 3D inspection module 52 is used to acquire 3D topographic data of the surface of the semiconductor wafer 10, including a 3D sensor 521. The 3D sensor 521 can be any one of a white light interferometer, a spectral confocal sensor, a laser triangulation sensor, a structured light projection sensor, or a time-of-flight sensor. The white light interferometer has the highest vertical resolution (up to 0.1 nm), suitable for detecting nanoscale dust and defects; the spectral confocal sensor is suitable for detecting transparent or highly reflective wafer surfaces; the laser triangulation sensor and the structured light projection sensor have the fastest scanning speed, suitable for large-area rapid inspection; the time-of-flight sensor has the fastest speed but relatively low accuracy, suitable for coarse inspection scenarios where high accuracy is not required. In this embodiment, the 3D sensor 521 preferably uses a white light interferometer or a spectral confocal sensor, with a vertical resolution better than 0.5 μm and a horizontal resolution better than 10 μm.

[0059] In another embodiment, the 3D sensor 521 can integrate two or more of the above-mentioned technologies simultaneously, selecting the most suitable detection mode based on the material characteristics of the wafer surface and the required detection accuracy. The combination of multiple sensors allows for flexible switching in different detection scenarios, balancing accuracy and speed.

[0060] The third motion mechanism 23 is used to mount the two-dimensional detection module 51 and the three-dimensional detection module 52. In this embodiment, the third motion mechanism 23 includes a second mounting frame 231, which extends along a second direction (X direction) in the horizontal plane and is mounted above the machine base 11 via a second column 232. The second mounting frame 231 is fixed and does not move in the X direction, only providing a mounting base. The two-dimensional detection module 51 and the three-dimensional detection module 52 are fixedly mounted on the second mounting frame 231, and their relative positions are fixed in the horizontal direction. The two-dimensional detection module 51 and the three-dimensional detection module 52 are arranged sequentially along the X direction on the second mounting frame 231, and the center distance between them is a fixed value L. The fixed value L matches the single step distance of the support platform 3 driven by the first motion mechanism 21. When the support platform 3 steps a fixed distance L, the same position on the surface of the wafer 10 passes under the 2D camera 511 and under the 3D sensor 521 in sequence, completing the seamless connection between 2D image acquisition and 3D topography scanning. This fixed-spacing design eliminates the need for independent drive components and guide rails for the two detection modules, resulting in a simpler, more compact structure and higher positioning accuracy.

[0061] The 2D detection module 51 is equipped with a second lifting member 513, and the 3D detection module 52 is equipped with a third lifting member 523. The second lifting member 513 and the third lifting member 523 control the 2D detection module 51 and the 3D detection module 52 to move up and down along the Z direction, respectively. The Z-axis travel of the second lifting member 513 is greater than that of the third lifting member 523 because the working distance (distance from the lens to the wafer surface) of the 2D camera 511 is typically 50mm to 100mm, requiring a larger focusing range; while the working distance of the 3D sensor 521 is typically 10mm to 30mm, with a shorter travel but requiring higher resolution. The Z-axis resolution of the third lifting member 523 is higher than that of the second lifting member 513 because 3D detection requires higher Z-axis positioning accuracy. In this embodiment, the second lifting member 513 uses a servo motor in conjunction with a lead screw mechanism, with a travel of 80mm and a resolution of 1μm; the third lifting member 523 uses a piezoelectric ceramic drive or a high-precision voice coil motor, with a travel of 20mm and a resolution of 0.1μm.

[0062] In this embodiment, the two-dimensional detection module 51 and the three-dimensional detection module 52 are fixedly mounted on the second mounting bracket 231 and only perform Z-axis lifting and lowering movements, remaining stationary in the X and Y directions. This design reduces the number of moving parts in the X direction, resulting in a simpler and more reliable structure. Since the relative positions of the detection modules are fixed, frequent refocusing and calibration after X-axis movement are unnecessary. Each detection only requires focusing in the Z-axis to begin scanning, significantly shortening the detection cycle and improving detection efficiency. The fixed mounting reduces vibration and impact caused by movement, which is beneficial for improving detection accuracy, especially for the three-dimensional detection module 52 acquiring high-quality three-dimensional topographic data. Furthermore, the elimination of X-axis drive components and guide rails reduces equipment costs and failure rates.

[0063] In another embodiment, the third motion mechanism 23 can also be movable. The third motion mechanism 23 further includes a fourth linear guide (not shown), which extends along a second direction (X direction) in the horizontal plane. The two-dimensional detection module 51 includes a fifth slider (not shown) and a fourth drive member (not shown), and the three-dimensional detection module 52 includes a sixth slider (not shown) and a fifth drive member (not shown). The fifth and sixth sliders are movably mounted on the fourth linear guide at intervals. The fourth drive member is connected to the fourth linear guide and the fifth slider, controlling the movement of the two-dimensional detection module 51 along the X direction. The fifth drive member is connected to the fourth linear guide and the sixth slider, controlling the movement of the three-dimensional detection module 52 along the X direction. In this embodiment, the two-dimensional detection module 51 and the three-dimensional detection module 52 move independently along the X direction, and can be moved to any position within the workspace for detection. The advantage of this solution is higher flexibility, allowing for precise point-to-point detection of any area on the surface of the wafer 10 without relying on the stepping motion of the support platform 3.

[0064] In this embodiment, a fixed crossbeam design is preferred. It has a more compact structure, fewer moving parts, and higher positioning accuracy, making it more suitable for mass wafer dust removal and inspection scenarios.

[0065] The 3D sensor 521 lens of the 3D detection module 52 can also be equipped with a dustproof component (not shown in the figure). When the 3D detection module 52 is not in operation, the dustproof component is set to a closed state to prevent the lens from being contaminated by dust, thus ensuring the long-term reliability of the 3D detection module 52 under the working conditions of the dust removal equipment.

[0066] like Figure 3 As shown, both the second motion mechanism 22 and the third motion mechanism 23 are configured as gantry structures, arranged parallel to each other to form a workspace 1001. The third linear guide rail 221 of the second motion mechanism 22 is mounted above the machine base 11 via the first column 227, forming a first gantry structure. The second mounting bracket 231 of the third motion mechanism 23 is mounted above the machine base 11 via the second column 232, forming a second gantry structure. The first and second gantry structures are arranged parallel to each other, and their projected areas on the horizontal plane constitute the boundary of the workspace 1001.

[0067] The first motion mechanism 21 and the support platform 3 are located within the projection area of ​​the workspace 1001 on the horizontal plane. Driven by the first motion mechanism 21, the support platform 3 moves within the workspace 1001. The semiconductor wafer 10 carried on the support platform 3 is located directly below the third linear guide rail 221 of the second motion mechanism 22 and the second mounting bracket 231 of the third motion mechanism 23, i.e., within the working range of the dust removal component 4 and the detection component 5.

[0068] The dust removal component 4 is installed on the side of the second motion mechanism 22 facing the third motion mechanism 23, that is, on the side of the third linear guide 221 facing the workspace 1001. The two-dimensional detection module 51 and the three-dimensional detection module 52 are installed on the side of the third motion mechanism 23 facing the second motion mechanism 22, that is, on the side of the second mounting bracket 231 facing the workspace 1001. In other words, both the dust removal component 4 and the detection component 5 are positioned facing the workspace 1001, arranged opposite each other, and their working areas overlap within the workspace 1001. This facing arrangement ensures that both the detection component 5 and the dust removal component 4 face the same workspace 1001. The wafer 10 is placed on the support platform 3 and thus fed into the workspace 1001, allowing it to receive both detection and dust removal services simultaneously. This avoids transferring the wafer 10 between different workstations, reducing movement time and the risk of secondary contamination.

[0069] In this design, two gantry frames span above the support platform 3, forming an open workspace 1001 in the horizontal direction. The wafers 10 can freely enter and exit, facilitating the automatic loading and unloading mechanism to place the wafers 10 on the support platform 3 or remove the wafers 10 after dust removal. The columns of the two gantry frames are respectively set on both sides of the machine base 11, without occupying space in the vertical direction within the workspace 1001, thus maximizing the usable area of ​​the workspace 1001 in the horizontal direction. The gantry frame structure provides sufficient support rigidity, ensuring the stability and vibration resistance of the third linear guide 221 and the second mounting bracket 231 during movement, which is beneficial to improving the accuracy of detection and dust removal.

[0070] The sealed housing 12 forms a closed working chamber. The operating door 13 is used for loading and unloading wafers 10 and for maintenance operations; the operating door 13 can be connected to the equipment's safety interlock device, automatically stopping all moving mechanisms when the operating door 13 is opened to ensure operator safety. The transparent observation window 14 allows operators to directly observe the wafer status and dust removal effect within the workspace 1001, facilitating manual monitoring and troubleshooting.

[0071] Please refer to the following: Figure 3 , Figure 5 and Figure 6 In this embodiment, the first motion mechanism 21 and the second motion mechanism 22 are each equipped with a cable chain for securing and guiding the cables of each motion mechanism. A cable chain is a device used to secure cables, wires, air hoses, and hydraulic hoses to facilitate their rotation and movement. Resembling a tank track, it is composed of numerous interconnected units that can rotate freely between each other. Cable chains are widely used in reciprocating motion applications, providing traction and protection for internal cables, oil pipes, air pipes, water pipes, etc.

[0072] Specifically, the first drive member 213 and the second drive member 216 are respectively provided with a first cable chain 217 and a second cable chain 218. The first cable chain 217 extends along the Y direction and is arranged on one side of the machine base 11, with one end fixed to the machine base 11 and the other end connected to the first sliding member 212. It houses the power and signal lines of the first drive member 213. The second cable chain 218 extends along the X direction and is arranged on the first sliding member 212 near the second motion mechanism 22. One end is fixed to the first sliding member 212 and the other end is connected to the support platform 3. It houses the power and signal lines of the second drive member 216 and vacuum lines. The position of the second cable chain 218 does not occupy additional space and can move with the first sliding member 212 within the workspace 1001.

[0073] The third drive unit 223 is provided with a corresponding third drag chain 228. The third drag chain 228 extends along the X direction and is arranged on the third linear guide rail 221, with one end fixed to the third linear guide rail 221 and the other end connected to the third sliding member 222.

[0074] Each cable chain is made of anti-static (ESD) and cleanroom-grade engineering plastic, constructed from polyoxymethylene (POM) or polyamide (PA66) materials with added antistatic agents. This results in extremely low wear, eliminates the generation of microparticles, and meets cleanroom requirements. The cable chains employ a link-type structure, with each link being openable for easy cable installation, inspection, and replacement. The cable chains effectively bind and guide the moving cables, preventing them from tangling or rubbing against other equipment components during movement, thus ensuring smooth and reliable operation of all moving mechanisms.

[0075] Based on the above structural layout, the complete process of wafer dust removal achieved by the coordinated operation of various motion mechanisms is as follows:

[0076] Driven by the first motion mechanism 21, the carrier platform 3 moves along the Y and X directions to the initial inspection station within the workspace 1001. Driven by the second lifting component 513, the 2D inspection module 51 descends along the Z direction to the working distance, performing a panoramic scan of the wafer 10 surface and acquiring 2D images. The control component 6 processes the 2D images to initially identify the planar coordinates of dust or defects. The carrier platform 3 then moves according to the identified dust / defect coordinates.

[0077] The support platform 3 moves the dust to a position below the dust removal module 41. Driven by the third sliding member 222, the dust removal module 41 moves along the X direction to the target position and descends along the Z direction under the drive of the first lifting member 225, allowing the adhesive stick to contact and remove the dust. If the adhesive stick is exhausted, the dust removal module 41 moves along the X direction to the stick-retrieving station. Driven by the first translation member 226, the stick-retrieving module 42 delivers a new adhesive stick to the stick-retrieving station along the Y direction. After retrieving the new stick, the dust removal module 41 continues to move along the X direction to the adhesive-retrieving station, obtains the adhesive, and then proceeds to dust removal.

[0078] After dust removal is completed, the two-dimensional detection module 51 and the three-dimensional detection module 52 re-inspect the dust-removed area. After confirming that the dust has been removed, the carrying platform 3 moves out of the workspace 1001, completing the entire dust removal process.

[0079] Of course, in the initial inspection, after the 2D inspection module determines the coordinates of the dust / defect, the target position can be moved below the 3D inspection module 52. Driven by the third lifting component 523, the 3D inspection module 52 descends along the Z-direction to the working distance, performs a 3D topographic scan of the position, and acquires 3D point cloud data. The control component 6 determines whether the abnormal point is dust or a defect based on the 3D topographic data. In other words, the 3D inspection module has higher accuracy and can be used during the initial inspection or for re-inspection after dust removal. Furthermore, based on the 3D information of dust or defects identified by the 3D inspection module, the quality of the wafer can be determined, allowing the user to choose whether to retain the wafer.

[0080] Throughout the entire working process described above, the cables of each motion mechanism are managed in an orderly manner through corresponding cable chains: the first cable chain 217 and the second cable chain 218 bend and extend with the XY motion of the bearing platform 3; the third cable chain 228 bends and extends with the X-direction motion of the dust removal module 41; all cable chains adopt a fully enclosed structure to prevent the escape of minute wear particles generated during the motion from polluting the dust-free working environment.

[0081] In this embodiment, the driving methods for the first lifting component 225, the first translation component 226, the second lifting component 513, and the third lifting component 523 can be selected from any one of the following: a screw lifting mechanism, a cylinder lifting mechanism, or a voice coil motor lifting mechanism, depending on the accuracy and speed requirements. The screw lifting mechanism has the highest accuracy and the best self-locking performance; the cylinder lifting mechanism has the fastest speed and the most sensitive response; the voice coil motor lifting mechanism can achieve smooth stepless speed change motion and is suitable for impact-sensitive scenarios. The third lifting component 523 of the three-dimensional detection module 52 preferably adopts a piezoelectric ceramic drive or a high-precision voice coil motor because it has the highest Z-axis resolution requirement (better than 0.1μm).

[0082] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A semiconductor wafer dust removal device with a three-dimensional detection module, used to remove dust from semiconductor wafers, characterized in that, include: Equipment frame assembly, wherein the equipment frame assembly is provided with a machine base; A motion assembly, comprising a first motion mechanism, a second motion mechanism, and a third motion mechanism, wherein the first motion mechanism, the second motion mechanism, and the third motion mechanism are spaced apart on the machine base; A support platform, which is mounted on the first motion mechanism, is used to support the semiconductor wafer; A dust removal component is disposed on the second motion mechanism; A detection component, wherein the detection component is disposed on the third motion mechanism; and A control component is electrically connected to the motion component, the dust removal component, and the detection component, respectively. The control component controls the relative movement of the first motion mechanism, the second motion mechanism, and the third motion mechanism to control the detection component to detect dust on the semiconductor wafer and control the dust removal component to remove dust from the semiconductor wafer. The detection component includes: A two-dimensional detection module is used to acquire two-dimensional images of the semiconductor wafer surface; and A three-dimensional detection module is used to acquire three-dimensional topographic data of the semiconductor wafer surface, and a two-dimensional detection module is disposed adjacent to the three-dimensional detection module on the third motion mechanism.

2. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 1, characterized in that, The first motion mechanism includes: A first linear guide rail is provided, which extends along a first direction in the horizontal plane; A first sliding member, wherein the first sliding member is movably connected to the first linear guide rail; and A first driving member is connected at both ends to the first sliding member and the machine base, respectively, to control the first sliding member to move relative to the first linear guide rail along the first direction, and the bearing platform is disposed on the first sliding member.

3. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 2, characterized in that, The first motion mechanism further includes: The second linear guide rail extends along a second direction in the horizontal plane and is disposed on the first sliding member; A second sliding member, movably connected to the second linear guide rail, and the supporting platform disposed on the second sliding member; and The second driving member has its two ends connected to the first sliding member and the bearing platform, respectively, and controls the second sliding member to move relative to the second linear guide rail along the second direction, which is perpendicular to the first direction.

4. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 3, characterized in that, The dust removal assembly adopts an adhesive rod dust removal mode, including an adhesive module, an adhesive rod module, and a dust removal module; the second motion mechanism includes: The third linear guide rail extends along the second direction in the horizontal plane and is preset at a first height relative to the machine base; wherein, the dust removal module includes a third sliding member, which is movably connected to the third linear guide rail; A third driving component, the two ends of which are respectively connected to the third linear guide rail and the third sliding component, controls the dust removal module to move relative to the third linear guide rail along the second direction; and The first mounting bracket is mounted on the machine base and is spaced apart from the extension space of the first linear guide rail and the second linear guide rail in the horizontal plane. The adhesive module and the adhesive rod module are mounted on the first mounting bracket and cooperate with the dust removal module to provide adhesive rods and adhesive.

5. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 4, characterized in that, The dust removal module is equipped with a first lifting component, which is arranged vertically and is movably connected to the third sliding component to control the dust removal module to move vertically. The adhesive stick module is provided with a first translation component, which is arranged along the first direction on the horizontal plane and is movably arranged with the first mounting bracket to control the adhesive stick module to move along the first direction.

6. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 4, characterized in that, The positions of the adhesive module and the adhesive stick module are respectively preset at a second height and a third height relative to the machine base, and the second height and the third height are smaller than the first height.

7. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 4, characterized in that, The projection of the first mounting bracket on the horizontal plane is located at one end of the extension line of the third linear guide.

8. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 3, characterized in that, The third motion mechanism includes a second mounting frame, which extends along the second direction in the horizontal plane, and the two-dimensional detection module and the three-dimensional detection module are mounted on the second mounting frame. The two-dimensional detection module includes a second lifting component, and the three-dimensional detection module includes a third lifting component. The second lifting component and the third lifting component respectively control the two-dimensional detection module and the three-dimensional detection module to move in the vertical direction.

9. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 3, characterized in that, The third motion mechanism further includes a fourth linear guide rail, which extends along the second direction in the horizontal plane. The two-dimensional detection module includes a third sliding member and a fourth driving member, and the three-dimensional detection module includes a fourth sliding member and a fifth driving member. The third sliding member and the fourth sliding member are movably disposed on the fourth linear guide rail at intervals. The fourth driving component is connected to the fourth linear guide rail and the third sliding component, and controls the two-dimensional detection module to move along the second direction; The fifth driving component is connected to the fourth linear guide and the fourth sliding component, and controls the three-dimensional detection module to move along the second direction.

10. The semiconductor wafer dust removal equipment with a three-dimensional detection module according to claim 1, characterized in that, Both the second motion mechanism and the third motion mechanism are configured as gantry structures, and are arranged in parallel relative to each other to form a workspace. The first motion mechanism and the supporting platform are located within the projection area of ​​the workspace on the horizontal plane. The dust removal component is installed in the direction of the second motion mechanism toward the third motion mechanism, and the two-dimensional detection module and the three-dimensional detection module are installed in the direction of the third motion mechanism toward the second motion mechanism.

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